A semiconductor automatic handling system

Abstract

The utility model provides a kind of semiconductor automatic handling system, for transporting wafer between multiple semiconductor processing machine platform, between semiconductor processing machine platform and warehousing area, including unmanned aerial vehicle and grabbing mechanism, grabbing mechanism is connected to the bottom of unmanned aerial vehicle, for grabbing wafer transport box;Wherein, preset handling path between multiple semiconductor processing machine platform or between semiconductor processing machine platform and warehousing area, and semiconductor processing machine platform, warehousing area all have target position for storing wafer transport box, and unmanned aerial vehicle transports wafer transport box between multiple target positions according to preset handling path.The utility model is by using the semiconductor automatic handling system based on unmanned aerial vehicle, the system has high flexibility, can quickly adjust handling route according to factory layout change, effectively overcome the drawbacks that traditional rail type overhead travelling crane system relies on fixed track, difficult to adapt to factory layout change.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor transfer equipment technology, and in particular to an automated semiconductor handling system. Background Technology

[0002] As semiconductor manufacturing processes become increasingly complex, wafer sizes increase, and manufacturing precision requirements rise, automated material handling systems are widely used in semiconductor factories to improve production efficiency and yield. Traditional OHT (Overhead Hoist Transport) systems rely on fixed tracks, resulting in limited flexibility, high maintenance costs, and difficulty in adapting to rapidly changing production demands.

[0003] Specifically, traditional semiconductor factories use overhead crane systems to transport FOUPs (Front Opening Unified Pods) using OHTs, but this method has the following drawbacks: (1) Fixed track limitations: Track installation and maintenance costs are high and it is difficult to adapt to changes in factory layout.

[0004] (2) Insufficient storage space: Storage space can only be set on the side of the track, which cannot make full use of the three-dimensional space.

[0005] (3) There are upper limits to the transport time and total transport volume: The transport time of the OHT system is limited by the track laying and the overhead crane congestion, which makes it difficult to meet the growing demand for efficient production in semiconductor factories. In addition, there is an upper limit to the total transport volume, which cannot flexibly cope with the demand during peak production periods.

[0006] (4) Traffic jam problem: Due to the single-path limitation of the track system, multiple OHTs are prone to traffic jams during peak hours, making it difficult to accurately predict the transport time. Traffic jams may cause Over Q Time (excessive queuing time), which in turn affects product yield. Furthermore, traffic jams make it difficult to predict transport time and cannot be accurately matched with the schedule, resulting in reduced production efficiency.

[0007] In summary, traditional OHT systems rely on fixed tracks, have limited flexibility, high maintenance costs, and are difficult to adapt to rapidly changing factory layout requirements. Utility Model Content

[0008] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide an automated semiconductor handling system to solve the problems of existing semiconductor transfer systems relying on fixed tracks, having limited flexibility, high maintenance costs, and difficulty in adapting to rapidly changing factory layout requirements.

[0009] To achieve the above objectives, this utility model provides an automated semiconductor handling system for transferring wafers between multiple semiconductor processing machines and between semiconductor processing machines and a storage area. The system includes a drone and a gripping mechanism connected to the bottom of the drone for gripping wafer transport boxes. A pre-defined transport path is established between the multiple semiconductor processing machines or between the semiconductor processing machines and the storage area. Both the semiconductor processing machines and the storage area have target locations for storing the wafer transport boxes. The drone transfers the wafer transport boxes between the multiple target locations according to the pre-defined transport path.

[0010] Preferably, it also includes a parking platform; the parking platform is located above the target position and includes a main support rod and multiple secondary support rods, the multiple secondary support rods being spaced apart and connected to the main support rod; two adjacent secondary support rods form a parking position; two buffer brackets are symmetrically provided at the bottom of the UAV; the secondary support rods are configured such that when the UAV is parked at the parking position, the two secondary support rods are respectively supported at the bottom of the two buffer brackets.

[0011] Preferably, the parking position is provided with a charging conductor for charging the drone when it is parked at the parking position.

