A high light efficiency LED light source packaging structure

Abstract

The utility model discloses a high light -efficient LED light source packaging structure, including the overflow slot, the packaging support, the packaging lens, the filling layer, the bulge of packaging support and LED chip, the overflow slot is located the first inside wall of bulge, and the overflow slot surrounds the packaging lens a circle, the utility model discloses by extruding the packaging lens downwards, makes the air of filling layer and the excess filling of flowing into the overflow slot, then the excess filling in the inside of overflow slot passes the gravity to do secondary replacement with the mode of backflow. Through the setting of overflow slot makes the excess filling not to contaminate the surface of packaging lens, has reached the effect of reducing the air volume of filling layer and indirectly fixed packaging lens.

Description

Technical Field

[0001] This utility model relates to the field of light-emitting diode packaging structure technology, specifically to a high-efficiency light-emitting diode light source packaging structure. Background Technology

[0002] Currently, LED (light-emitting diode) packaging structures are mainly divided into ordinary LED (light-emitting diode) packaging structures and ultraviolet LED (light-emitting diode) packaging structures. Ordinary LED (light-emitting diode) packaging structures use white light plus colored light sources, while ultraviolet LED (light-emitting diode) packaging structures use ultraviolet light sources.

[0003] Both standard LED (light-emitting diode) and ultraviolet LED (light-emitting diode) packaging structures consist of a package holder, an LED chip, and a packaging lens. However, the packaging lens of a standard LED is generally made of silicone, which allows it to fit tightly against the LED chip.

[0004] The encapsulation lenses of ultraviolet LED (light-emitting diode) light sources are typically made of optical glass or quartz glass, which cannot be precisely bonded to the LED chip. Therefore, conventional ultraviolet LED light source packages have a gap between the LED chip and the encapsulation lens. This gap affects the overall light extraction efficiency, leading to the development of a technique that fills the gap with a material to improve overall light extraction efficiency. However, during the filling process, it is difficult to control the quality of the filler, resulting in problems such as filler overflow and difficulty in venting some gases from the filler layer. Therefore, how to effectively solve the problems of filler overflow and effectively reduce the presence of gases in the filler layer is an important research topic.

[0005] Based on past practical experience, the traditional ultraviolet LED (light-emitting diode) packaging structure uses a miniature structure to solve the problem of filler material overflow and gas effective discharge. However, this miniature structure is adjacent to the filler layer, and the filler material can easily come into contact with it, causing some gas in the filler layer to not have time to be discharged. Summary of the Invention

[0006] The technical problem to be solved by this utility model is how to solve the problem of excess filler in the filling layer contaminating the surface of the encapsulated lens. The purpose is to provide a high-efficiency LED light source encapsulation structure to solve the problem that excess filler in the filling layer overflows and contaminates the surface of the encapsulated lens when the encapsulated lens is installed.

[0007] This utility model is achieved through the following technical solution: A high-efficiency LED light source packaging structure includes a packaging bracket. The upper surface of the packaging bracket has an annular protrusion with upward circumference. The inner sidewall of the protrusion has two stepped platforms and two stepped inner sidewalls. The two stepped platforms each include a first platform and a second platform that is lower than the first platform but higher than the loading surface of the packaging bracket. The two stepped inner sidewalls each include a first inner sidewall connecting the first platform and the second platform and a second inner sidewall connecting the second platform and the loading surface of the packaging bracket. A filling layer is located on the loading surface of the packaging bracket. A packaging lens is mounted on the second platform. There is a filling layer between the bottom surface of the packaging lens and the loading surface of the packaging bracket. The upper surface of the filling layer, the second platform, and the bottom surface of the packaging lens are located on the same dielectric interface. The structure also includes an overflow groove for filling excess filler that overflows from the second platform. The overflow groove is located on the first inner sidewall of the protrusion and surrounds the packaging lens. There is a gap between the first inner sidewall of the protrusion and the packaging lens, through which excess filler flows into the overflow groove. The purpose of setting the overflow groove on the raised first inner sidewall is to make the overflow groove higher than the filler layer. An overflow groove that can accommodate excess filler is set on the sidewall of the package holder to prevent excess filler from contaminating the surface of the packaged lens.

