Semiconductor die bonder wafer transfer module and production line

Abstract

The utility model relates to a kind of semiconductor die bonder wafer transfer module and production line, including pedestal, X-axis transfer module, Y-axis lifting module and jaw module;X-axis transfer module includes screw rod, first drive source and platform;Y-axis lifting module includes fixed plate and second drive source;Jaw module includes mounting plate, fixed clamping plate, movable clamping plate and third drive source.This transfer module includes X-axis transfer module, Y-axis lifting module and jaw module respectively by independent drive source drive, this kind of modular design allows each axis parallel preparation or action execution, greatly shorten the overall transfer cycle, pace is very compact.And sensor collaborative control and real-time information feedback are configured for three modules, so that equipment can quickly determine current state and immediately trigger next action, reduce waiting and confirmation time, to further shorten the response time of entire transfer process;While the space layout of entire structure is compact, saves space and cost.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, and in particular to a semiconductor die bonder wafer transfer module and production line. Background Technology

[0002] In semiconductor packaging processes, the die bonder is a key piece of equipment for bonding chips to substrates, and its performance directly affects packaging efficiency and precision. The gripping and positioning of the wafer disk is a fundamental step in the die bonder process, requiring the mechanism to efficiently and accurately transfer the wafer disk to the worktable and ensure coordination with subsequent steps.

[0003] In existing die bonding equipment, the transfer of wafer disks is mostly achieved by robotic arms or pneumatic grippers. However, their movement cycle and subsequent alignment, bonding and other processes often lack coordinated control, which can easily lead to motion interference or extended production cycle due to timing errors. At the same time, due to space layout limitations, traditional gripping mechanisms are often large in size and difficult to adapt to the needs of high-density integrated equipment. Utility Model Content

[0004] Therefore, the technical problem to be solved by this utility model is to overcome the fact that in the prior art, the transfer of wafer disks is mostly achieved by robotic arms or pneumatic grippers, but their movement cycle and subsequent alignment, bonding and other processes often lack coordinated control, which can easily lead to motion interference or extended production cycle due to timing errors. At the same time, due to space layout limitations, traditional gripping mechanisms are often large in size and difficult to adapt to the needs of high-density integrated equipment.

[0005] To solve the above-mentioned technical problems, this utility model provides a semiconductor die bonder wafer transfer module, comprising, Base; The X-axis transfer module includes a lead screw, a first drive source, and a platform. The lead screw is rotatably connected to the base and extends along the X-axis direction. The first drive source is mounted on the base to drive the lead screw to rotate. The platform is slidably connected to the base along the X-axis direction and threadedly connected to the lead screw. The Y-axis lifting module includes a fixed plate and a second drive source. The fixed plate is slidably connected to the platform along the Y-axis direction, and the second drive source is connected to the platform to drive the fixed plate to slide. The gripper module includes a mounting plate, a fixed clamping plate, a movable clamping plate, and a third drive source. The mounting plate is connected to the fixed plate and extends along the X-axis. At least two fixed clamping plates are symmetrically arranged in the width direction at the end of the mounting plate away from the fixed plate. At least two movable clamping plates, each corresponding to a position of a fixed clamping plate, are rotatably connected to the mounting plate. The third drive source is mounted on the mounting plate, and its output end is movably connected to each movable clamping plate via a guide rod. The third drive source drives the movable clamping plates to rotate to move closer to or away from the corresponding fixed clamping plates to perform a clamping or releasing action.

[0006] In one embodiment of the present invention, the base is provided with at least one first slide rail extending along the X-axis direction, and the platform is slidably connected to the first slide rail by a first slider.

[0007] In one embodiment of this utility model, a photoelectric sensor is connected to the end of the base away from the first driving source, and a sensing element corresponding to the position of the photoelectric sensor is provided on the platform.

[0008] In one embodiment of the present invention, the platform is provided with at least one second slide rail extending along the Y-axis direction, and the fixing plate is provided with at least one connecting seat, and each connecting seat is slidably connected to one of the second slide rails by a second slider.

[0009] In one embodiment of this utility model, a contact member is provided on one side of the platform, and a contact sensor corresponding to the position of the contact member is provided on one side of a connecting seat near the contact member.

[0010] In one embodiment of this utility model, the mounting plate is provided with a plurality of guide grooves, and each of the guide rods is slidably connected in the respective guide groove.