[0012] Preferably, the charging conductor includes a positive electrode and a negative electrode. The positive electrode is disposed on any one of the auxiliary support rods in the same parking position, and the negative electrode is disposed on the other auxiliary support rod in the same parking position. The positive electrode and the negative electrode are configured such that when the UAV is docked at the parking position, the positive electrode is in contact with the positive charging terminal of the UAV, and the negative electrode is in contact with the negative charging terminal of the UAV.

[0013] Preferably, the secondary support rod is provided with a first magnetic attractor, and the buffer bracket is provided with a second magnetic attractor; the first magnetic attractor and the second magnetic attractor are configured such that when the UAV is docked at the parking position, the first magnetic attractor and the second magnetic attractor attract each other to align the positive electrode with the charging positive electrode and the negative electrode with the charging negative electrode.

[0014] Preferably, the wafer transport box has a clamping part at the top; the gripping mechanism includes a first gripper, a second gripper and a driving device; the first gripper and the second gripper are respectively connected to the driving device, and under the drive of the driving device, they move closer to each other to clamp the clamping part, or move further apart to release the clamping part.

[0015] Preferably, the clamping part has symmetrically arranged limiting slots; when the gripping mechanism grips the clamping part, the first gripper and the second gripper respectively engage with the corresponding limiting slots, so that the gripping mechanism and the clamping part form a stable connection relationship.

[0016] Preferably, the drone further includes a lifting device; the lifting device is disposed at the bottom of the drone, the gripping mechanism is connected to the lifting device, and rises or falls relative to the drone under the drive of the lifting device to approach or move away from the target wafer transport box.

[0017] Preferably, the drone is equipped with an obstacle avoidance unit; the obstacle avoidance unit includes at least two of the following: a lidar module, an ultrasonic detection module, and a camera module.

[0018] Preferably, the auxiliary support rod of the parking position is equipped with a communication module. The communication module establishes data connections with the control system of the semiconductor processing machine and the onboard controller of the UAV through a wireless communication link, respectively, for real-time interaction of the loading or unloading status signals of the semiconductor processing machine and the workstation readiness signals of the UAV.

[0019] The beneficial effects of this invention are as follows: By employing a drone-based automated semiconductor handling system, multiple drones can transport wafers between multiple semiconductor processing machines and between semiconductor processing machines and storage areas according to preset handling paths. This system possesses high flexibility, allowing for rapid adjustment of handling routes based on changes in factory layout, effectively overcoming the drawbacks of traditional overhead crane systems that rely on fixed tracks and are difficult to adapt to changes in factory layout. Secondly, drones can operate in parallel, significantly shortening handling time and increasing the handling capacity per unit time. Furthermore, drones can fly freely in three-dimensional space, avoiding traffic congestion and ensuring predictable handling times. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the components of the semiconductor automated handling system according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the warehouse layout structure of the semiconductor automated handling system according to an embodiment of the present invention; Figure 3 This is a schematic diagram showing the installation position of the stopping platform on the semiconductor processing machine in an embodiment of this utility model; Figure 4 This is a diagram showing the state of the drone when it is docked on the helipad in this embodiment of the present invention; Figure 5 This is a schematic diagram of part of the mechanism of the stopping platform in an embodiment of this utility model; Figure 6This is a schematic diagram illustrating the cooperation relationship between the buffer bracket and the secondary support rod in an embodiment of this utility model; Figure 7 This is a state diagram of the gripping mechanism gripping the wafer transport box in an embodiment of this utility model; Figure 8 This is a diagram showing the state of the gripping mechanism after gripping the wafer transport box in an embodiment of this utility model. Figure 9 This is a schematic diagram of the drone structure in an embodiment of the present invention.

[0021] Figure label: 1-Drone; 11-Buffer bracket; 111-Charging positive terminal; 12-LiDAR module; 13-Ultrasonic detection module; 14-Camera module; 2-Gripping mechanism; 21-First gripper; 22-Second gripper; 23-Driver; 3-Semiconductor processing machine; 31-Loading port; 4-Storage area; 41-Storage group; 42-Storage location; 43-Flight area; 5-Stopping platform; 51-Main support rod; 52-Secondary support rod; 53-Charging conductor; 531-Anti-oxidation coating; 54-First magnetic chuck; 55-Second magnetic chuck; 56-Shock-absorbing pad; 57-Communication module; 6-Wafer transport box; 61-Clamping part; 62-Limiting slot; 7-Lifting device; 71-Suspension rope. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art to which this utility model pertains. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, but does not exclude other elements or objects. Unless otherwise specified, the term "connection" as used herein can refer to a direct connection or an indirect connection, i.e., a connection through an intermediate object.

