A mechanism for reducing the discharge temperature in a chemical production process
By combining spiral copper heat transfer tubes and cooling fans, along with temperature sensors and PLC controllers, the problem of rising water temperature in the circulating water tank was solved, enabling effective control of the chemical discharge temperature and ensuring safe production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU LIANZHUO PHOTOELECTRIC MATERIAL CO LTD
- Filing Date
- 2025-08-22
- Publication Date
- 2026-07-28
AI Technical Summary
In existing chemical production processes, the rising water temperature in the circulating water tank affects the cooling effect, making it difficult to effectively control the discharge temperature and posing a fire risk.
It uses spiral copper heat transfer tubes and cooling fans in conjunction with heat dissipation fins to achieve active cooling through water circulation and air flow, and uses temperature sensors and PLC controllers to ensure that the discharge temperature is below the flash point.
It effectively reduces the discharge temperature, prevents chemicals from exceeding their flash point, reduces the risk of fire, and improves production safety and efficiency.
Smart Images

Figure CN224567760U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chemical production technology, and in particular to a mechanism for reducing the discharge temperature during chemical production. Background Technology
[0002] Chemicals are classified into fine chemicals and specialty chemicals. They can be synthesized by chemical or biological means, or separated, extracted, and processed from natural substances. Currently, many chemicals generate a large amount of heat during production, causing the product temperature to rise, which may lead to fire in severe cases. Therefore, it is necessary to control the discharge temperature during the chemical production process. For example, in the DMF production process, the raw materials need to be heated to ensure the normal synthesis of DMF. If the DMF is not cooled during the discharge process, it may easily exceed the flash point, making it prone to catching fire during storage and transportation, resulting in serious consequences. For example, the patent with authorization announcement number CN220975294U discloses a device for reducing the discharge temperature during chemical production. In this device, with the cooperation of a cooling mechanism and a detection mechanism, the high-temperature DMF is driven into the cooler by the feed pump. At this time, the circulating water tank causes the water inside to flow out through the outlet pipe and into the heat dissipation pipe. In conjunction with multiple heat dissipation fins, the heat of the DMF is carried away. The temperature probe on the connecting pipe transmits the temperature of the DMF to the control console. Through the above structure and method, the temperature of the DMF can be monitored in real time through the temperature probe and the control console. The DMF will only be output after the cooler has carried away the heat of the DMF and reduced its temperature below the flash point, thereby reducing the risk of DMF ignition and ensuring the safety of the operation. When this device cools the discharged DMF through a cooling mechanism, it achieves the cooling of DMF by circulating water in a circulating water tank within the cooler. However, the circulating water tank is not equipped with a device for actively cooling the water in the tank. As the water in the circulating water absorbs heat from the discharged DMF, the water temperature in the circulating water tank gradually rises. This rise in water temperature affects the cooling effect of the water in the circulating water tank on the DMF, thus impacting work efficiency. Therefore, a mechanism for reducing the discharge temperature during chemical production is designed to solve the above problems. Utility Model Content
[0003] The purpose of this invention is to solve the problems existing in the background art mentioned above, and to propose a mechanism for reducing the discharge temperature in the chemical production process.
[0004] The technical problem to be solved by this utility model is to provide a mechanism for reducing the discharge temperature in the chemical production process, thereby solving the problems of existing mechanisms for reducing the discharge temperature in the chemical production process.
[0005] To solve the above-mentioned technical problems, this utility model provides the following technical solution: A mechanism for reducing the discharge temperature during chemical production includes a raw material tank, a discharge pump, a discharge pipe, a cooling tank, and a water circulation assembly. The discharge pump is installed at the bottom right side surface of the raw material tank, and a discharge pipe is installed at the output end of the discharge pump. The end of the discharge pipe is connected through the cooling tank, and a water circulation assembly is installed on the cooling tank. A discharge pipe is connected through the bottom right side surface of the cooling tank, and a storage tank is connected through the end of the discharge pipe. The water circulation assembly includes a circulating water tank, a water pump, an outlet pipe, a heat transfer pipe, a return pipe, a heat dissipation pipe, and a cooling fan. The water pump is fixedly installed on the outer side of the bottom surface of the circulating water tank. An outlet pipe is fixedly installed at the output end of the water pump. The end of the outlet pipe is connected to a heat transfer pipe. A return pipe is fixedly installed at the bottom of the heat transfer pipe. The bottom of the return pipe passes through the upper surface of the circulating water tank. A heat dissipation pipe is installed through the center of the outer surface of the circulating water tank. A cooling fan is installed inside the heat dissipation pipe.
