A convenient chip vacuum adsorption loading device

CN224638429UActive Publication Date: 2026-08-14NANTONG KINGTECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-07-25
Publication Date
2026-08-14

AI Technical Summary

Technical Problem

[0003]目前,芯片装载多采用真空吸附装置进行抓取和移动,但由于芯片尺寸小、精度要求高,现有装置在对位过程中存在以下问题:仅通过人工目测或简单机械定位,难以保证芯片与装载工位的精准对齐,容易导致芯片损坏或后续工序出错;需要多次手动调整芯片位置,耗时耗力,影响生产效率;且不便根据芯片的大小对吸盘进行拆装更换,降低使用的效果,因此,提出的一种方便对位的芯片真空吸附装载装置以解决上述问题

Benefits of technology

[0014]本实用新型中,所述的一种方便对位的芯片真空吸附装载装置,通过真空吸附机构中的吸盘通过负压吸附待装载的芯片,两个工业相机拍摄芯片图像,并与装载工位的标准图像进行比对,计算出芯片在X轴、Y轴方向的位置偏差以及角度偏差,PLC控制器根据偏差数据,分别控制上电机、下电机与气缸二的运行,进而上电机可带动上滑块的X轴移动调节,下电机可带动下滑块的Y轴移动调节,气缸二带动了齿条的横移,齿条带动了齿轮、旋转轴、吸盘与芯片的旋转调节,以便使得芯片正好与装载工位对位;对位完成后,通过气缸一带动了吸盘的下移把芯片放置在装载工位上,关闭真空发生器释放负压,将芯片放置在装载工位上,完成装载过程;

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224638429U_ABST
    Figure CN224638429U_ABST
Patent Text Reader

Abstract

This utility model belongs to the field of chip manufacturing technology, and in particular, it is a chip vacuum adsorption loading device for convenient alignment. It includes a base, a loading station for chip loading fixedly connected to the top of the base, a gantry fixedly connected to the top of the base, industrial cameras fixedly connected to the inner walls of both sides of the gantry, a PLC controller fixedly connected to one side of the gantry, a cylinder fixedly connected to the top of the gantry, an upper slide rail fixedly connected to the output shaft of the cylinder, and a connecting plate provided at the bottom of the upper slide rail. This utility model has a reasonable structural design. Through a combination of X-axis and Y-axis translation adjustment and rotation angle adjustment, combined with real-time monitoring and feedback from the industrial cameras, it can achieve precise alignment, meet the requirements of high-precision chip loading, and facilitate the disassembly and replacement of the suction cups according to the chip size, improving the versatility of the device.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This utility model relates to the field of chip manufacturing technology, and in particular to a chip vacuum adsorption loading device that facilitates chip alignment. Background Technology

[0002] In the chip manufacturing process, the chip needs to be precisely loaded onto a carrier or processing station for subsequent packaging, testing and other processes.

[0003] Currently, chip loading mostly uses vacuum adsorption devices for gripping and moving. However, due to the small size of chips and the high precision requirements, existing devices have the following problems in the alignment process: relying solely on manual visual inspection or simple mechanical positioning makes it difficult to ensure accurate alignment between the chip and the loading station, which can easily lead to chip damage or errors in subsequent processes; multiple manual adjustments to the chip position are required, which is time-consuming and labor-intensive, affecting production efficiency; and it is inconvenient to disassemble and replace the suction cup according to the size of the chip, reducing its effectiveness. Therefore, a chip vacuum adsorption loading device that facilitates alignment is proposed to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings mentioned above by providing a convenient chip vacuum adsorption loading device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A convenient chip vacuum adsorption loading device includes a base, a loading station for chip loading fixedly connected to the top of the base, a gantry fixedly connected to the top of the base, industrial cameras fixedly connected to the inner walls of both sides of the gantry, a PLC controller fixedly connected to one side of the gantry, a cylinder fixedly connected to the top of the gantry, an upper slide rail fixedly connected to the output shaft of the cylinder, a connecting plate provided at the bottom of the upper slide rail, an adjustment and alignment mechanism provided between the upper slide rail and the connecting plate, a vacuum adsorption mechanism provided at the bottom of the connecting plate, and two guide rods fixedly connected to the top of the upper slide rail, both guide rods being slidably connected to the top of the gantry.