[0023] Please see Figure 1 and Figure 2 This utility model provides an automated semiconductor handling system for transferring wafers between multiple semiconductor processing machines 3 and between semiconductor processing machines 3 and storage area 4.

[0024] The semiconductor automated handling system includes multiple drones 1, which are uniformly dispatched by a central control system. The central control system communicates and transmits data with the multiple drones 1 in real time via 5G or Wi-Fi. A gripping mechanism 2 is connected to the bottom of each drone 1, and the gripping mechanism 2 is used to grip wafer transport boxes 6. In this embodiment, the central control system can be the control center of a wafer fabrication workshop.

[0025] Among them, there are pre-set transport paths between multiple semiconductor processing machines 3 or between semiconductor processing machines 3 and the storage area 4. The transport paths are planned by the central control system and transmitted to the airborne controller of the UAV 1. The central control system includes a MAP (map) monitoring system, which records various information of the UAV 1 in real time, including but not limited to: the specific location, flight route, flight status, starting position and target position of the UAV 1 during the transport process, so as to ensure the controllability and traceability of the transport process of the UAV 1.

[0026] The semiconductor processing machine 3 and the storage area 4 each have target locations for storing the wafer transport box 6. The drone 1 transports the wafer transport box 6 between multiple target locations according to the preset transport path. In this embodiment, the wafer transport box 6 is a front-opening wafer cassette (FOUP).

[0027] See Figure 2 Furthermore, the storage area 4 includes multiple storage groups 41 spaced apart, and the multiple storage groups 41 form a flight area 43 for the UAV 1 to pass through; the storage group 41 includes multiple storage positions 42 centrally arranged; the target position is the loading port 31 of the semiconductor processing machine 3 or the storage position 42; the parking platform 5 is located above the loading port 31 or the storage position 42.

[0028] In some embodiments, some storage locations 42 are located on the ceiling or walls to make full use of three-dimensional space to solve the problem of insufficient storage space.

[0029] In this embodiment, by employing a semiconductor automated handling system based on UAVs 1, multiple UAVs 1, under the control and monitoring of a central control system, can transfer wafers between multiple semiconductor processing machines 3 and between semiconductor processing machines 3 and the storage area 4, which has multiple beneficial effects. First, the transfer of UAVs 1 does not require the setting of physical tracks; its handling path is automatically generated by the central control system, thus possessing high flexibility. The handling route can be quickly adjusted according to changes in the factory layout, effectively overcoming the drawbacks of traditional track-based overhead crane systems that rely on fixed tracks and are difficult to adapt to changes in the factory layout. Second, UAVs 1 can operate in parallel, significantly shortening the handling time and increasing the handling volume per unit time. Furthermore, UAVs 1 can fly freely in three-dimensional space, avoiding traffic jams and ensuring that the handling time is predictable.

[0030] Traditional track-based overhead crane systems, due to fixed tracks, have limited route options. Problems on any track can prevent some cranes from delivering the target wafer transport box 6 to its destination, thus delaying production. When there are many vehicles, this can lead to Over Q Time (excessive queuing time), impacting product yield. Furthermore, traffic congestion makes predicting transport times difficult, hindering precise alignment with the schedule and reducing production efficiency. In this embodiment, an intelligent scheduling system seamlessly integrates with the production plan, significantly reducing the risk of Over Q Time.

[0031] See Figure 3 In some embodiments, the automated semiconductor handling system further includes a stopping platform 5; the stopping platform 5 is disposed above the target position and includes a main support rod 51 and multiple secondary support rods 52, the multiple secondary support rods 52 being spaced apart and connected to the main support rod 51; two adjacent secondary support rods 52 form a stopping position, and the distance between two secondary support rods 52 forming the same stopping position is greater than the width of the wafer transport box 6 to ensure that the wafer transport box 6 does not interfere with the secondary support rods 52. In this embodiment, the secondary support rods 52 are welded to the main support rod 51.

