Electronic package

Abstract

An electronic package includes a carrier, an electronic component disposed on the carrier, a thermally conductive material disposed on the electronic component, a barrier structure disposed on the carrier and encircling an outer side of the electronic component, a heat spreader disposed on the carrier and located peripherally of the barrier structure, and a filler material formed between the barrier structure and the heat spreader to avoid moisture ingress and oxidation of the thermally conductive material.

Description

Technical Field

[0001] This application relates to a semiconductor device, and more particularly to an electronic package. Background Technology

[0002] As electronic products demand higher functionality and processing speeds, semiconductor chips, as core components of these products, need to have higher density electronic circuits and components. Consequently, semiconductor chips generate a greater amount of heat during operation. Furthermore, the encapsulating colloids traditionally used to cover these semiconductor chips are poor heat transfer materials with a thermal conductivity of only 0.8 W / mk (i.e., poor heat dissipation efficiency). Therefore, if the heat generated by the semiconductor chip cannot be effectively dissipated, it will cause damage to the semiconductor chip and product reliability issues.

[0003] Therefore, in order to quickly dissipate heat to the outside, the industry usually equips semiconductor packages with heat sinks. These heat sinks are typically bonded to the back of the semiconductor chip through a heat dissipation material, such as a thermal interface material (TIM), so that the heat generated by the semiconductor chip can be dissipated through the heat dissipation material and the heat sink. Furthermore, the top surface of the heat sink is usually exposed to the encapsulation colloid or directly exposed to the atmosphere to achieve better heat dissipation.

[0004] Figure 1 This is a cross-sectional schematic diagram of an existing semiconductor package 1. A semiconductor wafer 12 is first mounted on a packaging substrate 11 using a flip-chip bonding method. A heat sink 13 is then bonded to the back side of the semiconductor wafer 12 via a thermally conductive interface material (TIM) 14. When a low-melting-point thermally conductive interface material 14 (e.g., liquid metal containing gallium) is typically used on the back side of the semiconductor wafer 12, a back side metal layer (BSM) 15 must be applied. This BSM 15 can be composed of multiple metal layers. However, after applying the low-melting-point thermally conductive interface material 14, before entering the high-temperature processing stage, it is easily slipped or overflowed from the back edge of the semiconductor wafer 12 due to machine operation. This results in insufficient coverage of the thermally conductive interface material 14 between the heat sink 13 and the semiconductor wafer 12, reducing the heat dissipation capacity of the semiconductor package, leading to poor heat dissipation performance, or even damage to electronic products.

[0005] To address this, current industry solutions involve bonding the back metal layer and the thermally conductive interface material using polymeric adhesives. However, these adhesives hinder the reaction of metal ions during the bonding process between the low-melting-point thermally conductive interface material and the back metal layer, leading to voids and cracks at the welded interface and reducing heat dissipation efficiency. Furthermore, the presence of air inside the heat sink causes oxides to form between the air and the metal thermally conductive interface material. These oxides expand and can be extruded from the heat sink; since these metal oxides lack heat dissipation capabilities, the heat dissipation capacity of the thermally conductive interface material is significantly reduced.

[0006] Therefore, overcoming the problems of the existing technology has become an urgent issue that needs to be addressed. Utility Model Content

[0007] In view of the various deficiencies of the prior art, this application provides an electronic package, comprising: a carrier; an electronic component disposed on the carrier; a thermally conductive material disposed on the electronic component; a barrier structure disposed on the carrier and located outside the electronic component; an adhesive layer disposed on the carrier and located outside the barrier structure and having a notch; a heat dissipation component comprising a cover portion and a support portion extending from the cover portion, the cover portion being connected to the electronic component via the thermally conductive material, the support portion being connected to the carrier via the adhesive layer, and an accommodating space communicating with the adhesive layer is formed between the support portion and the barrier structure; and a filler material formed in the accommodating space.

[0008] This application also provides a method for manufacturing an electronic package, comprising: attaching an electronic component to a carrier; disposing a thermally conductive material on the electronic component; forming a barrier structure on the carrier corresponding to the outer side of the electronic component; disposing a heat sink on the carrier located on the periphery of the barrier structure via an adhesive layer, wherein the adhesive layer has a notch, and the heat sink includes a cover portion and a support portion extending from the cover portion, the cover portion being attached to the electronic component via the thermally conductive material, the support portion being attached to the carrier via the adhesive layer, and an accommodating space communicating with the notch in the adhesive layer is formed between the support portion and the barrier structure; and forming a filler material in the accommodating space through the notch in the adhesive layer.

