Control devices, thermal management devices and vehicles

By employing connecting components and fillers in the control device of the thermal management system, the problem of loose electrical wiring caused by vibration was solved, improving connection stability and system reliability, and ensuring the safety of the thermal management system.

CN224588895UActive Publication Date: 2026-08-04BYD CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-07-22
Publication Date
2026-08-04

AI Technical Summary

Technical Problem

Vibration can cause the electrical wiring controlling the valves in the vehicle's thermal management system to loosen, posing a risk of control failure.

Method used

Design a control device that ensures electrical coupling between the control interface and the drive interface by setting a connecting component and a filler inside the device housing, and uses insulating thermally conductive adhesive to fill the connection for stability. Combined with the hard metal pin structure of the circuit board and conductor, the risk of wire derailment caused by line shaking is reduced.

Benefits of technology

This improves the stability of the internal connections of the control device, reduces the risk of loosening due to vibration, and ensures the reliability and safety of the thermal management system.

✦ Generated by Eureka AI based on patent content.

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Abstract

This application relates to a control device, a thermal management device, and a vehicle. The control device includes: a housing having at least a receiving cavity; a control interface having at least a control terminal for receiving control signals; a drive interface having at least an excitation coil for generating a magnetic field to drive a controlled valve; a connection assembly disposed within the receiving cavity of the housing and at least partially disposed between the control interface and the drive interface, the connection assembly being configured to electrically couple the control terminal to the excitation coil; and a filler material filling at least between the control interface and the drive interface and at least partially covering the connection assembly. The advantage of this application is that it provides a control device, a thermal management device, and a vehicle capable of improving the internal connection stability of the control device.
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Description

Technical Field

[0001] This application relates to the field of electronic technology, and more particularly to a control device, a thermal management device, and a vehicle. Background Technology

[0002] The thermal management system in a vehicle is responsible for controlling the functions involving heat exchange of the working fluid, such as controlling the heating or cooling functions of the air conditioning.

[0003] In related technologies, electrical wiring used to control valves often becomes loose due to vibrations and other reasons caused by vehicle operation, which can lead to control failure. Utility Model Content

[0004] This application provides a control device, a thermal management device, and a vehicle, which improves the safety of the control device and at least partially solves the aforementioned technical problems.

[0005] To achieve the aforementioned objective, according to a first aspect of this application, a control device is provided, comprising: a device housing having at least a receiving cavity; a control interface disposed in the device housing, the control interface having at least a control terminal for receiving control signals; a drive interface disposed in the device housing, the drive interface having at least a function for receiving and controlling a valve; a connecting component disposed in the receiving cavity and at least partially disposed between the control interface and the drive interface, the connecting component being configured to electrically couple the control interface and the drive interface; and a filler that at least partially fills the space between the control interface and the drive interface and at least partially covers the connecting component.

[0006] Optionally, in some embodiments of this application, the control interface is disposed on a first side of the device housing, and at least part of the drive interface is disposed on a second side of the device housing; the first side and the second side are disposed opposite to each other.

[0007] Optionally, in some embodiments of this application, the drive interface includes: a solenoid valve interface configured to connect to a solenoid valve; and an expansion valve interface configured to connect to an electronic expansion valve; the solenoid valve interface and the expansion valve interface are both located on the same side of the device housing.

[0008] Optionally, in some embodiments of this application, the device housing is formed with: a main body portion for forming the receiving cavity; an insertion portion configured to form an insertion slot for receiving the control terminal; and a mounting portion configured to form a mounting slot for mounting the controlled valve.

[0009] Optionally, in some embodiments of this application, the insertion part protrudes from the main body; the control terminal is disposed in the insertion slot.

[0010] Optionally, in some embodiments of this application, the mounting portion protrudes from the main body portion; the drive interface includes: an excitation coil for generating a magnetic field to drive the controlled valve; the excitation coil is embedded in the groove wall of the mounting groove.

[0011] Optionally, in some embodiments of this application, the device housing includes: the device housing includes a first housing and a second housing fixedly connected, the insertion portion is formed in the first housing, and the mounting portion is formed in the second housing.

[0012] Optionally, in some embodiments of this application, the first housing and the second housing are fixedly connected by a threaded connection.

[0013] Optionally, in some embodiments of this application, the first housing forms a first type of internal pillar; the second housing forms a second type of internal pillar; the first housing and the second housing are fixedly connected by a first type of bolt that passes through the first type of internal pillar and is screwed into the second type of internal pillar.

[0014] Optionally, in some embodiments of this application, the connection component includes: a circuit board, at least partially disposed between the control interface and the drive interface; the circuit board having a positioning hole, and the second housing having a positioning post that at least partially passes through the positioning hole.

[0015] Optionally, in some embodiments of this application, the end of the positioning post is configured to have a stepped structure.

