Water supply device and gas water heater

Abstract

The utility model discloses a kind of water supply equipment and gas water heater, it relates to water supply equipment technical field, the heat dissipation control device of water supply equipment includes: shell, waterway system, controller and heat sink being set in the shell;The waterway system is to flow through the function module of water supply equipment with the water flow of connected water source;The controller is to control the water supply equipment operation, and the controller includes heating component;The heat sink is to heat the heating component, and the heat sink includes mounting portion, for fixing the heating component;The heat sink also includes cooling portion, for connecting the waterway system;The heating component is guided to the water in the waterway system by the heat sink with heat quantity.This application can solve the problem that heating component temperature in controller is high and not easy to cool.

Description

Technical Field

[0001] This utility model relates to the field of water supply equipment technology, and in particular to a water supply equipment and a gas water heater. Background Technology

[0002] In modern life and industry, water supply equipment plays a vital role. Among them, gas water heaters, as one of the most common water supply devices, are widely used in homes and commercial establishments, providing convenient hot water supply. The controller is the core component for the intelligent control and stable operation of gas water heaters and other water supply equipment. It integrates various electronic components to precisely control a series of functions. However, during the operation of the controller, some electronic components, due to their power consumption characteristics, high workload, or inherent properties, become particularly heat-generating components. In current technology, these heat-generating components typically rely on natural cooling. However, practice shows that natural cooling is inefficient and insufficient to meet the heat dissipation needs of these components, resulting in their temperature remaining at a consistently high level during operation.

[0003] This high-temperature condition not only adversely affects the performance of heating components, increasing controller energy consumption and electricity usage, thus raising equipment operating costs; more seriously, prolonged high temperatures accelerate the aging process of heating components, significantly shortening their lifespan. This, in turn, affects the operational stability and reliability of the entire controller and even the water supply equipment, increasing maintenance frequency and the risk of failure. Therefore, effectively solving the problem of excessively high temperatures and difficulty in cooling heating components in the controller has become a pressing technical challenge in the field of water supply equipment. It is of great significance for improving the performance of water supply equipment, reducing operating costs, and extending equipment lifespan. Utility Model Content

[0004] In order to overcome the above-mentioned defects of the prior art, the technical problem to be solved by the present invention is to provide a water supply device and a gas water heater that can solve the problem of high temperature and difficulty in cooling of the heating component in the controller.

[0005] The specific technical solution of this utility model embodiment is as follows:

[0006] A water supply device, comprising:

[0007] The housing, the water system disposed within the housing, the controller, and the heat dissipation components;

[0008] The water system is a functional module used to guide water from a connected water source through the water supply equipment.

[0009] The controller is used to control the operation of the water supply equipment, and the controller includes a heating element;

[0010] The heat sink is used to dissipate heat from the heat-generating component. The heat sink includes a mounting portion for fixing the heat-generating component. The heat sink also includes a cooling portion for connecting to the water system.

[0011] The heating element directs heat to the water in the water system through the heat sink.

[0012] Preferably, the heating element is a transistor, which is mounted on the mounting portion, and an insulating component is provided between the transistor and the mounting portion to prevent conduction between the transistor and the mounting portion.

[0013] Preferably, the insulating component includes a ceramic gasket disposed between the transistor and the mounting portion.

[0014] Preferably, the transistor pins are soldered to the first PCB board, the transistor is disposed in an opening in the first PCB board, and the ceramic pad is disposed between the transistor and the mounting portion.

[0015] Preferably, the transistor and the ceramic gasket are fixed to the mounting portion by an insulating connector.

[0016] Preferably, the insulating connector is a plastic screw, and the mounting part is provided with a screw hole corresponding to the plastic screw.

[0017] Preferably, the controller is separately connected to the heating element via a wire.

[0018] Preferably, the controller includes a first PCB board that is separately connected by wires, and the heating component is soldered onto the first PCB board.

[0019] Preferably, the mounting part is a groove-shaped structure, and the heating component and the first PCB board are installed in the groove-shaped structure of the mounting part, and the groove-shaped structure is filled with sealant.

[0020] Preferably, the cooling section includes an arc-shaped structure so as to fit onto the water pipe of the water supply equipment.

[0021] Preferably, the cooling section is provided with a snap-fit ​​structure to attach and fix the cooling section to the water pipe of the water supply equipment.

