Chip guiding mechanism
By setting up a grid plate on the carrier disk and an electromagnet-driven pusher system, the problem of chip misalignment was solved, enabling accurate chip positioning and efficient gripping by the robotic arm.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ANHUI CHAOYUAN SEMICON CO LTD
- Filing Date
- 2025-08-29
- Publication Date
- 2026-07-24
AI Technical Summary
The lack of a guiding mechanism on the carrier plate causes the chip to be misaligned, affecting the accuracy of the robotic arm's grasping.
A grid plate is set on the carrier disk. By moving the first and second push plates, in conjunction with the moving rod and moving plate driven by an electromagnet, the chip can be positioned and its position adjusted.
This achieves accurate positioning of the chip on the carrier disk, reduces subsequent correction steps, and improves the accuracy of the robotic arm's grasping.
Smart Images
Figure CN224556237U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of chip alignment, and in particular to a chip alignment mechanism. Background Technology
[0002] During the chip manufacturing process, sampling inspection is required. Workers need to place the chips in a carrier tray, and then a robotic arm will pick up the chips from the carrier tray to the inspection station. However, when the chips are manually placed in the slots of the carrier tray, the chips are not in the correct position, which causes the robotic arm to pick up the chips in different positions. This requires subsequent steps to correct the position of the chips. In order to save the correction steps, this application sets up a guiding mechanism on the carrier tray to align the chip position. Utility Model Content
[0003] The technical problem to be solved by this utility model is to provide a chip alignment mechanism to solve the problem of the lack of chip alignment mechanism on the carrier disk in the prior art described in the background art.
[0004] To achieve the above objectives, this utility model provides the following technical solution: a chip alignment mechanism, comprising...
[0005] Carrier disk;
[0006] A grid plate is disposed on the surface of a carrier disk, and the grid plate and the carrier disk form several positioning grooves for placing chips;
[0007] Among them, a number of the positioning grooves have a first hidden groove on the same side wall, and the bottom of the positioning groove has a first movable groove communicating with the first hidden groove at the position corresponding to the first hidden groove; a number of the positioning grooves have a second hidden groove on the same side wall, and the bottom of the positioning groove has a second movable groove communicating with the second hidden groove at the position corresponding to the second hidden groove, and the first hidden groove and the second hidden groove are located on two adjacent side walls of the positioning groove.
[0008] A plurality of first push plates are movably disposed in a plurality of first moving slots and extend into corresponding first hidden slots;
[0009] Several second push plates are movably disposed in several second moving slots and extend into corresponding second hidden slots.
[0010] Preferably, the carrier plate has a first moving hole that penetrates the carrier plate at the position corresponding to each horizontal row of positioning slots. The first moving hole penetrates the first hidden slot and the first moving slot. A first moving rod is movably disposed in the first moving hole. The first moving rod penetrates the first push plate and is fixedly connected to the first push plate.
[0011] Preferably, one end of each of the first moving rods extending out of the first moving hole is fixedly connected to the first moving plate. The first moving plate is connected to the side wall of the carrier plate by a plurality of first springs. The side wall of the carrier plate is provided with a plurality of first electromagnets corresponding to the position of the first moving plate. The first moving plate is an iron plate.
[0012] Preferably, the carrier plate has a second moving hole that penetrates the carrier plate at the position of each of the longitudinally arranged positioning slots. The second moving hole penetrates the second hidden slot and the second moving slot. A second moving rod is movably disposed in the second moving hole. The second moving rod penetrates the second push plate and is fixedly connected to the second push plate.
[0013] Preferably, one end of each of the second moving rods extending out of the second moving hole is fixedly connected to the second moving plate. The second moving plate is connected to the side wall of the carrier plate by a number of second springs. A number of second electromagnets are provided on the side wall of the carrier plate corresponding to the position of the second moving plate. The second moving plate is an iron plate.