[0016] Optionally, in some embodiments of this application, the connection component includes: a circuit board, at least partially disposed between the control interface and the drive interface; the circuit board having a mounting hole; the second housing having a third type of inner post; and the circuit board being fixedly mounted to the second housing by a second type of bolt passing through the mounting hole and screwed into the third type of inner post.

[0017] Optionally, in some embodiments of this application, the first housing and / or the second housing are formed with reinforcing ribs.

[0018] Optionally, in some embodiments of this application, the joint between the first housing and the second housing is configured to have a stepped structure.

[0019] Optionally, in some embodiments of this application, the device housing is formed with: an assembly portion having an assembly hole; the assembly portion is disposed at the edge of the first housing and / or the second housing.

[0020] Optionally, in some embodiments of this application, the connection component includes: a circuit board, at least partially disposed between the control interface and the drive interface; the connection component includes: a first conductor, connected between the control terminal and the circuit board; and a filler fills the space between the control terminal and the circuit board such that the filler at least covers the first conductor.

[0021] Optionally, in some embodiments of this application, the connection component includes: a circuit board, at least partially disposed between the control interface and the drive interface; the drive interface includes: an excitation coil for generating a magnetic field to drive the controlled valve; the connection component includes: a second conductor connected between the excitation coil and the circuit board; and a filler fills the space between the excitation coil and the circuit board such that the filler at least covers the second conductor.

[0022] Optionally, in some embodiments of this application, the filler comprises an insulating and thermally conductive adhesive that fills the receiving cavity.

[0023] Optionally, in some embodiments of this application, the control device further includes: a sensing interface having at least a sensing terminal for receiving sensing signals; wherein the filler is filled at least between the sensing interface and the driving interface.

[0024] Optionally, in some embodiments of this application, the sensing interface is disposed between the control interface and the drive interface.

[0025] According to a second aspect of this application, a thermal management device is provided, including the aforementioned control device.

[0026] Optionally, in some embodiments of this application, the thermal management device further includes: a controlled valve, at least partially assembled to the drive interface; a flow channel base, forming a working fluid flow channel and a valve interface; wherein at least a portion of the controlled valve is disposed at the valve interface to control the flow state of the working fluid in the corresponding working fluid flow channel.

[0027] Optionally, in some embodiments of this application, the thermal management device further includes: a sensor for detecting the state parameters of the working fluid in the working fluid channel; the sensor interacts with the control device, and the state parameters include at least one of temperature, pressure, flow rate, and flow velocity.

[0028] According to a third aspect of this application, a vehicle is also provided, including the aforementioned control device or the aforementioned thermal management device.

[0029] The beneficial effects of this application are: to provide a control device, a thermal management device, and a vehicle that can improve the stability of the internal connection of the control device.

[0030] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0033] Figure 1 This is a schematic diagram of the overall structure of a thermal management device provided in an exemplary embodiment of this application;

[0034] Figure 2 yes Figure 1 The diagram shows a partial exploded view of the thermal management device.

[0035] Figure 3 yes Figure 1 The diagram shows the structure of the sensing components in the thermal management device.

[0036] Figure 4 yes Figure 1 An exploded schematic diagram of a portion of the thermal management device consisting of the control unit and the controlled valves.

[0037] Figure 5 yes Figure 1 A schematic diagram of the thermal management device in which the control device and the controlled valve are separated.

[0038] Figure 6 yes Figure 1 The diagram shows the overall structure of the thermal management device, consisting of the control unit and the controlled valve, after removing the first housing.

[0039] Figure 7 yes Figure 1 A top view of the control device in the thermal management system shown.

[0040] Figure 8 yes Figure 1 The diagram shows a partial exploded structure of the control device in the thermal management system.

[0041] Figure 9 yes Figure 1A schematic diagram of the structure of the control device in the thermal management device with the first housing open;

[0042] Figure 10 yes Figure 1 The diagram shows the structure of the circuit board in the thermal management device.

[0043] Figure 11 yes Figure 1 The diagram shows the structure of the first housing in the thermal management device.

[0044] Figure 12 yes Figure 1 A schematic diagram of the first housing in the thermal management device from another perspective;

[0045] Figure 13 yes Figure 1 A partial structural diagram of the end of the positioning column in the thermal management device shown;

[0046] Figure 14 yes Figure 1 A partial cross-sectional view of the thermal management device after the positioning post is combined with the circuit board.

[0047] Figure 15 yes Figure 1 The diagram shows the structure of the second housing in the thermal management device.

[0048] Figure 16 yes Figure 1 A schematic diagram of the second housing in the thermal management device from another perspective;

[0049] Figure 17 yes Figure 1 A cross-sectional view of the valve interface in the thermal management device shown.

[0050] Figure 18 yes Figure 1 A cross-sectional view of the control device in the thermal management system shown.