[0032] See Figure 4 The drone 1 has two symmetrically arranged buffer supports 11 at its bottom. The auxiliary support rods 52 are configured such that when the drone 1 is docked at the parking position, the two auxiliary support rods 52 respectively support the bottom of the two buffer supports 11. In this embodiment, the parking platform 5 is installed on the semiconductor processing machine 3 and located directly above the loading port 31. After the drone 1 docks at the parking position, it releases the gripping mechanism 2 to grip the target wafer transport box 6 placed in the loading port 31. Compared with the prior art, the parking platform 5 has a simpler structure, is easier to install and maintain, and has a lower investment cost.

[0033] See Figure 5 and Figure 6 In some embodiments, a charging conductor 53 is provided on the parking position, and the charging conductor 53 is electrically connected to the semiconductor processing table 3. The charging conductor 53 is used to charge the drone 1 when it is docked at the parking position. The charging conductor 53 allows the drone 1 to charge while grasping and placing the wafer transport box 6, eliminating the need for additional time to charge the drone 1 and effectively extending its range. In addition, the helipad provides a parking position for the drone 1 during non-operational periods, and the drone 1 can also charge during parking to ensure sufficient power during operation.

[0034] See Figure 5 and Figure 6 In some implementations, the charging conductor 53 includes a positive electrode and a negative electrode. The positive electrode is disposed on any one of the auxiliary support rods 52 in the same parking position, and the negative electrode is disposed on another auxiliary support rod 52 in the same parking position. The positive electrode and the negative electrode are configured such that when the UAV 1 is docked at the parking position, the positive electrode is in contact with the charging positive electrode 111 of the UAV 1, and the negative electrode is in contact with the charging negative electrode of the UAV 1.

[0035] In this embodiment, the charging conductor 53, the positive charging electrode 111, and the negative charging electrode are all plated with an anti-oxidation coating 531 to prevent poor contact caused by oxidation of the charging conductor 53 due to prolonged exposure to air.

[0036] See Figure 5 and Figure 6 In some embodiments, the secondary support rod 52 is provided with a first magnetic attractor 54, and the buffer bracket 11 is provided with a second magnetic attractor 55. The first magnetic attractor 54 and the second magnetic attractor 55 are configured such that when the UAV 1 is docked at the parking position, the first magnetic attractor 54 and the second magnetic attractor 55 attract each other to align the positive electrode with the charging positive electrode 111 and the negative electrode with the charging negative electrode. Specifically, the first magnetic attractor 54 is disposed on the top surface of the secondary support rod 52, and the secondary support rod 52 is provided with two first magnetic attractors 54, which are symmetrically disposed on both sides of the charging conductor 53; the second magnetic attractor 55 is disposed on the bottom surface of the buffer bracket 11. In this embodiment, the first magnetic attractor 54 is a permanent magnet, and the second magnetic attractor 55 is an electromagnet, which is electrically connected to the UAV.

[0037] See Figure 5 and Figure 6In some embodiments, the secondary support rod 52 is also provided with a shock-absorbing pad 56 to prevent the buffer bracket 11 from rigidly contacting the secondary support rod 52. In this embodiment, the shock-absorbing pad 56 is made of silicone.

[0038] See Figure 5 and Figure 6 In some embodiments, a communication module 57 is integrated on the secondary support rod 52 of the parking position. The communication module 57 establishes data connections with the control system of the semiconductor processing machine 3 and the onboard controller of the UAV 1 via wireless communication links, respectively, for real-time exchange of loading / unloading status signals of the semiconductor processing machine 3 and workstation readiness signals of the UAV 1. In this embodiment, the communication module is installed on any one of the secondary support rods combined with the same parking position.

