Three-dimensional heat dissipation device and immersion cooling system

Abstract

The present application relates to a three-dimensional heat dissipation device and an immersion cooling system. The three-dimensional heat dissipation device comprises a base, a vapor chamber assembly and an evaporation structure layer. The vapor chamber assembly comprises a first vapor chamber, a second vapor chamber and a plurality of heat pipes. The first vapor chamber is located on the base and has a first internal space. The second vapor chamber is opposite to the first vapor chamber and has a second internal space. The heat pipes are located between the first vapor chamber and the second vapor chamber. Each heat pipe is connected to the first vapor chamber and the second vapor chamber respectively and has a pipe internal space communicating with the first internal space and the second internal space, so that the first internal space, the second internal space and the pipe internal space jointly form an airtight chamber. The evaporation structure layer covers and is in thermal conduction connection with the vapor chamber assembly. Through the above structure, the three-dimensional heat dissipation device and the immersion cooling system of the present application can effectively cool and dissipate heat for the to-be-cooled element, so as to maintain the working efficiency and service life of the to-be-cooled element.

Description

Technical Field

[0001] This invention relates to a three-dimensional heat dissipation device, particularly a three-dimensional heat dissipation device with a heat spreader and an immersion cooling system. Background Technology

[0002] In recent years, with the significant increase in processing power of electronic devices (such as computers or servers) used in cloud services, these devices generate a large amount of waste heat. Some manufacturers immerse the components of electronic devices that need to be cooled (such as CPUs and GPUs) in a closed tank of working fluid to remove the heat generated by these components.

[0003] However, if the current cooling system lacks effective heat dissipation methods, it will be unable to effectively cool and dissipate heat from the components to be cooled, which may affect the working performance and service life of the components to be cooled.

[0004] However, the aforementioned technologies still have inconveniences and shortcomings, requiring further improvement. Therefore, how to effectively solve these inconveniences and shortcomings is one of the important research and development topics at present, and has become a goal that urgently needs improvement in related fields. Summary of the Invention

[0005] This invention proposes a three-dimensional heat dissipation device and an immersion cooling system to solve the problems of prior art.

[0006] According to one embodiment of the present invention, a three-dimensional heat dissipation device includes a base, a vapor chamber assembly, and at least one evaporation structure layer. The vapor chamber assembly includes a first vapor chamber, a second vapor chamber, and a plurality of heat pipes. The first vapor chamber is located on the base and defines a first internal space therein. The second vapor chamber is opposite to the first vapor chamber and defines a second internal space therein. The heat pipes are located between the first and second vapor chambers. Each heat pipe connects the first and second vapor chambers respectively and defines an internal space within it that communicates with the first and second internal spaces, such that the first internal space, the second internal space, and these internal spaces together constitute an airtight chamber. The evaporation structure layer covers and thermally connects to the vapor chamber assembly.

[0007] According to one or more embodiments of the present invention, in the above-described three-dimensional heat dissipation device, the first vapor chamber includes a first inner surface and a first outer surface that are opposite to each other. The first inner surface faces the second vapor chamber and is connected to the heat pipes. The first outer surface protrudes outward with a top portion. The evaporation structure layer includes a plurality of first evaporation structure layers, which respectively and fixedly cover the first inner surface and the first outer surface of the first vapor chamber.

[0008] According to one or more embodiments of the present invention, in the above-described three-dimensional heat dissipation device, the first heat spreader further includes a plurality of first perforations and a plurality of first connecting portions. These first perforations are spaced apart on the first inner surface and are respectively passed through by the heat pipes. Each first connecting portion connects to the first inner surface, surrounds one of the first perforations, and fixes one of the heat pipes.

[0009] According to one or more embodiments of the present invention, in the above-described three-dimensional heat dissipation device, the second vapor chamber includes a second inner surface and a second outer surface that are opposite to each other. The second inner surface faces the first vapor chamber and is connected to the heat pipes. The evaporation structure layer includes a plurality of second evaporation structure layers, which respectively and fixedly cover the second inner surface and the second outer surface of the second vapor chamber.