[0051] Figure 19 yes Figure 1 A schematic cross-sectional view of the control device housing edge in the thermal management device shown.

[0052] Figure 20 This is a schematic diagram of the structure of a vehicle provided in an exemplary embodiment of this application.

[0053] Explanation of reference numerals in the attached figures:

[0054] 1. Vehicles;

[0055] 10. Thermal management device;

[0056] 100. Control device;

[0057] 110. Device casing;

[0058] 110a, First shell;

[0059] 110b, Second housing;

[0060] 110c, reinforcing ribs;

[0061] 111. Main body;

[0062] 111a. Receiving cavity;

[0063] 112. Insertion section;

[0064] 112a. Insertion slot;

[0065] 113. Installation Department;

[0066] 113a. Mounting slot;

[0067] 114. Type I internal pillars;

[0068] 115. Second type of internal column;

[0069] 116. Third type of internal column;

[0070] 117. Positioning post;

[0071] 118. Assembly Department;

[0072] 118a. Assembly hole;

[0073] 120. Control interface;

[0074] 121. Control terminals;

[0075] 130. Driver interface;

[0076] 130a, On / off valve interface;

[0077] 130b, Expansion valve interface;

[0078] 131. Excitation coil;

[0079] 132. Coil support;

[0080] 133. Magnetic conductor;

[0081] 140. Connecting components;

[0082] 141. First conductor;

[0083] 142. Second conductor;

[0084] 143. Circuit board;

[0085] 143a. Positioning hole;

[0086] 143b. Mounting hole;

[0087] 150. Filler;

[0088] 161. Class I bolts;

[0089] 162. Type II bolts;

[0090] 163. Class III bolts;

[0091] 170. Sensor interface;

[0092] 171. Sensing terminal;

[0093] 200. Sensing components;

[0094] 210. Temperature sensor;

[0095] 220. Pressure sensor;

[0096] 230. Composite sensor;

[0097] 240. Sensor connector terminals;

[0098] 250. Sensor cables;

[0099] 300. Flow channel base;

[0100] 310. Valve interface;

[0101] 400. Controlled valves

[0102] 410. Solenoid valve;

[0103] 420. Electronic expansion valve;

[0104] S1, First side;

[0105] S2, Second side. Detailed Implementation

[0106] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0107] Reference Figures 1 to 18 As shown, this application provides a thermal management device 10 and its control device 100.

[0108] Reference Figures 1 to 6 As shown, the thermal management device 10 of this application mainly includes: a control device 100, a sensing component 200, a flow channel base 300, and a controlled valve 400.

[0109] Among them, the control device 100 is mainly used to realize the control function and communication function of the thermal management device 10, the sensing component 200 is mainly used to realize the detection function of the thermal management device 10; the flow channel base 300 mainly forms the corresponding working fluid flow channel so as to send the working fluid flow path that needs to be controlled in the thermal management system to the thermal management device 10; the controlled valve 400 realizes the control of the flow state of the working fluid at the corresponding node (valve interface 310) in the working fluid flow channel (such as controlling the on and off of the working fluid flow or controlling the flow rate of the working fluid).

[0110] Reference Figures 1 to 18 As shown, specifically, the control device 100 of this application mainly includes: a device housing 110, a control interface 120, a drive interface 130, a connection component 140, and a filler 150.

[0111] It should be noted that, in order to prevent the filler 150 from blocking other structures, this application only... Figure 18 The display shows a fill size of 150.

[0112] The device housing 110 has at least a receiving cavity 111a; the control interface 120 has at least a control terminal 121 for receiving control signals; the drive interface 130 has at least an excitation coil 131 for generating a magnetic field to drive the controlled valve 400; the connecting assembly 140 is configured to electrically couple the control interface 120 and the drive interface 130, particularly to electrically couple the control terminal 121 and the excitation coil 131; the filler 150 fills at least between the control interface 120 and the drive interface 130 and at least partially covers the connecting assembly 140. The control interface 120 and the drive interface 130 are respectively located at different positions in the device housing 110, and the connecting assembly 140 is disposed in the receiving cavity 111a, with at least a portion disposed between the control interface 120 and the drive interface 130.

[0113] The housing 110 mainly forms the outer outline of the control device 100 and accommodates the other components of the control device 100, thereby allowing the control device 100 to be installed as a whole onto the flow channel base 300.

[0114] The control interface 120 is mainly used to form an electrical coupling (such as a direct contact electrical connection) with external plug terminals, so that the control device 100 can be connected to the control system of the vehicle 1. Generally speaking, the control device 100 is connected to the bus of the vehicle 1 through the control interface 120, and then interacts with the ECU (Electronic Control Unit, also known as the vehicle computer) or domain controller of the vehicle 1 through the bus of the vehicle 1 to form a signal or data exchange. Of course, a dedicated processor for the thermal management system can also be configured, and the control device 100 can interact with the dedicated processor through the control interface 120 to form a signal or data exchange.

