An infrared thermal imager

Abstract

This utility model relates to the field of measuring instrument technology, and in particular to an infrared thermal imager, comprising: a housing, an image acquisition module, a heat sink, and a main control circuit board; the image acquisition module, the heat sink, and the main control circuit board are all disposed within the housing; the image acquisition module includes an infrared camera module and a visible light camera module, which are fixedly disposed on the front side of the heat sink; the main control circuit board is disposed on the rear side of the heat sink, so that the heat sink forms a heat dissipation space between the image acquisition module and the main control circuit board, creating an airflow channel, improving heat dissipation efficiency, avoiding direct heat accumulation on the circuit board, protecting the stability and lifespan of electronic components, preventing performance degradation due to overheating, and thus playing a role in thermal isolation and protection.

Description

Technical Field

[0001] This utility model relates to the field of measuring instrument technology, and in particular to an infrared thermal imager. Background Technology

[0002] Handheld thermal imagers are divided into uncooled and cooled types. Cooled thermal imagers have a cooler, which can effectively cool the acquisition module, thus achieving higher measurement accuracy. However, this also makes them bulkier and consumes more power. Therefore, in non-high-precision fields, uncooled thermal imagers, which are more portable and consume less power, are generally used.

[0003] Existing uncooled thermal imagers have image acquisition modules that are fixed to or close to the main control board, resulting in concentrated heat, poor heat dissipation, and limited heat dissipation space. This affects the heat dissipation effect of the image acquisition module, and the components also interfere with each other.

[0004] Existing uncooled thermal imaging image acquisition modules typically employ a dual-module acquisition approach, using both infrared and visible light camera modules to achieve dual-spectrum imaging. By fusing visible and infrared image information, environmental adaptability and target recognition capabilities are improved. The advantages of dual-spectrum imaging enhance environmental adaptability: visible light lenses can capture details (such as color and texture) under normal lighting conditions, while infrared lenses can penetrate harsh environments such as smoke and darkness, imaging through the object's own heat radiation. The combination of the two enables all-weather monitoring. Both the visible light and infrared camera modules are directly soldered onto the circuit board. During operation, both the circuit board and the camera module generate a significant amount of heat. Lacking an effective heat dissipation structure, their temperature rise can exceed 12 degrees Celsius (the sensor's optimal operating temperature is below 12 degrees Celsius for the best accuracy and stability). To achieve an IP54 protection rating, handheld thermal imagers employ a sealed design. Due to the limited internal space, heat dissipation of the acquisition module is severely affected. The high concentrated heat generation will seriously impact the lifespan and accuracy of the camera module and circuit board components. Therefore, improving the heat dissipation efficiency of the acquisition device is an urgent problem to be solved. Utility Model Content

[0005] (a) Technical problems to be solved

[0006] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides an infrared thermal imager that solves the technical problem of poor heat dissipation efficiency of existing handheld uncooled thermal imagers.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, the main technical solutions adopted by this utility model include:

[0009] An infrared thermal imager includes: a housing, an image acquisition module, a heat sink, and a main control circuit board;

[0010] The image acquisition module, heat sink, and main control circuit board are all housed within the housing.

[0011] The image acquisition module includes an infrared camera module and a visible light camera module, which are fixedly mounted on the front side of the heat sink.

[0012] The main control circuit board is located on the rear side of the heat sink, so that the heat sink forms a heat dissipation space between the image acquisition module and the main control circuit board.

[0013] The heat sink includes a first heat sink;

[0014] The front side of the first heat sink is provided with a first mounting slot for mounting the infrared camera module and a second mounting slot for mounting the visible light camera module; wherein, the first mounting slot is located above the second mounting slot;

[0015] The first heat sink is provided with a first heat sink structure for dissipating heat from the infrared camera module, a second heat sink structure for dissipating heat from the visible light camera module, and a third heat sink structure capable of dissipating heat from both the infrared camera module and the visible light camera module simultaneously.

[0016] The heat sink also includes a second heat sink; the second heat sink is located behind the first heat sink and is configured corresponding to the first mounting slot to dissipate heat from the infrared camera module.

[0017] The second heat sink includes a first side plate, a second side plate, and a third side plate. The first side plate is fixedly connected to the first heat sink and is used to close the first mounting slot.

