An integrated semiconductor pick-up device

Abstract

The utility model provides a kind of integrated semiconductor material taking device, including material taking component one, material taking component two, lifting cylinder, material taking component one includes the material taking part one for material taking lead frame, material taking component two includes the material taking part two for material taking carrier, the output end of lifting cylinder is equipped with material taking component one, material taking part one and material taking part two are all arranged in the below of lifting cylinder, and material taking part one is located the inside of material taking part two.The utility model realizes the material taking of two kinds of materials by alternately, structure is more compact, space occupation reduces, improves material taking efficiency, and reduces cost.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, and in particular to an integrated semiconductor material handling device. Background Technology

[0002] As a chip carrier for integrated circuits, the lead frame is a key structural component that uses bonding materials to achieve electrical connection between the internal circuit leads and external leads of the chip, thereby forming an electrical circuit. Most semiconductor integrated circuits require the use of lead frames, which are an important basic material in the electronics and information industry.

[0003] Before electroplating, the lead frame is a soft strip. In the relevant processes before electroplating, it needs to be loaded onto a carrier and placed at the corresponding station. This means that during material handling, the lead frame and the carrier need to be handled separately. In existing technology, two grippers are generally used for material handling, with the two grippers located on two separate robotic arms that alternately handle the material, or a rotating head that changes position at the material handling station to alternately handle the material. This results in a bulky overall structure, increasing equipment costs, and the need for two positioning and handling operations, which affects production efficiency. Utility Model Content

[0004] The present invention aims to provide an integrated semiconductor material handling device to overcome the shortcomings of the prior art.

[0005] To solve the above-mentioned technical problems, the technical solution of this utility model is: an integrated semiconductor material handling device, including a material handling component one, a material handling component two, and a lifting cylinder. The material handling component one includes a material handling part one for handling the lead frame, and the material handling component two includes a material handling part two for handling the carrier. The output end of the lifting cylinder is provided with the material handling component one. The material handling part one and the material handling part two are both located below the lifting cylinder, and the material handling part one is located inside the material handling part two.

[0006] Furthermore, in the aforementioned integrated semiconductor material handling device, the material handling component one further includes a material handling plate one connected to the output end of the lifting cylinder, and the material handling part one is disposed on the material handling plate one, including multiple suction cups one.

[0007] Furthermore, in the aforementioned integrated semiconductor picking device, a plurality of the aforementioned suction cups are disposed on both sides of the lead frame and are evenly arranged along the length direction of the lead frame.

[0008] Furthermore, in the aforementioned integrated semiconductor picking device, the picking component two further includes two picking plates two, which are disposed on both sides of the picking part one, and the picking part one includes a plurality of suction cups two disposed on the two picking plates two.

[0009] Furthermore, the aforementioned integrated semiconductor material handling device also includes a mounting top plate, with the lifting cylinder located below the mounting top plate, and the material handling component two mounted below the mounting top plate via multiple connecting rods.

[0010] Furthermore, the aforementioned integrated semiconductor picking device also includes a robot, and the mounting plate is connected to the robot's output end.

[0011] Furthermore, in the aforementioned integrated semiconductor material handling device, a detection camera group is provided on one side of the mounting top plate, and a scanner is provided on the other side.

[0012] Furthermore, in the aforementioned integrated semiconductor material handling device, the detection camera assembly is mounted on a camera mounting plate, and a reinforcing support plate connecting the camera mounting plate and the mounting top plate is provided on the side of the camera mounting plate near the mounting top plate.

[0013] Compared with the prior art, the beneficial effects of this utility model are: this utility model integrates two material picking components on one robot, and realizes the picking of two kinds of materials by alternating up and down, without the need for multiple positioning, the structure is more compact, the space occupied is reduced, the material picking efficiency is improved, and the cost is reduced. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the integrated semiconductor material handling device of this utility model;

[0016] Figure 2 This is a partial structural schematic diagram of the semiconductor material handling device integrated in this utility model;

[0017] Figure 3 for Figure 2 A schematic diagram of the side view structure;

[0018] In the diagram: 1. Material handling component one; 11. Material handling plate one; 12. Suction cup one;

[0019] 1. Material handling component two; 21. Material handling plate two; 22. Suction cup two; 23. Connecting rod;

[0020] 3. Lifting cylinder; 4. Mounting top plate; 5. Robot; 6. Inspection camera group; 61. Camera mounting plate; 62. Reinforcing support plate; 7. Scanner. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Example 1

[0023] like Figure 1-3 As shown, an integrated semiconductor picking device includes a picking component 1, a picking component 2, and a lifting cylinder 3. Picking component 1 includes a picking section 1 for picking up a lead frame, and picking component 2 includes a picking section 2 for picking up a carrier. The output end of the lifting cylinder 3 is equipped with picking component 1. Both picking section 1 and picking section 2 are located below the lifting cylinder 3, with picking section 1 located inside picking section 2. The two do not overlap in the lifting direction of the lifting cylinder 3. In this embodiment, since the carrier and the lead frame are co-centered along their length, picking section 1 and picking section 2 are co-centered in at least one direction, but this is not a limitation, as long as picking section 1 and picking section 2 do not overlap in the lifting direction of the lifting cylinder 3.