[0010] According to one or more embodiments of the present invention, in the above-described three-dimensional heat dissipation device, the second heat spreader further includes a plurality of second perforations and a plurality of second connecting portions. These second perforations are spaced apart on the second inner surface and are respectively passed through by the heat pipes. Each second connecting portion connects to the first inner surface, surrounds one of the second perforations, and fixes one of the heat pipes.

[0011] According to one or more embodiments of the present invention, in the above-described three-dimensional heat dissipation device, the size of the first heat exchange plate is larger than the size of the second heat exchange plate.

[0012] According to one or more embodiments of the present invention, in the above-described three-dimensional heat dissipation device, the evaporation structure layer has a plurality of filaments that interweave to form a plurality of gaps.

[0013] According to one or more embodiments of the present invention, in the above-mentioned three-dimensional heat dissipation device, the evaporation structure layer is a single-layer or multi-layer structure.

[0014] According to one or more embodiments of the present invention, in the above-mentioned three-dimensional heat dissipation device, the evaporation structure layer is composed of a powder sintered body, a mesh body, a fiber body, a groove, whiskers, or thermally conductive foam.

[0015] According to one embodiment of the present invention, an immersion cooling system includes a liquid container, a heat source module, and the aforementioned three-dimensional heat dissipation device. The liquid container has an inner chamber for storing coolant. The heat source module is located inside the liquid container and is immersed in the coolant. The three-dimensional heat dissipation device is located inside the liquid container and is thermally connected to the heat source module. The long axis of the liquid container is parallel to the long axis of the heat spreader assembly and orthogonal to the long axis of each heat pipe.

[0016] Thus, through the above architecture, the three-dimensional heat dissipation device and immersion cooling system of this invention can effectively cool and dissipate heat from the components to be cooled, so as to maintain the working performance and service life of the components to be cooled.

[0017] The above description is only used to illustrate the problem that this creation aims to solve, the technical means to solve the problem, and the effects it produces. The specific details of this creation will be described in detail in the implementation methods and related diagrams below. Attached Figure Description

[0018] To make the above and other objects, features, advantages and embodiments of this invention more apparent and understandable, the accompanying drawings are described below:

[0019] Figure 1 This is a perspective view of a three-dimensional heat dissipation device according to an embodiment of the present invention.

[0020] Figure 2 for Figure 1 An exploded view of the three-dimensional heat dissipation device.

[0021] Figure 3 for Figure 1 A cross-sectional view along line segment AA.

[0022] Figure 4 for Figure 1 A cross-sectional view along line segment BB.

[0023] Figure 5 This is a schematic diagram of an immersion cooling system according to an embodiment of the present invention.

[0024] The reference numerals in the attached figures are explained as follows:

[0025] 10: Three-dimensional heat dissipation device

[0026] 100: Base

[0027] 110: Framework

[0028] 120: Opening

[0029] 130: Elastic Clip

[0030] 200: Heat spreader assembly

[0031] 210: First heat spreader

[0032] 211: First inner face

[0033] 212: First outside

[0034] 213: Top and back sections

[0035] 221: First perforation section

[0036] 222: First connecting part

[0037] 230: First Interior Space

[0038] 240: Capillary structure

[0039] 250: Second heat spreader

[0040] 251: Second inner face

[0041] 252: Second outside

[0042] 253: Second perforation section

[0043] 254: Second connecting part

[0044] 260: Second Interior Space

[0045] 300: Heat pipe

[0046] 310: Internal space

[0047] 320: Airtight Chamber

[0048] 400: First evaporation structure layer

[0049] 410: First internal evaporation structure layer

[0050] 411: Through-hole

[0051] 420: First external evaporation structure layer

[0052] 500: Second evaporation structure layer

[0053] 510: Second internal evaporation structure layer

[0054] 511: Through-hole

[0055] 520: Second external evaporation structure layer

[0056] 600: Immersion Cooling System

[0057] 610: Liquid containers

[0058] 611: Inner Chamber

[0059] 611A: Inner wall

[0060] 620: Coolant

[0061] 700: Heat source module

[0062] 710: Circuit Board

[0063] 720: Electronic Components

[0064] AA, BB: line segments

[0065] G: Gap

[0066] X, Y, Z: Axes Detailed Implementation

[0067] The following diagrams disclose various embodiments of this invention. For clarity, many practical details will be described in the following description. However, those skilled in the art will understand that these practical details are not essential in some embodiments of this invention and should not be used to limit the invention. Furthermore, for the sake of simplicity, some conventional structures and components are shown in a simplified schematic manner. Additionally, for ease of viewing, the dimensions of the components in the diagrams are not drawn to scale.