[0009] In the aforementioned electronic package and its manufacturing method, the electronic component has a working surface and a non-working surface, the electronic component is placed on and electrically connected to the carrier with the working surface, and the thermally conductive material is disposed on the non-working surface of the electronic component.

[0010] In the aforementioned electronic packaging components and their manufacturing methods, the thermally conductive material is a thermally conductive interface material. For example, the thermally conductive material is liquid metal.

[0011] In the aforementioned electronic package and its manufacturing method, the barrier structure is arranged around the outside of the electronic component to enclose the thermally conductive material.

[0012] In the aforementioned electronic package and its manufacturing method, the adhesive layer is composed of multiple blocks, and the gap is formed between the multiple blocks.

[0013] In the aforementioned electronic package and its manufacturing method, the cover portion is attached to the barrier structure and bonded to the electronic component through the thermally conductive material.

[0014] In the aforementioned electronic packaging components and their manufacturing methods, the filler material is a non-conductive compound.

[0015] In the aforementioned electronic packaging component and its manufacturing method, the carrier component has multiple functional elements disposed on the outer side of the retaining wall structure.

[0016] By implementing this application, a thermally conductive material (liquid metal) is mainly provided on the electronic component, and a baffle structure is provided around the electronic component to prevent the thermally conductive material from overflowing. At the same time, the cover of the heat sink is placed on the baffle structure and bonded to the electronic component through the thermally conductive material. The heat sink is supported by an adhesive layer and erected on the carrier. A receiving space is formed between the support and the baffle structure, and the adhesive layer has a notch to connect the receiving space. A completely sealed filler material is injected into the receiving space through the notch of the adhesive layer to form a completely sealed filling material, preventing air / moisture from penetrating through the gap between the baffle structure and the heat sink and causing oxidation and expansion of the thermally conductive material. Attached Figure Description

[0017] Figure 1 This is a cross-sectional schematic diagram of an existing semiconductor package.

[0018] Figures 2 to 5 This is a partial top view and cross-sectional view of the electronic package and its manufacturing method according to this application.

[0019] Explanation of reference numerals in the attached figures

[0020] 1 Semiconductor package

[0021] 11 Packaging substrate

[0022] 12 Semiconductor wafers

[0023] 13 Heat sink

[0024] 14 Thermally conductive interface material

[0025] 15 Crystal back metal layer

[0026] 2 Electronic Packages

[0027] 21. Bearing components

[0028] 21a First Surface

[0029] 21b Second Surface

[0030] 210 Functional Components

[0031] 22 Electronic components

[0032] 22a Working surface

[0033] 22b Non-operating surface

[0034] 220 conductive bump

[0035] 23 Thermal conductive materials

[0036] 24 Retaining Wall Structure

[0037] 25 Heat sink

[0038] 251 Cover section

[0039] 252 Support section

[0040] 26 Adhesive layer

[0041] 260 gap

[0042] 27. Filler Material

[0043] S represents the accommodating space. Detailed Implementation

[0044] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.

[0045] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.

[0046] Please see Figures 2 to 5 This is a partial top view and cross-sectional view of the electronic package and its manufacturing method of this application.

[0047] like Figure 2As shown, a carrier 21 is provided, and an electronic component 22 is attached to the carrier 21.

[0048] The carrier 21 has opposing first surfaces 21a and second surfaces 21b, which may be, for example, a substrate with a core layer and circuit structure or a coreless circuit structure, and include dielectric layers and circuit layers (such as redistribution layers). Alternatively, the carrier 21 may also be a lead frame, a silicon interposer, a wafer, or other board with metal routing, and is not limited to the above.

[0049] The electronic component 22 is disposed on the first surface 21a of the carrier 21 and electrically connected to the circuit layer. The electronic component 22 may be an active component, a passive component, a package structure, or a combination thereof. The active component may be a semiconductor wafer, while the passive component may be, for example, a resistor, a capacitor, or an inductor. In this embodiment, the electronic component 22 is a semiconductor wafer having opposing active surfaces 22a and non-active surfaces 22b, and the active surface 22a is electrically connected to the carrier 21 via a plurality of conductive bumps 220 by flip-chip bonding.