[0011] In one embodiment of this utility model, the movable clamping plate includes interconnected plate bodies and hinged parts. The middle part of the hinged part is rotatably connected to the mounting plate, and the end of the hinged part away from the plate body passes through a through groove opened on each of the fixed clamping plates and is connected to the guide rod.

[0012] In one embodiment of this utility model, an extension plate extending to the space between any two adjacent fixing plates is arranged parallel to the mounting plate, and an optical fiber sensor is arranged vertically on the extension plate.

[0013] In one embodiment of this utility model, a gripper gap adjustment assembly is included. The gripper gap adjustment assembly includes a limiting member and a set screw. The limiting member is slidably connected to the mounting plate. The limiting member is provided with a limiting part extending to the front end of the third driving source to limit the extension distance of its output end. The set screw is threadedly connected to one end of the mounting plate and extends in the sliding direction of the limiting member. The free end of the set screw abuts against the limiting member.

[0014] A production line comprising a semiconductor die bonder wafer transfer module as described in any of the preceding claims.

[0015] The above-mentioned technical solution of this utility model has the following advantages compared with the prior art: This utility model discloses a semiconductor die bonder wafer transfer module and production line, comprising an X-axis transfer module, a Y-axis lifting module, and a gripper module, each driven by an independent drive source. This modular design allows each axis to prepare or execute actions in parallel, greatly shortening the overall transfer cycle and achieving a very compact cycle time. Furthermore, all three modules are equipped with sensors for collaborative control and real-time information feedback, enabling the equipment to quickly determine its current state and immediately trigger the next action, reducing waiting and confirmation time, thereby further shortening the response time of the entire transfer process. Simultaneously, the compact spatial layout of the entire structure allows the semiconductor die bonder wafer transfer module to complete the required actions within a limited space, saving space and cost. Attached Figure Description

[0016] To make the content of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings. Figure 1 This is a perspective view of the semiconductor die bonder wafer transfer module of a preferred embodiment of the present invention; Figure 2 This is a schematic diagram of the X-axis transfer module of the semiconductor die bonder wafer transfer module according to a preferred embodiment of the present invention; Figure 3 This is a schematic diagram of the Y-axis lifting module of the semiconductor die bonder wafer transfer module according to a preferred embodiment of the present invention; Figure 4 This is a schematic diagram of the gripper module of the wafer transfer module of the semiconductor die bonder according to a preferred embodiment of the present invention; Figure 5 This is a schematic diagram of the movable clamping plate of the gripper module of the semiconductor die bonder wafer transfer module according to a preferred embodiment of the present invention; Figure 6 This is a schematic diagram of the gripper gap adjustment assembly of the wafer transfer module of the semiconductor die bonder according to a preferred embodiment of the present invention; Figure 7This is a cross-sectional view of the gripper gap adjustment component of the wafer transfer module of the semiconductor die bonder according to a preferred embodiment of the present invention.

[0017] Explanation of reference numerals in the accompanying drawings: 1. Base; 2. X-axis transfer module; 21. Lead screw; 22. First drive source; 23. Platform; 24. First slide rail; 25. Photoelectric sensor; 26. Sensing element; 3. Y-axis lifting module; 31. Fixing plate; 32. Second drive source; 33. Second slide rail; 34. Connecting seat; 35. Contact element; 36. Contact sensor; 4. Gripper module; 41. Mounting plate; 42. Fixed clamping plate; 43. Movable clamping plate; 431. Plate body; 432. Hinge; 44. Third drive source; 45. Guide rod; 46. Fiber optic sensor; 5. Gripper gap adjustment assembly; 51. Limiting element; 52. Set screw. Detailed Implementation

[0018] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand and implement the present invention. However, the embodiments are not intended to limit the present invention.