[0068] Figure 1 A perspective view of a three-dimensional heat dissipation device 10 according to an embodiment of this invention. Figure 2 for Figure 1 An exploded view of the three-dimensional heat dissipation device 10. Figure 3 for Figure 1 A sectional view along line segment AA. (e.g.) Figures 1 to 3 As shown, in this embodiment, the three-dimensional heat dissipation device 10 includes a base 100, a vapor chamber assembly 200, and multiple evaporation structure layers (such as a first evaporation structure layer 400 and a second evaporation structure layer 500). The vapor chamber assembly 200 includes a first vapor chamber 210, a second vapor chamber 250, and multiple (e.g., six) heat pipes 300. The first vapor chamber 210 is located on the base 100 and is used to conduct heat to connect the component to be cooled (not shown in the figure). The second vapor chamber 250 is configured relative to the first vapor chamber 210, and the first vapor chamber 210 and the second vapor chamber 250 are completely separated, that is, the first vapor chamber 210 and the second vapor chamber 250 have gaps between them. These heat pipes 300 are located between the first vapor chamber 210 and the second vapor chamber 250. Each heat pipe 300 is connected to the first vapor chamber 210 and the second vapor chamber 250 respectively. A first internal space 230 is defined within the first vapor chamber 210, and a second internal space 260 is defined within the second vapor chamber 250. Each heat pipe 300 has an internal space 310 connecting the first internal space 230 and the second internal space 260, such that the first internal space 230, the second internal space 260, and these internal spaces 310 together constitute an airtight chamber 320, which is filled with a working fluid (not shown in the figure). An evaporation structure layer covers and thermally connects to the vapor chamber assembly 200.

[0069] In this way, the heat energy of the element to be cooled can be distributed to the heat pipes 300 and the second heat spreader 250 through the working fluid (not shown in the figure) in the heat spreader assembly 200, and then evenly dissipated to the outside through the evaporation structure layer.

[0070] More specifically, in this embodiment, the base 100 includes a frame 110 and a plurality of elastic clips 130. The frame 110 can be welded or locked to the first heat spreader 210. The elastic clips 130 are located on two opposite sides of the frame 110 for fixing the frame 110 to a stationary component (such as a housing or wiring board). The frame 110 has a plurality of openings 120. These openings 120 are arranged sequentially along the long axis (such as the Y-axis) of the frame 110 and are located between the elastic clips 130.

[0071] Figure 4 for Figure 1 A sectional view created along line segment BB. (Example) Figure 3 and Figure 4 As shown, the first vapor chamber 210 is generally plate-shaped and extends along the XY axis. The first vapor chamber 210 has a first inner surface 211 and a first outer surface 212 that are opposite each other. The first inner surface 211 faces the second vapor chamber 250 and is connected to the heat pipes 300. The first outer surface 212 has an outwardly projecting abutment 213 that extends from one of the openings 120 of the frame 110 to abut against the element to be cooled.

[0072] The first vapor chamber 210 further includes a plurality of first perforations 221 and a plurality of first connecting portions 222. These first perforations 221 are spaced apart on the first inner surface 211, connecting to the first internal space 230, and are respectively passed through by the heat pipes 300. Each first connecting portion 222 connects to the first inner surface 211 of the first vapor chamber 210, is coaxially aligned and surrounds one of the first perforations 221, and is fixed to the corresponding heat pipe 300. For example, each first connecting portion 222 is fixed to the corresponding heat pipe 300 through a first solder layer (not shown), and the first solder layer (not shown) is directly located between the first connecting portion 222 and the corresponding heat pipe 300, so that the heat pipe 300 can be more securely confined on the first vapor chamber 210; and the first connecting portion 222 and the first vapor chamber 210 are integrally formed; however, this invention is not limited to this.

