A power module

Abstract

The application discloses a power module, comprising: a substrate; a plurality of power modules, the power modules being located on a first surface of the substrate; a heat dissipation bottom plate, the heat dissipation bottom plate being located on a second surface of the substrate; and a groove, the groove being located on a first surface of the heat dissipation bottom plate. By arranging the groove on the heat dissipation bottom plate, a temperature sensor can be placed to directly measure the temperature of the power module, thereby saving cost, simplifying the process and facilitating system integration.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor integrated circuit manufacturing, and in particular to a power module. Background Technology

[0002] With the advancement of power electronics technology, power modules have developed rapidly, and smaller size, higher power density, and lower cost are gradually becoming the trend, while also creating a demand for temperature sampling.

[0003] On the power modules of the power module, one implementation scheme involves additionally setting up temperature sensors and temperature detection pins. Each power module requires a temperature detection pin, which increases the difficulty of power module design and manufacturing, and the temperature detection pins occupy area of ​​the power module, making implementation inconvenient. Another implementation scheme uses a PCB temperature sensing board for temperature measurement. The temperature sensing board has an embedded NTC on the back and is interconnected with the power module through thermal grease for temperature measurement. This scheme is costly and not easy to apply in system systems. Utility Model Content

[0004] In view of the above, the purpose of this utility model is to provide a power module, comprising:

[0005] substrate;

[0006] A plurality of power modules are located on the first surface of a substrate. Each power module includes a first side and a second side of a power module, as well as a third side and a fourth side of a power module. The first side and the third side of the power module are perpendicular to each other, the third side of the power module is parallel to the third side of the power module, and the fourth side of the power module is parallel to the fourth side of the power module.

[0007] A heat dissipation base plate is located on the second surface of the substrate.

[0008] The groove is located on the first surface of the heat sink base plate.

[0009] Preferably, the power module further includes a temperature sensor located within the recess.

[0010] Preferably, the power module further includes a plug-in board, one end of which is fixedly located in the groove, and the other end of which is connected to the PCB driver board.

[0011] Preferably, the power module includes:

[0012] Power device unit;

[0013] The power terminals include a first power terminal and a second power terminal. The first power terminal is located on the third side of the power module, and the second power terminal is located on the fourth side of the power module.

[0014] The signal terminals include a first control terminal and a first sampling terminal, which are located on the third side of the power module.

[0015] Preferably, two power modules constitute a half-bridge power unit, and three half-bridge power units constitute a full-bridge power unit.

[0016] Preferably, the power module includes:

[0017] Power device unit;

[0018] The power terminals include a first power terminal, a second power terminal, and a third power terminal. The first power terminal is located on the third side of the power module, the second power terminal is located in the middle of the first surface of the power module, and the third power terminal is located on the fourth side of the power module.

[0019] The signal terminals include a first control terminal, a first sampling terminal, a second control terminal, and a second sampling terminal. The first control terminal and the first sampling terminal are located on the third side of the power module, and the second control terminal and the second sampling terminal are located on the fourth side of the power module.

[0020] Preferably, the power module is a half-bridge power unit, and three half-bridge power units constitute a full-bridge power unit.

[0021] Preferably, the heat dissipation base plate includes a first side and a second side of the heat dissipation base plate, as well as a third side and a fourth side of the heat dissipation base plate, with the first side and the third side of the heat dissipation base plate being perpendicular to each other, and the groove being located on the first side of the heat dissipation base plate.

[0022] Preferably, the groove is located on the first side and the second side of the heat dissipation base plate.

[0023] Preferably, the grooves are located on both sides of the half-bridge power unit.

[0024] Preferably, there are N grooves, where N is a positive integer greater than or equal to 1.

[0025] Preferably, the projected shape of the groove includes, but is not limited to, waist-shaped, circular, elliptical, square, and rhomboid.