[0014] The beneficial effects of adopting the above technical solutions are:
[0015] This application provides a first pusher plate that moves laterally and a second pusher plate that moves longitudinally on the inner wall of the positioning groove on the carrier disk, which can push the chip so that the chip is positioned in the positioning groove. In this application, a first electromagnet can attract the first moving plate to move, the first moving plate drives the first moving rod to move, and the first moving rod drives the first pusher plate to move. A second electromagnet can attract the second moving plate to move, the second moving plate drives the second moving rod to move, and the second moving rod drives the second pusher plate to move. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of a chip alignment mechanism according to the present invention.
[0017] Figure 2 This is a top view of a chip alignment mechanism according to this utility model.
[0018] Figure 3 This is a top view of the first and second movable plates of this utility model being removed from the hidden groove.
[0019] Figure 4 This is a cross-sectional view of a chip alignment mechanism according to this utility model.
[0020] The components include: a carrier plate 10, a grid plate 20, a positioning groove 30, a first push plate 40, a first hidden groove 41, a first moving groove 42, a first moving rod 43, a first moving hole 44, a first moving plate 50, a first spring 51, a first electromagnet 52, a second push plate 60, a second hidden groove 61, a second moving groove 62, a second moving rod 63, a second moving hole 64, a second moving plate 70, a second spring 71, and a second electromagnet 72. Detailed Implementation
[0021] The embodiments of this utility model are described in detail below with reference to the accompanying drawings.
[0022] like Figure 1-2 In this first embodiment, a chip alignment mechanism includes...
[0023] Carrier disk 10;
[0024] A grid plate 20 is disposed on the surface of the carrier disk 10. The grid plate 20 and the carrier disk 10 form a plurality of positioning grooves 30 for placing chips.
[0025] Among them, a number of positioning grooves 30 have a first hidden groove 41 on the same side wall, and the bottom of the positioning groove 30 has a first movable groove 42 communicating with the first hidden groove 41 at the position corresponding to the first hidden groove 41; a number of positioning grooves 30 have a second hidden groove 61 on the same side wall, and the bottom of the positioning groove 30 has a second movable groove 62 communicating with the second hidden groove 61 at the position corresponding to the second hidden groove 61, and the first hidden groove 41 and the second hidden groove 61 are located on two adjacent side walls of the positioning groove 30;
[0026] A plurality of first push plates 40 are movably disposed in a plurality of first moving slots 42 and extend into corresponding first hidden slots 41;
[0027] Several second push plates 60 are movably disposed in several second moving slots 62 and extend into corresponding second hidden slots 61.
[0028] This embodiment is implemented as follows:
[0029] In use, the first push plate 40 is positioned in the first hidden groove 41 and the second push plate 60 is positioned in the second hidden groove 61. Then, the chip is placed in the positioning groove 30. The first push plate 40 and the second push plate 60 move together to push the chip to move, so that the chip is positioned in one corner of the positioning groove 30. Then, the first push plate 40 returns to the first hidden groove 41 and the second push plate 60 returns to the second hidden groove 61.
[0030] Please see Figure 1 , 2 3, 4, The carrier plate 10 has a first moving hole 44 that penetrates the carrier plate 10 at the position corresponding to each horizontal row of positioning slots 30. The first moving hole 44 penetrates the first hidden slot 41 and the first moving slot 42. A first moving rod 43 is movably provided in the first moving hole 44. The first moving rod 43 penetrates the first push plate 40 and is fixedly connected to the first push plate 40.
[0031] This application enables the first moving rod 43 to move within the first moving hole 44, thereby allowing the first push plate 40 connected to the first moving rod 43 to move.
[0032] Please see Figure 1 , 2 3, 4, one end of each of the first moving rods 43 extending out of the first moving hole 44 is fixedly connected to the first moving plate 50. The first moving plate 50 is connected to the side wall of the carrier plate 10 through a number of first springs 51. A number of first electromagnets 52 are provided on the side wall of the carrier plate 10 corresponding to the position of the first moving plate 50. The first moving plate 50 is an iron plate.
