Bonding tool and bonding apparatus

Abstract

The utility model discloses a kind of bonding tool and bonding device, it is related to the technical field of semiconductor material processing.The bonding tool is used to carry out alignment to two semiconductor substrates, including bearing part, pusher assembly and two above limit components, bearing part is used to carry semiconductor substrate.Two above limit components and pusher assembly are all arranged in the circumferential side of bearing part.The limit direction of at least two limit components in two above limit components intersects, and two above limit components are set to be scalable along the direction of bearing part to selectively form limit area.Pusher assembly can push semiconductor substrate to limit area.When pusher assembly pushes semiconductor substrate to this limit area, whether semiconductor substrate is square or circular, the limit area can constrain the freedom of semiconductor substrate two above directions.Pusher assembly actively exert directional force and limit area jointly form stable multi-point positioning, so that two semiconductor substrates accurately superpose alignment.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor material processing technology, and in particular to a bonding fixture and bonding device. Background Technology

[0002] In the field of semiconductor material processing technology, wafer bonding technology is a key process for realizing three-dimensional integration, manufacturing microelectromechanical systems (MEMS), and advanced packaging. Wafer alignment and holding fixtures are an important component of the semiconductor manufacturing process. Their main function is to assist in aligning two wafers and stably hold them after alignment for smooth transfer to the next process step.

[0003] With the advancement of bonding technology, the shape of semiconductor substrates has evolved from the existing circular wafers to many different shapes, such as square wafers; however, existing bonding fixtures cannot simultaneously achieve precise alignment of square wafers and circular wafers.

[0004] Therefore, in order to improve the applicability of bonding fixtures, it is urgent to design a bonding fixture that is suitable for both square wafers and round wafers. Utility Model Content

[0005] The purpose of this invention is to provide a bonding fixture and bonding device that can align circular wafers and square wafers, thereby improving the applicability of the bonding fixture.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] A bonding fixture for aligning two semiconductor substrates, including:

[0008] Carrier component, used to support semiconductor substrate;

[0009] Two or more limiting components are disposed on the periphery of the carrier, at least two of the limiting components have intersecting limiting directions, and the two or more limiting components are extendable and retractable in the direction pointing to the carrier to selectively form a limiting area.

[0010] A pushing component is disposed on the periphery of the carrier, the pushing component being capable of pushing the semiconductor substrate toward the limiting region.

[0011] As an optional embodiment of the bonding fixture, the pushing component is a single component located on opposite sides of two or more limiting components and on the center line of the two or more limiting components. The pushing component pushes the semiconductor substrate so that the semiconductor substrate abuts against both or more limiting components.

[0012] As an optional solution for the bonding tooling, there are two or more pushing components, each corresponding to a limiting component. The pushing components push the semiconductor substrate so that the semiconductor substrate and the limiting component opposite to the pushing component come into contact.

[0013] As an optional embodiment of the bonding fixture, the limiting component has a working position and an avoidance position. The limiting component can switch between the working position and the avoidance position. When in the working position, the limiting component is used to cooperate with the pushing component to position the semiconductor substrate. When in the avoidance position, the limiting component is used to avoid the semiconductor substrate.

[0014] As an optional solution to the bonding fixture, the limiting component includes:

[0015] The mounting block is movably disposed on the support member;

[0016] The limiting member has one end fixed to the mounting block and the other end extending toward the center of the bearing member to form an abutment end;

[0017] Lock the handle, drive the mounting block to move to switch the position of the limiting member and lock the limiting member.

[0018] As an optional solution to the bonding fixture, the limiting component further includes:

[0019] A mounting base is fixed to the circumference of the support member, and the mounting base has a mounting cavity inside;

[0020] The mounting block has a first through hole, and one end of the limiting pin has a limiting head. The other end passes through the first through hole and the first elastic element in sequence and is fixed to the cavity wall of the mounting cavity.

[0021] The locking handle is rotatably connected to the limiting head, and the locking handle rotates to drive the mounting block to move.