[0008] Furthermore, the overflow trough is positioned higher than the medium connection surface. When the encapsulation lens is installed, the encapsulation lens is squeezed, causing the filler to overflow. During this process, air will flow out from the gap between the filler layer and the encapsulation lens. The overflow trough is higher than the bonding surface between the encapsulation lens and the filler layer so that the filler flowing into the overflow trough can be refluxed by gravity and undergo a secondary displacement in the filler layer.

[0009] Furthermore, the longitudinal section of the overflow channel is square or rectangular. A rectangle can better fill excess filler from the filler layer through the second and third gaps. At the same time, when the excess filler solidifies in the overflow channel, the solidified filler can also serve to fix the encapsulated lens.

[0010] Furthermore, the side length of the overflow trough is 0.07-0.13 mm. Since the machine cannot precisely measure the side length to a single number during the fabrication of this overflow trough, a range is set to ensure the regularity of the overflow trough's side length.

[0011] Furthermore, the three-dimensional shape of the encapsulated lens is a hemisphere or a cuboid. Hemispheres and cuboids allow the light emitted by the LED chip to diverge in one direction.

[0012] Furthermore, the height of the overflow groove from the dielectric interface between the encapsulation lens and the filler layer is 0.03-0.05 mm. This height range is set because there are two scenarios where the dielectric interface is higher than the overflow groove: first, the bottom surface of the overflow groove and the dielectric interface can be on the same horizontal line; second, the overflow groove is 0.03-0.05 mm higher than the dielectric interface. However, in the second scenario, the gravity during filler return is better than in the first.

[0013] Furthermore, the gap is divided into upper and lower layers by the overflow channel. The upper and lower gaps respectively include a first gap above the overflow channel and a second gap below the overflow channel. A third gap is left between the encapsulated lens and the second platform. Excess filler from the filling layer flows into the second gap through the third gap. The excess filler fills the second gap and flows into the overflow channel. The second and third gaps are the channels for excess filler to flow from the filling layer into the overflow channel. During the downward pressing of the encapsulated lens, the bottom surface of the encapsulated lens and the filling layer will form a gradually decreasing third gap. At this time, excess filler flows into the second gap below the overflow channel through this gradually decreasing third gap, and finally flows into the overflow channel through the second gap. Finally, the excess filler in the third gap, the excess filler in the second gap, and the excess filler in the overflow channel are combined into one.

[0014] Furthermore, the first gap above the overflow channel contains adhesive. Filling the first gap with adhesive serves to further secure the encapsulation lens to the encapsulation bracket.

[0015] Furthermore, an LED chip is embedded within the filler layer. When the LED chip is powered on and emits light, the light travels directly from the surface of the LED chip to the surface of the encapsulated lens, and finally radiates outwards.

[0016] Compared with the prior art, this utility model has the following advantages and beneficial effects: 1. This utility model provides a high-efficiency LED light source packaging structure. Traditional packaging structures are sealed filling layers, which require strict control of the amount of filler and leave some air inside the filling layer. Compared with traditional packaging structures, this utility model does not require strict control of the amount of filler and can even use more, while also greatly reducing the amount of air remaining in the filling layer.

[0017] 2. This utility model provides a high-efficiency LED light source packaging structure. The filling layer of the traditional packaging structure is only used to improve the light utilization rate. However, this utility model not only improves the light utilization rate, but also better fixes the packaging lens. Attached Figure Description

[0018] The accompanying drawings, which are included to provide a further understanding of the embodiments of the present invention and form part of this application, do not constitute a limitation thereof. In the drawings: Figure 1 This is a cross-sectional view of the structure of this utility model along the bb direction.

[0019] Figure 2 This is a top view of the new structure used in this invention.

[0020] Figure 3 This uses a novel structure Figure 1 Enlarged view of point A in the middle.

[0021] The attached diagram shows the markings and corresponding component names: 1- Overflow channel, 2- Encapsulation bracket, 3- Encapsulation lens, 4- Filler layer, 41- Filler hardened body, 5- Protrusion, 6- LED chip, 7- Adhesive. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the embodiments and accompanying drawings. The illustrative embodiments and descriptions of this utility model are only used to explain this utility model and are not intended to limit this utility model.