[0019] Example 1, refer to Figures 1-7 As shown, this utility model discloses a semiconductor die bonder wafer transfer module, comprising: Base 1; X-axis transfer module 2 includes a lead screw 21, a first drive source 22 and a platform 23. The lead screw 21 is rotatably connected to the base 1 and extends along the X-axis direction. The first drive source 22 is mounted on the base 1 to drive the lead screw 21 to rotate. The platform 23 is slidably connected to the base 1 along the X-axis direction and threadedly connected to the lead screw 21. Y-axis lifting module 3 includes a fixed plate 31 and a second drive source 32. The fixed plate 31 is slidably connected to the platform 23 along the Y-axis direction, and the second drive source 32 is connected to the platform 23 to drive the fixed plate 31 to slide. The gripper module 4 includes a mounting plate 41, a fixed clamping plate 42, a movable clamping plate 43, and a third drive source 44. The mounting plate 41 is connected to the fixed plate 31 and extends along the X-axis. At least two fixed clamping plates 42 are symmetrically arranged in the width direction at one end of the mounting plate 41 away from the fixed plate 31. At least two movable clamping plates 43 are rotatably connected to the mounting plate 41, each corresponding to the position of a fixed clamping plate 42. The third drive source 44 is mounted on the mounting plate 41. The output end of the third drive source 44 is movably connected to each movable clamping plate 43 through a guide rod 45. The third drive source 44 drives the movable clamping plates 43 to rotate to move closer to or away from the corresponding fixed clamping plates 42 to form a clamping or releasing action.

[0020] This invention discloses a wafer transfer module for a semiconductor die bonder, comprising an X-axis transfer module 2, a Y-axis lifting module 3, and a gripper module 4, each driven by an independent drive source. This modular design allows each axis to prepare or execute actions in parallel, significantly shortening the overall transfer cycle and resulting in a very compact cycle time. Furthermore, all three modules are equipped with sensors for collaborative control and real-time information feedback, enabling the device to quickly determine its current state and immediately trigger the next action, reducing waiting and confirmation time and further shortening the response time of the entire transfer process. Simultaneously, the compact spatial layout of the entire structure allows the semiconductor die bonder wafer transfer module to complete the required actions within a limited space, saving space and cost.

[0021] Specifically, the X-axis transfer module 2 drives the stage 23 to reciprocate along the X-axis direction, realizing linear transfer of the wafer in the horizontal direction. A lead screw 21 is rotatably connected to the base 1 and extends along the X-axis direction. Both ends of the lead screw 21 are connected to the base 1 via high-precision bearings. The bearings are pre-tightened to effectively eliminate radial and axial backlash, improving the stability and accuracy of the lead screw 21's rotation. A first drive source 22 is mounted on the base 1 to drive the lead screw 21 to rotate. The first drive source 22 can be a stepper motor or a servo motor. The stage 23 is slidably connected to the base 1 along the X-axis direction and threadedly connected to the lead screw 21. The stage 23 has a threaded hole adapted to the lead screw 21. When the lead screw 21 rotates under the drive of the first drive source 22, the stage 23 can slide smoothly along the X-axis direction under the threaded transmission of the lead screw 21.

[0022] Y-axis lifting module 3 is used to drive gripper module 4 to move up and down along the Y-axis direction, thereby adjusting the height of the wafer in the vertical direction. Fixing plate 31 is slidably connected to stage 23 along the Y-axis direction. Fixing plate 31 serves as the mounting carrier for gripper module 4, and its sliding accuracy directly affects the lifting accuracy of gripper module 4. Second drive source 32 is connected to stage 23 to drive fixing plate 31 to slide. Second drive source 32 can be a cylinder.

[0023] The gripper module 4 is used to perform clamping and releasing operations on the wafer, and is a key component to ensure the stability and reliability of the wafer during transfer. The mounting plate 41 and the fixed plate 31 are fixedly connected by bolts, and the levelness and positional accuracy of the mounting plate 41 are ensured through precise calibration during the connection process. The mounting plate 41 is made of lightweight high-strength alloy, which reduces the weight of the overall module and reduces the drive load while ensuring structural strength. The movable clamping plates 43 correspond one-to-one with the fixed clamping plates 42 to form a clamping unit. Through the coordinated action of multiple clamping units, the wafer can be clamped from multiple positions, further improving the stability of clamping and preventing the wafer from shifting or slipping during transfer. The output end of the third drive source 44 is movably connected to each movable clamping plate 43 through the guide rod 45. The third drive source 44 is preferably a small cylinder or electric push rod, which has the characteristics of small size, fast response speed and stable output force, and can provide reliable power for the rotation of the movable clamping plates 43. When the third drive source 44 is working, its output end extends or retracts, driving each movable clamping plate 43 to rotate around its rotational connection point with the mounting plate 41 via the guide rod 45. This causes the movable clamping plate 43 to move closer to or further away from the corresponding fixed clamping plate 42, thereby achieving the clamping or releasing action of the wafer. The guide rod 45 is a flexible guide rod.

