Electronic radiator for electronic components

Abstract

The utility model provides an electronic radiator for electronic components heat dissipation belongs to electronic components heat management technical field, include: heat dissipation base plate, mounting seat, brushless DC fan, connecting seat and fin, the side of heat dissipation base plate is provided with the ventilation opening, the bottom of heat dissipation base plate is installed with mounting seat through bolt, the inside lower extreme of heat dissipation base plate is installed with brushless DC fan through bolt, the utility model a plurality of groups of fin of fin of heat dissipation piece can absorb heat from heat source part, and the fin and connecting piece of fin of heat dissipation piece are in arched distribution, and gradually protrude from both sides to the middle, help heat dissipation piece to absorb heat from heat source part fully, and rapidly transmit to the area around, can shorten the heat transfer path, avoid the area of electronic components power density too high and appear the overheated spot, make the heat progressive area conduction, compared with traditional centralized conduction, can improve the heat dissipation efficiency of electronic components.

Description

Technical Field

[0001] This utility model relates to the field of thermal management technology for electronic components, and in particular to an electronic heat sink for heat dissipation of electronic components. Background Technology

[0002] Electronic heat sinks are heat dissipation devices designed specifically for high-power electronic components. They conduct heat to the air or cooling medium through natural cooling or forced air cooling, and are commonly found in power supplies, graphics cards, switching transistors, and other devices. Traditional electronic heat sinks, such as aluminum extruded heat sinks, have low heat conduction efficiency. The thermal conductivity of a single metal material is limited, and the fins of aluminum extruded heat sinks are aligned side by side and highly uniform, resulting in the same heat transfer path between them and electronic components. During heat conduction, heat is concentrated and can easily form local hot spots in high-power scenarios, causing damage to electronic components. Therefore, this application provides an electronic heat sink for heat dissipation of electronic components to meet the requirements. Utility Model Content

[0003] The purpose of this invention is to solve the problems existing in the above-mentioned background technology by proposing an electronic heat sink for heat dissipation of electronic components.

[0004] To solve the above-mentioned technical problems, this utility model provides the following technical solution: An electronic heat sink for heat dissipation of electronic components includes: a heat dissipation substrate, a mounting base, a brushless DC fan, a connector, and heat sink fins. The heat dissipation substrate has ventilation openings on its side. The mounting base is bolted to the bottom of the heat dissipation substrate. A brushless DC fan is bolted to the lower interior of the heat dissipation substrate. An air outlet is provided at the upper end of the brushless DC fan housing. A heat dissipation vent is provided on the front of the brushless DC fan housing. A connector is welded to the upper interior of the heat dissipation substrate, and heat sink fins are mounted thereon via the connector.

[0005] Preferably, the heat sink is composed of several sets of fins and connecting pieces, and the fins are fixed together by the connecting pieces.

[0006] Preferably, the fins are provided with a number of heat-conducting grooves, which are distributed in a long strip shape on both the front and back sides of the fins.

[0007] Preferably, the heat-conducting groove has a "V" shaped cross-section, and the groove is filled with graphene-nano silver composite thermal conductive paste.

[0008] Preferably, the fins and connecting pieces of the heat sink are arranged in an arch shape, gradually bulging from both sides towards the middle.

[0009] Preferably, the connecting piece is located at the middle of the side of the fin, and a rectangular strip-shaped guide groove is formed on the connecting piece.

[0010] Preferably, the heat sink is located directly above the brushless DC fan, and the air outlet of the brushless DC fan faces the bottom of the heat sink.

[0011] Preferably, there is a gap between the heat sink and the brushless DC fan, and the vent is located on the outside of the heat sink and the brushless DC fan.

[0012] Compared with the prior art, this utility model has at least the following beneficial effects: In the above scheme, the heat sink consists of several sets of fins and connecting plates. The fins of the heat sink can absorb heat from the heat source. The fins and connecting plates of the heat sink are arranged in an arch shape, gradually bulging from both sides to the middle. This helps the heat sink to fully absorb heat from the heat source and quickly transfer it to the surrounding area. This can shorten the heat transfer path and avoid hot spots in areas with high power density of electronic components. This allows for progressive heat conduction, which can improve the heat dissipation efficiency of electronic components compared to traditional centralized conduction.