[0022] Preferably, the heat sink is made of a single piece of thermally conductive material.

[0023] Preferably, the heat sink further includes heat sink fins.

[0024] Preferably, the water supply equipment is one of the following: a gas water heater, an electric water heater, or a water purifier.

[0025] A gas water heater, the gas water heater comprising the water supply equipment described in any of the above claims;

[0026] The gas water heater is a condensing gas water heater. The gas water heater also includes an atomizing device, which can atomize the condensate produced by the gas water heater into water mist, and the water mist can be discharged with the flue gas.

[0027] The controller is electrically connected to the atomizing device, the heating element is mounted on the mounting part of the heat sink, and the heat sink is assembled onto the water pipe of the gas water heater through the snap-fit ​​structure of the cooling part.

[0028] Preferably, the gas water heater further includes a fan, the casing is provided with an air inlet and a flue gas outlet, the fan inlet is connected to the air inlet, and the fan outlet is connected to the flue gas outlet; the heat dissipation component is disposed on the water pipe between the air inlet and the fan inlet.

[0029] Preferably, the housing has an air inlet near the heat sink or upstream of the heat sink along the air inlet direction.

[0030] The technical solution of this utility model has the following significant beneficial effects:

[0031] In the water supply equipment of this application, when the heating element in the controller heats up, since the heating element is fixed to the mounting part of the heat sink, and the cooling part of the heat sink is connected to the water system, the heating element can direct heat to the water in the water system through the heat sink. Thus, the water in the water system can efficiently and quickly remove the heat from the heating element, significantly reducing its temperature. Especially when the water in the water system flows, the heat dissipation effect on the heating element is further enhanced, and its temperature can be further reduced. This structure allows the heating element to operate at a relatively low temperature, extending its service life and ensuring the normal operation of the water supply equipment. Attached Figure Description

[0032] The accompanying drawings described herein are for illustrative purposes only and are not intended to limit the scope of this invention in any way. Furthermore, the shapes and proportions of the components in the drawings are merely illustrative to aid in understanding the invention and do not specifically limit the shapes and proportions of the components. Those skilled in the art, under the guidance of this invention, can select various possible shapes and proportions to implement this invention according to specific circumstances.

[0033] Figure 1 This is a schematic diagram of the water supply equipment in the embodiments of this utility model;

[0034] Figure 2 This is a schematic diagram of the heat sink in an embodiment of the present invention;

[0035] Figure 3 This is a top view of the heating component, the first PCB board, the insulating component, and the insulating connector in an embodiment of this utility model;

[0036] Figure 4 This is a cross-sectional view of the heating component, the first PCB board, the insulating component, and the insulating connector in an embodiment of this utility model;

[0037] Figure 5 This is a schematic diagram of the structure of the gas water heater in the embodiment of this utility model.

[0038] The reference numerals in the above figures are as follows:

[0039] 1. Shell; 2. Water system; 3. Heat sink; 31. Mounting part; 32. Cooling part; 33. Heat sink fins; 4. Controller; 41. Heating element; 42. Wire; 43. First PCB board; 44. Second PCB board; 5. Insulating component; 6. Insulating connector; 7. Sealant; 100. Atomizing device; 200. Fan; 300. Main heat exchanger; 400. Condensing heat exchanger; 500. Combustion device; 600. Exhaust pipe. Detailed Implementation

[0040] The details of this utility model can be more clearly understood by referring to the accompanying drawings and the description of specific embodiments. However, the specific embodiments of this utility model described herein are for illustrative purposes only and should not be construed as limiting the utility model in any way. Under the teachings of this utility model, those skilled in the art can conceive of any possible modifications based on this utility model, and these should all be considered to fall within the scope of this utility model.

[0041] To address the problem of high temperatures and difficulty in cooling the heat-generating components in the controller, this application proposes a water supply device. Figure 1 This is a schematic diagram of the water supply equipment in an embodiment of this utility model. Figure 2 This is a schematic diagram of the heat sink in an embodiment of the present invention, as shown below. Figure 1 and Figure 2As shown, the water supply equipment may include: a housing 1, a water system 2 disposed within the housing 1, a controller 4, and a heat sink 3. The water system 2 is a functional module for channeling water from a connected water source through the water supply equipment. The controller 4 controls the operation of the water supply equipment and includes a heating element 41. The heat sink 3 dissipates heat from the heating element 41. The heat sink 3 includes a mounting portion 31 for fixing the heating element 41. The heat sink 3 also includes a cooling portion 32 for connecting to the water system 2. The heating element 41 directs heat to the water in the water system 2 through the heat sink 3.