[0022] As an optional embodiment of the bonding fixture, the locking handle includes:

[0023] The locking block has a first limiting surface, a second limiting surface, and a through hole. The first limiting surface and the second limiting surface are arranged adjacent to each other, and the distance from the axis of the through hole to the first limiting surface is less than the distance to the second limiting surface.

[0024] When the first limiting surface abuts against the mounting block, the limiting member is in the avoidance position; when the second limiting surface abuts against the mounting block, the limiting member is in the working position.

[0025] As an optional embodiment of the bonding fixture, the locking handle further includes:

[0026] The locking pin has a connecting hole, and the locking pin passes through the through hole and the connecting hole in sequence and is then axially fixed by the retaining ring.

[0027] As an optional embodiment of the bonding fixture, the pushing component includes:

[0028] A positioning base is fixed to the circumference of the bearing member, and the positioning base has a positioning cavity inside;

[0029] A pushing member, one end of which extends toward the center of the supporting member to form a pushing end;

[0030] The top block is fixed to the other end of the pusher and slides within the positioning cavity.

[0031] As an optional embodiment of the bonding fixture, the pushing component further includes:

[0032] The top block has a second through hole, one end of the positioning pin has a positioning head, and the other end passes through the second through hole and the second elastic element in sequence and is fixed to the cavity wall of the positioning cavity. The pushing member can drive the top block to move and compress the second elastic element, and reset under the elastic force of the second elastic element.

[0033] As an optional embodiment of the bonding fixture, the carrier includes a support ring and a carrier disk disposed within the support ring. The carrier disk has a carrier side and a non-carrier side. The carrier side is used to carry the semiconductor substrate, and the projection of the semiconductor substrate is completely located within the carrier side. The non-carrier side is used to receive external forces.

[0034] As an optional solution for the bonding tooling, the carrier disk is made of silicon carbide, and a graphite sheet is provided between the carrier side and the semiconductor substrate.

[0035] A bonding apparatus comprising bonding fixtures as described in any of the above embodiments.

[0036] The beneficial effects of this utility model are:

[0037] The bonding fixture provided by this utility model includes a carrier, a pushing component and two or more limiting components disposed on the periphery of the carrier. At least two of the limiting components have intersecting limiting directions, and the two or more limiting components can selectively form limiting regions along the direction pointing towards the carrier. These limiting regions constitute linear limiting boundaries. When the pushing component pushes the semiconductor substrate towards these limiting regions, regardless of whether the semiconductor substrate is square or circular, these limiting regions can constrain the semiconductor substrate's degrees of freedom in two or more directions. The pushing component actively applies a directional force to ensure that the semiconductor substrate inevitably and stably contacts the limiting points of the two or more limiting components. The two or more fixed limiting points and the actively applied pushing point work together to form a stable multi-point positioning, enabling precise stacking and alignment of two semiconductor substrates. This bonding fixture is suitable for aligning semiconductor substrates of different shapes, improving applicability while ensuring the accuracy of semiconductor substrate alignment.

[0038] The bonding apparatus provided by this invention, by applying the aforementioned bonding fixture, achieves precise alignment of semiconductor substrates of different shapes, improves applicability, and reduces production costs. Attached Figure Description

[0039] Figure 1 This is a schematic diagram of the bonding fixture provided in a specific embodiment of the present invention when aligning a square wafer;

[0040] Figure 2 This is a schematic diagram of the bonding fixture provided in a specific embodiment of the present invention when it is aligned with a circular wafer;

[0041] Figure 3 This is a schematic diagram of the structure of the limiting component provided in a specific embodiment of this utility model;

[0042] Figure 4 This is a front view of the limiting component provided in a specific embodiment of this utility model;

[0043] Figure 5 This is a cross-sectional view of the limiting component provided in a specific embodiment of this utility model;

[0044] Figure 6 This is a schematic diagram of the structure of the pushing component provided in a specific embodiment of this utility model;

[0045] Figure 7 This is a cross-sectional view of the pushing component provided in a specific embodiment of this utility model;

[0046] Figure 8 This is a cross-sectional view of the support member provided in a specific embodiment of this utility model;

[0047] Figure 9This is a cross-sectional view of the interval pressing component provided in a specific embodiment of this utility model;

[0048] Figure 10 yes Figure 9 A magnified view of a portion of point A in the middle.