[0018] The second side plate and the first side plate are connected to each other in an L-shaped structure. The opposite side of the second side plate and the third side plate is provided with a fixed limiting structure. The fixed limiting structure is fixedly connected to the third side plate so that an installation space for the infrared acquisition and control circuit board of the infrared camera module is formed between the second side plate and the third side plate.

[0019] The first heat dissipation structure is located at the end of the first heat dissipation frame that is away from the second side plate and the third side plate;

[0020] The second heat dissipation structure is located below the second mounting slot;

[0021] The third heat dissipation structure is located between the first heat dissipation structure and the second heat dissipation structure;

[0022] The first heat dissipation structure, the second heat dissipation structure, and the third heat dissipation structure all include multiple heat dissipation fins, and heat dissipation cavities are formed between adjacent heat dissipation fins.

[0023] A fourth heat dissipation structure is provided at the corner where the second side plate meets the first side plate;

[0024] The fourth heat dissipation structure includes multiple fourth heat dissipation fins, and a fourth heat dissipation cavity is formed between adjacent fourth heat dissipation fins.

[0025] It also includes an infrared camera module housing and a visible light camera module housing, both of which are located on the front side of the first heat sink.

[0026] The infrared camera module housing is fixedly connected to the first mounting slot;

[0027] The visible light camera module housing is fixedly connected to the second mounting slot;

[0028] The front side of the first mounting slot is provided with a through hole for the lens of the infrared camera module to pass through;

[0029] The infrared camera module housing has a through groove in the middle corresponding to the through hole for fixing the lens of the infrared camera module.

[0030] It also includes an LED light assembly and a power supply, wherein the LED light assembly is fixedly connected to the lower end of the heat sink.

[0031] The image acquisition module, main control circuit board, and LED light assembly are connected to the power supply.

[0032] The housing includes a front housing and a rear housing, which are sealed together by a waterproof ring.

[0033] The image acquisition module, the LED light assembly, and the heat sink are fixedly connected to the front housing; the main control circuit board is fixedly connected to the rear housing.

[0034] The front housing is provided with an infrared camera module window, a visible light camera module window, and an LED light assembly, respectively.

[0035] The rear housing is equipped with a display screen.

[0036] (III) Beneficial Effects

[0037] The beneficial effects of this utility model are as follows: The infrared thermal imager provided by this utility model includes a housing, an image acquisition module, and a main control circuit board. A heat sink is provided between the image acquisition module and the main control circuit board. The heat sink creates a heat dissipation space between the image acquisition module and the main control circuit board, separating the main heat source (image acquisition module) from the temperature-sensitive main control circuit board by a distance. This creates an airflow channel, improves heat dissipation efficiency, and prevents heat from directly accumulating on the circuit board, protecting the stability and lifespan of electronic components and preventing performance degradation or system crashes due to overheating. This provides thermal isolation and protection. The visible light camera module and the infrared camera module are both separately configured and not integrated onto the main control circuit board, which is beneficial for heat dissipation.

[0038] The heat sink includes a first heat sink and a second heat sink connected sequentially in a front-to-back direction. The first heat sink has a first mounting slot for mounting an infrared camera module and a second mounting slot for mounting a visible light camera module. This facilitates installation while providing independent mounting spaces to protect each functional module from physical impacts. Each functional module is equipped with a heat dissipation structure, increasing the surface area for air contact and thus significantly improving heat dissipation efficiency.

[0039] The second heat sink is L-shaped, which isolates the image acquisition module and the main control circuit board, creating a space with sufficient spacing for heat dissipation. This prevents heat buildup inside and ensures the stability of the main control circuit board. At the same time, it integrates the mounting space for the infrared acquisition and control circuit board within the heat sink body structure, making the structure more compact and saving internal space. Attached Figure Description

[0040] Figure 1 This is a three-dimensional view (front view) of the infrared thermal imager of this utility model;

[0041] Figure 2 This is a three-dimensional view (rear view) of the infrared thermal imager of this utility model.

[0042] Figure 3 This is a partial disassembled perspective view of the infrared thermal imager of this utility model;

[0043] Figure 4 This is a disassembled diagram of the infrared thermal imager of this utility model;

[0044] Figure 5 This is a disassembled cross-section of the image acquisition module and heat sink of this utility model;

[0045] Figure 6 This is a perspective view (rear view) of the first heat sink of this utility model.