[0042] In the water supply equipment of this application, when the heating element 41 in the controller 4 heats up, since the heating element 41 is fixed on the mounting part 31 of the heat sink 3, and the cooling part 32 of the heat sink 3 is connected to the water system 2, the heating element 41 can direct heat to the water in the water system 2 through the heat sink 3. Thus, the water in the water system 2 can efficiently and quickly remove the heat from the heating element 41, significantly reducing its temperature. Especially when the water in the water system 2 flows, the heat dissipation effect on the heating element 41 is further enhanced, and its temperature can be further reduced. Through this structure, the heating element 41 can operate at a relatively low temperature, extending its service life and ensuring the normal operation of the water supply equipment.

[0043] To better understand the water supply equipment in this application, it will be further explained and described below. For example... Figure 1 As shown, the water supply equipment may include: a housing 1, a water system 2 disposed within the housing 1, a controller 4, and a heat sink 3. The water system 2 is used to allow water from a connected water source to flow through the functional modules of the water supply equipment. A certain amount of water remains in the water system 2, which can be used to absorb the heat generated by the heat-generating component 41 of the heat sink 3, thereby dissipating heat. Furthermore, when the water supply equipment supplies water externally or performs certain functions, such as when the functional modules need to supply or replenish water, the water system 2 allows water from the connected water source to flow through the functional modules of the water supply equipment. In this way, the water in the water system 2 is flowing water, which can significantly improve the cooling efficiency and effect on the heat-generating part of the heat sink 3.

[0044] Controller 4 is used to control the operation of the water supply equipment. For example, controller 4 may include a circuit board with electronic components. Controller 4 may include a heating element 41. The heating element 41 may be an electronic component that generates a large amount of heat; for example, the heating element 41 may be a transistor. Figure 2As shown, the heat sink 3 is used to dissipate heat from the heat-generating component 41. The heat sink 3 includes a mounting portion 31 for fixing the heat-generating component 41. Heat exchange is possible between the heat-generating component 41 and the mounting portion 31, for example, by at least partially contacting each other or by having a highly efficient thermally conductive material between them. The heat-generating component 41 can be separately disposed from other components of the controller 4. The controller 4 can be separately connected to the heat-generating component 41 via wires 42. For example, the controller 4 may include a first PCB board 43 separately connected via wires 42, and the heat-generating component 41 is soldered onto the first PCB board 43. The first PCB board 43 with the heat-generating component 41 is separately disposed from other components of the controller 4. The controller 4 may also include a second PCB board 44, on which other low-heat electronic components of the controller 4 can be mounted. The second PCB board 44 is separately connected to the first PCB board 43 via wires 42.

[0045] like Figure 2 As shown, the heat sink 3 also includes a cooling section 32 for connecting to the water system 2, allowing the cooling section 32 to exchange heat with the water in the water system 2. For example, the two are at least partially in contact or a highly efficient thermally conductive material is placed between them. In this way, the heat-generating component 41 can direct heat to the water in the water system 2 through the heat sink 3. Thus, the water in the water system 2 can efficiently and quickly remove the heat from the heat-generating component 41, significantly reducing its temperature. Especially when the water in the water system 2 flows, the heat dissipation effect on the heat-generating component 41 is further enhanced, and its temperature can be further reduced. This structure allows the heat-generating component 41 to operate at a relatively low temperature, extending its service life and ensuring the normal operation of the water supply equipment.

[0046] As a feasible option, the heat sink 3 can be made of an integral thermally conductive material, thereby increasing its own heat transfer coefficient and thus increasing the heat exchange between the heat sink and the water in the water system 2.