[0050] Next, a thermally conductive material 23 is formed on the non-functional surface 22b of the electronic component 22. The thermally conductive material 23 is a thermal interface material (TIM), such as a low-temperature molten heat-conducting material, which may be indium, gallium or liquid metal containing the aforementioned materials.

[0051] A baffle structure 24 is erected on the first surface 21a of the support member 21. The baffle structure 24 is arranged around the outside of the electronic component 22 to enclose the heat-conducting material 23 (liquid metal). The baffle structure 24 can be made of metal, epoxy resin, or a special porous structure that allows air to pass through but prevents fluid from passing through, effectively blocking the heat-conducting material 23 from the inside of the baffle structure 24.

[0052] Furthermore, a back metal layer (not shown) may be provided between the non-functional surface 22b of the electronic component 22 and the thermal conductive material 23. The back metal layer may be a multilayer metal structure, such as one of the groups consisting of aluminum (Al), titanium (Ti), nickel (Ni), vanadium (V), and gold (Au).

[0053] Furthermore, multiple functional elements 210 (e.g., passive elements) may be provided on the first surface 21a of the support member 21 corresponding to the outer side of the retaining wall structure 24.

[0054] like Figure 3 As shown, a heat sink 25 is attached to the carrier 21 via an adhesive layer 26. The heat sink 25 is omitted in the top view of the figure to clearly show the configuration of the adhesive layer 26.

[0055] The adhesive layer 26 is disposed on the periphery of the first surface 21a of the support member 21 and has a notch 260 to prevent stress concentration.

[0056] The adhesive layer 26, for example, is a thermally conductive adhesive and may be composed of multiple blocks, with gaps 260 formed between the blocks. For example, as shown in this figure, the adhesive layer 26 with straight blocks is formed on each of the four sides of the rectangular support 21, with gaps 260 formed at the corners; or the adhesive layer 26 with U-shaped blocks is formed on opposite sides of the rectangular support 21, with gaps 260 formed on adjacent sides.

[0057] The heat sink 25 includes a cover portion 251 and a support portion 252 extending outward from the surface of the cover portion 251. The heat sink 25 is made of, for example, copper.

[0058] The cover portion 251 is attached to the retaining wall structure 24 and is connected to the electronic component 22 through the thermally conductive material 23.

[0059] The heat sink 25 is erected on the support member 21 by the support portion 252 and the adhesive layer 26, so that an accommodating space S is formed between the support portion 252 and the retaining wall structure 24, and the notch 260 of the adhesive layer 26 can communicate with the accommodating space S.

[0060] like Figure 4 and Figure 5 As shown, a filler material 27 is injected into the accommodating space S through the notch 260 of the adhesive layer 26, so that the filler material 27 fills the accommodating space S, and then the notch 260 is sealed to obtain the electronic package 2 of this application.

[0061] The filler 27 is a non-conductive compound, specifically an organic compound of the type of benzotriazole, imidazole, or benzimidazole, to prevent external moisture from entering the thermally conductive material 23.

[0062] Because the filler material 27 (non-conductive compound) has a certain viscosity and the gap 260 of the adhesive layer 26 has a small discontinuous space, the filler material 27 will not overflow. In addition, the baffle structure 24 is mainly to prevent the thermal conductive material 23 (liquid metal) from overflowing. At the same time, considering that air / moisture between the support part 252 of the heat sink 25 and the thermal conductive material 23 can still penetrate through the gap between the baffle structure 24 and the heat sink 25, causing the thermal conductive material 23 to oxidize and expand, resulting in the plate bursting, the filler material 27 must be poured into the space between the support part 252 and the baffle structure 24 to completely seal it.