[0006] Preferably, the water outlet pipe runs through the center of the upper surface of the cooling box, the heat transfer pipe is located inside the cooling box, and the return pipe runs through the center of the bottom surface of the cooling box.
[0007] Preferably, the heat transfer tube is spiral-shaped and made of copper, a material with good thermal conductivity.
[0008] Preferably, the heat dissipation pipe is made of copper material with good thermal conductivity, and screens are fixedly installed at both ends of the heat dissipation pipe.
[0009] Preferably, a plurality of first heat dissipation fins are fixedly disposed on the outer surface of the heat dissipation pipe, and the first heat dissipation fins are located inside the circulating water tank.
[0010] Preferably, the outer surface of the cooling box has multiple annular grooves at equal intervals, and the cooling box is made of aluminum alloy with good thermal conductivity.
[0011] Preferably, a temperature sensor is installed on the left side of the upper surface of the discharge pipe, the probe of the temperature sensor extends into the discharge pipe, and a solenoid valve is installed in the center of the discharge pipe.
[0012] Preferably, a PLC controller is embedded in the outer surface of the circulating water tank, and the temperature sensor and the solenoid valve are electrically connected to the PLC controller. The PLC controller contains the switch used by the solenoid valve.
[0013] Preferably, a plurality of second heat dissipation fins are fixedly provided on the outer surface of the discharge pipe.
[0014] Preferably, the second heat dissipation fin is located between the solenoid valve and the storage tank.
[0015] Compared with the prior art, this utility model has at least the following beneficial effects: In the above scheme, by setting up a water circulation component, when the DMF with a high temperature in the raw material tank is discharged, the DMF is discharged into the cooling tank through the discharge pipe by the discharge pump. The water pump on the water circulation component draws water from the circulating water tank to the outlet pipe, and the water flow in the heat transfer pipe absorbs the heat in the DMF in the cooling tank. The water flows back into the circulating water tank through the return pipe, realizing the effect of water circulation. The cooled DMF is discharged from the discharge pipe and enters the storage tank for storage.
[0016] In the above solution, by setting up heat dissipation pipes and heat dissipation fans, the heat dissipation fans inside the heat dissipation pipes are turned on to increase the air circulation inside the heat dissipation pipes. The air carries the heat on the heat dissipation pipes, and the heat dissipation pipes absorb the temperature of the water in the circulating water tank, thereby achieving the effect of actively cooling the water in the circulating water tank, preventing the water temperature in the circulating water tank from becoming too high, and ensuring the cooling effect of the water circulation components on the DMF.
[0017] In the above scheme, by setting the heat transfer tube to a spiral shape, the contact area between the heat transfer tube and the DMF in the cooling box is increased, thereby increasing the heat transfer effect and thus increasing the cooling effect on the DMF. In addition, the spiral shape of the heat transfer tube can increase the flow time of water in the heat transfer tube, further increasing the heat transfer effect and increasing the cooling effect on the DMF.
[0018] In the above scheme, by setting a first heat dissipation fin, the contact area between the heat dissipation pipe and the water in the circulating water tank can be increased, thereby increasing the cooling effect of the heat dissipation pipe on the water in the circulating water tank.
[0019] In the above scheme, a temperature sensor, a solenoid valve, and a PLC controller are installed. The PLC controller sets the temperature sensed by the temperature sensor when the solenoid valve is opened, so that the sensed temperature is not higher than the flash point temperature of DMF. When the temperature sensor senses that the temperature of DMF in the discharge pipe is lower than the flash point temperature of DMF, the PLC controller controls the solenoid valve to open, and the cooled DMF is discharged from the discharge pipe and stored in the storage box.