[0039] See Figure 7 In some embodiments, the wafer transport box 6 has a clamping portion 61 at its top; the gripping mechanism 2 includes a first gripper 21, a second gripper 22, and a driving device 23; the first gripper 21 and the second gripper 22 are respectively connected to the driving device 23, and under the drive of the driving device 23, they move closer to each other to clamp the clamping portion 61, or move further apart to release the clamping portion 61. In this embodiment, the driving device 23 includes a first driving motor, a first driving gear, and a second driving gear. The first driving gear and the second driving gear rotate under the drive of the first driving motor, and the first gripper 21 and the second gripper 22 move closer to each other or further apart under the drive of the first driving gear and the second driving gear, respectively.

[0040] See Figure 7 and Figure 8 In some embodiments, the clamping part 61 has symmetrically arranged limiting slots 62; when the gripping mechanism 2 grips the clamping part 61, the first gripper 21 and the second gripper 22 respectively engage with the corresponding limiting slots 62, so that the gripping mechanism 2 and the clamping part 61 form a stable connection relationship, thereby ensuring the stability and reliability of the gripping process.

[0041] See Figure 7 and Figure 8In some embodiments, the drone 1 further includes a lifting device 7; the lifting device 7 is disposed at the bottom of the drone 1, and the gripping mechanism 2 is connected to the lifting device 7, rising or falling relative to the drone 1 under the drive of the lifting device 7 to approach or move away from the target wafer transport box 6. In this embodiment, the lifting device 7 includes a second drive motor, a drum, and a suspension rope 71, and the gripping mechanism 2 is connected to the second drive motor via the suspension rope 71. Specifically, the drum rotates under the drive of the second drive motor, one end of the suspension rope 71 is wound around the drum, and the other end is connected to the gripping mechanism 2. The gripping mechanism 2 rises or falls by driving the drum to rotate forward or backward by the second drive motor. In some embodiments, a belt can be used to replace the suspension rope 71.

[0042] See Figure 9 In some embodiments, the UAV 1 is equipped with an obstacle avoidance unit; the obstacle avoidance unit includes at least two of a lidar module 12, an ultrasonic detection module 13, and a camera module 14. In this embodiment, the obstacle avoidance unit includes a lidar module, an ultrasonic detection module 13, and a camera module 14. This embodiment achieves real-time obstacle avoidance and environmental perception by employing multi-sensor fusion technology. Multi-sensor fusion (MSF) is an information processing process that utilizes computer technology to automatically analyze and synthesize information and data from multiple sensors or sources according to certain criteria to complete the required decision-making and estimation. This technology is existing technology, and its principle will not be elaborated here. In this embodiment, the different signals collected by the lidar module, ultrasonic detection module 13, and camera module 14 are input to the onboard controller for automatic analysis and synthesis, improving the environmental perception capability of the UAV 1, thereby effectively enhancing the obstacle avoidance capability and effect of the UAV 1.

[0043] Operation flow of semiconductor automated handling system: Step 1: The central control system receives the transfer command and determines the starting and ending machines; Step 2: The central control system instructs the drone 1 to dock on the parking platform 5 above the loading port 31 of the starting machine, and simultaneously begins charging; Step 3: The airborne control system establishes a data connection with the starting machine through the communication module 57 integrated in the parking position, confirms the loading status, and the lifting device 7 lowers the gripping mechanism 2. The gripping mechanism 2 then grips the wafer transport box 6 and rises.

[0044] Step 4: The central control system plans the transport path between the starting station and the ending station. The UAV 1 transports the wafer transport box 6 to the ending station according to the transport path.

[0045] Step 5: Drone 1 docks on the landing platform 5 above the destination machine and begins charging. Step 6: The airborne control system establishes a data connection with the starting machine through the communication module 57 integrated in the parking position, confirms the unloading status, and the lifting device 7 lowers the gripping mechanism 2 and lowers the wafer transport box 6 to the loading port 31 of the destination machine.

[0046] In summary, this invention employs a drone-based automated semiconductor handling system, enabling multiple drones to transport wafers between various semiconductor processing machines and between these machines and storage areas according to pre-set transport paths. This system offers high flexibility, allowing for rapid adjustment of transport routes based on factory layout changes, effectively overcoming the limitations of traditional overhead crane systems that rely on fixed tracks and struggle to adapt to changing factory layouts. Secondly, the drones can operate in parallel, significantly reducing transport time and increasing the transport volume per unit time. Furthermore, the drones' free flight in three-dimensional space avoids congestion and ensures predictable transport times. This invention effectively overcomes the various shortcomings of existing technologies and possesses high industrial application value.