[0049] In the picture:

[0050] 100. Square wafer; 200. Round wafer;

[0051] 1. Bearing component; 11. Support ring; 12. Bearing disc;

[0052] 2. Limiting component; 21. Mounting block; 22. Limiting element; 221. Abutting end; 222. Mounting hole; 23. Locking handle; 231. Locking block; 2311. First limiting surface; 2312. Second limiting surface; 232. Locking pin; 233. Operating handle; 24. Mounting base; 241. First flange; 25. Limiting pin; 26. First elastic element; 27. Retaining ring;

[0053] 3. Pushing component; 31. Positioning base; 311. Second flange; 32. Pushing element; 321. Pushing end; 322. Pushing handle; 33. Top block; 34. Positioning pin; 35. Second elastic element; 36. Positioning shaft;

[0054] 4. Graphite sheets;

[0055] 5. Interval pressing assembly; 51. Clamping component; 52. Spacer;

[0056] 6. Fixing components. Detailed Implementation

[0057] To make the technical problem solved by this utility model, the technical solution adopted, and the technical effect achieved clearer, the technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0058] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0059] Semiconductor substrates include various shapes such as circular wafers and square wafers. Since circular wafers are the mainstream shape for current semiconductor substrates, current bonding fixtures are generally designed for circular wafers, enabling precise alignment and smooth transport of two circular wafers. With advancements in bonding technology, the bonding of square wafers is becoming increasingly common. Existing bonding fixtures are only suitable for aligning circular wafers and cannot achieve precise alignment of square wafers.

[0060] To address the aforementioned technical problems, this embodiment provides a bonding fixture for aligning two semiconductor substrates. It is applicable not only to circular wafers but also to square wafers, improving the applicability of the bonding fixture and reducing production costs.

[0061] like Figure 1 and Figure 2 As shown, the bonding fixture includes a carrier 1, a pushing component 3, and two or more limiting components 2. The carrier 1 carries a semiconductor substrate. Both the limiting components 2 and the pushing component 3 are located on the periphery of the carrier 1. At least two of the limiting components 2 have intersecting limiting directions, and the two or more limiting components 2 are extendable and retractable along the direction pointing towards the carrier 1 to selectively form limiting regions. The pushing component 3 pushes the semiconductor substrate towards the limiting region. This limiting region constitutes a linear limiting boundary. When the pushing component 3 pushes the semiconductor substrate towards this limiting region, regardless of whether the semiconductor substrate is square or circular, this limiting region can constrain the semiconductor substrate's degrees of freedom in two or more directions. The pushing component 3 actively applies a directional force to ensure that the semiconductor substrate inevitably and stably contacts the limiting points of the two or more limiting components 2. The two or more fixed limiting points and the actively applied pushing point work together to form a stable multi-point positioning, enabling precise overlapping and alignment of the two semiconductor substrates. This bonding fixture is suitable for aligning semiconductor substrates of different shapes, improving applicability while ensuring the accuracy of semiconductor substrate alignment.

[0062] In one embodiment, there are two or more pushing components 3, and the pushing components 3 are set corresponding to the limiting components 2. The pushing components 3 push the semiconductor substrate so that the semiconductor substrate and the limiting components 2 opposite to the pushing components 3 can come into contact.

[0063] For example, such as Figure 1As shown, when the semiconductor substrate is a square wafer 100, three pushing components 3 and two limiting components 2 are provided. The two limiting components 2 are respectively provided on one pair of adjacent sides of the square wafer 100. On one side of the other pair of adjacent sides of the square wafer 100, two pushing components 3 are provided, and on the other side, one pushing component 3 is provided. When aligning the two square wafers 100, one of the pushing components 3 is operated first, so that the pushing component 3 pushes the side of the square wafer 100 corresponding to it until the opposite side of the square wafer 100 abuts against the corresponding limiting component 2; then, the other two pushing components 3 are operated simultaneously, so that the two pushing components 3 simultaneously push the other side of the square wafer 100 corresponding to it until the opposite side of the square wafer 100 abuts against the corresponding limiting component 2, thus realizing the alignment of the two square wafers 100.

