A high precision rgb edge emitting laser lamp cluster module

Abstract

The utility model discloses a kind of high-precision RGB edge-emitting laser lamp group module, it is related to optoelectronic packaging technical field, including copper substrate, the top of copper substrate is fixedly connected with chip bracket, the top of chip bracket is fixedly connected with several T table type silicon prism, the top of chip bracket is fixedly connected with edge-emitting laser chip assembly, the top of copper substrate is installed with glass optical window, the bottom of glass optical window is coated with metal plating, the device is through structural integration design, optical integration optimization and all inorganic packaging process, effectively improve the light path precision of edge-emitting laser chip assembly, structural stability, packaging reliability and thermal management performance, while significantly improve the automation assembly efficiency and reduce manufacturing cost, especially suitable for high-resolution display, complex environment lighting and laser system in the scene with higher precision and reliability requirement.

Description

Technical Field

[0001] This utility model belongs to the field of optoelectronic packaging technology, and specifically relates to a high-precision RGB edge-emitting laser light module. Background Technology

[0002] Edge-emitting laser technology is widely used in many high-end fields such as laser processing, optical communication, scientific research, military, and aerospace. With the continuous advancement of edge-emitting laser chip technology, its output power, conversion efficiency and stability have been significantly improved, and market demand continues to grow. However, in order to meet the industry's demand for high-performance and high-reliability light sources, edge-emitting laser technology still needs to be optimized in many aspects.

[0003] Currently, the light emission direction of traditional edge-emitting laser chips is located on the side of the chip. TO-type packaging makes it difficult to achieve a small-size, high-precision integrated structure. Not only is the structure complex and the assembly efficiency low, but it is also prone to optical path contamination and thermal mismatch, which can lead to package damage. It is difficult to adapt to high-precision displays and long-term use in harsh environments. To solve the above problems, we provide a high-precision RGB edge-emitting laser lamp module. Utility Model Content

[0004] The purpose of this invention is to provide a high-precision RGB edge-emitting laser lamp module to solve the problems mentioned in the background art. The light emission direction of traditional edge-emitting laser chips is located on the side of the chip. TO-type package makes it difficult to achieve a small-size, high-precision integrated structure. Not only is the structure complex and the assembly efficiency low, but it is also easy to cause optical path contamination and thermal mismatch leading to package damage. It is difficult to adapt to high-precision displays and long-term use in harsh environments.

[0005] The above-mentioned technical objective of this utility model is achieved through the following technical solution: a high-precision RGB edge-emitting laser light group module, including a copper substrate, a chip bracket fixedly connected to the top of the copper substrate, a plurality of T-shaped silicon prisms fixedly connected to the top of the chip bracket, an edge-emitting laser chip assembly fixedly connected to the top of the chip bracket, a glass light window installed on the top of the copper substrate, and a metal plating coating on the bottom of the glass light window.

[0006] The edge-emitting laser chip assembly includes an edge-emitting laser chip R, an edge-emitting laser chip G, and an edge-emitting laser chip B.

[0007] Preferably, the number of T-shaped silicon prisms is three, and each T-shaped silicon prism includes an adsorption plane and a reflective surface, the surface of which is coated.

[0008] Preferably, a Zener diode is fixedly connected to the top of the chip holder, and a positioning hole is provided inside the copper substrate.

[0009] Preferably, a positive electrode is fixedly connected to the top of the copper substrate, and a negative electrode is fixedly connected to the top of the copper substrate.

[0010] Preferably, the glass window has a dam structure, the T-shaped silicon prism is made of silicon material, and the glass window is welded to the copper substrate through a metal plating layer.

[0011] This utility model has the following beneficial effects:

[0012] This device effectively improves the optical path accuracy, structural stability, packaging reliability, and thermal management performance of the edge-emitting laser chip assembly through integrated structural design, optical integration optimization, and all-inorganic packaging technology. At the same time, it significantly improves automated assembly efficiency and reduces manufacturing costs, making it particularly suitable for high-precision and high-reliability scenarios in high-resolution displays, complex ambient lighting, and laser systems. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0014] Figure 2 This is an exploded view of the structure of this utility model;

[0015] Figure 3 This is a partial three-dimensional structural view of the present invention;

[0016] Figure 4 This is a partial three-dimensional structural view of this utility model.

[0017] Reference numerals: 1. Copper substrate; 2. Chip holder; 3. T-shaped silicon prism; 31. Adsorption plane; 32. Reflective surface; 4. Edge-emitting laser chip assembly; 5. Zener diode; 6. Glass window; 7. Metal plating; 8. Substrate positive electrode; 9. Substrate negative electrode; 10. Positioning hole. Detailed Implementation

[0018] The present invention will be further described in detail below with reference to the accompanying drawings.

[0019] Example 1:

[0020] refer to Figure 1-4 A high-precision RGB edge-emitting laser light module includes a copper substrate 1, a chip bracket 2 fixedly connected to the top of the copper substrate 1, several T-shaped silicon prisms 3 fixedly connected to the top of the chip bracket 2, an edge-emitting laser chip assembly 4 fixedly connected to the top of the chip bracket 2, a glass light window 6 installed on the top of the copper substrate 1, and a metal plating layer 7 coated on the bottom of the glass light window 6.