[0024] Reference Figure 2 As shown, further, the base 1 is provided with at least one first slide rail 24 extending along the X-axis direction, and the platform 23 is slidably connected to the first slide rail 24 via a first slider. Preferably, two first slide rails 24 are arranged in parallel on the base 1, with the two first slide rails 24 located on both sides of the lead screw 21, and two first sliders adapted to the first slide rails 24 are correspondingly provided at the bottom of the platform 23. This double slide rail guide structure can effectively limit the swaying of the platform 23 during the sliding process, ensuring that the platform 23 always moves in a straight line along the X-axis direction, significantly improving the accuracy of load transfer in the X-axis direction.

[0025] Furthermore, a photoelectric sensor 25 is connected to the end of the base 1 furthest from the first drive source 22, and a sensing element 26 corresponding to the position of the photoelectric sensor 25 is provided on the stage 23. Specifically, the photoelectric sensor 25 and the sensing element 26 work together to limit the movement stroke and detect the position of the stage 23. When the stage 23 moves along the X-axis towards the end furthest from the first drive source 22, and the sensing element 26 moves into the detection area of ​​the photoelectric sensor 25, the photoelectric sensor 25 will emit a detection signal. This signal can be transmitted to the control system of the device. The control system controls the first drive source 22 to stop working based on this signal, thereby achieving limit protection for the stage 23 and preventing the stage 23 from colliding with other components due to overtravel. At the same time, through the cooperation of the photoelectric sensor 25 and the sensing element 26, the position information of the stage 23 can also be monitored in real time, providing data support for the control system to accurately control the movement position of the stage 23.

[0026] Reference Figure 3 As shown, further, the platform 23 is provided with at least one second slide rail 33 extending along the Y-axis direction, and the fixed plate 31 is provided with at least one connecting seat 34. Each connecting seat 34 is slidably connected to one of the second slide rails 33 via a second slider. Preferably, two second slide rails 33 are arranged in parallel on the platform 23, and two connecting seats 34 are correspondingly provided on the fixed plate 31. The bottom of each connecting seat 34 is equipped with a second slider that matches the second slide rail 33. This double slide rail guide structure can effectively prevent the fixed plate 31 from tilting or swaying during the lifting process, ensuring that the fixed plate 31 always moves vertically along the Y-axis direction, thus improving the accuracy of lifting in the Y-axis direction.

[0027] Furthermore, a contact element 35 is provided on one side of the stage 23, and a contact sensor 36 corresponding to the position of the contact element 35 is provided on one side of a connecting seat 34 near the contact element 35. Specifically, the contact sensor 36 works in conjunction with the contact element 35 to limit and detect the lifting stroke of the fixing plate 31. When the fixing plate 31 descends along the Y-axis, the connecting seat 34 descends along with the fixing plate 31. When the contact sensor 36 contacts the contact element 35, the contact sensor 36 will send a trigger signal. After receiving the signal, the control system will control the second drive source 32 to stop working. Similarly, when the fixing plate 31 descends to the lowest position, a similar contact detection structure can also be used to achieve limit protection. In addition, the contact sensor 36 can also provide real-time feedback on the lifting position of the fixing plate 31, providing a reliable basis for the control system to accurately control the lifting height of the wafer.

[0028] Reference Figure 4 As shown, the mounting plate 41 is further provided with multiple guide grooves, and each guide rod 45 is slidably connected to each guide groove. Specifically, to ensure the stability and motion accuracy of the guide rod 45 in driving the movable clamping plate 43, the mounting plate 41 is provided with multiple guide grooves, and each guide rod 45 is slidably connected to each guide groove. The shape and size of the guide grooves are adapted to the guide rod 45, which can limit the movement direction of the guide rod 45, prevent the guide rod 45 from deviating or wobbling during movement, and ensure that the guide rod 45 can accurately and stably drive the movable clamping plate 43 to rotate, thereby ensuring the accuracy and reliability of the clamping action.