[0047] The above description is merely a specific implementation of the embodiments of this application, but the protection scope of the embodiments of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of this application should be covered within the protection scope of the embodiments of this application. Therefore, the protection scope of the embodiments of this application should be determined by the protection scope of the claims.

Claims

1. A semiconductor automated handling system for transferring wafers between multiple semiconductor processing machines and between semiconductor processing machines and storage areas, characterized in that, include: Drones; A gripping mechanism, connected to the bottom of the drone, is used to grip the wafer transport box; There are pre-defined transport paths between the semiconductor processing machines or between the semiconductor processing machines and the storage area, and both the semiconductor processing machines and the storage area have target locations for storing the wafer transport boxes. The drone transfers the wafer transport boxes between the multiple target locations according to the pre-defined transport paths.

2. The semiconductor automated handling system according to claim 1, characterized in that: It also includes a parking platform; the parking platform is located above the target position and includes a main support rod and multiple auxiliary support rods, the multiple auxiliary support rods being spaced apart and connected to the main support rod; two adjacent auxiliary support rods form a parking position; The drone is equipped with two symmetrical buffer supports at its bottom. The auxiliary support rods are configured such that when the UAV is docked at the parking position, the two auxiliary support rods are respectively supported at the bottom of the two buffer brackets.

3. The semiconductor automated handling system according to claim 2, characterized in that: The parking position is equipped with a charging conductor for charging the drone when it is parked at the parking position.

4. The semiconductor automated handling system according to claim 3, characterized in that: The charging conductor includes a positive electrode and a negative electrode. The positive electrode is disposed on any one of the auxiliary support rods in the same stopping position, and the negative electrode is disposed on the other auxiliary support rod in the same stopping position. The positive electrode and negative electrode are configured such that when the UAV is docked at the parking position, the positive electrode is in contact with the positive charging terminal of the UAV, and the negative electrode is in contact with the negative charging terminal of the UAV.

5. The semiconductor automated handling system according to claim 4, characterized in that: The secondary support rod is provided with a first magnetic attraction element, and the buffer bracket is provided with a second magnetic attraction element; The first magnetic attractor and the second magnetic attractor are configured such that when the drone is docked at the parking position, the first magnetic attractor and the second magnetic attractor attract each other to align the positive electrode with the charging positive electrode and the negative electrode with the charging negative electrode.

6. The semiconductor automated handling system according to claim 1, characterized in that: The wafer transport box is provided with a clamping part at the top; the gripping mechanism includes a first gripper, a second gripper and a driving device; the first gripper and the second gripper are respectively connected to the driving device, and under the drive of the driving device, they move closer to each other to clamp the clamping part, or move further apart to release the clamping part.

7. The semiconductor automated handling system according to claim 6, characterized in that: The clamping part has symmetrically arranged limiting slots; when the gripping mechanism grips the clamping part, the first gripper and the second gripper respectively engage with the corresponding limiting slots, so that the gripping mechanism and the clamping part form a stable connection relationship.

8. The semiconductor automated handling system according to claim 1, characterized in that: The drone also includes a lifting device; The lifting device is located at the bottom of the drone, and the gripping mechanism is connected to the lifting device. Under the action of the lifting device, the gripping mechanism rises or falls relative to the drone to move closer to or away from the target wafer transport box.

9. The semiconductor automated handling system according to claim 1, characterized in that: The drone is equipped with an obstacle avoidance unit; the obstacle avoidance unit includes at least two of the following: a lidar module, an ultrasonic detection module, and a camera module.

10. The semiconductor automated handling system according to claim 2, characterized in that: The auxiliary support rod of the parking position is equipped with a communication module. The communication module establishes data connections with the control system of the semiconductor processing machine and the onboard controller of the UAV through a wireless communication link, respectively, for real-time interaction of the loading or unloading status signals of the semiconductor processing machine and the workstation readiness signals of the UAV.

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