[0023] Example 1 Firstly, a high-efficiency LED light source packaging structure, such as Figure 1 As shown, the upper surface of the packaging bracket 2 has annular protrusions 5 extending upwards from all four sides. The inner sidewall of the protrusions 5 has two stepped platforms and two stepped inner sidewalls. The two stepped platforms each include a first platform and a second platform that is lower than the first platform but higher than the loading surface of the packaging bracket 2. The two stepped inner sidewalls each include a first inner sidewall connecting the first platform and the second platform and a second inner sidewall connecting the second platform and the loading surface of the packaging bracket 2. The filling layer 4 located on the loading surface of the packaging bracket 2 is installed on the second... The encapsulated lens 3 is mounted on the platform. A filling layer 4 exists between the bottom surface of the encapsulated lens 3 and the loading surface of the encapsulation support 2. The upper surface of the filling layer 4, the second platform, and the bottom surface of the encapsulated lens 3 are located on the same dielectric interface. The platform also includes an overflow trough 1 for filling excess filler material that overflows from the filling layer 4 via the second platform. The overflow trough 1 is located on the first inner sidewall of the protrusion 5 and surrounds the encapsulated lens 3. A gap exists between the first inner sidewall of the protrusion 5 and the encapsulated lens 3, allowing excess filler material to flow into the overflow trough 1 through the gap. The overflow trough 1 is positioned on the first inner sidewall of the protrusion 5 to ensure it is higher than the filling layer 4. The overflow trough 1, located on the sidewall of the encapsulation support 2, is designed to accommodate excess filler material, preventing it from contaminating the surface of the encapsulated lens 3.

[0024] Specifically, the overflow trough 1 is positioned higher than the medium connection surface. When the encapsulation lens 3 is installed, the encapsulation lens 3 is squeezed, causing the filler to overflow. During this process, air will flow out from the gap between the filling layer 4 and the encapsulation lens 3. The overflow trough 1 is higher than the bonding surface between the encapsulation lens 3 and the filling layer 4 so that the filler flowing into the overflow trough 1 can be refluxed by gravity and undergo a secondary replacement in the filling layer 4.

[0025] Specifically, the longitudinal section of the overflow groove 1 is square or rectangular. A rectangle can better fill the excess filler from the filler layer 4 through the second and third gaps. At the same time, when the excess filler solidifies in the overflow groove 1, the solidified filler can also serve to fix the encapsulated lens 3.

[0026] Specifically, the side length of the overflow trough 1 is 0.07-0.13 mm. When processing this overflow trough 1, the machine cannot make the side length accurate to a certain number, so a range is set to ensure the regularity of the side length of the overflow trough 1.

[0027] Specifically, the height of the overflow trough 1 from the dielectric interface between the encapsulation lens 3 and the filling layer 4 is 0.03-0.05 mm. This height range is set because there are two scenarios where the dielectric interface is higher than the overflow trough 1: first, the bottom surface of the overflow trough 1 and the dielectric interface can be on the same horizontal line; second, the overflow trough 1 is 0.03-0.05 mm higher than the dielectric interface. However, in the second scenario, the gravity during filler return is better than in the first.

[0028] Specifically, the three-dimensional shape of the encapsulated lens 3 is a hemisphere or a cuboid. The hemisphere and cuboid shape allow the light emitted by the LED chip 6 to radiate in one direction. Specifically, the gap is divided into upper and lower layers by the overflow trough 1. The upper and lower gaps include a first gap above the overflow trough 1 and a second gap below the overflow trough 1, respectively. A third gap is left between the encapsulated lens and the second platform. Excess filler from the filling layer 4 flows into the second gap through the third gap, filling the second gap and then flowing into the overflow trough 1. During the downward pressing of the encapsulated lens 3, the bottom surface of the encapsulated lens 3 and the filling layer 4 form a gradually decreasing third gap. At this time, excess filler flows into the second gap below the overflow trough 1 through this gradually decreasing third gap, and finally flows into the overflow trough 1 through the second gap. Finally, the excess filler in the third gap, the excess filler in the second gap, and the excess filler in the overflow trough 1 are combined into one.

[0029] Specifically, the first gap above the overflow trough 1 contains adhesive 7. The purpose of filling the first gap with adhesive 7 is to further secure the encapsulated lens 3 to the encapsulation bracket 2.

[0030] Specifically, an LED chip 6 is installed inside the filling layer. When the LED chip 6 is powered on and emits light, the light travels directly from the surface of the LED chip 6 to the surface of the encapsulation lens 3, and finally radiates outward.