[0021] The edge-emitting laser chip assembly 4 includes an edge-emitting laser chip R, an edge-emitting laser chip G, and an edge-emitting laser chip B.

[0022] Specifically, the T-shaped silicon prism 3 is fixed to the chip carrier 2 by adhesive bonding. The edge-emitting laser chip assembly 4 corresponds to three T-shaped silicon prisms 3 respectively. When the circuit is connected, the chip is excited to emit light. The Y-axis optical path comes into contact with the reflective surface 32 of the T-shaped silicon prism 3 and is reflected into the Z-axis optical path to achieve the laser path. Through integrated structural design, optical integration optimization and all-inorganic packaging process, this device effectively improves the optical path accuracy, structural stability, packaging reliability and thermal management performance of the edge-emitting laser chip assembly 4. At the same time, it significantly improves the efficiency of automated assembly and reduces manufacturing costs. It is particularly suitable for high-resolution displays, complex environmental lighting and laser systems with high requirements for accuracy and reliability.

[0023] refer to Figure 3 The number of T-shaped silicon prisms 3 is three. The T-shaped silicon prisms 3 include an adsorption plane 31 and a reflective surface 32. The adsorption plane 31 is used for mounting in automated equipment to avoid contaminating the reflective surface 32. The surface of the reflective surface 32 is coated. The coating on the reflective surface 32 can efficiently reflect the light path of the corresponding wavelength, reduce light path consumption, and avoid heat generation problems.

[0024] refer to Figure 2 A Zener diode 5 is fixedly connected to the top of the chip holder 2. The Zener diode 5 is used to stabilize the voltage, prevent overcurrent breakdown, and protect the circuit. A positioning hole 10 is provided inside the copper substrate 1. The positioning hole 10 facilitates the installation of the device.

[0025] refer to Figure 1 A positive electrode 8 is fixedly connected to the top of the copper substrate 1, and a negative electrode 9 is fixedly connected to the top of the copper substrate 1.

[0026] refer to Figure 2 and Figure 4 The glass light window 6 is equipped with a dam structure. The T-shaped silicon prism 3 is made of silicon material. The thermal expansion coefficient of the T-shaped silicon prism 3 is similar to that of the copper substrate 1 and the glass light window 6. It is also fixed with insulating glue, which can effectively reduce the problem of device cracking caused by thermal differences and ensure the structural stability of the product. The glass light window 6 is welded to the copper substrate 1 through the metal plating layer 7. The encapsulation adopts the eutectic welding process of the metal plating layer 7 to improve airtightness and environmental compatibility, and is suitable for environments with high temperature, high humidity and high vibration.

[0027] Brief description of the usage process: The coating on the reflective surface 32 can efficiently reflect the light path of the corresponding wavelength, reduce light path consumption, and avoid heat generation. The glass window 6 is welded to the copper substrate 1 through the metal coating 7. The encapsulation adopts the eutectic welding process of the metal coating 7 to improve airtightness and environmental compatibility, and is suitable for environments with high temperature, high humidity, and high vibration. The side-emitting laser chip component 4 corresponds to three T-shaped silicon prisms 3. When the circuit is connected, the chip is excited to emit light. The light path of the Y-axis comes into contact with the reflective surface 32 of the T-shaped silicon prism 3 and is reflected into the light path of the Z-axis, realizing the laser path.

[0028] This specific embodiment is merely an explanation of the present utility model and is not intended to limit the present utility model. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but as long as they are within the scope of the claims of the present utility model, they are protected by patent law.

Claims

1. A high precision RGB edge emitting laser lamp cluster module comprising a copper substrate (1), characterized in that: A chip holder (2) is fixedly connected to the top of the copper substrate (1), a plurality of T-shaped silicon prisms (3) are fixedly connected to the top of the chip holder (2), a side-emitting laser chip assembly (4) is fixedly connected to the top of the chip holder (2), a glass window (6) is installed on the top of the copper substrate (1), and a metal plating layer (7) is coated on the bottom of the glass window (6). The edge-emitting laser chip assembly (4) includes an edge-emitting laser chip R, an edge-emitting laser chip G, and an edge-emitting laser chip B.

2. A high precision RGB edge emitting laser lamp cluster module according to claim 1, characterized in that: The number of T-shaped silicon prisms (3) is three. Each T-shaped silicon prism (3) includes an adsorption plane (31) and a reflective surface (32). The surface of the reflective surface (32) is coated.

3. A high precision RGB edge emitting laser lamp cluster module according to claim 1, characterized in that: A Zener diode (5) is fixedly connected to the top of the chip holder (2), and a positioning hole (10) is provided inside the copper substrate (1).

4. The high-precision RGB edge-emitting laser light group module according to claim 1, characterized in that: The top of the copper substrate (1) is fixedly connected to a substrate positive electrode (8), and the top of the copper substrate (1) is fixedly connected to a substrate negative electrode (9).

5. A high precision RGB edge emitting laser lamp cluster module according to claim 1, characterized in that: The glass window (6) is equipped with a dam structure, the T-shaped silicon prism (3) is made of silicon material, and the glass window (6) is eutectic welded to the copper substrate (1) through a metal plating layer (7).

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