[0064] In one embodiment, there is one pushing component 3, which is located on the opposite side of two or more limiting components 2 and on the center line of the two or more limiting components 2. The pushing component 3 pushes the semiconductor substrate so that the semiconductor substrate and the two limiting components 2 can simultaneously come into contact.

[0065] For example, such as Figure 2 As shown, when the semiconductor substrate is a circular wafer 200, the pushing component 3 is set to one and the limiting component 2 is set to two. The two limiting components 2 and the pushing component 3 are evenly distributed along the circumference of the carrier 1. The pushing component 3 pushes the two circular wafers 200, so that the other side of the two circular wafers 200 abuts against the two limiting components 2, thereby realizing the alignment of the two circular wafers 200.

[0066] In one embodiment, the limiting component 2 has a working position and a clearance position, and the limiting component 2 can switch between the working position and the clearance position. When in the working position, the limiting component 2 cooperates with the pushing component 3 to position the semiconductor substrate. When in the clearance position, the limiting component 2 is used to avoid contact with the semiconductor substrate. Before the semiconductor substrate is placed on the carrier 1, to prevent the semiconductor substrate from being damaged by contact with the limiting component 2 in the working position due to space constraints when placed on the carrier 1, the limiting component 2 is switched to the clearance position. After the semiconductor substrate is aligned, it is clamped and conveyed to the next bonding process. After the semiconductor substrate is clamped, the limiting component 2 is switched to the clearance position.

[0067] In one embodiment, such as Figures 3-5As shown, the limiting component 2 includes a mounting block 21, a limiting member 22, and a locking handle 23. The mounting block 21 is movably mounted on the support member 1. One end of the limiting member 22 is fixed to the mounting block 21, and the other end extends toward the center of the support member 1 to form an abutment end 221. The locking handle 23 drives the mounting block 21 to move to switch the position of the limiting member 22 and lock the limiting member 22. The locking handle 23 not only enables the position switching of the limiting member 22, but also enables locking after the position is switched, so as to ensure the stability of the position of the limiting component 2.

[0068] For example, a connecting plate is provided on one side of the mounting block 21, and the limiting member 22 is set as an elongated limiting plate. One end of the elongated limiting plate is provided with a mounting hole 222, and the connecting plate is provided with a first threaded hole. A first fastening screw passes through the mounting hole 222 and connects with the first threaded hole. Further, the mounting hole 222 is set as an oblong hole, so that when fixing the elongated limiting plate, the position of the elongated limiting plate can be finely adjusted to ensure the accuracy of alignment of the two semiconductor substrates.

[0069] Furthermore, the abutment end 221 is provided with an abutment plate. The side of the abutment plate that abuts against the semiconductor substrate is configured as a plane adapted to the square wafer 100. The plane can also push the circular wafer 200 by making point contact with it; or the side of the abutment plate that abuts against the semiconductor substrate is configured as an arc-shaped surface adapted to the circular wafer 200. Furthermore, the abutment plate and the elongated limiting plate are detachably connected.

[0070] In one embodiment, the limiting component 2 further includes a mounting base 24, a limiting pin 25, and a first elastic element 26, fixed circumferentially to the support member 1. The mounting base 24 has a mounting cavity. The mounting block 21 has a first through hole. One end of the limiting pin 25 has a limiting head, and the other end passes through the first through hole and the first elastic element 26 in sequence before being fixed to the cavity wall of the mounting cavity. The locking handle 23 is rotatably connected to the limiting head, and the locking handle 23 rotates to drive the mounting block 21 to move. The mounting base 24 provides rigid support for the limiting component 2, and the synergistic effect of the limiting pin 25 and the first elastic element 26 achieves precise guidance and elastic pre-tightening of the mounting block 21. The limiting pin 25 passes through the first through hole, reducing the radial offset of the limiting member 22 and ensuring that the limiting member 22 always maintains linear movement when switching positions.