[0047] When the heating element 41 is an electronic component, such as a transistor, the heating element 41 is mounted on the mounting part 31. Figure 3 This is a top view of the heating element, the first PCB board, the insulating element, and the insulating connector in an embodiment of this utility model. Figure 4 This is a cross-sectional view of the heating element, the first PCB board, the insulating element, and the insulating connector in an embodiment of this utility model, as shown below. Figure 3 and Figure 4As shown, an insulating component 5 can be provided between the heating element 41 and the mounting part 31 to prevent electrical continuity between the transistor and the mounting part 31, thus avoiding accidents such as short circuits. Alternatively, the insulating component 5 may include a ceramic gasket disposed between the heating element 41 and the mounting part 31. The ceramic gasket not only serves as insulation but also has a high thermal conductivity, effectively improving the heat exchange efficiency between the heating element 41 and the mounting part 31. Furthermore, a high-efficiency thermally conductive material, such as thermally conductive silicone grease, can be applied between the ceramic gasket and the heating element 41 to further improve the heat exchange performance between them. Similarly, a high-efficiency thermally conductive material, such as thermally conductive silicone grease, can also be used between the ceramic gasket and the mounting part 31 to improve the heat exchange performance between them.

[0048] In one specific implementation, the pins of a heating element 41, such as a transistor, can be soldered onto a first PCB board 43. The heating element 41 can be disposed in an opening in the first PCB board 43, and a ceramic gasket is disposed between the heating element 41 and the mounting part 31. This not only facilitates the connection of the heating element 41 with other parts of the controller 4, but also allows the heating element 41 to directly contact the ceramic gasket, improving the heat exchange efficiency between the heating element 41 and the mounting part 31, avoiding the reduction in heat exchange efficiency caused by the first PCB board 43 separating them; in addition, it can effectively reduce the thickness of the above-mentioned components after they are installed together.

[0049] As a feasible option, such as Figure 3 and Figure 4 As shown, the transistor and ceramic washer can be fixed to the mounting part 31 via the insulating connector 6. The insulating connector 6 can be a screw made of insulating material, which can pass through the transistor and ceramic washer and be screwed into the mounting part 31, thereby making the transistor and ceramic washer firmly connected to the mounting part 31. Specifically, the insulating connector 6 can be a plastic screw, and the mounting part 31 has screw holes corresponding to the plastic screws, so that the insulating connector 6 can be screwed into the mounting part 31.

[0050] As a feasible option, such as Figure 2 As shown, the mounting part 31 can be a groove-shaped structure. The heating element 41 and the first PCB board 43 are installed in the groove-shaped structure of the mounting part 31. The groove-shaped structure is filled with sealant 7, which seals the first PCB board 43 and the heating element 41 to prevent them from coming into contact with water and being corroded or short-circuited. Of course, the sealant 7 has insulating properties.

[0051] As a feasible option, such as Figure 2 As shown, the cooling section 32 may include an arc-shaped structure to fit onto the water pipe of the water supply equipment, thereby increasing the contact area between the two and improving heat exchange efficiency. The water system 2 may include the aforementioned water pipe.

[0052] In order to fix the cooling part 32 to the water pipe, the cooling part 32 may be provided with a snap-fit ​​structure to attach the cooling part 32 to the water pipe of the water supply equipment and fix it.

[0053] As a feasible option, such as Figure 2 As shown, the heat sink 3 may also include heat dissipation fins 33. The heat dissipation fins 33 can improve the heat exchange efficiency between the heat sink 3 and the air, and can also remove the heat from the heat-generating component 41 to a certain extent, thus reducing its temperature.

[0054] As is feasible, the water supply equipment can be one of the following types of equipment, such as gas water heaters, electric water heaters, water purifiers, etc. Of course, it can also include other equipment that requires water and outputs water and has a heating element 41, and this application does not impose any limitations on it.

[0055] This application also proposes a gas water heater, which includes any of the above-mentioned water supply devices.

[0056] Furthermore, Figure 5 This is a schematic diagram of the structure of the gas water heater in an embodiment of this utility model, as shown below. Figure 5 As shown, the gas water heater is a condensing gas water heater. That is, this condensing gas water heater includes a main heat exchanger 300 and a condensing heat exchanger 400. The gas water heating device also includes a combustion device 500 and a fan 200. The casing 1 has an air inlet and a flue gas outlet. The inlet of the fan 200 is connected to the air inlet, and the outlet of the fan 200 is connected to the flue gas outlet. The heat sink 3 is installed on the water pipe between the air inlet and the inlet of the fan 200. Under the action of the fan 200, the gas flowing into the casing 1 can flow through the heat sink 3, thereby improving the heat dissipation efficiency of the heat sink 3. For example, when the fan 200 is located between the main heat exchanger 300 and the condensing heat exchanger 400, the gas flowing into the casing 1 can first flow through the heat sink 3, then sequentially enter the combustion device 500, the main heat exchanger 300, the fan 200, the condensing heat exchanger 400, and finally be discharged from the flue gas outlet. For example, when the fan 200 is located upstream of the combustion device 500, the gas flowing into the casing 1 can first flow through the heat sink 3, and then sequentially enter the fan 200, the combustion device 500, the main heat exchanger 300, the condensing heat exchanger 400, and finally be discharged from the flue gas outlet.