[0026] This invention eliminates the need for additional temperature sensors and temperature detection pins on the power module itself, and also eliminates the need for temperature measurement via a PCB temperature measuring board, simplifying the power module implementation. Furthermore, the power module of this invention only features a groove on its heat sink base, allowing the temperature sensor to be directly embedded within it, thus avoiding signal and power terminals and saving space. Additionally, the groove can connect to a plug-in board, with one end fixed within the groove and the other end connected to the PCB driver board. This structure not only reduces the overall system cost but also simplifies the manufacturing process and improves assembly efficiency. Simultaneously, because the temperature sensor is directly embedded in the module structure, it can more accurately reflect the temperature changes of the coolant or heat dissipation medium, providing more precise temperature monitoring data and contributing to improved system control accuracy and operational safety. Attached Figure Description

[0027] The above and other objects, features and advantages of the present invention will become clearer from the following description of embodiments of the present invention with reference to the accompanying drawings, in which:

[0028] Figure 1 A schematic diagram of the structure of a power module according to a first embodiment of the present invention is shown;

[0029] Figure 2 A schematic diagram of the structure of the power module of this utility model in embodiment two is shown;

[0030] Figure 3 This diagram shows a structural schematic of another arrangement of the grooves in Embodiment 2 of the power module of this utility model;

[0031] Figure 4 This diagram shows the structural schematic of the connection between the power module of Embodiment 2 of this utility model and the PCB driver board; Detailed Implementation

[0032] The present application is described below based on embodiments, but it is not limited to these embodiments. In the detailed description of the present application below, certain specific details are described in detail. Those skilled in the art can fully understand the present application without these details. To avoid obscuring the substance of the present application, well-known methods, processes, flows, elements, and circuits are not described in detail.

[0033] Furthermore, those skilled in the art should understand that the accompanying drawings provided herein are for illustrative purposes only and are not necessarily drawn to scale.

[0034] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0035] For ease of explanation, spatially related terms such as “inside,” “outside,” “below,” “below,” “lower,” “above,” “upper,” etc., are used herein to describe the relationship between one element or feature illustrated in the figure and another. It will be understood that spatially related terms may be intended to encompass different orientations of the device in use or operation besides those depicted in the figure. For example, if the device in the figure is flipped, an element described as “below” or “below” another element or feature would then be positioned “above” that other element or feature. Thus, the exemplified term “below” can encompass both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially related descriptive terms used herein should be interpreted accordingly.

[0036] Unless the context explicitly requires it, words such as "including" or "contains" throughout the application should be interpreted as including rather than exclusive or exhaustive; that is, meaning "including but not limited to".

[0037] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0038] Figures 1-4 This is a schematic diagram of a power module provided in an embodiment of the present invention. The power module includes:

[0039] substrate 100;

[0040] A plurality of power modules are located on the first surface of the substrate 100. Each power module includes a first side and a second side of the power module, as well as a third side and a fourth side of the power module. The first side and the third side of the power module are perpendicular to each other, the third side of the power module is parallel to the third side of the power module, and the fourth side of the power module is parallel to the fourth side of the power module.

[0041] Heat dissipation base plate 200, which is located on the second surface of substrate 100;

[0042] Groove 201 is located on the first surface of heat dissipation base plate 200.

[0043] Furthermore, the power module also includes a temperature sensor located within the recess 201.

[0044] like Figure 4 As shown, the power module also includes a plug-in board 401, one end of which is fixedly located in the groove 201, and the other end of which is connected to the PCB driver board 400.

[0045] like Figure 2 As shown, the power module includes:

[0046] Power device unit;

[0047] The power terminals include a first power terminal 301 and a second power terminal 302. The first power terminal 301 is located on the third side of the power module, and the second power terminal 302 is located on the fourth side of the power module.

[0048] The signal terminals include a first control terminal 304 and a first sampling terminal 305, which are located on the third side of the power module.

[0049] like Figure 2 As shown, two power modules constitute a half-bridge power unit, and three half-bridge power units constitute a full-bridge power unit.

[0050] like Figure 3 As shown, the power module includes:

[0051] Power device unit;

[0052] The power terminals include a first power terminal 301, a second power terminal 302, and a third power terminal 303. The first power terminal 301 is located on the third side of the power module, the second power terminal 302 is located in the middle of the first surface of the power module, and the third power terminal 303 is located on the fourth side of the power module.