[0013] In the above solution, by opening a ventilation port on the side of the heat sink substrate, the ventilation port is located outside the heat sink and the brushless DC fan. This allows some of the air blown out by the brushless DC fan to be discharged from the ventilation port after contacting the bottom of the heat sink. This improves the airflow between the heat sink and the brushless DC fan, thereby improving the cooling efficiency of the heat sink, reducing the temperature difference, and minimizing the large difference in heat dissipation in the heat sink area. This effectively improves the overall heat dissipation efficiency of the electronic heat sink. Attached Figure Description

[0014] The accompanying drawings, which are incorporated herein and form part of the specification, illustrate embodiments of the present disclosure and, together with the specification, further serve to explain the principles of the present disclosure and enable those skilled in the art to implement and use the present disclosure.

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the specific structure of the brushless DC fan of this utility model; Figure 3 This is a schematic diagram of the specific structure of the heat sink of this utility model; Figure 4 This is a top view of the heat sink structure of this utility model.

[0016] [Figure Labels] 1-Heat dissipation base plate; 2-Mounting base; 3-Brushless DC fan; 4-Connector base; 5-Heat dissipation fin; 101-Ventilation port; 301-Air outlet; 302-Heat dissipation port; 501-Fin; 502-Heat conduction groove; 503-Connecting piece; 504-Flow guide groove.

[0017] As shown in the figure, specific structures and devices are marked in the figure to clearly illustrate the structure of the embodiments of this utility model. However, this is only for illustrative purposes and is not intended to limit this utility model to the specific structure, device and environment. According to specific needs, those skilled in the art can adjust or modify these devices and environments, and such adjustments or modifications are still included in the scope of the appended claims. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0020] like Figure 1 , Figure 2 , Figure 3 and Figure 4 An electronic heat sink for heat dissipation of electronic components is shown in the present invention. The embodiment includes: a heat dissipation substrate 1, a mounting base 2, a brushless DC fan 3, a connecting base 4, and a heat sink 5. A ventilation opening 101 is provided on the side of the heat dissipation substrate 1. The mounting base 2 is bolted to the bottom of the heat dissipation substrate 1. The brushless DC fan 3 is bolted to the lower end of the interior of the heat dissipation substrate 1. An air outlet 301 is provided at the upper end of the housing of the brushless DC fan 3. A heat dissipation opening 302 is provided on the front of the housing of the brushless DC fan 3. The connecting base 4 is welded to the upper end of the interior of the heat dissipation substrate 1. The heat sink 5 is mounted to the upper end of the interior of the heat dissipation substrate 1 via the connecting base 4.

[0021] In this embodiment, the heat sink 5 is composed of several sets of fins 501 and connecting pieces 503. The fins 501 are fixed together by the connecting pieces 503. The several sets of fins 501 of the heat sink 5 can absorb heat from the heat source.

[0022] In this embodiment, a number of heat conduction grooves 502 are provided on the fin 501. The heat conduction grooves 502 are distributed in a long strip shape on both sides of the fin 501, which can ensure the contact area between the heat conduction grooves 502 and the air.

[0023] In this embodiment, the heat conduction groove 502 has a "V" shaped cross section. The groove of the heat conduction groove 502 is filled with graphene-nano silver composite thermal conductive paste, which can improve the thermal conductivity of the heat sink 5 and make the heat sink 5 absorb heat more efficiently.

[0024] In this embodiment, the fins 501 and connecting pieces 503 of the heat sink 5 are arranged in an arch shape, gradually protruding from both sides to the middle. This helps the heat sink 5 to fully absorb heat from the heat source and quickly transfer it to the surrounding area, so that the heat is conducted in a progressive manner. Compared with the traditional centralized conduction, this can improve the heat dissipation efficiency.