[0057] The combustion device 500 is located upstream of the main heat exchanger 300. The combustion device 500 mixes and burns the gas and air input into the gas water heater, generating high-temperature flue gas. The main heat exchanger 300 exchanges heat with the high-temperature flue gas output from the combustion device 500, thereby heating the water flowing through it. After heat exchange in the main heat exchanger 300, the high-temperature flue gas is converted into relatively lower-temperature flue gas. Alternatively, a fan 200 drives the high-temperature flue gas generated by the combustion device 500 to flow sequentially through the main heat exchanger 300 and the condensing heat exchanger 400. After heat exchange in the main heat exchanger 300, the flue gas, under the action of the fan 200, is input into the condensing heat exchanger 400 to exchange heat with the heat exchange components, thereby heating the water flowing through them. The water to be heated, which is fed into the gas water heater, is first preheated by the flue gas after heat exchange in the main heat exchanger 300. The preheated water then flows into the main heat exchanger 300 for further heating, thus forming hot water that meets the user's temperature requirements, and is then output for the user's use.

[0058] When the fan 200 is positioned between the main heat exchanger 300 and the condensing heat exchanger 400, the flue gas inlet of the heat exchange chamber of the condensing heat exchanger 400 can be connected to the outlet of the fan 200. The inlet of the fan 200 can be connected to the outlet of the main heat exchanger 300. The flue gas outlet of the heat exchange chamber can be connected to the exhaust pipe 600 of the gas water heater, allowing the flue gas to exit the flue gas outlet of the heat exchange chamber and be discharged from the exhaust pipe 600. When the flue gas exchanges heat with the water to be heated flowing through the heat exchange components, the water vapor in the flue gas is further cooled, condensing into liquid and precipitating on the heat exchange components. The condensate precipitated on the heat exchange components falls to the bottom of the heat exchange chamber.

[0059] The gas water heater also includes an atomizing device 100. The atomizing chamber in the atomizing device 100 is connected to the heat exchange chamber of the condensing heat exchanger 400, so condensate at the bottom of the heat exchange chamber can flow into the atomizing chamber through the connecting component. The atomizing device 100 atomizes the condensate produced by the gas water heater into water mist, which is then discharged with the flue gas. The atomizing device 100 primarily atomizes the condensate produced by the condensing heat exchanger 400 into water mist, which is then discharged with the flue gas from the exhaust pipe 600. For example, the atomizing module in the atomizing device 100 is used to atomize the condensate flowing into the atomizing chamber to form water mist, which can then be discharged through the exhaust pipe 600.

[0060] The controller 4 can be electrically connected to the atomizing device 100. The heating element 41 is mounted on the mounting portion 31 of the heat sink 3, such as... Figure 5 As shown, the heat sink 3 is mounted on the water pipe of the gas water heater via a snap-fit ​​structure of the cooling section 32. For example, this water pipe may be an inlet pipe that is connected to the heat exchange component of the condenser heat exchanger 400.

[0061] As a feasible option, the housing 1 is provided with an air inlet near the heat sink 3 or upstream of the heat sink 3 along the air intake direction. In this way, when the fan 200 operates to draw air from outside the housing 1 into the housing 1 to supply the combustion device 500, some air will be drawn into the housing 1 through the air inlet. During this process, the air drawn in from the air inlet will be blown toward the heat sink 3 or drawn into the housing 1 and then flow through the heat sink 3 in the air intake direction. In this way, the heat exchange between the air and the heat sink 3 can be effectively improved, thereby helping to reduce the temperature of the heat sink 3.

[0062] Since the water system 2 is installed inside the casing 1 of the gas water heater, the water inlet pipe of the water system 2 is cold water, and condensation may form on its outer surface and heat sink 3. In order to prevent the condensation from contacting the heating element 41, the heat sink 3 is filled with sealant 7 in its groove structure to seal the first PCB board 43 and the heating element 41, preventing them from being corroded or short-circuited by the condensation.

