Wafer handling ceramic chuck

Abstract

The utility model discloses a wafer carries ceramic suction cup, including gas distribution block, capillary, suction cup seat, first ceramic suction cup, support plate and clamping plate, and the gas distribution block has the shunt chamber in, and the gas distribution block is sealed and is fixed and is installed with the gas path joint, and the gas path joint is connected to vacuum generating device through pipeline and solenoid valve, and a plurality of capillary sealed fixed mounting is in the gas distribution block, and the gas path joint, capillary all are communicated to the shunt chamber, and suction cup seat fixed mounting is in a plurality of capillary right -hand ends. This ceramic suction cup can satisfy the wafer above 500 degrees Celsius environment and carry out the traceless operation of handling. The height of suction cup seat, first ceramic suction cup combination is 4.6mm, and the height of support plate, clamping plate, second ceramic suction cup is also 4.6mm, can enter the space operation of height 5mm, and can satisfy 5inches -12 inches wafer size.

Description

Technical Field

[0001] This utility model belongs to the field of automated vacuum handling technology, and in particular relates to a ceramic chuck for wafer handling. Background Technology

[0002] Wafer transfer chucks are key components in semiconductor manufacturing used for the safe and precise handling of wafers. They utilize negative pressure adsorption or non-contact Bernoulli effect to grip and move these expensive and fragile substrates. In the semiconductor industry, wafer processing stages require high-temperature / mark-free handling of wafers within a space of only about 5mm. Summary of the Invention

[0003] The technical problem to be solved by this utility model is to provide a ceramic chuck that can handle wafers without leaving marks in environments above 500 degrees Celsius.

[0004] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution: a wafer handling ceramic chuck, comprising a gas distribution block, capillaries, a chuck base, a first ceramic chuck, a support plate, and a clamping plate. The gas distribution block has a flow distribution chamber. A gas path connector is sealed and fixedly installed on the gas distribution block. The gas path connector is connected to a vacuum generating device through a pipeline and a solenoid valve. Several capillaries are sealed and fixedly installed on the gas distribution block. The gas path connector and the capillaries are all connected to the flow distribution chamber. The chuck base is fixedly installed on the right end of several capillaries. The edge of the first ceramic chuck is sealed and fixedly installed on the chuck base. The first ceramic chuck is also connected to several capillaries. The support plate and clamping plate are provided with semi-circular holes that match the capillary tube. The support plate and clamping plate are locked and fixed to the capillary tube by bolts.

[0005] Preferably, a second ceramic suction cup is fixedly installed on both sides of the support plate, and the second ceramic suction cup is connected to the diversion chamber through pipelines and solenoid valves.

[0006] Preferably, the gas distribution block is also equipped with a spare interface, which is sealed by a screw plug.

[0007] Preferably, several capillaries are arranged in parallel into two groups, with a gap of 3-6 mm between the two groups of capillaries.

[0008] Compared with the prior art, the advantages of this utility model are: this ceramic chuck can perform traceless handling of wafers in environments above 500 degrees Celsius. The height of the chuck base and the first ceramic chuck assembly is 4.6mm, and the height of the support plate, clamping plate, and the second ceramic chuck is also 4.6mm, allowing operation in spaces with a height of 5mm, and accommodating wafer sizes from 5 inches to 12 inches. Attached Figure Description

[0009] The present invention will be further described below with reference to the accompanying drawings.

[0010] Figure 1 This is a perspective view of the present invention.

[0011] Figure 2 This is a top view of the present invention.

[0012] Figure 3 This is a bottom view of the present invention.

