A positioning device for a multilayer composite circuit board

Abstract

The utility model relates to a kind of positioning device of multilayer composite circuit board, belong to circuit board manufacturing equipment technical field.The device includes upper bottom plate, lower bottom plate, multiple positioning components, pressing plate, telescopic support column and support foot;The positioning component is installed above upper bottom plate, contains positioning column, guide sleeve and elastic piece, and positioning column top is conical structure, and under the action of elastic piece, it can be vertically reset;Pressing plate is connected with upper bottom plate by telescopic support column, and the bottom of pressing plate is equipped with elastic compression layer, for flexible compression circuit board;Support foot is installed in the four corners of lower bottom plate, for adjusting device horizontal state.The utility model structure is reasonable, positioning precision is high, and adaptability is strong, can effectively prevent circuit board from misplacement before laminating, while avoiding surface damage caused by compression process, suitable for multilayer circuit board positioning operation of multiple specifications.

Description

Technical Field

[0001] This utility model relates to the field of circuit board manufacturing equipment technology, and more specifically to a positioning device for a multilayer composite circuit board. Background Technology

[0002] With the rapid development of the modern electronics industry, circuit board manufacturing is gradually evolving towards higher density, higher performance, and thinner designs. Especially in high-end applications such as smartphones, 5G communication equipment, automotive electronics, industrial control, and aerospace, multilayer printed circuit boards (MLPCBs) have become a core electronic carrier structure. These boards typically consist of three or more single-sided or double-sided circuit boards, separated by insulating layers and laminated together, offering advantages such as high wiring density, stable electrical performance, and small size.

[0003] In the manufacturing process of multilayer boards, interlayer lamination and positioning is a critical step that directly determines the wiring alignment accuracy and reliability of the finished circuit board. Specifically, before lamination, each layer of the circuit board must be accurately stacked according to the design requirements and kept in a stable relative position during the lamination process. Otherwise, defects such as misalignment, interlayer misalignment, broken wires, short circuits, and warping can easily occur, seriously affecting the product yield.

[0004] The mainstream lamination positioning methods currently include the following categories:

[0005] 1. Pin and positioning hole method: Holes are pre-drilled in the circuit board, and metal or plastic positioning pins are inserted for fixation. This method has a simple structure, but the positioning pins are mostly of fixed size, resulting in poor adaptability; at the same time, micro-displacement is prone to occur during repeated insertion and removal or hot pressing, making it difficult to achieve high-precision positioning, especially in large-size boards.

[0006] 2. Limiting clamp fixing method: This method uses edge limiting blocks or mechanical grippers to constrain the edges of the circuit board, which is suitable for boards without pre-drilled holes. However, most of these clamping methods can only achieve two-dimensional constraints and cannot effectively adjust for the micro-deformation of the circuit board caused by thermal expansion and contraction, which can easily lead to an increase in interlayer alignment errors.

[0007] 3. Vacuum adsorption platform method: Used in high-end manufacturing, the circuit board is fixed on the platform surface by negative pressure. It has good flatness, but the structure is complex, the cost is high, it is not suitable for batch and rapid tooling change, and mechanical limiting or manual alignment operation is still required for the edge of the board.

[0008] 4. Pressing mold integration method: Some large-scale automated production lines integrate the positioning structure with the pressing mold, but this limits the mold's versatility, results in long mold replacement cycles, complex debugging, and an inability to flexibly adapt to different product batches.

[0009] In addition, existing positioning structures generally suffer from the following technical problems:

[0010] Insufficient positioning accuracy: There is often a gap between the positioning pin and the hole, which makes it difficult to maintain constant center alignment, especially under the thermal expansion and contraction of the sheet material.

[0011] Poor adaptability: The fixed locating pin structure makes it difficult to adapt to plates of different thicknesses or hole diameters, and it lacks elastic buffering capability.

[0012] Unstable structure: The clamps and pins are mostly rigid structures, lacking springback or flexible adjustment functions, and are prone to displacement after the application of pressure.