[0063] All articles and references disclosed herein, including patent applications and publications, are incorporated herein by reference for various purposes. The term “substantially constitutes…” used to describe a combination should include the identified element, component, part, or step, as well as other elements, components, parts, or steps that do not substantially affect the essential novelty of the combination. The use of the terms “comprising” or “including” to describe combinations of elements, components, parts, or steps herein also contemplates embodiments substantially constituted by such elements, components, parts, or steps. The use of the term “may” herein is intended to indicate that any described attribute “may” include is optional. Multiple elements, components, parts, or steps can be provided by a single integrated element, component, part, or step. Alternatively, a single integrated element, component, part, or step can be divided into multiple separate elements, components, parts, or steps. The disclosure of “a” or “an” used to describe an element, component, part, or step does not imply exclusion of other elements, components, parts, or steps.

[0064] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.

Claims

1. A water supply device, characterized in that, include: The housing, the water system disposed within the housing, the controller, and the heat dissipation components; The water system is a functional module used to guide water from a connected water source through the water supply equipment. The controller is used to control the operation of the water supply equipment, and the controller includes a heating element; The heat sink is used to dissipate heat from the heat-generating component. The heat sink includes a mounting portion for fixing the heat-generating component. The heat sink also includes a cooling portion for connecting to the water system. The heating element directs heat to the water in the water system through the heat sink.

2. The water supply equipment according to claim 1, characterized in that, The heating element is a transistor, which is mounted on the mounting part. An insulating component is provided between the transistor and the mounting part to prevent the transistor from conducting to the mounting part.

3. The water supply equipment according to claim 2, characterized in that, The insulating component includes a ceramic gasket disposed between the transistor and the mounting portion.

4. The water supply equipment according to claim 3, characterized in that, The transistor pins are soldered to the first PCB board, the transistor is disposed in an opening in the first PCB board, and the ceramic pad is disposed between the transistor and the mounting part.

5. The water supply equipment according to claim 3, characterized in that, The transistor and the ceramic gasket are fixed to the mounting part by an insulating connector.

6. The water supply equipment according to claim 5, characterized in that, The insulating connector is a plastic screw, and the mounting part is provided with screw holes corresponding to the plastic screw.

7. The water supply equipment according to claim 1, characterized in that, The controller is connected to the heating element separately via wires.

8. The water supply equipment according to claim 7, characterized in that, The controller includes a first PCB board that is connected separately by wires, and the heating element is soldered onto the first PCB board.

9. The water supply equipment according to claim 8, characterized in that, The mounting part is a groove-shaped structure, and the heating component and the first PCB board are installed in the groove-shaped structure of the mounting part. The groove-shaped structure is filled with sealant.

10. The water supply equipment according to claim 1, characterized in that, The cooling section includes an arc-shaped structure to fit onto the water pipe of the water supply equipment.

11. The water supply equipment according to claim 10, characterized in that, The cooling section is provided with a snap-fit ​​structure to attach and fix the cooling section to the water pipe of the water supply equipment.

12. The water supply equipment according to claim 1, characterized in that, The heat sink is made of a single piece of thermally conductive material.

13. The water supply equipment according to claim 1, characterized in that, The heat dissipation component also includes heat dissipation fins.

14. The water supply equipment according to claim 1, characterized in that, The water supply equipment is one of the following: gas water heater, electric water heater, or water purifier.

15. A gas-fired water heater, characterized in that, The gas water heater includes the water supply device according to any one of claims 1 to 13; The gas water heater is a condensing gas water heater. The gas water heater also includes an atomizing device, which can atomize the condensate produced by the gas water heater into water mist, and the water mist can be discharged with the flue gas. The controller is electrically connected to the atomizing device, the heating element is mounted on the mounting part of the heat sink, and the heat sink is assembled onto the water pipe of the gas water heater through the snap-fit ​​structure of the cooling part.

16. The gas water heater according to claim 15, characterized in that, The gas water heater also includes a fan. The casing is provided with an air inlet and a flue gas outlet. The fan inlet is connected to the air inlet, and the fan outlet is connected to the flue gas outlet. The heat dissipation component is disposed on the water pipe between the air inlet and the fan inlet.

17. The gas water heater according to claim 16, characterized in that, The housing is provided with an air inlet near the heat sink or upstream of the heat sink along the air inlet direction.

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