[0013] Figure 4 It is a three-dimensional diagram of the support plate and clamping plate. Detailed Implementation

[0014] The present invention will now be described in detail with reference to specific embodiments: like Figures 1 to 4 The wafer handling ceramic chuck shown includes a gas distribution block 1, capillary tubes 2, a chuck base 3, a first ceramic chuck 31, a support plate 4, and a clamping plate 5. The gas distribution block 1 has a flow distribution chamber. A gas connector 11 is sealed and fixedly installed on the gas distribution block 1. The gas connector 11 is connected to a vacuum generator through a pipeline and a solenoid valve. Several capillary tubes 2 are sealed and fixedly installed on the gas distribution block 1. The gas connector 11 and the capillary tubes 2 are all connected to the flow distribution chamber. The chuck base 3 is fixedly installed on the right end of several capillary tubes 2. The edge of the first ceramic chuck 31 is sealed and fixedly installed on the chuck base 3. The first ceramic chuck 31 is also connected to several capillary tubes 2. The support plate 4 and clamping plate 5 are respectively provided with semi-circular holes that mate with the capillary tube 2. The support plate 4 and clamping plate 5 are fixed to the capillary tube 2 by bolts. The gas distribution block 1, capillary tube 2, suction cup seat 3, support plate 4 and clamping plate 5 are all made of iron.

[0015] The support plate 4 has a second ceramic suction cup 41 fixedly installed on both sides. The second ceramic suction cup 41 is connected to the diversion chamber through pipelines and solenoid valves to increase the negative pressure suction on the wafer and prevent the adsorbed wafer from falling off when flipping.

[0016] The air distribution block 1 is also equipped with a spare interface, which is sealed by screw plug 12 and serves as a spare air connection for air connector 11. Multiple air connectors 11 can be installed when a large suction is required.

[0017] Several capillary tubes 2 are arranged in parallel into two groups, and there is a 5.5mm gap 21 between the two groups of capillary tubes 2 so that the bolts connecting the support plate 4 and the clamping plate 5 can pass through the gap 21.

[0018] Taking the negative pressure adsorption method as an example, the ceramic suction cup is installed on the automated robotic arm. The air connector 11 is connected to the vacuum generating equipment through pipelines and solenoid valves. When the vacuum generating equipment is started, the first ceramic suction cup 31 and the second ceramic suction cup 41 adsorb and fix the wafer, take it out of the space and rotate it 180°. After rotation, the first ceramic suction cup 31 and the second ceramic suction cup 41 can also support the wafer, increasing its stability during the transfer process.

Claims

1. A ceramic chuck for wafer handling, characterized in that: The system includes a gas distribution block (1), capillary tubes (2), suction cup seat (3), first ceramic suction cup (31), support plate (4), and clamping plate (5). The gas distribution block (1) has a flow distribution chamber. A gas connection connector (11) is sealed and fixedly installed on the gas distribution block (1). The gas connection connector (11) is connected to the vacuum generator through pipelines and solenoid valves. Several capillary tubes (2) are sealed and fixedly installed on the gas distribution block (1). The gas connection connector (11) and capillary tubes (2) are connected to the flow distribution chamber. The suction cup seat (3) is fixedly installed on the right end of several capillary tubes (2). The edge of the first ceramic suction cup (31) is sealed and fixedly installed on the suction cup seat (3). The first ceramic suction cup (31) is also connected to several capillary tubes (2). The support plate (4) and clamping plate (5) are respectively provided with semi-circular holes that cooperate with the capillary tube (2). The support plate (4) and clamping plate (5) are fixed to the capillary tube (2) by bolts.

2. The wafer handling ceramic chuck according to claim 1, characterized in that: The second ceramic suction cup (41) is fixedly installed on both sides of the support plate (4). The second ceramic suction cup (41) is connected to the diversion chamber through pipelines and solenoid valves.

3. The wafer handling ceramic chuck according to claim 1, characterized in that: A spare interface is also provided on the gas distribution block (1), and the spare interface is sealed by screwing in a plug (12).

4. The wafer handling ceramic chuck according to claim 2, characterized in that: Several capillaries (2) are arranged in parallel and divided into two groups, with a gap (21) of 3-6 mm between the two groups of capillaries (2).

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