A multilayer printed wiring board

Abstract

The utility model discloses a kind of multilayer printed circuit boards, including multilayer circuit board structure;The utility model is equipped with multilayer circuit board structure, when assembling, first wire insertion is connected into wiring port, make upper layer board and lower layer board establish electrical connection, then the upper layer board is superimposed in lower layer board top, upper layer board is movably nested in mounting post outside by mounting port at this time, realize pre-fixing, finally screw is passed through upper screw hole and lower screw hole inside and is tightly fixed, complete the assembly connection of upper layer board and lower layer board, wherein, the upper layer board and lower layer board in multilayer circuit board structure are split type structure, and insulating support is provided between the upper layer board and lower layer board as support, so as to leave heat dissipation space between the upper layer board and lower layer board, not easy to produce heat accumulation, to better realize heat management.

Description

Technical Field

[0001] This utility model relates to the field of printed circuit board technology, specifically a multilayer printed circuit board. Background Technology

[0002] Printed circuit boards (PCBs) are core components in the electronics industry. They are formed on an insulating substrate through printing processes to support electronic components and achieve electrical connections. In order to meet the requirements of higher integration and signal processing, multilayer PCBs, as a high-performance electronic interconnection platform, have become an indispensable and important part of modern electronic products.

[0003] Existing patent application number: 202121380580.3 A multilayer composite PCB board, comprising two or more PCB boards stacked together, each PCB board having a rotating mounting hole and a positioning part; all PCB boards are rotatably stacked through a rotating positioning assembly, the rotating positioning assembly including a connecting glue pin and a perforated glue pad; the connecting glue pin has a cap and a rod extending upward from the top of the cap; the rod passes through the upper and lower corresponding rotating mounting holes of each PCB board, and the perforated glue pad is fitted onto the rod and spaced between adjacent upper and lower PCB boards.

[0004] The aforementioned patent describes a multilayer printed circuit board. In the prior art, the circuit layers of multilayer printed circuit boards are usually connected and fixed by thermoforming. However, multilayer stacking can easily lead to heat accumulation, which is not conducive to heat management. Furthermore, the difference in thermal expansion between different layer materials may cause the board to deform and fail, reducing structural reliability. Therefore, we propose a multilayer printed circuit board to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide a multilayer printed circuit board to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a multilayer printed circuit board, comprising a multilayer circuit board structure, wherein the multilayer circuit board structure includes an upper layer board, a lower layer board, a support, a connector, and a ribbon cable. The lower layer board is stacked directly below the upper layer board. The support is equidistantly arranged and adhered to the top surface of the lower layer board, and the support is supported between the upper layer board and the lower layer board. A connector is provided on the right side of the top surface of the lower layer board, and a ribbon cable is provided on the right side of the bottom surface of the upper layer board. The ribbon cable is installed and connected to the inside of the connector to establish an electrical connection between the upper layer board and the lower layer board.

[0007] Preferably, the support is made entirely of insulating material.

[0008] Preferably, the upper plate has through-holes on both the front and rear sides, and the support has lower screw holes at the front and rear ends. The upper screw holes and lower screw holes are connected and fixed by screws.

[0009] Preferably, mounting posts are welded to the four corners of the top surface of the lower plate. The mounting posts are hollow tube structures. Mounting openings are provided through the four corners of the top surface of the upper plate. The mounting openings are movably nested outside the mounting posts.

[0010] Preferably, the top surface of the support has an opening in the center, with no less than two openings, and the openings are evenly distributed on the top surface of the support.

[0011] Compared with the prior art, the beneficial effects of this utility model are: This utility model features a multi-layer circuit board structure. During assembly, the ribbon cable is first plugged into the connection port to establish an electrical connection between the upper and lower layers. Then, the upper layer is stacked on top of the lower layer, where it is pre-fixed by being movably nested outside the mounting post through the mounting port. Finally, screws are passed through the upper and lower screw holes and tightened to complete the assembly and connection of the upper and lower layers. In this multi-layer circuit board structure, the upper and lower layers are separate structures with an insulated support between them, thus providing a heat dissipation space and preventing heat accumulation, thereby improving heat management. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a top-view, disassembled structural diagram of the multilayer circuit board structure in this utility model; Figure 3 This is a schematic diagram of the upper layer plate in this utility model; Figure 4 This is a top view of the lower layer of the present invention.

[0013] In the diagram: Multilayer circuit board structure-1, upper layer board-11, lower layer board-12, support-13, through-hole-131, wiring port-14, ribbon cable-15, upper screw hole-16, lower screw hole-17, mounting post-18, mounting port-19. Detailed Implementation

[0014] To further explain the technical solution of this utility model, a detailed description is provided below through specific embodiments.