[0115] It is understood that the control interface 120 of the control device 100 is at least used to receive control commands or control signals.

[0116] The drive interface 130 is mainly used to accommodate a portion of the controlled valve 400, so that the portion of the controlled valve 400 that can be driven by the electromagnetic field enters the magnetic field range of the excitation coil 131, thereby enabling the controlled valve 400 to perform its corresponding function under the action of the electromagnetic field generated by the excitation coil 131.

[0117] Reference Figure 4 and Figure 5 As shown, as a specific embodiment, the controlled valve 400 of this application may include a solenoid valve 410 and an electronic expansion valve 420. The solenoid valve 410 is mainly used to control the on / off state of the working fluid flow channel, while the electronic expansion valve 420 is mainly used to control the working fluid flow rate, thereby adjusting the working fluid temperature and pressure. It is understood that the controlled valve 400 is not limited to solenoid valves and electronic expansion valves, but may also be other controllable valves in the thermal management system, such as diverter valves.

[0118] Correspondingly, the drive interface 130 mainly includes an on / off valve interface 130a and an expansion valve interface 130b. The on / off valve interface 130a is configured to connect to the solenoid valve 410; the expansion valve interface 130b is configured to connect to the electronic expansion valve 420. Furthermore, to facilitate connection with the flow channel base 300, both the on / off valve interface 130a and the expansion valve interface 130b are located on the same side of the device housing 110.

[0119] Reference Figure 17 As shown, the driver interface 130 ( Figure 17 The on / off valve interface 130a) also includes: a coil support 132 and a magnetic conductor 133. The coil support 132 is used to mount the excitation coil 131, and the magnetic conductor 133 is used to guide the magnetic field lines and reduce leakage flux.

[0120] As a specific solution, the excitation coil 131, coil support 132, and conductor in the drive interface 130 can be integrally formed with the device housing 110 by means of injection molding or other methods. That is to say, the main components of the drive interface 130, such as the drive coil, can be embedded in the shell wall of the device housing 110.

[0121] Reference Figure 17 As shown, the on / off valve interface 130a is connected to the solenoid valve 410, which only needs to be responsible for on / off control. Therefore, the on / off valve interface 130a only needs to be equipped with an excitation coil 131 to drive the solenoid valve 410 to achieve the action. After the electromagnetic field is eliminated, the solenoid valve 410 can be reset by its own elastic reset mechanism (not shown in the figure).

[0122] Reference Figure 18 As shown, since the expansion valve interface 130b is connected to the electronic expansion valve 420, and due to the working principle of the electronic expansion valve 420, the expansion valve interface 130b needs to provide two electromagnetic fields with opposite magnetic field directions. Therefore, the expansion valve interface 130b has two excitation coils 131 arranged opposite to each other, as well as corresponding coil supports 132 and magnetic conductors 133.

[0123] The specific structure and function of the solenoid valve 410 and the electronic expansion valve 420 are not the focus of this application, and are technical solutions well known to those skilled in the art, so they will not be described in detail here.

[0124] In addition, since the excitation coil 131 requires an external power source to generate a magnetic field, it is understood that in some embodiments, the control interface 120 can also be used to connect the power required by the control device 100, especially the power required by the excitation coil 131.

[0125] Specifically, refer to Figures 4 to 11 As shown, the connection component 140 of this application includes: a plurality of first conductors 141, a plurality of second conductors 142, and a circuit board 143.

[0126] The first conductor 141 is connected between the control terminal 121 and the circuit board 143; the second conductor 142 is connected between the excitation coil 131 and the circuit board 143. The circuit board 143 may be at least partially disposed in the receiving cavity 111a of the device housing 110 and at least partially disposed between the control interface 120 or the drive interface 130. The circuit board 143 may be a PCB (Printed Circuit Board), on which printed circuits, electrical components, and various terminals are provided.

[0127] Reference Figures 4 to 11As shown, the main function of the connecting component 140 is to transmit electrical energy or signals. Of course, this transmission is not necessarily wired; it can also be wireless through electromagnetic field coupling, photosensitive semiconductors, etc. It is understood that the "electrical coupling" referred to in this application includes both wired transmission of electrical energy or signals and other energy transmission methods that are formed through energy field interaction.

[0128] It should be noted that the electrical coupling between the control terminal 121 and the excitation coil 131 when the connection component 140 is used can be understood as follows: when the electrical energy or signal connected to the control terminal 121 changes, the electromagnetic field generated by the excitation coil 131 will also change accordingly (including generating or eliminating the electromagnetic field). In other words, the connection component 140 establishes an electric field-based coupling relationship between the control terminal 121 and the excitation coil 131, thereby associating their electric field states (voltage state or current state). Similarly, the connection component 140 also establishes an electrical coupling between the control interface 120 and the drive interface 130. That is, when the electrical energy or signal connected to the control interface 120 changes, the electromagnetic field generated by the drive interface 130 will also change accordingly (including generating or eliminating the electromagnetic field), establishing an electric field-based coupling relationship, thereby associating the interface states of the control interface 120 and the drive interface 130.