[0053] The signal terminals include a first control terminal 304, a first sampling terminal 305, a second control terminal 306, and a second sampling terminal 307. The first control terminal 304 and the first sampling terminal 305 are located on the third side of the power module, and the second control terminal 306 and the second sampling terminal 307 are located on the fourth side of the power module.

[0054] like Figure 3 As shown, the power module is a half-bridge power unit, and three half-bridge power units constitute a full-bridge power unit.

[0055] like Figure 2As shown, the heat dissipation base plate 200 includes a first side and a second side of the heat dissipation base plate 200, as well as a third side and a fourth side of the heat dissipation base plate 200, which are opposite to each other. The first side and the third side of the heat dissipation base plate 200 are perpendicular to each other, and the groove 201 is located on the first side of the heat dissipation base plate 200.

[0056] like Figure 3 As shown, the groove 201 is located on the first and second sides of the heat dissipation base plate 200.

[0057] Furthermore, the groove 201 is located on both sides of the half-bridge power unit.

[0058] Furthermore, there are N grooves 201, where N is a positive integer greater than or equal to 1.

[0059] like Figures 1 to 4 As shown, the projected shape of the groove 201 includes, but is not limited to, waist-shaped, circular, elliptical, square, and rhomboid.

[0060] As described above, these embodiments of the present invention do not exhaustively cover all details, nor do they limit the invention to the specific embodiments described. Clearly, many modifications and variations can be made based on the above description. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to effectively utilize the present invention and its modifications. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A power module, characterized in that, include: substrate; A plurality of power modules are located on a first surface of the substrate. Each power module includes a first side and a second side of the power module, as well as a third side and a fourth side of the power module, which are opposite to each other. The first side and the third side of the power module are perpendicular to each other, the third side of the power module is parallel to the third side of the power module, and the fourth side of the power module is parallel to the fourth side of the power module. A heat dissipation base plate, wherein the heat dissipation base plate is located on the second surface of the substrate; A groove, the groove being located on the first surface of the heat dissipation base plate.

2. The power module according to claim 1, characterized in that, The power module also includes a temperature sensor located within the groove.

3. The power module according to claim 1 or 2, characterized in that, The power module also includes a plug-in board, one end of which is fixedly located in the groove, and the other end of which is connected to the PCB driver board.

4. The power module according to claim 1, characterized in that, The power module includes: Power device unit; The power terminal includes a first power terminal and a second power terminal, wherein the first power terminal is located on the third side of the power module and the second power terminal is located on the fourth side of the power module; The signal terminal includes a first control terminal and a first sampling terminal, which are located on the third side of the power module.

5. The power module according to claim 4, characterized in that, Two of the power modules constitute a half-bridge power unit, and three of the half-bridge power units constitute a full-bridge power unit.

6. The power module according to claim 1, characterized in that, The power module includes: Power device unit; The power terminal includes a first power terminal, a second power terminal, and a third power terminal. The first power terminal is located on the third side of the power module, the second power terminal is located in the middle of the first surface of the power module, and the third power terminal is located on the fourth side of the power module. The signal terminal includes a first control terminal, a first sampling terminal, a second control terminal, and a second sampling terminal. The first control terminal and the first sampling terminal are located on the third side of the power module, and the second control terminal and the second sampling terminal are located on the fourth side of the power module.

7. The power module according to claim 6, characterized in that, The power module is a half-bridge power unit, and three half-bridge power units constitute a full-bridge power unit.

8. The power module according to claim 1, characterized in that, The heat dissipation base plate includes a first side and a second side of the heat dissipation base plate, as well as a third side and a fourth side of the heat dissipation base plate, which are opposite to each other. The first side and the third side of the heat dissipation base plate are perpendicular to each other, and the groove is located on the first side of the heat dissipation base plate.

9. The power module according to claim 8, characterized in that, The groove is located on the first side and the second side of the heat dissipation base plate.

10. The power module according to claim 5 or 7, characterized in that, The grooves are located on both sides of the half-bridge power unit.

11. The power module according to claim 1, characterized in that, There are N grooves, where N is a positive integer greater than or equal to 1.

12. The power module according to claim 1, characterized in that, The projected shape of the groove includes, but is not limited to, waist-shaped, circular, elliptical, square, and rhomboid.

Images