[0020] In the above solution, by setting a second heat dissipation fin, when the solenoid valve is opened and the cooled DMF is discharged from the discharge pipe, the temperature of the DMF in the discharge pipe is transferred to the discharge pipe and dissipated into the air through the second heat dissipation fin, thereby achieving the effect of further cooling the DMF in the discharge pipe, further ensuring that the temperature of the DMF is below the flash point temperature, preventing the DMF from catching fire, and ensuring practicality. Attached Figure Description
[0021] The accompanying drawings, which are incorporated herein and form part of the specification, illustrate embodiments of the present disclosure and, together with the specification, further serve to explain the principles of the present disclosure and enable those skilled in the art to implement and use the present disclosure.
[0022] Figure 1 This is a three-dimensional schematic diagram of the overall structure of this utility model; Figure 2 This is a three-dimensional structural diagram of the water circulation component of this utility model; Figure 3 This is a schematic cross-sectional view of the water circulation component of this utility model; Figure 4 In this utility model Figure 1 Enlarged structural diagram at point A.
[0023] [Figure Labels] 1. Raw material tank; 101. Discharge pump; 102. Discharge pipe; 2. Cooling box; 201. Annular trough; 3. Circulating water tank; 301. Water pump; 302. Water outlet pipe; 303. Heat transfer pipe; 304. Return pipe; 305. Heat dissipation pipe; 3051. First heat dissipation fin; 306. Heat dissipation fan; 4. Discharge pipe; 5. Storage box; 6. Temperature sensor; 7. Solenoid valve; 8. Second heat dissipation fin.
[0024] As shown in the figure, specific structures and devices are marked in the figure to clearly illustrate the structure of the embodiment of this utility model. However, this is only for illustrative purposes and is not intended to limit this utility model to this specific structure, device and environment. Those skilled in the art can adjust or modify these devices and environments according to specific needs. Detailed Implementation
[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0026] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0027] like Figure 1 , Figure 2 and Figure 3 As shown, an embodiment of the present invention provides a mechanism for reducing the discharge temperature during chemical production, including a raw material tank 1, a discharge pump 101, a discharge pipe 102, a cooling box 2, and a water circulation assembly. The discharge pump 101 is installed at the bottom right side surface of the raw material tank 1, and the discharge pipe 102 is installed at the output end of the discharge pump 101. The end of the discharge pipe 102 is provided through the cooling box 2, and the water circulation assembly is installed on the cooling box 2. The discharge pipe 4 is provided through the bottom right side surface of the cooling box 2, and the end of the discharge pipe 4 is provided through the storage box 5. The water circulation assembly includes a circulating water tank 3, a water pump 301, an outlet pipe 302, a heat transfer pipe 303, a return pipe 304, a heat dissipation pipe 305, and a heat dissipation fan 306. The water pump 301 is fixedly installed on the outer side of the bottom surface of the circulating water tank 3. The outlet pipe 302 is fixedly installed at the output end of the water pump 301. The end of the outlet pipe 302 is connected to the heat transfer pipe 303. The return pipe 304 is fixedly installed at the bottom of the heat transfer pipe 303. The bottom of the return pipe 304 passes through the upper surface of the circulating water tank 3. The heat dissipation pipe 305 passes through the center of the outer surface of the circulating water tank 3. The heat dissipation fan 306 is installed inside the heat dissipation pipe 305.
[0028] By incorporating a water circulation component, when the DMF with a high temperature is discharged from the raw material tank 1, the discharge pump 101 discharges the DMF through the discharge pipe 102 into the cooling tank 2. The water pump 301 on the water circulation component draws water from the circulating water tank 3 to the outlet pipe 302, and the water flow in the heat transfer pipe 303 absorbs the heat from the DMF in the cooling tank 2. The water then flows back to the circulating water tank 3 through the return pipe 304, achieving the effect of water circulation. The cooled DMF is discharged from the discharge pipe 4 and enters the storage tank 5 for storage.