[0063] Through the aforementioned manufacturing method, this application also discloses an electronic package 2, which includes: a carrier 21; an electronic component 22, disposed on the carrier 21 and electrically connected to the carrier 21; a thermally conductive material 23 disposed on the electronic component 22; a barrier structure 24 erected on the carrier 21 and surrounding the outside of the electronic component 22; an adhesive layer 26 disposed on the carrier 21 and located around the periphery of the barrier structure 24 and having a notch 260; and a heat sink 25. It includes a cover portion 251 and a support portion 252 extending from the cover portion 251. The cover portion 251 is attached to the electronic component 22 via the thermally conductive material 23. The support portion 252 is attached to the carrier member 21 via the adhesive layer 26. An accommodating space S is formed between the support portion 252 and the retaining wall structure 24, and the notch 260 of the adhesive layer 26 communicates with the accommodating space S. A filler 27 is formed in the accommodating space S.

[0064] The electronic component 22 has an active surface 22a and a non-active surface 22b, and the active surface 22a is electrically connected to the carrier 21 via a plurality of conductive bumps 220 by flip-chip method.

[0065] The thermally conductive material 23 is disposed on the non-functional surface 22b of the electronic component 22. It is a thermally conductive interface material (TIM), such as a gallium-containing liquid metal.

[0066] The barrier structure 24 is arranged around the outside of the electronic component 22 to enclose the thermally conductive material 23 (liquid metal).

[0067] The cover portion 251 of the heat sink 25 is attached to the baffle structure 24 and bonded to the non-functional surface 22b of the electronic component 22 via the thermally conductive material 23. The heat sink 25 is erected on the carrier member 21 by the support portion 252 and the adhesive layer 26.

[0068] The filler 27 is injected into the accommodating space S from the notch 260 of the adhesive layer 26, so that the filler 27 fills the accommodating space S. It is a non-conductive compound to prevent external moisture from entering the thermally conductive material 23.

[0069] In summary, the electronic package and its manufacturing method of this application mainly involve providing a thermally conductive material (liquid metal) on the electronic component and providing a baffle structure around the electronic component to prevent the thermally conductive material from overflowing. Simultaneously, the cover portion of the heat sink is placed on the baffle structure and bonded to the electronic component through the thermally conductive material. The heat sink is supported by an adhesive layer and erected on a carrier. A receiving space is formed between the support portion and the baffle structure, and the adhesive layer has a notch to connect to the receiving space. A completely sealed filler material is injected into the receiving space through the notch, preventing air / moisture from penetrating through the gap between the baffle structure and the heat sink and causing oxidation and expansion of the thermally conductive material. Furthermore, the aforementioned structure does not require the development of new processes and materials or the purchase of new equipment. Existing materials, processes, and equipment can solve existing technical problems in the industry, thus avoiding significant additional cost expenditures.

[0070] The above embodiments are used to illustrate the principles and effects of this application, and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.

Claims

1. An electronic package, characterized in that, include: Load-bearing components; Electronic components are mounted on this carrier. A thermally conductive material is disposed on the electronic component; A retaining wall structure is provided on the support member and located outside the electronic component; An adhesive layer is provided on the load-bearing member and located on the periphery of the retaining wall structure, and has a notch; A heat sink includes a cover portion and a support portion extending from the cover portion. The cover portion is attached to the electronic component via the thermally conductive material, and the support portion is attached to the carrier via the adhesive layer. An accommodating space is formed between the support portion and the retaining wall structure, which communicates with the notch of the adhesive layer. as well as The filler material is formed in the accommodating space.

2. The electronic package as described in claim 1, characterized in that, The electronic component has a working surface and a non-working surface. The electronic component is placed on and electrically connected to the carrier on the working surface, and the thermally conductive material is disposed on the non-working surface of the electronic component.

3. The electronic package as described in claim 1, characterized in that, This thermally conductive material is a thermally conductive interface material.

4. The electronic package as described in claim 1, characterized in that, The thermally conductive material is liquid metal.

5. The electronic package as described in claim 1, characterized in that, The retaining wall structure is arranged around the outside of the electronic component to enclose the thermally conductive material.

6. The electronic package as claimed in claim 1, characterized in that, The adhesive layer consists of multiple blocks, and the gap is formed between the multiple blocks.

7. The electronic package as claimed in claim 1, characterized in that, The cover is attached to the retaining wall structure and connected to the electronic component through the thermally conductive material.

8. The electronic package as claimed in claim 1, characterized in that, The filler is a non-conductive compound.

9. The electronic package as claimed in claim 1, characterized in that, The supporting component has multiple functional elements on the outside of the retaining wall structure.

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