[0025] In this embodiment, the connecting piece 503 is located in the middle of the side of the fin 501. A rectangular strip-shaped guide groove 504 is provided on the connecting piece 503 so that the heat between the fins 501 of the heat sink 5 can be conducted vertically. After the brushless DC fan 3 is working, the air outlet 301 blows air directly towards the lower end of the heat sink 5. The guide groove 504 can blow the air upward to ensure the contact area with the fins 501.

[0026] In this embodiment, the heat sink 5 is located directly above the brushless DC fan 3, and the air outlet 301 of the brushless DC fan 3 faces the bottom of the heat sink 5.

[0027] In this embodiment, there is a gap between the heat sink 5 and the brushless DC fan 3, and the vent 101 is located on the outside of the heat sink 5 and the brushless DC fan 3. This allows some of the air blown out from the brushless DC fan to be discharged from the vent 101 after contacting the bottom of the heat sink 5. This improves the airflow between the heat sink 5 and the brushless DC fan 3, thereby improving the cooling efficiency of the heat sink 5, reducing the temperature difference, and minimizing the large temperature difference in the heat sink 5 area. This effectively improves the overall heat dissipation efficiency of the electronic heat sink.

[0028] This utility model encompasses any substitutions, modifications, equivalent methods, and solutions made within the spirit and scope of this utility model. To provide the public with a thorough understanding of this utility model, specific details are described in detail in the following preferred embodiments; however, those skilled in the art will fully understand this utility model even without these detailed descriptions. Furthermore, to avoid unnecessary confusion regarding the essence of this utility model, well-known methods, processes, procedures, components, and circuits are not described in detail.

[0029] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. An electronic heat sink for heat dissipation of electronic components, characterized in that, include: The heat dissipation substrate (1), mounting base (2), brushless DC fan (3), connecting base (4) and heat sink (5) are provided. The heat dissipation substrate (1) has a ventilation opening (101) on its side. The mounting base (2) is installed on the bottom of the heat dissipation substrate (1) by bolts. The brushless DC fan (3) is installed on the lower end of the interior of the heat dissipation substrate (1) by bolts. The upper end of the housing of the brushless DC fan (3) is provided with an air outlet (301). The front of the housing of the brushless DC fan (3) is provided with a heat dissipation opening (302). The connecting base (4) is welded to the upper end of the interior of the heat dissipation substrate (1). The heat sink (5) is installed on the upper end of the interior of the heat dissipation substrate (1) through the connecting base (4).

2. The electronic heat sink for heat dissipation of electronic components according to claim 1, characterized in that: The heat sink (5) is composed of several sets of fins (501) and connecting pieces (503), and the fins (501) are fixed together by the connecting pieces (503).

3. The electronic heat sink for heat dissipation of electronic components according to claim 2, characterized in that: The fin (501) has several sets of heat conduction grooves (502), which are distributed in a long strip shape on both sides of the fin (501).

4. The electronic heat sink for heat dissipation of electronic components according to claim 3, characterized in that: The heat-conducting groove (502) has a "V" shaped cross section, and the groove of the heat-conducting groove (502) is filled with graphene-nano silver composite heat-conducting paste.

5. The electronic heat sink for heat dissipation of electronic components according to claim 2, characterized in that: The fins (501) and connecting pieces (503) of the heat sink (5) are arranged in an arch shape, gradually protruding from both sides to the middle.

6. The electronic heat sink for heat dissipation of electronic components according to claim 2, characterized in that: The connecting piece (503) is located in the middle of the side of the fin (501), and a rectangular strip-shaped guide groove (504) is provided on the connecting piece (503).

7. The electronic heat sink for heat dissipation of electronic components according to claim 1, characterized in that: The heat sink (5) is located directly above the brushless DC fan (3), and the air outlet (301) of the brushless DC fan (3) is directly opposite the bottom of the heat sink (5).

8. The electronic heat sink for heat dissipation of electronic components according to claim 1, characterized in that: There is a gap between the heat sink (5) and the brushless DC fan (3), and the vent (101) is located on the outside of the heat sink (5) and the brushless DC fan (3).

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