[0073] The second heat spreader 250 is generally plate-shaped and extends along the XY axis. The second heat spreader 250 has a second inner surface 251 and a second outer surface 252 that are opposite to each other. The second inner surface 251 of the second heat spreader 250 faces the first inner surface 211 of the first heat spreader 210 and overlaps with the first inner surface 211 of the first heat spreader 210 on the Z axis.

[0074] The second vapor chamber 250 further includes a plurality of second perforations 253 and a plurality of second connecting portions 254. These second perforations 253 are spaced apart on the second inner surface 251, connecting to the second internal space 260, and are respectively passed through by the heat pipes 300. Each second connecting portion 254 connects to the second inner surface 251 of the second vapor chamber 250, is coaxially aligned and surrounds one of the second perforations 253, and is fixed to the corresponding heat pipe 300. For example, each second connecting portion 254 is fixed to the corresponding heat pipe 300 through a second solder layer (not shown), and the second solder layer (not shown) is directly located between the second connecting portion 254 and the corresponding heat pipe 300, so that the heat pipe 300 can be more securely confined on the second vapor chamber 250; and the second connecting portion 254 and the second vapor chamber 250 are integrally formed; however, the invention is not limited thereto.

[0075] These heat pipes 300 are straight and arranged parallel to each other between the first vapor chamber 210 and the second vapor chamber 250. Each heat pipe 300 extends along the Z-axis, with one end inserted vertically into the first connecting portion 222 of the first vapor chamber 210 and the other end inserted vertically into the second connecting portion 254 of the second vapor chamber 250. In this embodiment, the major axis direction (e.g., the Z-axis) of the heat pipe 300 is orthogonal to the major axis direction (e.g., the Y-axis) of the first vapor chamber 210 and the second vapor chamber 250; however, this invention is not limited thereto.

[0076] In this embodiment, the size of the first heat spreader 210 is larger than the size of the second heat spreader 250, that is, the first internal space 230 of the first heat spreader 210 is larger than the second internal space 260 of the second heat spreader 250. However, this invention is not limited to this.

[0077] The evaporation structure layer includes multiple first evaporation structure layers 400, which respectively and fixedly cover the first inner surface 211 and the first outer surface 212 of the first heat spreader 210. More specifically, the first evaporation structure layer 400 is divided into a first inner evaporation structure layer 410 and a first outer evaporation structure layer 420. The first inner evaporation structure layer 410 directly covers the first inner surface 211 of the first heat spreader 210. The first outer evaporation structure layer 420 directly covers the first outer surface 212 of the first heat spreader 210 and is exposed through another opening 120 of the frame 110. However, the invention is not limited to this; in other embodiments, the first evaporation structure layer 400 may only have a first inner evaporation structure layer 410.

[0078] In this embodiment, the first evaporation structure layer 400 completely surrounds the heat pipes 300 on the first inner surface 211 of the first heat spreader 210, that is, the heat pipes 300 extend into the through holes 411 formed by the first inner evaporation structure layer 410 respectively. However, this invention is not limited to this.

[0079] The first evaporation structure layer 400 is a powder sintered body, mesh, fiber, groove, whisker, or thermally conductive foam formed on the first heat spreader 210; however, this invention is not limited to this.

[0080] In this embodiment, the first evaporation structure layer 400 is a mesh structure, hence also called the first mesh structure layer, which has many filaments (not shown in the figure) that interweave to form multiple gaps. Therefore, these gaps allow more fluid (such as gas or liquid) to pass through and carry away more heat energy from the element to be cooled; however, this invention is not limited to this.

[0081] Furthermore, in this embodiment, the first evaporation structure layer 400 is a multi-layer structure with layers stacked sequentially on each other. However, this invention is not limited to this. In other embodiments, the first evaporation structure layer 400 may also be a single-layer structure.