[0046] [Explanation of Labels in the Attached Image]

[0047] 1: Housing; 11: Front housing; 111: Infrared camera module window; 112: Visible light camera module window; 113: LED light window; 114: First control button;

[0048] 12: Rear housing; 121: Display screen; 122: Second control button; 123: Display screen support base;

[0049] 13: Waterproof ring;

[0050] 2: Image acquisition module; 21: Infrared camera module; 22: Visible light camera module; 23: Infrared camera module housing; 24: Visible light camera module housing; 25: Infrared acquisition control circuit board;

[0051] 3: Heat sink bracket; 31: First heat sink bracket; 311: First mounting slot; 312: First heat sink fin; 313: Second mounting slot; 314: Second heat sink fin; 315: Third heat sink fin;

[0052] 32: Second heat sink; 321: First side panel; 322: Second side panel; 323: Third side panel; 324: Fourth heat sink fin;

[0053] 4: Main control circuit board;

[0054] 5: LED light assembly;

[0055] 6: Power supply;

[0056] 7: Type-C charging dock. Detailed Implementation

[0057] To better understand the above technical solutions, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present invention can be understood more clearly and thoroughly, and that the scope of the present invention can be fully conveyed to those skilled in the art.

[0058] See appendix Figure 1-6As shown, this utility model embodiment provides an infrared thermal imager, including: a housing 1, an image acquisition module 2, a heat sink 3, a main control circuit board 4, an LED light assembly 5, and a power supply 6. The image acquisition module 2, heat sink 3, main control circuit board 4, LED light assembly 5, and power supply 6 are disposed within the housing 1. The image acquisition module 2 includes an infrared camera module 21 and a visible light camera module 22, which are disposed on the front side of the heat sink 3. The main control circuit board 4 is disposed on the rear side of the heat sink 3, so that a heat dissipation space is formed between the image acquisition module 2 and the main control circuit board 4 through the heat sink 3. This separates the main heat source (image acquisition module 2) from the temperature-sensitive main control circuit board 4 by a distance, creating an airflow channel, improving heat dissipation efficiency, preventing heat from directly accumulating on the circuit board, protecting the stability and lifespan of electronic components, and preventing performance degradation or system crashes due to overheating, thereby playing a role in thermal isolation and protection.

[0059] The infrared camera module 21 is electrically connected to the infrared acquisition and control circuit board 25 via an FPC cable, while the visible light camera module 22 and the infrared acquisition and control circuit board 25 are electrically connected to the main control circuit board 4 via FPC cables. Both the visible light camera module 22 and the infrared camera module 21 are separately configured and not integrated onto the circuit board, which facilitates heat dissipation.

[0060] The heat sink 3 is made of metal and can effectively transfer heat to dissipate heat from the image acquisition module 2.

[0061] The heat sink 3 includes a first heat sink 31 and a second heat sink 32 that are fixedly connected in the front-to-back direction. The front side of the first heat sink 31 is provided with a first mounting slot 311 for mounting an infrared camera module 21 and a second mounting slot 313 for mounting a visible light camera module 22; wherein, the first mounting slot 311 is located above the second mounting slot 313.

[0062] The opening of the first mounting slot 311 is located at the rear of the first heat sink 31. The second heat sink 32 covers the opening of the first mounting slot 311 and is fixedly connected to the first heat sink 31 with screws to seal the first mounting slot 311. By dividing the heat sink 3 into two parts, the infrared camera module 21 can be installed into the mounting slot from the rear, facilitating the connection and installation of the infrared camera module 21 with the infrared acquisition and control circuit board 25. After installation, it is then sealed by the second heat sink 32 for easy assembly and maintenance. The first mounting slot 311 and the second heat sink 32 form a relatively closed cavity, which can protect the infrared camera module 21 from physical impact.

[0063] An infrared camera module housing 23 is located on the front side of the first mounting slot 311, and the infrared camera module housing 23 is fixedly connected to the first mounting slot 311. The front side of the first mounting slot 311 has a through hole for the lens of the infrared camera module 21 to pass through. Corresponding to this through hole, the infrared camera module housing 23 has a through groove for fixing the lens of the infrared camera module 21, thus fixing and protecting the lens and lens of the camera module and providing them with an optical path. The housing, combined with the mounting slot, provides a dustproof and moisture-proof barrier for the internal precision optical components.

[0064] The second mounting slot 313 is located below the first heat sink 31, and the opening of the second mounting slot 313 is located on the front side of the heat sink 3. The visible light camera module 22 can be inserted into the mounting slot from the front, which facilitates installation and removal.