[0071] For example, the top of the mounting base 24 is set as an opening, and first flanges 241 are provided on opposite sides of the opening. A first mounting groove is provided circumferentially on the support member 1, and the mounting base 24 is disposed in the first mounting groove. The first flanges 241 on both sides are fixedly connected to the support member 1 by second fastening screws. The limiting head of the limiting pin 25 is located in the mounting cavity, and the end of the limiting pin 25 away from the limiting head is fixedly connected to the cavity wall of the mounting cavity by means of threaded connection or interference fit. The first elastic member 26 is a first spring, which is located between the mounting block 21 and the cavity wall of the mounting cavity. Rotating the locking handle 23 can compress or release the compression force of the first spring, changing the position of the mounting block 21 in the mounting cavity, thereby causing the position of the limiting member 22 to change.

[0072] Of course, in other embodiments, a linear drive can be provided to drive the mounting block 21 to move linearly, thereby causing the limiting member 22 to switch positions.

[0073] In one embodiment, the locking handle 23 includes a locking block 231 and a locking pin 232. The locking block 231 has a first limiting surface 2311, a second limiting surface 2312, and a through hole. The first limiting surface 2311 and the second limiting surface 2312 are arranged adjacent to each other. The distance from the axis of the through hole to the first limiting surface 2311 is less than the distance to the second limiting surface 2312. When the first limiting surface 2311 abuts against the mounting block 21, the limiting member 22 is in a clearance position; when the second limiting surface 2312 abuts against the mounting block 21, the limiting member 22 is in a working position. This arrangement allows the locking block 231 to rotate 90° to switch between the working position and the clearance position. Because the distance from the axis of the through hole to the first limiting surface 2311 and the distance to the second limiting surface 2312 are different, after the locking block 231 rotates 90°, the mounting block 21 is displaced within the mounting cavity, causing the limiting member 22 to move and switch positions. The structure is simple and the operation is convenient.

[0074] The limiting head is provided with a connecting hole. The locking pin 232 passes through the through hole and the connecting hole in sequence and is then axially fixed by the retaining ring 27. The locking pin 232 connects the limiting pin 25 and the locking block 231, so that the locking block 231 can drive the limiting pin 25 to move together. This ensures that the locking block 231 will not move axially in the direction perpendicular to the moving direction of the locking pin 232, thereby ensuring that the abutting end 221 of the limiting member 22 always points to the center of the bearing member 1.

[0075] In one embodiment, the locking handle 23 further includes an operating handle 233 connected to the locking block 231, the operating handle 233 extending laterally from the locking block 231. By operating this laterally bent operating handle 233, the locking block 231 is driven to rotate around the axis of the locking pin 232, which significantly reduces the torque required for operation and makes operation more effortless; at the same time, the lateral extension design optimizes the operating space, making the switching of the position state of the limiting member 22 more convenient and efficient.

[0076] In one embodiment, such as Figure 6 and Figure 7 As shown, the pushing assembly 3 includes a positioning base 31, a pushing member 32, and a top block 33. The positioning base 31 is fixed to the circumference of the support member 1 and has a positioning cavity inside. One end of the pushing member 32 is a pushing end 321 and extends towards the center of the support member 1. The top block 33 is fixed to the other end of the pushing member 32 and slides within the positioning cavity. The positioning base 31 provides stable support for the pushing assembly 3. Manually pushing the pushing member 32 allows it to slide within the positioning cavity, thereby achieving a relatively long displacement and aligning the semiconductor substrate.

[0077] For example, the positioning base 31 has the same structure as the mounting base 24, with an open end at the top and second flanges 311 on opposite sides of the open end. The positioning base 31 is placed in the second mounting groove of the carrier 1, and the second flanges 311 abut against the upper surface of the carrier 1. The second flanges 311 are fixed to the carrier 1 by third fastening screws. At the same time, a guide groove is formed between the two second flanges 311 to guide the movement of the pusher 32.

[0078] The pusher 32 is configured as a long strip-shaped pusher plate, and the pusher end 321 of the pusher plate is configured as a plane. The plane abuts against the side of the square wafer 100 to push the square wafer 100. At the same time, the plane can also contact the outer periphery of the circular wafer 200 to push the circular wafer 200.