[0029] By incorporating a heat dissipation pipe 305 and a heat dissipation fan 306, the heat dissipation fan 306 inside the heat dissipation pipe 305 is turned on, increasing air circulation within the heat dissipation pipe 305. The air carries the heat from the heat dissipation pipe 305, and the heat dissipation pipe 305 absorbs the temperature of the water in the circulating water tank 3, thereby achieving the effect of actively cooling the water in the circulating water tank 3, preventing the water temperature in the circulating water tank 3 from becoming too high, and ensuring the cooling effect of the water circulation component on the DMF.
[0030] In this embodiment, the water outlet pipe 302 passes through the center of the upper surface of the cooling box 2, the heat transfer pipe 303 is located inside the cooling box 2, and the return pipe 304 passes through the center of the bottom surface of the cooling box 2.
[0031] In this embodiment, the heat transfer tube 303 is spiral-shaped and is made of copper material with good thermal conductivity.
[0032] By setting the heat transfer tube 303 in a spiral shape, the contact area between the heat transfer tube and the DMF in the cooling box 2 is increased, thereby increasing the heat transfer effect and thus increasing the cooling effect on the DMF. In addition, the spiral shape of the heat transfer tube 303 can increase the flow time of water in the heat transfer tube 303, further increasing the heat transfer effect and increasing the cooling effect on the DMF.
[0033] In this embodiment, the heat dissipation pipe 305 is made of copper material with good thermal conductivity, and screens are fixedly installed at both ends of the heat dissipation pipe 305 to ensure that the heat dissipation pipe 305 cools the water in the circulating water tank 3.
[0034] In this embodiment, multiple first heat dissipation fins 3051 are fixedly disposed on the outer surface of the heat dissipation pipe 305, and the first heat dissipation fins 3051 are located in the circulating water tank 3.
[0035] By providing a first heat dissipation fin 3051, the first heat dissipation fin 3051 can increase the contact area between the heat dissipation pipe 305 and the water in the circulating water tank 3, thereby increasing the cooling effect of the heat dissipation pipe 305 on the water in the circulating water tank 3.
[0036] In this embodiment, multiple annular grooves 201 are equally spaced on the outer surface of the cooling box 2, and the cooling box 2 is made of aluminum alloy with good thermal conductivity.
[0037] By providing annular grooves 201, and by setting multiple annular grooves 201 at equal intervals on the outer surface of the cooling box 2, the contact area between the cooling box 2 and the air can be increased, which facilitates the dissipation of heat from the cooling box 2 into the air, thereby increasing the cooling effect of DMF inside the cooling box 2.
[0038] Reference Figure 4 As mentioned above, In this embodiment, a temperature sensor 6 is installed on the left side of the upper surface of the discharge pipe 4, and the probe on the temperature sensor 6 extends into the discharge pipe 4. A solenoid valve 7 is installed in the center of the discharge pipe 4.
[0039] In this embodiment, a PLC controller is embedded on the outer surface of the circulating water tank 3, and the temperature sensor 6 and the solenoid valve 7 are both electrically connected to the PLC controller. The PLC controller contains the switch used by the solenoid valve 7.
[0040] The system is equipped with a temperature sensor 6, a solenoid valve 7, and a PLC controller. The PLC controller sets the temperature sensed by the temperature sensor 6 when the solenoid valve 7 is opened, so that the sensed temperature is not higher than the flash point temperature of DMF. When the temperature sensor 6 senses that the temperature of DMF in the discharge pipe 4 is lower than the flash point temperature of DMF, the PLC controller controls the solenoid valve 7 to open, and the cooled DMF is discharged from the discharge pipe 4 and stored in the storage tank 5.
[0041] In this embodiment, multiple second heat dissipation fins 8 are fixedly disposed on the outer surface of the discharge pipe 4.
[0042] In this embodiment, the second heat dissipation fin 8 is located between the solenoid valve 7 and the storage tank 5.
[0043] By providing a second heat dissipation fin 8, when the solenoid valve 7 is opened and the cooled DMF is discharged from the discharge pipe 4, the temperature of the DMF in the discharge pipe 4 is transferred to the discharge pipe 4 and dissipated into the air through the second heat dissipation fin 8, thereby achieving the effect of further cooling the DMF in the discharge pipe 4, further ensuring that the temperature of the DMF is below the flash point temperature, preventing the DMF from catching fire, and ensuring practicality.