[0031] The working principle of this embodiment is explained as follows: First, the filler is filled to a position slightly higher than the filler layer 4. Then, the encapsulation lens 3 is pressed downwards, forming a gradually narrowing third gap between the bottom surface of the encapsulation lens 3 and the filler layer 4. At this time, since the mass of air is less than that of the filler, the priority of air outflow is greater than that of the filler. Next, the air at the top of the filler layer 4 flows preferentially into the overflow trough 1. Then, the excess filler mixed with air flows into the second gap below the overflow trough 1 through the gradually narrowing third gap. The encapsulation lens 3 is pressed downwards until it is completely adhered to the filler layer 4. The excess filler flows into the second gap below the overflow trough 1 and into the interior of the overflow trough 1. Finally, because there is air and filler flowing into the overflow trough 1, the pressure at the top of the overflow trough 1 is relatively high. Most of the air is at the top of the overflow trough 1, and most of the filler is at the bottom of the overflow trough 1. The filler also forms a backflow state due to gravity. Compared to existing designs that are close to the filler and cannot achieve reflux, the present invention improves the position of the overflow trough 1 by placing it higher than the filler layer 4. This allows for secondary displacement via gravity through reflux, thus completely expelling the air from the filler layer 4. Finally, after the reflux of the filler is complete and the air is completely expelled, a hardened filler body 41 is obtained.

[0032] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of this utility model. It should be understood that the above description is only a specific embodiment of this utility model and is not intended to limit the scope of protection of this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A high-efficiency LED light source packaging structure, comprising a packaging bracket (2), the upper surface of the packaging bracket (2) having an annular protrusion (5) extending upwards from all four sides, the protrusion (5) having two stepped platforms and two stepped inner sidewalls, the two stepped platforms respectively including a first platform and a second platform lower than the first platform and higher than the surface of the packaging bracket (2), the two stepped inner sidewalls respectively including a first inner sidewall connecting the first platform and the second platform, and a second inner sidewall connecting the second platform and the loading surface of the packaging bracket (2); a packaging lens (3) mounted on the second platform, the bottom surface of the packaging lens (3) having a filling layer (4) between the loading surface of the packaging lens (3) and the loading surface of the packaging bracket (2), the upper surface of the filling layer (4), the second platform and the bottom surface of the packaging lens (3) being located on the same dielectric connection surface, characterized in that, It also includes an overflow trough (1) for filling the filler layer (4) with excess filler that overflows through the second platform. The overflow trough (1) is located on the first inner sidewall of the protrusion (5) and the overflow trough (1) surrounds the encapsulation lens (3). There is a gap between the first inner sidewall of the protrusion (5) and the encapsulation lens (3), and the excess filler flows into the overflow trough (1) through the gap.

2. The high-efficiency LED light source packaging structure according to claim 1, characterized in that, The overflow trough (1) is positioned higher than the medium connection surface.

3. The high-efficiency LED light source packaging structure according to claim 1, characterized in that... The longitudinal section of the overflow trough (1) is square or rectangular.

4. The high-efficiency LED light source packaging structure according to claim 3, characterized in that... The side length of the overflow trough (1) is 0.07-0.13 mm.

5. The high-efficiency LED light source packaging structure according to claim 1, characterized in that, The height of the overflow groove (1) from the dielectric connection surface between the encapsulation lens (3) and the filling layer (4) is 0.03-0.05 mm.

6. The high-efficiency LED light source packaging structure according to claim 1, characterized in that, The three-dimensional shape of the encapsulated lens (3) is a hemisphere or a cuboid.

7. The high-efficiency LED light source packaging structure according to claim 2, characterized in that, The gap is divided into upper and lower layers by the overflow trough (1). The upper and lower gaps include a first gap located above the overflow trough (1) and a second gap located below the overflow trough (1). The encapsulated lens (3) and the second platform have a third gap. Excess filler flows into the second gap through the third gap. The excess filler fills the second gap and flows into the overflow trough (1).

8. The high-efficiency LED light source packaging structure according to claim 7, characterized in that, The first gap above the overflow trough (1) contains adhesive (7).

9. The high-efficiency LED light source packaging structure according to claim 1, characterized in that, The filling layer (4) contains an LED chip (6).

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