[0013] Uneven compression: Traditional pressure plates or cover plates are made of rigid materials and do not take into account the protection of the circuit board surface, which can easily cause local indentations or damage.

[0014] In summary, current positioning devices for multilayer composite circuit boards still have significant shortcomings in terms of structural adaptability, ease of operation, positioning accuracy, and clamping protection. There is an urgent need for a new type of device with a reasonable structural design, strong adaptability, gentle clamping, and reliable positioning to meet the pressing needs of modern electronics manufacturing industry for high-precision, high-efficiency, and multi-specification product production. Utility Model Content

[0015] The purpose of this invention is to provide a multilayer composite circuit board positioning device with a reasonable structure, suitable for circuit boards of various thicknesses, and with automatic reset and flexible clamping functions, so as to solve the problems of insufficient positioning accuracy, uneven clamping, and easy damage to the board material in the prior art.

[0016] To achieve the above objectives, this utility model provides the following technical solution:

[0017] A positioning device for a multilayer composite circuit board, comprising:

[0018] The base assembly consists of an upper base plate and a lower base plate, which are connected and supported by multiple support columns. The upper base plate is provided with multiple mounting holes.

[0019] Multiple positioning components are respectively installed in the mounting holes of the upper base plate, and each positioning component includes:

[0020] The positioning column is arranged vertically, and its upper end has a conical tip structure;

[0021] A guide sleeve is fixedly mounted on the upper base plate to accommodate the positioning post;

[0022] An elastic element, disposed inside the guide sleeve and located below the positioning post, is used to support and reset the positioning post;

[0023] A pressure plate is disposed above the positioning component. The pressure plate is connected to the upper base plate through multiple retractable support columns. The retractable support columns include a connecting section or a threaded adjustment section with a relatively movable structure, which is used to shorten its length when the pressure plate is pressed down, so that the pressure plate can exert a pressing effect on the circuit board.

[0024] An elastic clamping layer is provided on the lower surface of the pressure plate, covering the contact area between the pressure plate and the circuit board, to provide flexible cushioning and uniform pressing force;

[0025] Multiple support feet are located at the four corners of the bottom plate. The height of the support feet is adjustable to adjust the level and stability of the overall device.

[0026] Preferably, the support column has a sleeve-slide rod structure or a spiral locking structure, which is used to achieve vertical extension and retraction during the pressing of the pressure plate and to automatically reset in the released state.

[0027] Preferably, the elastic pressing layer is an integrally molded silicone cushioning pad, which has high elasticity and compressive strength, and is suitable for uniform pressing of circuit boards.

[0028] Preferably, the inner wall of the guide sleeve is provided with a low-friction coating to improve the sliding flexibility and stability of the positioning post.

[0029] Preferably, the outer peripheral surface of the positioning post is provided with annular or spiral anti-slip ridges to enhance its positioning stability when inserted into the circuit board hole.

[0030] As can be seen from the above technical solution, compared with the prior art, the present invention has the following beneficial effects:

[0031] 1. Through the cooperation of the guide sleeve and the positioning post, and the reset support of the elastic element, the precise automatic alignment of the multilayer circuit board is achieved;

[0032] 2. The pressure plate is connected to the base plate via a telescopic support column, which allows for flexible height adjustment during the pressing process, effectively accommodating circuit boards of different thicknesses, and returning to its original position after use;

[0033] 3. The elastic clamping layer is made of flexible material, which effectively prevents damage to the circuit board during the pressure application process and improves the yield of finished products;

[0034] 4. The adjustable support legs ensure the horizontal stability of the entire device on different platforms;

[0035] 5. The overall structure is simple, the positioning stability is high, and it has good practicality and manufacturing feasibility. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0037] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0038] Figure 2 This is a structural cross-sectional view of the positioning component.