[0129] As a specific solution, the control interface 120 is connected to the drive signal of the excitation coil 131. The circuit board 143 is equipped with a semiconductor switch (not shown in the figure), such as a MOS-FET (metal-oxide semiconductor FET). The control interface 120 is at least connected to the control terminal of the MOS-FET, so that the drive signal directly controls the current on / off or duty cycle of the excitation coil 131. Although the current connected to the control interface 120 does not flow directly through the excitation coil 131, it should still be considered that the connection component 140 in this solution makes the control interface 120 and the drive interface 130 constitute the "electrical coupling" referred to in this application. When the drive signal connected to the control interface 120 changes, the electromagnetic field generated by the excitation coil 131 of the drive interface 130 also changes.

[0130] As an alternative, the control interface 120 receives control signals (carrying control commands), and the circuit board 143 is equipped with a semiconductor switch and a control chip (not shown in the figure), such as a microcontroller. The control chip outputs the drive signal of the excitation coil 131 to the control terminal of the semiconductor switch according to the received control command, thereby enabling the drive signal to directly control the current on / off or duty cycle of the excitation coil 131. The difference from the above-mentioned alternative is that the control interface 120 is used to receive commands, and the drive signal is output by the control chip inside the control device 100. Similarly, although the current of the control signal received by the control interface 120 is not transmitted to the excitation coil 131 of the drive interface 130 in any way (wired or wireless), it should still be considered that the connection component 140 in this alternative constitutes the "electrical coupling" referred to in this application between the control interface 120 and the drive interface 130. When the control signal received by the control interface 120 changes, the electromagnetic field generated by the excitation coil 131 of the drive interface 130 also changes.

[0131] As a relatively direct solution, the control interface 120 is connected to the power supply of the excitation coil 131. That is, some control terminals 121, the first conductor 141, the second conductor 142 and the excitation coil 131 in the control interface 120 are all part of the main circuit. At this time, the change in electrical energy connected to the control interface 120 will directly affect the current state of the excitation coil 131 of the drive interface 130, which constitutes the "electrical coupling" referred to in this application.

[0132] As a specific solution, the first conductor 141 and the second conductor 142 can be made of rigid materials. This ensures the accuracy of the connection positions at both ends, thus avoiding the problem of wire detachment caused by the swaying or pulling of the flexible wire. However, using rigid materials will cause the rigid material itself to bear stress, and without other auxiliary support, its structure is prone to brittle fracture. Of course, the first conductor 141 and the second conductor 142 can be configured into a more complex or voluminous structure to avoid breakage. However, since the control device 100 contains numerous excitation coils 131, control terminals 121, and sensors, a more complex or voluminous structure for the first conductor 141 and the second conductor 142 would undoubtedly occupy more space. This larger volume would require more installation space for the control device 100, thus reducing the integration of the thermal management device 10.

[0133] Therefore, in this application, both the first conductor 141 and the second conductor 142 are constructed as metal pins, which can ensure the accuracy of the hard connection while reducing space occupation. At this time, the filler 150 can be used to supplement the structural strength of the first conductor 141 and the second conductor 142.

[0134] Because the filler 150 fills at least between the control interface 120 and the drive interface 130, it can provide some support for the internal structure between the control interface 120 and the drive interface 130, thereby reducing the force received by the first conductor 141 and the second conductor 142. Secondly, the filler 150 covers at least part of the connection component 140, and whether it covers a part of the circuit board 143 or a part of the first conductor 141 and the second conductor 142, it will further share the force received by the first conductor 141 and the second conductor 142.

[0135] The circuit board 143, located between the control interface 120 and the drive interface 130, provides a relatively stable force-bearing platform for the filler 150, allowing the filler 150 to be divided into two parts to provide auxiliary support for the first conductor 141 and the second conductor 142 respectively.

[0136] In this way, the internal connection stability of the control device 100 can be improved by the position of the circuit board 143 and the coverage of the connection component 140 by the filler 150.

[0137] As a specific embodiment, the filler 150 may include (cured) insulating and thermally conductive adhesive filling the receiving cavity 111a. More specifically, the filler 150 may be used to fill the entire receiving cavity 111a. This maximizes the connection stability of the connecting assembly 140 from the perspective of adhesive filler amount, while also achieving better heat dissipation.

[0138] As a further embodiment, the filler 150 is filled between the control terminal 121 and the circuit board 143 so that the filler 150 at least covers the first conductor 141; the filler 150 is also filled between the excitation coil 131 and the circuit board 143 so that the filler 150 at least covers the second conductor 142. This provides the advantage that the filler 150 provides further protection for both the first conductor 141 and the second conductor 142 through this covering.