[0079] Of course, in other embodiments, when pushing the circular wafer 200, the pushing end 321 is configured as an arc-shaped surface adapted to the outer periphery of the circular wafer 200, and the arc-shaped surface abuts against the outer periphery of the circular wafer 200.

[0080] A push handle 322 is provided at the end of the push plate away from the push end 321. The push handle 322 is set higher than the push plate. The push handle 322 is positioned with the top block 33 through the positioning shaft 36 and is fixedly connected to the top block 33 through the fourth fastening screw.

[0081] In one embodiment, the pushing component 3 further includes a positioning pin 34 and a second elastic element 35. The top block 33 has a second through hole. One end of the positioning pin 34 has a positioning head, and the other end passes through the second through hole and the second elastic element 35 in sequence and is fixed to the cavity wall of the positioning cavity. The pushing component 32 can drive the top block 33 to move and compress the second elastic element 35, and reset under the elastic force of the second elastic element 35. The pushing component 32 moves towards the center of the bearing component 1, driving the top block 33 to move and compress the second elastic element 35. When the pushing component 32 pushes the semiconductor substrate to abut against the limiting component 22, the pushing component 32 is released, and the pushing component 32 automatically resets under the elastic restoring force of the second elastic element 35, improving the ease of operation, motion reliability, and space efficiency.

[0082] For example, the second elastic element 35 is a second spring. The positioning cavity has two opposing cavity walls, one of which has a stepped hole, and the other has a second threaded hole. The positioning pin 34 passes through the stepped hole from outside one cavity wall into the positioning cavity, then passes through the second through hole and the second spring in sequence, and is screwed into the second threaded hole. The positioning head of the positioning pin 34 is located in the larger hole of the stepped hole.

[0083] Both the pushing component 3 and the limiting component 2 are detachably connected to the carrier 1, and the number and position of the pushing component 3 and the limiting component 2 can be adjusted according to the shape of the semiconductor substrate.

[0084] Currently, in order to position and support semiconductor substrates of different sizes, the bonding force experienced by the semiconductor substrate at the location supported by the bonding fixture during bonding is relatively small. This results in uneven bonding force on the semiconductor substrate, and areas with insufficient bonding force are prone to forming loose bonding interfaces, leading to a decrease in product yield. To solve the above technical problems, the bonding fixture provided in this embodiment improves the support structure of the carrier 1 to achieve full-size bonding of the semiconductor substrate.

[0085] In one embodiment, continue to refer to Figure 1 , Figure 2 and Figure 8 The carrier 1 includes a support ring 11 and a carrier disk 12 disposed within the support ring 11. The carrier disk 12 has a carrier side and a non-carrier side. The carrier side is used to support the semiconductor substrate, and the projection of the semiconductor substrate is completely located within the carrier side. The non-carrier side is used to receive external force. When an external force is applied to the non-carrier side, the entire bonding surface of the semiconductor substrate can be squeezed, so that the semiconductor substrate is subjected to uniform force, ensuring that the bonding interface of the two semiconductor substrates is tightly bonded, thereby ensuring bonding quality and improving product yield.

[0086] In one embodiment, the non-load-bearing side is used to contact the press, and the area of ​​the non-load-bearing side is the same as the area of ​​the pressing surface of the press. During the bonding of the semiconductor substrate, this ensures that the pressing surface and the non-load-bearing side are completely in contact, thereby ensuring that the bonding interface of the semiconductor substrate on the load-bearing side is subjected to uniform pressing force, effectively avoiding uneven force distribution.

[0087] The support ring 11 provides stable support for the limiting component 2, the pushing component 3, and the carrier disk 12, ensuring the rigidity of the bonding fixture. The carrier disk 12 supports the semiconductor substrate and directly bears the bonding pressure. By setting the carrier disk 12 and the support ring 11 as separate structures, the carrier disk 12 can be independently selected from a specific material that is highly compatible with the bonding process, significantly different from the material of the support ring 11, thereby avoiding the adverse effects of the material properties of the support ring 11 on the bonding interface quality and uniformity.