[0065] A visible light camera module housing 24 is provided on the front side of the second mounting slot 313, and the visible light camera module housing 24 is fixedly connected to the second mounting slot 313. By setting the visible light camera module housing 24 and the second mounting slot 313 to form a closed mounting cavity, the visible light camera module 22 can be protected from physical impact.

[0066] The second heat sink 32 includes a first side plate 321, a second side plate 322, and a third side plate 323. The first side plate 321 is fixedly connected to the first heat sink 31. The second side plate 322 is perpendicular to the first side plate 321. A fixing limiting structure is provided on the outer side of the second side plate 322. The fixing limiting structure is fixedly connected to the third side plate 323 by screws, so that an installation space for the infrared acquisition control circuit board 25 of the infrared camera module 21 is formed between the second side plate 322 and the third side plate 323. The infrared acquisition control circuit board 25 is fixedly installed between the fixing limiting structures by screws.

[0067] The second heat sink 32 has a small gap between itself and the main control circuit board 4 or is in contact with the main control circuit board 4 during installation.

[0068] By setting up an L-shaped second heat sink 32, the image acquisition module 2 and the main control circuit board 4 are isolated, forming a heat dissipation space with a certain spacing. At the same time, the mounting space of the infrared acquisition control circuit board 25 is integrated into the body structure of the heat sink 3, which greatly saves internal space and makes the structure more compact. The infrared acquisition control circuit board 25 is directly mounted on the metal heat sink 3, and the heat it generates can be directly dissipated through the surface area of ​​the second heat sink 32, avoiding heat accumulation inside and ensuring the stability of the main control board.

[0069] The first heat sink 31 is also equipped with a first heat dissipation structure for dissipating heat from the infrared camera module 21, a second heat dissipation structure for dissipating heat from the visible light camera module 22, and a third heat dissipation structure capable of dissipating heat from both the infrared camera module 21 and the visible light camera module 22 simultaneously. By setting up heat dissipation structures, the surface area in contact with air is increased, which helps air circulation and allows heat to be conducted into the air more quickly, thereby improving heat dissipation efficiency.

[0070] The first heat dissipation structure is located at the end of the first heat sink 31 furthest from the second side plate 322 and the third side plate 323. The first heat dissipation structure includes a plurality of first heat dissipation fins 312, and a first heat dissipation cavity is formed between adjacent first heat dissipation fins 312. The heat dissipation cavity between the heat dissipation fins forms a regular airflow channel, making heat dissipation more efficient and uniform.

[0071] The second heat dissipation structure is located below the second mounting slot 313. The second heat dissipation structure includes multiple second heat dissipation fins 314, with adjacent second heat dissipation fins 314 forming a second heat dissipation cavity. By setting up the second heat dissipation structure, a dedicated heat dissipation area is provided for the visible light camera module 22. The visible light module also generates heat during operation; the independent second heat dissipation structure can effectively dissipate this heat source, preventing overheating and affecting image quality. The heat from infrared and visible light is conducted separately through different areas of the heat sink 3, avoiding cross-contamination and heat concentration, resulting in more balanced overall thermal management.

[0072] The third heat dissipation structure is located between the first and second heat dissipation structures. The third heat dissipation structure includes multiple third heat dissipation fins 315, and adjacent third heat dissipation fins 315 form a third heat dissipation cavity. The third heat dissipation cavity can simultaneously dissipate heat from the infrared camera module 21 and the visible light camera module 22, further improving heat dissipation efficiency.

[0073] A fourth heat dissipation structure is provided at the corner between the second side plate 322 and the first side plate 321. The fourth heat dissipation structure includes multiple fourth heat dissipation fins 324, and a fourth heat dissipation cavity is formed between adjacent fourth heat dissipation fins 324. By increasing the heat dissipation area at the corner of the structure, the space is fully utilized to enhance heat dissipation at the weak link (corner) of the structural connection.

[0074] The infrared camera module 21 and the visible light camera module 22 are connected via FPC cables. FPC cable outlets are provided on both sides of the first mounting slot 311 and the second mounting slot 313 to facilitate the installation and connection of the infrared camera module 21 and the visible light camera module 22. The infrared camera module 21 is connected to the infrared acquisition control circuit board 25 via an FPC cable, and the visible light camera module 22 is connected to the main control circuit board 4 via an FPC cable.