[0139] Reference Figures 4 to 18 As shown, in some embodiments of this application, the control interface 120 is disposed on the first side S1 of the device housing 110, and at least a portion of the drive interface 130 is disposed on the second side S2 of the device housing 110; the first side S1 and the second side S2 are disposed opposite to each other. This distribution maximizes the utilization of the maximum outline of the control device 100 and facilitates the wiring and installation of the control device 100.

[0140] In some embodiments of this application, the on / off valve interface 130a and the expansion valve interface 130b are both located on the same side of the device housing 110. This facilitates the assembly of the control device 100, the controlled valve 400, and the flow channel base 300.

[0141] Reference Figures 4 to 18 As shown, in some embodiments of this application, the device housing 110 is formed with a main body 111, an external connection portion, and a mounting portion 113.

[0142] The main body 111 is used to form a receiving cavity 111a; the external part is configured to form an insertion slot 112a for receiving the control terminal 121; and the mounting part 113 is configured to form a mounting slot 113a for mounting the controlled valve 400.

[0143] That is, in addition to forming the main body 111 to accommodate the internal components, the device housing 110 also forms spaces for accommodating the control interface 120 and the drive interface 130 through the external part and the mounting part 113, respectively.

[0144] It should be noted that the control interface 120 and drive interface 130 in this application do not include the portion of the device housing 110 that houses them. That is, the control interface 120 and drive interface 130 refer only to the parts that implement electrical functions, i.e., they are only electrical interfaces, and do not include the external part and mounting part 113, which form a "physical interface". The sensing interface 170 described below is a similar case, the difference being that it is arranged in a notch formed in the device housing 110, rather than in a recess-like space.

[0145] As a specific design, the external part protrudes from the main body 111; the control terminal 121 is disposed in the insertion slot 112a; the mounting part 113 protrudes from the main body 111; and the excitation coil 131 is embedded in the groove wall of the mounting slot 113a. This effectively reduces the space occupied by the main body 111 and avoids the control device 100 from becoming too large.

[0146] Reference Figures 4 to 18 As shown, in some embodiments of this application, the device housing 110 may have a two-part structure. Specifically, the device housing 110 includes a first housing 110a and a second housing 110b.

[0147] The first housing 110a is disposed on the first side S1 of the device housing 110; the second housing 110b is disposed on the second side S2 of the device housing 110; for example, the first housing 110a is disposed on the top side of the device housing 110; and the second housing 110b is disposed on the bottom side of the device housing 110. Furthermore, as a specific embodiment, the first housing 110a forms an external connection portion; and the second housing 110b forms a mounting portion 113. This facilitates the overall assembly of the control device 100 and also facilitates the injection molding of the device housing 110.

[0148] The first housing 110a and the second housing 110b are fixedly connected. As a specific solution, the first housing 110a and the second housing 110b can be fixedly connected by a threaded connection.

[0149] Reference Figures 4 to 18 As shown, in a more specific embodiment, the first housing 110a forms a first type of inner pillar 114; the second housing 110b forms a second type of inner pillar 115; the first housing 110a and the second housing 110b are fixedly connected by first type bolts 161 that pass through the first type of inner pillar 114 and are screwed into the second type of inner pillar 115. A countersunk hole (not shown in the figure) can be formed on the surface of the first housing 110a, which can serve as the inner hole of the first type of inner pillar 114. This inner hole can be an internally threaded hole or a general through hole, allowing the first type bolts 161 to pass through. The second type of inner pillar 115 has an internally threaded hole (not shown in the figure), and the first type bolts 161 have external threads that mate with it. Finally, the first housing 110a and the second housing 110b are fastened together by multiple first type bolts 161.

[0150] Reference Figures 4 to 18 As shown, in a more specific embodiment, in order to fix the circuit board 143, the circuit board 143 is formed with a positioning hole 143a, and the second housing 110b is formed with a positioning post 117 that at least partially passes through the positioning hole 143a.

[0151] Reference Figure 13 and Figure 14 As shown, as a further solution, the end of the positioning post 117 is constructed with a stepped structure. For example, the positioning post 117 includes two cylinders with a larger diameter and a smaller diameter. This forms an annular stepped surface, which allows the positioning post 117 to position the circuit board 143 while also providing some support to the circuit board 143, thereby ensuring the accuracy of the circuit board 143's position. In other words, it indirectly ensures the stability of the connection between the first conductor 141 and the second conductor 142 and the circuit board 143.