[0015] Please see Figure 1-3This utility model provides a multilayer printed circuit board, including a multilayer circuit board structure 1. The multilayer circuit board structure 1 includes an upper layer board 11, a lower layer board 12, a support 13, a terminal block 14, and a ribbon cable 15. The lower layer board 12 is stacked directly below the upper layer board 11. The support 13 is equidistantly arranged and glued on the top surface of the lower layer board 12. The support 13 supports the upper layer board 11 and the lower layer board 12 to prevent direct contact. The terminal block 14 is provided on the right side of the top surface of the lower layer board 12. The ribbon cable 15 is provided on the right side of the bottom surface of the upper layer board 11. The ribbon cable 15 is installed and connected to the inside of the terminal block 14 to establish an electrical connection between the upper layer board 11 and the lower layer board 12.

[0016] To further explain, the support 13 is made entirely of insulating material to prevent current from being conducted through unexpected paths and to ensure the stability of signal transmission.

[0017] This utility model provides a multilayer printed circuit board. The upper plate 11 has a through upper screw hole 16 on both the front and rear sides. The support 13 has a lower screw hole 17 at the front and rear ends of the top. The upper screw hole 16 and the lower screw hole 17 are connected and fixed by screws. The upper plate 11 and the lower plate 12 are detachably connected, allowing damaged parts to be disassembled and replaced individually, reducing replacement costs.

[0018] This utility model provides a multilayer printed circuit board. The four corners of the top surface of the lower plate 12 are welded with mounting posts 18, which are hollow tube structures. The four corners of the top surface of the upper plate 11 are provided with mounting openings 19. The mounting openings 19 are movably nested outside the mounting posts 18, so that screws can pass smoothly through the mounting posts 18 through the upper plate 11 and the lower plate 12 and be connected and locked to the mounting surface without the need to frequently adjust the screw insertion angle.

[0019] Please see Figure 4 This utility model provides a multilayer printed circuit board. A through-hole 131 is provided in the center of the top surface of the support 13. There are no less than two through-holes 131, and the through-holes 131 are evenly distributed on the top surface of the support 13, allowing airflow to pass through the support 13 through the through-holes 131 for lateral communication, so as to improve heat dissipation efficiency.

[0020] Specifically, during assembly, firstly, insert the ribbon cable 15 into the wiring port 14 to establish an electrical connection between the upper plate 11 and the lower plate 12. Then, stack the upper plate 11 on top of the lower plate 12. At this time, the upper plate 11 is movably nested outside the mounting post 18 through the mounting port 19 to achieve pre-fixation. Finally, pass the screws through the upper screw hole 16 and the lower screw hole 17 and tighten them to fix the upper plate 11 and the lower plate 12, thereby completing the assembly connection of the upper plate 11 and the lower plate 12. To further explain, the upper layer board 11 and the lower layer board 12 in the multilayer circuit board structure 1 are separate structures. An insulating support 13 is provided between the upper layer board 11 and the lower layer board 12 as a support, thereby leaving a heat dissipation space between the upper layer board 11 and the lower layer board 12, which makes it less likely for heat to accumulate, so as to better achieve heat management. In addition, the upper layer board 11 and the lower layer board 12 are detachably connected, allowing damaged parts to be disassembled and replaced individually, reducing replacement costs.

[0021] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A multilayer printed circuit board, comprising a multilayer circuit board structure (1); characterized in that: The multilayer circuit board structure (1) includes an upper layer board (11), a lower layer board (12), a support (13), a terminal block (14), and a ribbon cable (15). The lower layer board (12) is stacked directly below the upper layer board (11). The support (13) is equidistantly arranged on the top surface of the lower layer board (12). The support (13) is supported between the upper layer board (11) and the lower layer board (12). The terminal block (14) is provided on the right side of the top surface of the lower layer board (12). The ribbon cable (15) is provided on the right side of the bottom surface of the upper layer board (11). The ribbon cable (15) is installed and connected to the inside of the terminal block (14) to establish an electrical connection between the upper layer board (11) and the lower layer board (12).

2. The multilayer printed circuit board according to claim 1, characterized in that: The support (13) is made of insulating material.

3. The multilayer printed circuit board according to claim 1, characterized in that: The upper plate (11) has a through screw hole (16) on both the front and rear sides, and the support (13) has a screw hole (17) at the front and rear ends of the top. The upper screw hole (16) and the screw hole (17) are connected and fixed by screws.

4. The multilayer printed circuit board according to claim 1, characterized in that: The lower plate (12) has four corners of the top surface with mounting posts (18), which are hollow tube structures. The upper plate (11) has four corners of the top surface with mounting openings (19), which are movably nested outside the mounting posts (18).

5. A multilayer printed circuit board according to claim 1, characterized in that: The support (13) has an opening (131) in the center of the top surface. There are no less than two openings (131), and the openings (131) are evenly distributed on the top surface of the support (13).

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