[0088] It should be noted that this bonding fixture is suitable for semiconductor substrates with a set size range, which is set according to the diameter of the carrier disk 12 and the pushing distance of the pushing component 3.

[0089] In one embodiment, the support disk 12 is made of silicon carbide, and a graphite sheet 4 is disposed between the support side and the semiconductor substrate. The high hardness, high thermal conductivity, and semiconductor process compatibility of silicon carbide enable it to more effectively transfer pressure, manage thermal stress, and ensure the purity and consistency of the wafer bonding process. Furthermore, by placing a graphite sheet 4 of the same size as the semiconductor substrate between the support disk 12 and the semiconductor substrate, not only can the uniformity of the surface temperature of the semiconductor substrate be improved, but also the uniformity of pressure when the semiconductor substrate is pressurized, further enhancing the bonding quality of the semiconductor substrate.

[0090] For example, the graphite sheet 4 is provided with a connecting lug in the circumferential direction, the connecting lug extends to the support ring 11, and is fixed to the support ring 11 by a fourth fastening screw.

[0091] The support disk 12 is secured to the support ring 11 by fixing components 6 evenly distributed along its circumference. Exemplarily, three fixing components 6 are provided.

[0092] The fixing component 6 includes a fixing pin and a fifth fastening screw. The support ring 11 has a radially extending through fixing hole, and the support disk 12 has a circumferential fixing groove. The fixing pin passes through the fixing hole and is inserted into the fixing groove. The fixing pin passes through the fixing hole from the outer wall of the support ring 11 and is inserted into the fixing groove. The support ring 11 also has a third threaded hole communicating with the fixing hole. The fifth fastening screw is screwed into the third threaded hole and abuts against the fixing pin to lock the fixing pin. After the fixing pin is inserted and positioned, the axial pressure generated by tightening the fifth fastening screw acts directly on the fixing pin, eliminating the risk of radial or axial loosening that may occur during tooling vibration, handling, or repeated disassembly and assembly of the semiconductor substrate, ensuring the connection rigidity and long-term positional stability between the support disk 12 and the support ring 11.

[0093] In one embodiment, continue to refer to Figure 1 , Figure 2 , Figure 9 and Figure 10 The bonding fixture also includes a spacing pressing assembly 5, which is evenly distributed around the circumference of the support disk 12 to isolate and clamp the two semiconductor substrates. After alignment, the two semiconductor substrates are stably clamped by the spacing pressing assembly 5 to ensure no movement during transport and smooth transfer to the next process.

[0094] For example, three spacer pressing components 5 are provided, and the three spacer pressing components 5 are evenly distributed along the circumference of the support disk 12 to ensure the stability of the semiconductor substrate clamping.

[0095] The spacer pressing assembly 5 includes a spacer 52 and a clamping member 51. The spacer 52 is used to isolate the two semiconductor substrates in an atmospheric environment, preventing the atmosphere from being trapped and affecting the bonding quality when the two semiconductor substrates are bonded together. The clamping member 51 can press the two semiconductor substrates together after alignment, preventing them from shifting and affecting the alignment accuracy.

[0096] The specific structure and connection relationship of the interval pressing component 5 can be referred to the existing technology design. This is not the focus of the improvement in this embodiment, and will not be described in detail here.

[0097] This embodiment also provides a bonding apparatus, including the bonding fixture described above. This enables precise alignment of semiconductor substrates of different shapes, improves applicability, and reduces production costs.

[0098] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of ​​this utility model. The content of this specification should not be construed as a limitation of this utility model.

Claims

1. A bonding fixture for aligning two semiconductor substrates, characterized in that, include: Carrier (1), used to carry semiconductor substrate; Two or more limiting components (2) are provided on the periphery of the support member (1), and the limiting directions of at least two of the two or more limiting components (2) intersect. The two or more limiting components (2) are extensibly and retractably arranged in the direction pointing to the support member (1) to selectively form a limiting area. A pushing component (3) is disposed on the periphery of the carrier (1), and the pushing component (3) can push the semiconductor substrate toward the limiting area.