[0075] The LED light assembly 5 is fixedly connected to the lower end of the heat sink 3, allowing for heat dissipation and extending its service life. This design integrates thermal imaging, visible light imaging, and supplementary lighting, expanding the device's application capabilities in low-light environments.

[0076] The housing 1 includes a front housing 11 and a rear housing 12, which are sealed together by a waterproof ring 13. By connecting the front housing 11 and the rear housing 12 with the waterproof ring 13, the equipment can achieve a preset dustproof and waterproof rating and adapt to harsh working environments such as outdoor, humid, and dusty conditions.

[0077] The image acquisition module 2, LED light assembly 5 and heat sink 3 are fixedly connected to the front housing 11, and the main control circuit board 4 is fixedly connected to the rear housing 12. The layout is reasonable, easy to install, and can improve heat dissipation efficiency.

[0078] The front housing 11 is provided with infrared camera module window 111, visible light camera module window 112, and LED light assembly 5 respectively, corresponding to infrared camera module 21, visible light camera module 22, and LED light assembly 5. The window layout is rationalized for each functional module to ensure that each functional module works normally, making the appearance neat and beautiful, and easy for users to understand and operate.

[0079] The front inner wall of the front housing 11 is provided with multiple fixing posts for fixing the heat sink 3, and a fixing slot is provided on the front side of the first heat sink 31 corresponding to the fixing posts. The circumferential inner wall of the front housing 11 is provided with multiple fixing posts for fixing the third side plate 323, and a fixing slot is provided on the third side plate 323 corresponding to the fixing posts. The fixing posts and fixing slots facilitate the quick positioning and connection of the internal components with the outer housing 1.

[0080] It also includes a display screen support 123, the front of which is fixedly connected to the main control circuit board 4, and the rear of which is fixedly connected to the display screen 121. The display screen 121 is connected to the main control circuit board 4 and is used to display measurement data and other equipment information. The display screen support 123 is fixedly connected to the rear housing 12.

[0081] The main control circuit board 4 has a first control button 114 at the lower end. The first control button 114 is fixed to the front housing 11 and is used to control the LED light assembly 5 for supplemental lighting.

[0082] The rear housing 12 is provided with a second control button 122, which is used to control various functions of the image acquisition module 2.

[0083] Image acquisition module 2, main control circuit board 4 and LED light assembly 5 are all connected to power supply 6. A battery is used as power supply 6 to power all modules, which simplifies the circuit design.

[0084] The lower end of the housing 1 is a handle, and the battery is located inside the handle. The front housing 11 has a removable battery cover for easy battery replacement.

[0085] It also includes a Type-C charging dock 7, which is fixedly connected to the top of the front housing 11 for charging.

[0086] The infrared thermal imager provided by this utility model includes a housing 1, an image acquisition module 2, and a main control circuit board 4. A heat sink 3 is provided between the image acquisition module 2 and the main control circuit board 4, forming a heat dissipation space between them. This heat sink 3 separates the main heat source (image acquisition module 2) from the temperature-sensitive main control circuit board 4, creating an airflow channel, improving heat dissipation efficiency, preventing heat from directly accumulating on the circuit board, protecting the stability and lifespan of electronic components, and preventing performance degradation or system crashes due to overheating. This provides thermal isolation and protection. The visible light camera module 22 and the infrared camera module 21 are both separately configured and not integrated into the main control circuit board 4, which facilitates heat dissipation.

[0087] The heat sink 3 includes a first heat sink 31 and a second heat sink 32 connected sequentially in the front-to-back direction. The first heat sink 31 has a first mounting slot 311 and a second mounting slot 313, which facilitates the installation of the infrared camera module 21 and the visible light camera module 22. The independent installation space can protect each functional module from physical impact. At the same time, each module has an independent heat dissipation structure, which increases the surface area in contact with air, thereby greatly improving the heat dissipation efficiency.

[0088] The second heat sink 32 is L-shaped, which isolates the image acquisition module 2 and the main control circuit board 4 and forms a heat dissipation space with a certain distance, avoiding heat accumulation inside and ensuring the stability of the main control circuit board 4. At the same time, the installation space of the infrared acquisition control circuit board 25 is integrated into the body structure of the heat sink 3, making the structure more compact and saving internal space of the equipment.