[0039] 1-Upper base plate; 11-Lower base plate; 2-Positioning component; 21-Positioning column; 22-Guide sleeve; 23-Elastic element; 3-Pressure plate; 31-Elastic pressing layer; 4-Supporting foot; 41-Retractable support column. Detailed Implementation

[0040] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0041] Example

[0042] like Figure 1 and Figure 2 As shown, this utility model provides a positioning device for the processing of multilayer composite circuit boards, which mainly includes: an upper base plate 1, a lower base plate 11, multiple positioning components 2, a pressure plate 3, an elastic pressing layer 31, several retractable support columns 41, and support feet 4 installed at the four corners of the base.

[0043] The upper base plate 1 and the lower base plate 11 are fixedly connected by four retractable support columns 41, and the support feet 4 provide bottom support and level adjustment. The upper surface of the upper base plate 1 has multiple positioning component mounting holes arranged in a matrix for mounting positioning components 2, enabling multi-point positioning of the multilayer composite circuit board. The lower base plate 11 provides overall support, counterweight, and enhanced stability. It can be made of rigid materials such as aluminum alloy, steel plate, or engineering plastics, with the appropriate material and thickness selected according to the specific equipment load requirements.

[0044] The positioning assembly 2 includes a positioning post 21, a guide sleeve 22, and an elastic element 23. The guide sleeve 22 is fixedly installed in the mounting hole of the upper base plate 1, and its inner cavity is a through-hole structure to accommodate the sliding stroke of the positioning post 21. The guide sleeve 22 is preferably made of wear-resistant and self-lubricating material, such as polytetrafluoroethylene reinforced engineering plastic or copper-based alloy, and its inner wall is provided with a lubricating coating, which can effectively reduce the frictional resistance when the positioning post 21 slides, and improve its service life and operational sensitivity.

[0045] The positioning post 21 is a solid cylindrical rod structure with a tapered tip at its upper end, providing excellent guiding and insertion capabilities for quick and precise alignment with the positioning holes on the circuit board. Its lower end extends to the bottom of the guide sleeve 22, where it connects with the elastic element 23. The elastic element 23 is a helical compression spring, fitted around the lower end of the positioning post 21 and pressed against the bottom of the guide sleeve 22, providing stable upward vertical elastic support. This allows the positioning post 21 to buffer and automatically reset when inserted into or removed from the circuit board hole.

[0046] Preferably, the outer circular surface of the positioning post 21 is machined with several circular or spiral anti-slip ridges. This structure can effectively increase the friction between the positioning post and the inner hole of the circuit board, prevent the board layer from sliding laterally or rotating during the positioning process, and further enhance the positioning accuracy and stability.

[0047] The pressure plate 3 is positioned above the positioning assembly 2 and connected to the upper base plate 1 via four retractable support columns 41. The support columns 41 are adjustable, allowing for manual or electric extension and retraction in the vertical direction. Preferably, they are metal columns with a sleeve sliding structure or an internal / external thread linkage mechanism. Their upper ends are fixedly connected to the pressure plate 3, and their lower ends are fixedly connected to the upper base plate 1. When pressing multi-layer circuit boards, the operator can manually rotate the adjustment knob on the support column 41 or use the quick-release button to reduce the overall length of the support column, thereby moving the pressure plate 3 downwards. An elastic pressing layer 31 is provided at the bottom of the pressure plate 3. This elastic pressing layer 31 is made of highly elastic silicone material, typically 2 to 5 millimeters thick, and has good cushioning and heat resistance. During the pressing process, it effectively disperses the applied force, preventing mechanical damage or deformation of the circuit board due to concentrated localized force on the pressure plate.

[0048] The bottom plate 11 has four support feet 4 at its corners. The support feet 4 have a threaded rotating structure and rubber anti-slip pads on their bottoms to enhance friction and adapt to work platforms made of different materials. Users can manually rotate the adjustment knob at the top of the support feet 4 to adjust their extension length, thereby achieving fine-tuning and leveling of the base as a whole, ensuring that the equipment can stably and accurately complete positioning tasks in various environments.

[0049] The implementation process is as follows:

[0050] 1. Equipment preparation: Place the lower base plate 11 on a flat workbench and adjust the support feet 4 to make the entire positioning device horizontal.