2. The bonding fixture according to claim 1, characterized in that, The pushing component (3) is one, and the pushing component (3) is located on the opposite side of the two or more limiting components (2) and on the center line of the two or more limiting components (2). The pushing component (3) pushes the semiconductor substrate so that the semiconductor substrate abuts against the two or more limiting components (2).

3. The bonding fixture according to claim 1, characterized in that, There are two or more pushing components (3), and the pushing components (3) are set corresponding to the limiting components (2). The pushing components (3) push the semiconductor substrate so that the semiconductor substrate and the limiting components (2) opposite to the pushing components (3) come into contact.

4. The bonding fixture according to claim 1, characterized in that, The limiting component (2) has a working position and an avoidance position. The limiting component (2) can switch between the working position and the avoidance position. When in the working position, the limiting component (2) is used to cooperate with the pushing component (3) to position the semiconductor substrate. When in the avoidance position, the limiting component (2) is used to avoid the semiconductor substrate.

5. The bonding fixture according to claim 4, characterized in that, The limiting component (2) includes: Mounting block (21) is movably disposed on the support member (1); The limiting member (22) has one end fixed to the mounting block (21) and the other end extending toward the center of the bearing member (1) to form an abutment end (221); Lock the handle (23) to drive the mounting block (21) to move to switch the position of the limiting member (22) and lock the limiting member (22).

6. The bonding fixture according to claim 5, characterized in that, The limiting component (2) also includes: Mounting base (24) is fixed to the circumference of the support member (1), and the mounting base (24) has a mounting cavity; The mounting block (21) is provided with a first through hole, and one end of the limiting pin (25) is provided with a limiting head. The other end passes through the first through hole and the first elastic element (26) in sequence and is fixed to the cavity wall of the mounting cavity. The locking handle (23) is rotatably connected to the limiting head, and the locking handle (23) rotates to drive the mounting block (21) to move.

7. The bonding fixture according to claim 6, characterized in that, The locking handle (23) includes: The locking block (231) has a first limiting surface (2311), a second limiting surface (2312) and a through hole. The first limiting surface (2311) and the second limiting surface (2312) are arranged adjacent to each other. The distance from the axis of the through hole to the first limiting surface (2311) is less than the distance to the second limiting surface (2312). When the first limiting surface (2311) abuts against the mounting block (21), the limiting member (22) is in the avoidance position; when the second limiting surface (2312) abuts against the mounting block (21), the limiting member (22) is in the working position.

8. The bonding fixture according to claim 7, characterized in that, The locking handle (23) also includes: The locking pin (232) is provided with a connecting hole. The locking pin (232) passes through the through hole and the connecting hole in sequence and is then axially fixed by the retaining ring (27).

9. The bonding fixture according to claim 1, characterized in that, The actuating component (3) includes: A positioning base (31) is fixed to the circumference of the bearing member (1), and the positioning base (31) has a positioning cavity; A pusher (32), one end of which extends toward the center of the support member (1) to form a push end (321); The top block (33) is fixed to the other end of the pusher (32) and slides in the positioning cavity.

10. The bonding fixture according to claim 9, characterized in that, The actuation component (3) also includes: The positioning pin (34) and the second elastic element (35) are provided. The top block (33) is provided with a second through hole. One end of the positioning pin (34) is provided with a positioning head. The other end passes through the second through hole and the second elastic element (35) in sequence and is fixed to the cavity wall of the positioning cavity. The pushing member (32) can drive the top block (33) to move and compress the second elastic element (35), and reset under the elastic force of the second elastic element (35).

11. The bonding fixture according to any one of claims 1-10, characterized in that, The carrier (1) includes a support ring (11) and a carrier disk (12) disposed in the support ring (11). The carrier disk (12) has a carrier side and a non-carrier side. The carrier side is used to carry the semiconductor substrate, and the projection of the semiconductor substrate is completely located within the carrier side. The non-load-bearing side is used to receive external forces.

12. The bonding fixture according to claim 11, characterized in that, The supporting disk (12) is made of silicon carbide, and a graphite sheet (4) is provided between the supporting side and the semiconductor substrate.

13. A bonding apparatus, characterized in that, Includes the bonding fixture as described in any one of claims 1-12.

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