[0089] In the description of this utility model, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0090] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0091] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "beneath" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0092] In the description of this specification, the terms "one embodiment," "some embodiments," "embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0093] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make modifications, alterations, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. An infrared thermal imager, characterized in that, include: Housing (1), image acquisition module (2), heat sink (3) and main control circuit board (4); The image acquisition module (2), heat sink (3) and main control circuit board (4) are all housed inside the housing (1); The image acquisition module (2) includes an infrared camera module (21) and a visible light camera module (22), which are fixedly installed on the front side of the heat sink (3); The main control circuit board (4) is located on the rear side of the heat sink (3) so as to form a heat dissipation space between the image acquisition module (2) and the main control circuit board (4) through the heat sink (3).

2. The infrared thermal imager according to claim 1, characterized in that, The heat sink (3) includes a first heat sink (31). The front side of the first heat sink (31) is provided with a first mounting slot (311) for mounting the infrared camera module (21) and a second mounting slot (313) for mounting the visible light camera module (22); wherein, the first mounting slot (311) is located above the second mounting slot (313); The first heat sink (31) is provided with a first heat sink structure for dissipating heat from the infrared camera module (21), a second heat sink structure for dissipating heat from the visible light camera module (22), and a third heat sink structure that can dissipate heat from both the infrared camera module (21) and the visible light camera module (22) at the same time.

3. The infrared thermal imager according to claim 2, characterized in that, The heat sink (3) also includes a second heat sink (32); the second heat sink (32) is located on the rear side of the first heat sink (31) and is set in relation to the first mounting slot (311) to dissipate heat from the infrared camera module (21).

4. The infrared thermal imager according to claim 3, characterized in that, The second heat sink (32) includes: a first side plate (321), a second side plate (322) and a third side plate (323). The first side plate (321) is fixedly connected to the first heat sink (31) and is used to close the first mounting groove (311). The second side plate (322) and the first side plate (321) are connected to each other in an L-shaped structure. The second side plate (322) and the third side plate (323) are provided with a fixed limiting structure on their opposite sides. The fixed limiting structure is fixedly connected to the third side plate (323) so that an installation space for the infrared acquisition control circuit board (25) of the infrared camera module (21) is formed between the second side plate (322) and the third side plate (323).

5. The infrared thermal imager according to claim 4, characterized in that, The first heat dissipation structure is located at the end of the first heat dissipation frame (31) that is away from the second side plate (322) and the third side plate (323); The second heat dissipation structure is located below the second mounting slot (313); The third heat dissipation structure is located between the first heat dissipation structure and the second heat dissipation structure; The first heat dissipation structure, the second heat dissipation structure, and the third heat dissipation structure all include multiple heat dissipation fins, and heat dissipation cavities are formed between adjacent heat dissipation fins.

6. The infrared thermal imager according to claim 4, characterized in that, A fourth heat dissipation structure is provided at the corner between the second side plate (322) and the first side plate (321); The fourth heat dissipation structure includes multiple heat dissipation fins, and a heat dissipation cavity is formed between adjacent heat dissipation fins.

7. The infrared thermal imager according to claim 2, characterized in that, It also includes an infrared camera module housing (23) and a visible light camera module housing (24), both of which are located in front of the first heat sink (31); The infrared camera module housing (23) is fixedly connected to the first mounting slot (311); The visible light camera module housing (24) is fixedly connected to the second mounting slot (313); The front side of the first mounting slot (311) is provided with a through hole for the lens of the infrared camera module (21) to pass through; The infrared camera module housing (23) has a through groove in the middle corresponding to the through hole for fixing the lens of the infrared camera module (21).

8. The infrared thermal imager according to claim 1, characterized in that, It also includes an LED lamp assembly (5) and a power supply (6), wherein the LED lamp assembly (5) is fixedly connected to the lower end of the heat sink (3); The image acquisition module (2), the main control circuit board (4) and the LED light assembly (5) are connected to the power supply (6).

9. The infrared thermal imager according to claim 8, characterized in that, The housing (1) includes a front housing (11) and a rear housing (12), which are sealed together by a waterproof ring (13); The image acquisition module (2), the LED light assembly (5), and the heat sink (3) are fixedly connected to the front housing (11); the main control circuit board (4) is fixedly connected to the rear housing (12); The front housing (11) is provided with an infrared camera module window (111), a visible light camera module window (112), and an LED light assembly (5) in sequence, corresponding to the infrared camera module (21), the visible light camera module (22), and the LED light assembly (5). The rear housing (12) is equipped with a display screen (121).

Images