[0007] In a preferred embodiment of this utility model, the adjustment and alignment mechanism includes an upper motor fixedly connected to one side of the upper slide rail, an upper lead screw fixedly connected to the output shaft of the upper motor, an upper slider threaded on the outer side of the upper lead screw, a lower slide rail fixedly connected to the bottom of the upper slider, a lower motor fixedly connected to the front side of the lower slide rail, a lower lead screw fixedly connected to the output shaft of the lower motor, and a lower slider threaded on the outer side of the lower lead screw.

[0008] In a preferred embodiment of this invention, the upper slider is slidably sleeved within the upper slide rail, and the lower slider is slidably sleeved within the lower slide rail.

[0009] In a preferred embodiment of this invention, a second cylinder is fixedly connected to one side of the lower slider, a rack is fixedly connected to the output shaft of the second cylinder, a rotating shaft is rotatably connected to the bottom of the lower slider, a gear is fixedly connected to the top of the rotating shaft, the gear meshes with the rack, and the connecting disc is fixedly connected to the bottom end of the rotating shaft.

[0010] As a preferred embodiment of this utility model, the vacuum adsorption mechanism includes a vacuum generator fixedly connected to the bottom of the connecting plate, a suction pipe fixedly connected to the bottom of the vacuum generator, a suction cup detachably fixedly connected to the bottom end of the suction pipe, a connection port fixedly connected to the top of the suction cup, and a convenient connection sealing component provided between the connection port and the suction pipe.

[0011] As a preferred embodiment of this utility model, the convenient connection sealing assembly includes a lower ring fixedly sleeved on the outside of the connection port and an upper ring fixedly sleeved on the outside of the suction pipe. Four compression blocks are fixedly connected to the bottom of the upper ring. An annular groove is formed on the inner wall of the lower ring. A sealing ring is movably sleeved in the annular groove. An air bladder is fixedly sleeved on the outside of the sealing ring. Four pressure blocks are fixedly connected to the outside of the air bladder. The compression blocks movably abut against the outside of the pressure blocks.

[0012] In a preferred embodiment of this utility model, a convex ring is fixedly sleeved on the outer side of the lower ring, an elastic part is fixedly connected to the bottom of the upper ring, a retaining ring is fixedly connected to the bottom of the elastic part, the retaining ring is movably engaged with the bottom of the convex ring, an external thread is provided on the outer side of the upper ring, a nut is sleeved on the outer thread of the external thread, and the nut is movably abutted against the outer side of the elastic part.

[0013] In a preferred embodiment of this invention, the sealing ring is movably abutted against the connection between the connection port and the air extraction pipe.

[0014] In this invention, a convenient chip vacuum adsorption loading device is described. The chip to be loaded is adsorbed by a suction cup in the vacuum adsorption mechanism using negative pressure. Two industrial cameras capture images of the chip, which are compared with a standard image at the loading station to calculate the chip's positional and angular deviations in the X and Y axes. Based on the deviation data, the PLC controller controls the operation of the upper motor, lower motor, and cylinder two. The upper motor moves the upper slider along the X-axis, and the lower motor moves the lower slider along the Y-axis. Cylinder two moves the rack laterally, which in turn moves the gears, rotating shaft, suction cup, and chip, ensuring the chip is precisely aligned with the loading station. After alignment, cylinder one moves the suction cup downwards to place the chip on the loading station. The vacuum generator is then turned off to release the negative pressure, completing the loading process.

[0015] In this utility model, a convenient chip vacuum adsorption loading device is described. When it is necessary to use the vacuum adsorption of chips of different sizes, the suction cup and the lower ring are pressed upward, so that the extrusion block is inserted into the annular groove to press the pressure block. The four pressure blocks press the air bag inward, so that the air bag expands inward and presses the sealing ring, thus firmly pressing the sealing ring at the connection between the connection port and the air extraction pipe, improving the sealing performance of the connection. At the same time, the elastic part and the retaining ring move outward until the retaining ring is no longer pressed by the convex ring. At this time, under the elasticity of the elastic part, the retaining ring is engaged with the outside of the convex ring, achieving the purpose of engagement and fixation. In order to ensure the firmness of the connection, the nut is unscrewed, so that the nut moves down and abuts against the outside of the elastic part, preventing the elastic part from deforming outward and affecting the firmness of the engagement.