[0051] 2. Pre-laying the circuit board: Prepare a multi-layer composite circuit board. Manually insert the alignment holes of each layer of the board into the multiple positioning posts 21 located on the surface of the upper base plate 1. Guided by the conical tip, the multi-layer board will naturally fall into the accurate position, completing the initial alignment between layers.

[0052] 3. Pressing and fixing: Operate the telescopic support column 41 to retract it inward and drive the pressure plate 3 to slowly descend. The elastic pressing layer 31 below the pressure plate 3 contacts the upper surface of the circuit board and applies downward pressure. Under the flexible deformation of the silicone layer, a uniformly distributed pressing force is formed, which effectively compacts each layer structure and prevents displacement in subsequent hot pressing or welding processes.

[0053] 4. Subsequent processes: After positioning and clamping, the entire circuit board can be sent to a hot press, curing machine or testing platform for further processing without disassembly, ensuring operational efficiency and accuracy.

[0054] 5. Release and disassembly: After processing is completed, operate the support column 41 to reset, so that the pressure plate 3 is raised, releasing the clamping force on the circuit board. Then the board can be taken out and the next cycle can be started.

[0055] Application Expansion and Adaptability

[0056] The structural design of this utility model supports modular assembly. The number and arrangement of the positioning components 2 can be flexibly set according to the size of the circuit board, making it suitable for positioning requirements of circuit boards of various sizes and layers. The positioning posts 21, guide sleeves 22, pressure plates 3, and other components are all detachable and replaceable, facilitating maintenance and upgrades. By replacing the elastic element 23 or adjusting the elastic parameters, it can adapt to circuit boards of different thicknesses and materials, further expanding its application range.

[0057] This device is particularly suitable for circuit board manufacturing scenarios that require high positioning accuracy, high stack-up consistency and high efficiency, such as production lines for high-frequency and high-speed PCBs, HDI boards, rigid-flex boards, server motherboards and automotive electronics.

[0058] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A positioning device for a multilayer composite circuit board, characterized in that, include: The base assembly consists of an upper base plate (1) and a lower base plate (11). The upper base plate (1) and the lower base plate (11) are connected and supported by multiple support columns (41). The upper base plate (1) is provided with multiple mounting holes. Multiple positioning components (2) are respectively installed in the mounting holes of the upper base plate (1), and each positioning component (2) includes: Positioning column (21) is arranged vertically, and its upper end is a conical tip structure; A guide sleeve (22) is fixedly mounted on the upper base plate (1) to accommodate the positioning post (21); An elastic element (23) is disposed inside the guide sleeve (22) and located below the positioning post (21) to support and reset the positioning post (21); A pressure plate (3) is disposed above the positioning component (2). The pressure plate (3) is connected to the upper base plate (1) through multiple telescopic support columns (41). The telescopic support column (41) includes a connecting section or a threaded adjustment section with a relatively movable structure, which is used to shorten its length when the pressure plate (3) is pressed down, so that the pressure plate (3) exerts a pressing effect on the circuit board. An elastic clamping layer (31) is disposed on the lower surface of the pressure plate (3) and covers the contact area between the pressure plate (3) and the circuit board to provide flexible buffering and uniform pressing force; Multiple support feet (4) are set at the four corners of the bottom plate (11). The support feet (4) are height adjustable to adjust the horizontal state and stability of the overall device.

2. The positioning device according to claim 1, characterized in that, The support column (41) has a sleeve-slide rod structure or a spiral locking structure, which is used to extend and retract vertically during the pressing process of the pressure plate (3) and automatically reset in the released state.

3. The positioning device according to claim 1, characterized in that, The elastic pressing layer (31) is an integrally molded silicone cushioning pad with high elasticity and pressure resistance, suitable for uniform pressing of circuit boards.

4. The positioning device according to claim 1, characterized in that, The inner wall of the guide sleeve (22) is provided with a low-friction coating to improve the sliding flexibility and stability of the positioning post (21).

5. The positioning device according to claim 1, characterized in that, The outer circumferential surface of the positioning post (21) is provided with annular or spiral anti-slip ridges to enhance its positioning stability when inserted into the circuit board hole.

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