[0082] The evaporation structure layer includes multiple second evaporation structure layers 500. These second evaporation structure layers 500 are fixedly covered by the second inner surface 251 and the second outer surface 252 of the second heat spreader 250. More specifically, the second evaporation structure layer 500 is divided into a second inner evaporation structure layer 510 and a second outer evaporation structure layer 520. The second inner evaporation structure layer 510 directly covers the second inner surface 251 of the second heat spreader 250. The second outer evaporation structure layer 520 directly covers the second outer surface 252 of the second heat spreader 250.

[0083] In this embodiment, the second evaporation structure layer 500 completely surrounds the heat pipes 300 on the second inner surface 251 of the second heat spreader 250, that is, the heat pipes 300 extend into the through holes 511 formed by the second inner evaporation structure layer 510 respectively. However, the invention is not limited to this.

[0084] For example, the second evaporation structure layer 500 may be a powder sintered body, mesh, fiber, groove, whisker, or thermally conductive foam formed on the second heat spreader 250; however, this invention is not limited to this.

[0085] In this embodiment, the second evaporation structure layer 500 is a mesh structure, hence also called the second mesh structure layer, which has many filaments (not shown in the figure) that interweave to form multiple gaps. Therefore, these gaps allow more fluid (such as gas or liquid) to pass through and carry away more heat energy from the element to be cooled; however, this invention is not limited to this.

[0086] Furthermore, in this embodiment, the second evaporation structure layer 500 is a multi-layer structure with layers stacked sequentially on each other. However, this invention is not limited to this, and in other embodiments, the second evaporation structure layer 500 may also be a single-layer structure.

[0087] Furthermore, the airtight chamber 320 of the heat spreader assembly 200 includes a capillary structure 240. The capillary structure 240 is disposed on the inner surface of the airtight chamber 320, allowing the working fluid within the airtight chamber 320 to flow under the guidance of the capillary structure 240. The capillary structure 240, the first evaporation structure layer 400, and the second evaporation structure layer 500 can be similar components. For example, the capillary structure 240 can be made of a powder sintered body, a mesh body, a fiber body, a groove, whiskers, or any combination thereof, but this invention is not limited thereto.

[0088] It should be understood that this creation is not limited to the number of vapor chamber, heat pipe 300, first evaporation structure layer 400 and second evaporation structure layer 500.

[0089] Figure 5 This is a schematic diagram of an immersion cooling system 600 according to an embodiment of the present invention. Figure 5 As shown, the immersion cooling system 600 includes a liquid container 610, a heat source module 700, and the aforementioned three-dimensional heat dissipation device 10. The liquid container 610 has an inner chamber 611 for storing coolant 620. The heat source module 700 is located within the liquid container 610 and is immersed in the coolant 620. The three-dimensional heat dissipation device 10 is located within the liquid container 610 and is thermally connected to the heat source module 700.

[0090] Thus, when the heat energy of the heat source module 700 is transferred to the heat spreader assembly 200 of the three-dimensional heat dissipation device 10, since all surfaces of the first evaporation structure layer 400 and the second evaporation structure layer 500 are in contact with the coolant 620, some of the heat energy transferred to the first evaporation structure layer 400 and the second evaporation structure layer 500 can be quickly transferred into the coolant 620, thereby effectively removing the heat energy of the heat source module 700.

[0091] Furthermore, in this embodiment, the three-dimensional heat dissipation device 10 is located upright in the inner cavity 611, and the long axis direction (e.g., Z-axis) of the liquid container 610 is parallel to the long axis direction (e.g., Z-axis) of the heat spreader assembly 200, and orthogonal to the long axis direction (e.g., Y-axis) of each heat pipe 300.

[0092] In this way, the coolant 620 can enter the gap G between the first heat spreader 210, the second heat spreader 250 and the heat pipe 300, and the first evaporation structure layer 400 and the second evaporation structure layer 500, so that the coolant 620 evaporates into bubbles due to heat and rises along the Z-axis to the surface of the coolant 620, thereby quickly dissipating heat from the heat source module 700.

[0093] For example, the immersion cooling system 600 is a server device, and the liquid container 610 is a 1U server chassis; the heat source module 700 includes a circuit board 710 and several electronic components 720. The circuit board 710 is vertically fixed to the inner wall 611A of the liquid container 610. The electronic components 720 are distributed on the circuit board 710 and are in contact with the top portion 213 of the heat spreader. In this embodiment, the electronic components 720 are conventional components such as CPUs, GPUs, or interface cards; however, this invention is not limited to these.