[0029] Reference Figure 5As shown, the movable clamping plate 43 further includes a plate body 431 and a hinge portion 432 connected to each other. The middle position of the hinge portion 432 is rotatably connected to the mounting plate 41, and the end of the hinge portion 432 away from the plate body 431 passes through a through slot opened on each fixed clamping plate 42 and is connected to the guide rod 45. Specifically, the fixed clamping plate 42 and the mounting plate 41 are integrally formed structures or fixedly connected by welding, bolts or other methods. A flexible buffer pad is attached to the inner side wall of the fixed clamping plate 42. The buffer pad is made of wear-resistant and high-temperature resistant silicone or rubber material, which can effectively prevent scratches on the edge of the wafer when clamping the wafer, and at the same time increase the friction between the fixed clamping plate 42 and the wafer, thereby improving the clamping stability. The structural design of plate 431 matches that of fixed clamping plate 42. Its inner sidewall is also covered with flexible buffer pads, which work together with the buffer pads of fixed clamping plate 42 to achieve flexible clamping of the wafer. The hinge part 432 is made of high-strength metal material, which has good toughness and wear resistance. The through slot on fixed clamping plate 42 provides space for the connection between hinge part 432 and guide rod 45.

[0030] Furthermore, an extension plate extending parallel to any two adjacent fixed clamping plates 42 is disposed on the mounting plate 41, and a fiber optic sensor 46 is vertically disposed on the extension plate. The fiber optic sensor 46 features high detection accuracy, fast response speed, and strong anti-interference capability, and can detect in real time whether the wafer has entered the clamping position and whether the wafer's position is accurate. When the gripper module 4 performs a clamping action, if the fiber optic sensor 46 detects the presence of the wafer and its accurate position, it will send a confirmation signal to the control system, and the control system can then control the X-axis transfer module 2 and the Y-axis lifting module 3 to perform the transfer operation; if the fiber optic sensor 46 does not detect the wafer or detects a wafer position deviation, it will send an alarm signal, and the control system will immediately stop subsequent operations to prevent equipment failure or poor processing due to the absence of a wafer or abnormal wafer position, effectively improving the safety and reliability of the entire transfer process.

[0031] Reference Figure 6 and Figure 7As shown, the device further includes a gripper gap adjustment assembly 5, which includes a limiting member 51 and a set screw 52. The limiting member 51 is slidably connected to the mounting plate 41, and has a limiting portion extending to the front end of the third drive source 44 to limit the extension distance of its output end. The set screw 52 is threaded to one end of the mounting plate 41 and extends in the sliding direction of the limiting member 51, with the free end of the set screw 52 abutting against the limiting member 51. Specifically, by rotating the set screw 52, ​​the limiting member 51 can be pushed to slide along the mounting plate 41, thereby changing the position of the limiting portion. When the clamping gap needs to be increased, the set screw 52 is rotated clockwise. The set screw 52 pushes the limiting member 51 to slide closer to the third drive source 44. The limiting part contacts the output end of the third drive source 44 in advance, limiting the extension distance of the output end, thereby increasing the distance between the movable clamping plate 43 and the fixed clamping plate 42. When the clamping gap needs to be decreased, the set screw 52 is rotated counterclockwise. The output end of the third drive source 44 can extend further, thereby decreasing the distance between the movable clamping plate 43 and the fixed clamping plate 42. This adjustment method is simple and precise to operate. The clamping gap can be adjusted without disassembling the clamping jaw module 4, which greatly improves the versatility and ease of use of the clamping jaw module 4.

[0032] Working process: Upon receiving the wafer transfer signal, the X-axis transfer module 2 is activated. The first drive source 22 drives the lead screw 21 to rotate, thereby driving the stage 23 to move along the X-axis. The moving distance is confirmed by the output signal of the first drive source 22, and the photoelectric sensor 25 confirms that the stage 23 has reached the position signal. While the stage 23 is moving, the Y-axis lifting module 3 is activated. The second drive source 32 drives the fixed plate 31 to descend. The magnetic switch sensor of the second drive source 32 confirms the extension state of the output end of the second drive source 32, and the contact sensor 36 confirms that the descent is in place. At the same time, the gripper module 4 opens (i.e., the third drive source 44 drives the movable gripper 43 to rotate away from the fixed gripper 42), and the fiber optic sensor 46 confirms that the wafer has reached the position signal. Whether the disk is in position (i.e., whether the wafer has entered between the fixed clamping plate 42 and the movable clamping plate 43) is detected. When the position is detected, the signal feedback notifies the third drive source 44 to retract and clamp the wafer disk. The magnetic opening sensor of the third drive source 44 confirms the retraction state of the third drive source 44, and the signal feedback notifies the X-axis transfer module 2 to move, so that the stage 23 moves backward and drives the wafer disk to the predetermined position. The output signal of the first drive source 22 confirms the moving distance, and at the same time, the photoelectric sensor 25 confirms the position arrival signal. Then, the gripper module 4 moves to release the wafer disk, and the first drive source 22 drives the stage 23 to continue to move backward and reset, so that the chuck (i.e., the fixed clamping plate 42 and the movable clamping plate 43) is separated from the wafer disk. At the same time, the Y-axis lifting module 3 resets.