[0016] This utility model has a reasonable structural design. By combining X-axis and Y-axis translation adjustment and rotation angle adjustment, along with real-time monitoring and feedback from an industrial camera, it can achieve precise alignment, meet the requirements of high-precision chip loading, and facilitate the disassembly and replacement of the suction cup according to the size of the chip, thus improving the versatility of the device. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a chip vacuum adsorption loading device for convenient alignment proposed in this utility model.

[0018] Figure 2 A partial cross-sectional view of a chip vacuum adsorption loading device for convenient alignment proposed in this utility model;

[0019] Figure 3 A cross-sectional view of the suction cup and the vacuum tube of a chip vacuum adsorption loading device for convenient alignment proposed in this utility model.

[0020] Figure 4 for Figure 3 A schematic diagram of the structure of part A.

[0021] In the diagram: 1. Base; 2. Loading station; 3. Gantry; 4. PLC controller; 5. Cylinder 1; 6. Guide rod; 7. Industrial camera; 8. Adjustment and alignment mechanism; 9. Vacuum adsorption mechanism; 801. Upper slide rail; 802. Upper slider; 803. Upper motor; 804. Upper lead screw; 805. Lower slide rail; 806. Lower slider; 807. Cylinder 2; 808. Lower motor; 809. Lower lead screw; 810. Gear; 811. Rack; 812. Rotating shaft; 813. Connecting disc; 901. Vacuum generator; 902. Suction cup; 903. Evacuation pipe; 904. Connecting port; 905. Upper ring; 906. Lower ring; 907. Sealing ring; 908. Air bladder; 909. Extrusion block; 910. External thread; 911. Nut; 912. Elastic part; 913. Convex ring; 914. Snap ring; 915. Annular groove; 916. Pressure block. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0023] Reference Figures 1-4 A convenient chip vacuum adsorption loading device includes a base 1, a loading station 2 for chip loading fixedly connected to the top of the base 1, a gantry 3 fixedly connected to the top of the base 1, industrial cameras 7 fixedly connected to the inner walls on both sides of the gantry 3, a PLC controller 4 fixedly connected to one side of the gantry 3, a cylinder 5 fixedly connected to the top of the gantry 3, an upper slide rail 801 fixedly connected to the output shaft of the cylinder 5, a connecting plate 813 provided at the bottom of the upper slide rail 801, an adjustment and alignment mechanism 8 provided between the upper slide rail 801 and the connecting plate 813, a vacuum adsorption mechanism 9 provided at the bottom of the connecting plate 813, and two guide rods 6 fixedly connected to the top of the upper slide rail 801, both guide rods 6 being slidably connected to the top of the gantry 3.

[0024] Furthermore, refer to Figure 1 and Figure 2The adjusting alignment mechanism 8 includes an upper motor 803 fixedly connected to one side of the upper slide rail 801. An upper lead screw 804 is fixedly connected to the output shaft of the upper motor 803. An upper slider 802 is threaded on the outer side of the upper lead screw 804. A lower slide rail 805 is fixedly connected to the bottom of the upper slider 802. A lower motor 808 is fixedly connected to the front side of the lower slide rail 805. A lower lead screw 809 is fixedly connected to the output shaft of the lower motor 808. A lower slider 806 is threaded on the outer side of the lower lead screw 809. A cylinder 807 is fixedly connected to one side of the lower slider 806. A rack 811 is fixedly connected to the output shaft of the cylinder 807. A rotating shaft 812 is rotatably connected to the bottom of the lower slider 806. A gear 810 is fixedly connected to the top of the rotating shaft 812. The gear 810 meshes with the rack 811. A connecting disc 813 is fixedly connected to the bottom end of the rotating shaft 812.

[0025] The above scheme is adopted as follows: the suction cup 902 in the vacuum adsorption mechanism adsorbs the chip to be loaded through negative pressure. Two industrial cameras 7 capture images of the chip and compare them with the standard images of the loading station 2 to calculate the positional and angular deviations of the chip in the X and Y axes. Based on the deviation data, the PLC controller 4 controls the operation of the upper motor 803, the lower motor 808, and the cylinder 807. The upper motor 803 drives the upper slider 802 to move and adjust along the X axis, and the lower motor 808 drives the lower slider 806 to move and adjust along the Y axis. The cylinder 807 drives the rack 811 to move laterally. The rack 811 drives the gear 810, the rotating shaft 812, the suction cup 902, and the chip to rotate and adjust, so that the chip is aligned with the loading station. After alignment, the cylinder 5 drives the suction cup 902 to move downward to place the chip on the loading station 2. The vacuum generator 901 is turned off to release the negative pressure and place the chip on the loading station, completing the loading process.