[0044] This utility model encompasses any substitutions, modifications, equivalent methods, and solutions made within the spirit and scope of this utility model. To provide the public with a thorough understanding of this utility model, specific details are described in detail in the following preferred embodiments; however, those skilled in the art will fully understand this utility model even without these detailed descriptions. Furthermore, to avoid unnecessary confusion regarding the essence of this utility model, well-known methods, processes, procedures, components, and circuits are not described in detail.
[0045] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.
Claims
1. A mechanism for reducing the discharge temperature during chemical production, characterized in that, The system includes a raw material tank (1), a discharge pump (101), a discharge pipe (102), a cooling tank (2), and a water circulation assembly. The discharge pump (101) is installed at the bottom of the right side surface of the raw material tank (1). The discharge pipe (102) is installed at the output end of the discharge pump (101). The end of the discharge pipe (102) is connected through the cooling tank (2). The cooling tank (2) is installed on the cooling tank (2). The bottom of the right side surface of the cooling tank (2) is connected through the discharge pipe (4). The end of the discharge pipe (4) is connected through the storage tank (5). The water circulation assembly includes a circulating water tank (3), a water pump (301), an outlet pipe (302), a heat transfer pipe (303), a return pipe (304), a heat dissipation pipe (305), and a heat dissipation fan (306). The water pump (301) is fixedly installed on the outer side of the bottom surface of the circulating water tank (3). The outlet pipe (302) is fixedly installed at the output end of the water pump (301). The end of the outlet pipe (302) is connected to the heat transfer pipe (303). The bottom of the heat transfer pipe (303) is fixedly installed with the return pipe (304). The bottom of the return pipe (304) penetrates through the upper surface of the circulating water tank (3). The heat dissipation pipe (305) is installed through the center of the outer surface of the circulating water tank (3). The heat dissipation fan (306) is installed inside the heat dissipation pipe (305).
2. The mechanism for reducing the discharge temperature during chemical production according to claim 1, characterized in that: The water outlet pipe (302) runs through the center of the upper surface of the cooling box (2), the heat transfer pipe (303) is located inside the cooling box (2), and the return pipe (304) runs through the center of the bottom surface of the cooling box (2).
3. The mechanism for reducing the discharge temperature during chemical production according to claim 2, characterized in that: The heat transfer tube (303) is spiral-shaped and is made of copper material with good thermal conductivity.
4. The mechanism for reducing the discharge temperature during chemical production according to claim 3, characterized in that: The heat dissipation pipe (305) is made of copper material with good thermal conductivity, and screens are fixedly installed at both ends of the heat dissipation pipe (305).
5. The mechanism for reducing the discharge temperature during chemical production according to claim 4, characterized in that: The outer surface of the heat pipe (305) is fixedly provided with a number of first heat dissipation fins (3051), and the first heat dissipation fins (3051) are located in the circulating water tank (3).
6. The mechanism for reducing the discharge temperature during chemical production according to claim 1, characterized in that: The outer surface of the cooling box (2) is provided with multiple annular grooves (201) at equal intervals, and the cooling box (2) is made of aluminum alloy with good thermal conductivity.
7. The mechanism for reducing the discharge temperature during chemical production according to claim 1, characterized in that: A temperature sensor (6) is installed on the left side of the upper surface of the discharge pipe (4). The probe on the temperature sensor (6) extends into the discharge pipe (4). A solenoid valve (7) is installed in the center of the discharge pipe (4).
8. The mechanism for reducing the discharge temperature during chemical production according to claim 6, characterized in that: A PLC controller is embedded on the outer surface of the circulating water tank (3), and the temperature sensor (6) and the solenoid valve (7) are electrically connected to the PLC controller. The PLC controller is equipped with a switch for the solenoid valve (7).
9. The mechanism for reducing the discharge temperature during chemical production according to claim 1, characterized in that: Multiple second heat dissipation fins (8) are fixedly installed on the outer surface of the discharge pipe (4).
10. The mechanism for reducing the discharge temperature during chemical production according to claim 9, characterized in that: The second heat dissipation fin (8) is located between the solenoid valve (7) and the storage tank (5).