[0094] Thus, through the above architecture, the three-dimensional heat dissipation device and immersion cooling system of this invention can effectively cool and dissipate heat from the components to be cooled, thereby maintaining the working efficiency and service life of the components to be cooled.

[0095] Finally, the embodiments disclosed above are not intended to limit this invention. Any person skilled in the art may make various modifications and refinements without departing from the spirit and scope of this invention, and all such modifications and refinements shall be protected under this invention. Therefore, the scope of protection of this invention shall be determined by the appended claims.

Claims

1. A three-dimensional heat dissipation device, characterized in that, include: A base; A heat spreader assembly, comprising: A first heat spreader is located on the base, and a first internal space is defined therein; A second heat exchanger, relative to the first heat exchanger, and having a second internal space defined therein; and Multiple heat pipes are located between the first vapor chamber and the second vapor chamber. Each heat pipe is connected to both the first and second vapor chambers and has a pipe-shaped internal space that connects the first internal space and the second internal space, such that the first internal space, the second internal space, and the pipe-shaped internal space together form an airtight chamber. At least one evaporation structure layer covers and thermally connects the vapor chamber assembly.

2. The three-dimensional heat dissipation device as described in claim 1, characterized in that, The first vapor chamber includes a first inner surface and a first outer surface that are opposite to each other. The first inner surface faces the second vapor chamber and is connected to the plurality of heat pipes. The first outer surface protrudes outward with a top portion. The at least one evaporation structure layer comprises a plurality of first evaporation structure layers, the plurality of first evaporation structure layers respectively fixedly covering the first inner surface and the first outer surface of the first heat spreader.

3. The three-dimensional heat dissipation device as described in claim 2, characterized in that, The first heat spreader further includes: Multiple first perforations are spaced apart on the first inner surface and are respectively passed through by the multiple heat pipes; and A plurality of first connecting portions, each of which is connected to the first inner surface, surrounds one of the plurality of first perforated portions, and fixes one of the plurality of heat pipes.

4. The three-dimensional heat dissipation device as described in claim 1, characterized in that, The second vapor chamber includes a second inner surface and a second outer surface that are opposite to each other. The second inner surface faces the first vapor chamber and is connected to the plurality of heat pipes. The at least one evaporation structure layer includes a plurality of second evaporation structure layers, the plurality of second evaporation structure layers respectively fixedly covering the second inner surface and the second outer surface of the second heat spreader.

5. The three-dimensional heat dissipation device as described in claim 4, characterized in that, The second heat spreader further includes: Multiple second perforations are spaced apart on the second inner surface and are respectively passed through by the multiple heat pipes; and A plurality of second connecting portions, each of which connects to the second inner surface, surrounds one of the plurality of second perforations, and fixes one of the plurality of heat pipes.

6. The three-dimensional heat dissipation device as described in claim 1, characterized in that, The size of the first temperature distribution plate is larger than the size of the second temperature distribution plate.

7. The three-dimensional heat dissipation device as described in claim 1, characterized in that, The at least one evaporation structure layer has a plurality of filaments that are interwoven to form a plurality of voids.

8. The three-dimensional heat dissipation device as described in claim 1, characterized in that, The at least one evaporation structure layer is a single-layer or multi-layer structure.

9. The three-dimensional heat dissipation device as described in claim 1, characterized in that, The at least one evaporation structure layer is composed of a powder sintered body, a mesh body, a fiber body, a groove, whiskers, or thermally conductive foam.

10. An immersion cooling system, characterized in that, include: A liquid container having an internal chamber for storing coolant; A heat source module is located inside the liquid container and is used to be immersed in the coolant; as well as The three-dimensional heat dissipation device as described in any one of claims 1 to 9 is located inside the liquid container and is thermally connected to the heat source module. The long axis of the liquid container is parallel to the long axis of the heat spreader assembly and orthogonal to the long axis of each of the plurality of heat pipes.

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