[0026] Furthermore, the upper slider 802 is slidably sleeved within the upper slide rail 801, and the lower slider 806 is slidably sleeved within the lower slide rail 805, which facilitates the guidance of the upper and lower sliders and makes their movement more stable.

[0027] Furthermore, the vacuum adsorption mechanism 9 includes a vacuum generator 901 fixedly connected to the bottom of the connecting plate 813. The bottom of the vacuum generator 901 is fixedly connected to an air extraction pipe 903. The bottom end of the air extraction pipe 903 is detachably fixedly connected to a suction cup 902. The top of the suction cup 902 is fixedly connected to a connection port 904. A convenient connection sealing component is provided between the connection port 904 and the air extraction pipe 903. Through the vacuum generator 901, the air in the suction cup 902 can be extracted to form a negative pressure. Under the negative pressure, the chip can be adsorbed and fixed.

[0028] Furthermore, refer to Figures 1-4The convenient connection sealing assembly includes a lower ring 906 fixedly sleeved on the outside of the connection port 904 and an upper ring 905 fixedly sleeved on the outside of the suction pipe 903. Four compression blocks 909 are fixedly connected to the bottom of the upper ring 905. An annular groove 915 is formed on the inner wall of the lower ring 906. A sealing ring 907 is movably sleeved in the annular groove 915. An air bladder 908 is fixedly sleeved on the outside of the sealing ring 907. Four pressure blocks 916 are fixedly connected to the outside of the air bladder 908. The compression blocks 909 movably abut against the pressure blocks 916. On the outside, the sealing ring 907 is movably abutted against the connection between the connection port 904 and the suction pipe 903. The outer side of the lower ring 906 is fixedly fitted with a protruding ring 913. The bottom of the upper ring 905 is fixedly connected with an elastic part 912. The bottom of the elastic part 912 is fixedly connected with a retaining ring 914. The retaining ring 914 is movably engaged with the bottom of the protruding ring 913. The outer side of the upper ring 905 is provided with an external thread 910. The outer thread of the external thread 910 is fitted with a nut 911. The nut 911 is movably abutted against the outer side of the elastic part 912.

[0029] Using the above scheme: When vacuum adsorption is required for chips of different sizes, the suction cup 902 and the lower ring 906 are pressed upwards, causing the pressing block 909 to be inserted into the annular groove 915 to press the pressure block 916. The four pressure blocks 916 press the airbag 908 inwards, causing the airbag 908 to expand inwards and press the sealing ring 907. This firmly presses the sealing ring 907 onto the connection between the connection port 904 and the suction pipe 903, improving the sealing performance of the connection. At the same time, the elastic part 912 and the retaining ring 914 move outwards until the retaining ring 914 is no longer pressed by the convex ring 913. At this time, under the elasticity of the elastic part 912, the retaining ring 914 is engaged with the outside of the convex ring 913, achieving the purpose of engagement and fixation. To ensure the firmness of the connection, the nut 911 is unscrewed, causing the nut 911 to move downwards and abut against the outside of the elastic part 912, preventing the elastic part 912 from deforming outwards and affecting the firmness of the engagement.

[0030] In this invention, during use, the suction cup 902 in the vacuum adsorption mechanism adsorbs the chip to be loaded through negative pressure. Two industrial cameras 7 capture images of the chip and compare them with the standard images at the loading station 2 to calculate the positional and angular deviations of the chip in the X and Y axes.

[0031] Based on the deviation data, the PLC controller 4 controls the operation of the upper motor 803, the lower motor 808, and the second cylinder 807. The upper motor 803 drives the upper slider 802 to move along the X-axis, and the lower motor 808 drives the lower slider 806 to move along the Y-axis. The second cylinder 807 drives the rack 811 to move laterally, and the rack 811 drives the gear 810, the rotating shaft 812, the suction cup 902, and the chip to rotate, so that the chip is aligned with the loading station. After alignment, the first cylinder 5 drives the suction cup 902 to move down and place the chip on the loading station 2. The vacuum generator 901 is turned off to release the negative pressure and place the chip on the loading station, completing the loading process.