[0152] Reference Figures 4 to 18 As shown, as a further solution, to limit the movement of the circuit board 143 towards the first housing 110a, the circuit board 143 has a mounting hole 143b; the second housing 110b has a third type of inner post 116; the circuit board 143 is fixedly mounted to the second housing 110b by a second type of bolt 162 passing through the mounting hole 143b and screwed into the third type of inner post 116. The second type of bolt 162 can contact and limit the upper surface of the circuit board 143 through its own nut or an external washer (not shown in the figure). This further ensures that the position of the circuit board 143 will not move.

[0153] Reference Figure 12 and Figure 16As shown, in a specific embodiment, the first shell 110a and the second shell 110b are formed with reinforcing ribs 110c, which ensures sufficient structural strength even when the first shell 110a and the second shell 110b have relatively thin walls. Simultaneously, the grid structure formed by the reinforcing ribs 110c can also position and distribute the forces acting on the filler 150.

[0154] Reference Figure 19 As shown, as a specific embodiment, the joint between the first housing 110a and the second housing 110b is constructed with a stepped structure. This has the advantage of allowing the first housing 110a and the second housing 110b to self-position during assembly, preventing misalignment of structures such as the first type of inner pillar 114 and the second type of inner pillar 115.

[0155] Reference Figures 1 to 9 as well as Figures 15 to 16 As shown, in a specific embodiment, the device housing 110 also forms an assembly portion 118. The assembly portion 118 has an assembly hole 118a for mounting the control device 100 to the flow channel base 300, which has a corresponding threaded hole. A second type of bolt 162 passes through the assembly hole 118a and is screwed into the threaded hole of the flow channel base 300, thus achieving the connection between the control device 100 and the flow channel base 300. More specifically, the device housing 110 can form multiple assembly portions 118 to ensure stable installation. Furthermore, the assembly portion 118 can be formed at the edge of either the first housing 110a or the second housing 110b, or it can be formed by each housing 110a and the second housing 110b at their respective edges; that is, the assembly portion 118 is located at the edge of the first housing 110a and / or the second housing 110b.

[0156] Reference Figures 1 to 10 As shown, the control device 100 also includes a sensing interface 170, which has at least a sensing terminal 171 (such as a network cable interface terminal) for receiving sensing signals.

[0157] Reference Figures 1 to 3 As shown, the sensing component 200 of the thermal management device 10 of this application mainly includes: a temperature sensor 210, a pressure sensor 220, a composite sensor 230, and a sensing connector 240.

[0158] The temperature sensor 210 is used to detect the temperature of the working fluid in the flow channel base 300; the pressure sensor 220 is used to detect the pressure of the working fluid in the flow channel base 300; the composite sensor 230 can detect both temperature and pressure, and in some embodiments, the composite sensor 230 can also detect flow rate or velocity. That is, the thermal management device 10 also includes: multiple sensors used to detect the state parameters of the working fluid in the flow channel; the sensors and the control device 100 interact with each other, and the state parameters include at least one of temperature, pressure, flow rate, and velocity.

[0159] The sensor connector 240 (network cable connector) transmits the sensor signal to the sensor interface 170 of the control device 100 via the sensor cable 250. In this way, the control device 100 can process or forward data such as temperature and pressure detected by the sensor component 200.

[0160] To ensure the stability of the connection of the sensing interface 170, as a specific solution, the filler 150 can be filled at least between the sensing interface 170 and the drive interface 130, and the sensing interface 170 is located between the control interface 120 and the drive interface 130. More specifically, the sensing interface 170 can be located on the side of the device housing 110, which makes it easier to arrange the sensing cable 250 and the sensing plug terminal 240 of the sensing component 200.

[0161] As a specific solution, the first housing 110a can be formed with a notch (not shown in the figure) that exposes the sensing interface 170.

[0162] Reference Figure 1 and Figure 2 As shown, in the thermal management device 10 of this application, a portion of the controlled valve 400 (the portion capable of sensing a magnetic field) can be accommodated in the drive interface 130, while another portion (at least a portion of the valve core) is disposed in the valve interface 310 provided on the flow channel base 300. The valve interface 310 is disposed in a portion of the corresponding working fluid flow channel, thereby enabling the controlled valve 400 to control the flow state of the working fluid in the corresponding working fluid flow channel. Referring to the foregoing, the flow state here includes, but is not limited to, whether it flows, flow rate, flow volume, etc.

[0163] Reference Figure 20 As shown, this application also provides a vehicle 1, which includes the aforementioned control device 100 or thermal management device 10. The vehicle 1 has all the beneficial effects of the aforementioned control device 100 or thermal management device 10, which will not be repeated here.

[0164] The vehicle 1 can be a gasoline-powered vehicle, a plug-in hybrid electric vehicle, or a new energy vehicle, etc., and this application does not make any specific restrictions on it.