[0033] In embodiment two, this utility model also discloses a production line, including the semiconductor die bonder wafer transfer module as in embodiment one.

[0034] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. A semiconductor die bonder wafer transfer module, characterized in that: include, Base; The X-axis transfer module includes a lead screw, a first drive source, and a platform. The lead screw is rotatably connected to the base and extends along the X-axis direction. The first drive source is mounted on the base to drive the lead screw to rotate. The platform is slidably connected to the base along the X-axis direction and threadedly connected to the lead screw. The Y-axis lifting module includes a fixed plate and a second drive source. The fixed plate is slidably connected to the platform along the Y-axis direction, and the second drive source is connected to the platform to drive the fixed plate to slide. The gripper module includes a mounting plate, a fixed clamping plate, a movable clamping plate, and a third drive source. The mounting plate is connected to the fixed plate and extends along the X-axis. At least two fixed clamping plates are symmetrically arranged in the width direction at the end of the mounting plate away from the fixed plate. At least two movable clamping plates, each corresponding to a position of a fixed clamping plate, are rotatably connected to the mounting plate. The third drive source is mounted on the mounting plate, and its output end is movably connected to each movable clamping plate via a guide rod. The third drive source drives the movable clamping plates to rotate to move closer to or away from the corresponding fixed clamping plates to perform a clamping or releasing action.

2. The semiconductor die bonder wafer transfer module according to claim 1, characterized in that: The base is provided with at least one first slide rail extending along the X-axis direction, and the platform is slidably connected to the first slide rail by a first slider.

3. The semiconductor die bonder wafer transfer module according to claim 1, characterized in that: A photoelectric sensor is connected to the end of the base away from the first driving source, and a sensing element corresponding to the position of the photoelectric sensor is provided on the platform.

4. The semiconductor die bonder wafer transfer module according to claim 1, characterized in that: The platform is provided with at least one second slide rail extending along the Y-axis, and the fixed plate is provided with at least one connecting seat. Each connecting seat is slidably connected to one of the second slide rails by a second slider.

5. The semiconductor die bonder wafer transfer module according to claim 4, characterized in that: A contact element is provided on one side of the platform, and a contact sensor corresponding to the position of the contact element is provided on one side of a connecting seat near the contact element.

6. The semiconductor die bonder wafer transfer module according to claim 1, characterized in that: The mounting plate is provided with multiple guide grooves, and each of the guide rods is slidably connected in each of the guide grooves.

7. The semiconductor die bonder wafer transfer module according to claim 6, characterized in that: The movable clamping plate includes interconnected plates and hinged parts. The middle part of the hinged part is rotatably connected to the mounting plate. The end of the hinged part away from the plate passes through a through groove opened on each of the fixed clamping plates and is connected to the guide rod.

8. The semiconductor die bonder wafer transfer module according to claim 1, characterized in that: An extension plate extending between any two adjacent fixing plates is arranged parallel to the mounting plate, and an optical fiber sensor is arranged vertically on the extension plate.

9. The semiconductor die bonder wafer transfer module according to claim 1, characterized in that: The device includes a gripper gap adjustment assembly, which includes a limiting member and a set screw. The limiting member is slidably connected to the mounting plate and has a limiting part extending to the front end of the third drive source to limit the extension distance of its output end. The set screw is threadedly connected to one end of the mounting plate and extends in the sliding direction of the limiting member. The free end of the set screw abuts against the limiting member.

10. A production line, characterized in that: Includes the semiconductor die bonder wafer transfer module as described in any one of claims 1-9.

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