[0024] During material handling, the first material handling unit descends to pick up the lead frame under the action of the lifting cylinder 3. At this time, the second material handling unit is located outside the first material handling unit and is higher than the first material handling unit, without contacting the lead frame and without affecting the material handling unit's picking up. After picking up the lead frame, the first material handling unit rises under the action of the lifting cylinder 3, making the first material handling unit higher than the second material handling unit, and then the second material handling unit can begin to pick up the material carrier. The material handling device of this utility model is mainly used in the assembly of semiconductor DIP series products. It can integrate multiple specifications of suction grippers into one robotic arm in a limited space, improving the picking and placing efficiency. This utility model is also applicable to other situations where the workpieces to be picked up are stacked and of different sizes.

[0025] It should be noted that the lifting cylinder 3 can also be replaced by other linear modules, electric cylinders, etc. that can drive lifting.

[0026] Among them, such as Figure 2 , 3 As shown, the material handling assembly 1 also includes a material handling plate 11 connected to the output end of the lifting cylinder 3. The material handling part 1 is disposed on the material handling plate 11 and includes multiple suction cups 12. The multiple suction cups 12 are disposed on both sides of the lead frame and are evenly arranged along the length direction of the lead frame.

[0027] like Figure 2 , 3As shown, the material handling component 2 also includes two material handling plates 21, which are located on both sides of the material handling part 1. The material handling part 1 includes a plurality of suction cups 22 disposed on the two material handling plates 21.

[0028] like Figure 1-3 As shown, the integrated semiconductor picking device described above also includes a mounting plate 4, a robot 5, and a lifting cylinder 3 located below the mounting plate 4. The picking assembly 2 is mounted below the mounting plate 4 via multiple connecting rods 23. The mounting plate 4 is connected to the output end of the robot 5. By integrating the two picking devices onto the robot 5 using the mounting plate, the number of mechanisms required is reduced, thus lowering costs.

[0029] In addition, such as Figure 2 , 3 As shown, a detection camera group 6 is provided on one side of the mounting plate 4 for automatically detecting and positioning the material picking position, and a scanner 7 is provided on the other side of the mounting plate 4 to cooperate with the material tracking of the control system.

[0030] In the above structure, the detection camera group 6 is mounted on the camera mounting plate 61. The side of the camera mounting plate 61 near the mounting top plate 4 is provided with a reinforcing support plate 62 that connects the camera mounting plate 61 and the mounting top plate 4, thereby improving the installation strength of the camera group and enhancing the overall structural stability.

[0031] This invention integrates two material handling components onto a single robot, and achieves material handling of two different materials by alternating up and down movements. This eliminates the need for multiple positioning operations, resulting in a more compact structure, reduced space occupation, improved material handling efficiency, and lower costs.

[0032] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0033] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An integrated semiconductor feeding device, characterized in that: The device includes a material handling component one, a material handling component two, and a lifting cylinder. The material handling component one includes a material handling part one for handling the material lead frame, and the material handling component two includes a material handling part two for handling the material carrier. The output end of the lifting cylinder is provided with the material handling component one. Both the material handling part one and the material handling part two are located below the lifting cylinder, and the material handling part one is located inside the material handling part two.

2. The integrated semiconductor feeding device according to claim 1, characterized in that: The material handling assembly one also includes a material handling plate one connected to the output end of the lifting cylinder one, and the material handling part one is disposed on the material handling plate one, including multiple suction cups one.

3. The integrated semiconductor feeding device according to claim 2, characterized in that: Multiple suction cups are disposed on both sides of the lead frame and are evenly arranged along the length of the lead frame.

4. The integrated semiconductor feeding device according to claim 1, characterized in that: The material handling component 2 also includes two material handling plates 2, which are disposed on both sides of the material handling part 1. The material handling part 1 includes a plurality of suction cups 2 disposed on the two material handling plates 2.

5. The integrated semiconductor feeding device according to claim 1, characterized in that: It also includes a mounting top plate, the lifting cylinder is located below the mounting top plate, and the material handling assembly 2 is installed below the mounting top plate via multiple connecting rods.

6. The integrated semiconductor feeding device according to claim 5, characterized in that: It also includes a robot, and the mounting plate is connected to the robot's output end.

7. The integrated semiconductor feeding device according to claim 5, characterized in that: A detection camera group is provided on one side of the mounting plate, and a scanner is provided on the other side.

8. The integrated semiconductor feeding device according to claim 7, characterized in that: The detection camera assembly is mounted on a camera mounting plate, and a reinforcing support plate connecting the camera mounting plate and the mounting top plate is provided on the side of the camera mounting plate near the mounting top plate.

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