[0033] This application uses a first electromagnet 52 to attract a first movable plate 50, which in turn causes the first movable plate 50 to move the first movable rod 43. When the first electromagnet 52 is de-energized, the first movable plate 50 is moved by the reset action of the first spring 51.
[0034] Please see Figure 1 , 2 3, 4, The carrier plate 10 has a second moving hole 64 that penetrates the carrier plate at the position corresponding to each of the longitudinally arranged positioning slots 30. The second moving hole 64 penetrates the second hidden slot 61 and the second moving slot 62. A second moving rod 63 is movably arranged in the second moving hole 64. The second moving rod 63 penetrates the second push plate 60 and is fixedly connected to the second push plate 60.
[0035] This application enables the second moving rod 63 to move within the second moving hole 64, thereby allowing the second push plate 60 connected to the second moving rod 63 to move.
[0036] Please see Figure 1 , 2 3, 4, and one end of each of the second moving rods 63 extending from the second moving hole 64 is fixedly connected to the second moving plate 70. The second moving plate 70 is connected to the side wall of the carrier plate 10 via a plurality of second springs 71. A plurality of second electromagnets 72 are provided on the side wall of the carrier plate 10 corresponding to the position of the second moving plate 70. The second moving plate 70 is an iron plate.
[0037] The second electromagnet 72 in this application can attract the second moving plate 70, so that the second moving plate 70 drives the second moving rod 63 to move. When the second electromagnet 72 is de-energized, the second moving plate 70 is driven to move under the reset action of the second spring 71.
[0038] The above are merely preferred embodiments of this utility model. It should be noted that, for those skilled in the art, several modifications and improvements can be made without departing from the inventive concept of this utility model, and these all fall within the protection scope of this utility model.
Claims
1. A chip alignment mechanism, comprising: Carrier disk; A grid plate is disposed on the surface of a carrier disk, and the grid plate and the carrier disk form several positioning grooves for placing chips; Its features are, in, A first hidden groove is provided on the same side wall of several positioning grooves, and a first movable groove communicating with the first hidden groove is provided at the bottom of the positioning groove corresponding to the position of the first hidden groove; a second hidden groove is provided on the same side wall of several positioning grooves, and a second movable groove communicating with the second hidden groove is provided at the bottom of the positioning groove corresponding to the position of the second hidden groove, and the first hidden groove and the second hidden groove are located on two adjacent side walls of the positioning groove. A plurality of first push plates are movably disposed in a plurality of first moving slots and extend into corresponding first hidden slots; Several second push plates are movably disposed in several second moving slots and extend into corresponding second hidden slots.
2. The chip alignment mechanism according to claim 1, characterized in that, The carrier plate has a first moving hole that penetrates the carrier plate at the position of each horizontally arranged positioning slot. The first moving hole penetrates the first hidden slot and the first moving slot. A first moving rod is movably disposed in the first moving hole. The first moving rod penetrates the first push plate and is fixedly connected to the first push plate.
3. The chip alignment mechanism according to claim 2, characterized in that, One end of each of the first movable rods extending out of the first movable hole is fixedly connected to the first movable plate. The first movable plate is connected to the side wall of the carrier plate by a number of first springs. A number of first electromagnets are provided on the side wall of the carrier plate corresponding to the position of the first movable plate. The first movable plate is an iron plate.
4. The chip alignment mechanism according to claim 1, characterized in that, The carrier plate has a second moving hole that penetrates the carrier plate at the position of each longitudinally arranged positioning slot. The second moving hole penetrates the second hidden slot and the second moving slot. A second moving rod is movably disposed in the second moving hole. The second moving rod penetrates the second push plate and is fixedly connected to the second push plate.
5. A chip alignment mechanism according to claim 4, characterized in that, One end of each of the second moving rods extending out of the second moving hole is fixedly connected to the second moving plate. The second moving plate is connected to the side wall of the carrier plate by a number of second springs. A number of second electromagnets are provided on the side wall of the carrier plate corresponding to the position of the second moving plate. The second moving plate is an iron plate.