[0165] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0166] In the foregoing embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0167] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0168] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A control device, at least applied to a thermal management system, characterized in that, include: The device housing has at least a receiving cavity; A control interface is located in the housing of the device, and the control interface has at least a control terminal for receiving control signals; A drive interface is disposed in the housing of the device, and the drive interface has at least one function for controlling a valve. A connection component disposed in the receiving cavity and at least partially disposed between the control interface or the drive interface, the connection component being configured to electrically couple the control interface and the drive interface; The filler material at least partially fills the space between the control interface and the drive interface and at least partially covers the connection components.

2. The control device according to claim 1, characterized in that, The control interface is located on the first side of the device housing, and at least part of the drive interface is located on the second side of the device housing; the first side and the second side are arranged opposite to each other.

3. The control device according to claim 2, characterized in that, The driver interface includes: Solenoid valve interface, configured to connect to a solenoid valve; The expansion valve interface is configured to connect to an electronic expansion valve. The solenoid valve interface and the expansion valve interface are both located on the same side of the device housing.

4. The control device according to claim 3, characterized in that, The device housing is formed with: The main body is used to form the receiving cavity; The insertion section is configured to have an insertion slot for receiving the control terminal; The mounting section is configured to have a mounting groove for mounting the controlled valve.

5. The control device according to claim 4, characterized in that, The insertion part protrudes from the main body; the control terminal is disposed in the insertion slot.

6. The control device according to claim 4, characterized in that, The mounting portion protrudes from the main body portion; The driver interface includes: An excitation coil is used to generate a magnetic field that drives the controlled valve; the excitation coil is embedded in the wall of the mounting groove.

7. The control device according to claim 4, characterized in that, The device housing includes a first housing and a second housing that are fixedly connected, the insertion part is formed in the first housing, and the mounting part is formed in the second housing.

8. The control device according to claim 7, characterized in that, The first housing and the second housing are fixedly connected by a threaded connection.

9. The control device according to claim 8, characterized in that, The first housing forms a first type of internal pillar; the second housing forms a second type of internal pillar; the first housing and the second housing are fixedly connected by a first type of bolt that passes through the first type of internal pillar and is screwed into the second type of internal pillar.

10. The control device according to claim 7, characterized in that, The connection component includes: A circuit board is at least partially disposed between the control interface and the drive interface; The circuit board has a positioning hole, and the second housing has a positioning post that at least partially passes through the positioning hole.

11. The control device according to claim 10, characterized in that, The end of the positioning post is constructed with a stepped structure.

12. The control device according to claim 10, characterized in that, The circuit board has mounting holes; the second housing has a third type of inner pillar; the circuit board is fixedly mounted to the second housing by a second type of bolt that passes through the mounting holes and is screwed into the third type of inner pillar.

13. The control device according to claim 7, characterized in that, The first housing and / or the second housing are provided with reinforcing ribs.

14. The control device according to claim 7, characterized in that, The joint between the first housing and the second housing is constructed with a stepped structure.

15. The control device according to claim 7, characterized in that, The device housing is formed with: The assembly section has assembly holes; The assembly part is located at the edge of the first housing and / or the second housing.

16. The control device according to any one of claims 1 to 15, characterized in that, The connection component includes: A circuit board is at least partially disposed between the control interface and the drive interface; A first conductor is connected between the control terminal and the circuit board; The filler is filled between the control terminal and the circuit board so that the filler at least covers the first conductor.

17. The control device according to any one of claims 1 to 15, characterized in that, The connection component includes: A circuit board is at least partially disposed between the control interface and the drive interface; The driver interface includes: An excitation coil is used to generate a magnetic field that drives the controlled valve; The connection component includes: A second conductor is connected between the excitation coil and the circuit board; The filler is filled between the excitation coil and the circuit board so that the filler at least covers the second conductor.

18. The control device according to any one of claims 1 to 15, characterized in that, The filler comprises an insulating and thermally conductive adhesive that fills the cavity.

19. The control device according to any one of claims 1 to 15, characterized in that, Also includes: The sensing interface has at least a sensing terminal for receiving sensing signals; The filler is at least filled between the sensing interface and the driving interface.

20. The control device according to claim 19, characterized in that, The sensing interface is located between the control interface and the drive interface.

21. A thermal management device, characterized in that, Includes the control device as described in any one of claims 1 to 20.

22. The thermal management device according to claim 21, characterized in that, Also includes: A controlled valve, at least partially assembled to the drive interface; The flow channel base forms a working fluid flow channel and valve interface; Wherein, at least a portion of the controlled valve is disposed at the valve interface to control the flow state of the working fluid in the corresponding working fluid channel.

23. The thermal management device according to claim 21, characterized in that, Also includes: Sensors are used to detect the state parameters of the working fluid in the working fluid flow channel; The sensor and the control device interact with each other via signals, and the status parameters include at least one of temperature, pressure, flow rate, and flow velocity.

24. A vehicle, characterized in that, It includes the control device according to any one of claims 1 to 20 or the thermal management device according to any one of claims 21 to 23.