[0032] When vacuum adsorption is required for chips of different sizes, the suction cup 902 and the lower ring 906 are pressed upwards, causing the pressing block 909 to insert into the annular groove 915 and press the pressure block 916. The four pressure blocks 916 press the airbag 908 inwards, causing the airbag 908 to expand inwards and press the sealing ring 907. This firmly presses the sealing ring 907 onto the connection between the connection port 904 and the suction pipe 903, improving the sealing performance of the connection. At the same time, the elastic part 912 and the retaining ring 914 move outwards until the retaining ring 914 is no longer pressed by the convex ring 913. At this point, under the elasticity of the elastic part 912, the retaining ring 914 is engaged with the outside of the convex ring 913, achieving the purpose of engagement and fixation. To ensure the firmness of the connection, the nut 911 is unscrewed, causing the nut 911 to move downwards and abut against the outside of the elastic part 912, preventing the elastic part 912 from deforming outwards and affecting the firmness of the engagement.

Claims

1. A chip vacuum suction loading device that facilitates alignment, characterized by, The system includes a base (1), a loading station (2) for loading chips is fixedly connected to the top of the base (1), a gantry frame (3) is fixedly connected to the top of the base (1), industrial cameras (7) are fixedly connected to the inner walls on both sides of the gantry frame (3), a PLC controller (4) is fixedly connected to one side of the gantry frame (3), a cylinder (5) is fixedly connected to the top of the gantry frame (3), an upper slide rail (801) is fixedly connected to the output shaft of the cylinder (5), a connecting plate (813) is provided at the bottom of the upper slide rail (801), an adjustment and alignment mechanism (8) is provided between the upper slide rail (801) and the connecting plate (813), a vacuum adsorption mechanism (9) is provided at the bottom of the connecting plate (813), and two guide rods (6) are fixedly connected to the top of the upper slide rail (801), both guide rods (6) are slidably connected to the top of the gantry frame (3).

2. The vacuum chucking and loading device for chips according to claim 1, wherein The adjustment and alignment mechanism (8) includes an upper motor (803) fixedly connected to one side of the upper slide rail (801), an upper lead screw (804) fixedly connected to the output shaft of the upper motor (803), an upper slider (802) threaded on the outer side of the upper lead screw (804), a lower slide rail (805) fixedly connected to the bottom of the upper slider (802), a lower motor (808) fixedly connected to the front side of the lower slide rail (805), a lower lead screw (809) fixedly connected to the output shaft of the lower motor (808), and a lower slider (806) threaded on the outer side of the lower lead screw (809).

3. The vacuum chucking and loading device for chips according to claim 2, wherein The upper slider (802) is slidably sleeved in the upper slide rail (801), and the lower slider (806) is slidably sleeved in the lower slide rail (805).

4. The vacuum chucking and loading device for chips according to claim 2, wherein A cylinder (807) is fixedly connected to one side of the lower slider (806). A rack (811) is fixedly connected to the output shaft of the cylinder (807). A rotating shaft (812) is rotatably connected to the bottom of the lower slider (806). A gear (810) is fixedly connected to the top of the rotating shaft (812). The gear (810) meshes with the rack (811). The connecting disc (813) is fixedly connected to the bottom end of the rotating shaft (812).

5. The vacuum chucking and loading device for chips according to claim 1, wherein The vacuum adsorption mechanism (9) includes a vacuum generator (901) fixedly connected to the bottom of the connecting plate (813). The bottom of the vacuum generator (901) is fixedly connected to a suction pipe (903). The bottom end of the suction pipe (903) is detachably fixedly connected to a suction cup (902). The top of the suction cup (902) is fixedly connected to a connection port (904). A convenient connection sealing assembly is provided between the connection port (904) and the suction pipe (903).

6. The vacuum chuck loading device for chip with easy alignment according to claim 5, wherein, The convenient connection sealing assembly includes a lower ring (906) fixedly sleeved on the outside of the connection port (904) and an upper ring (905) fixedly sleeved on the outside of the suction pipe (903). The bottom of the upper ring (905) is fixedly connected to four compression blocks (909). An annular groove (915) is provided on the inner wall of the lower ring (906). A sealing ring (907) is movably sleeved in the annular groove (915). An air bag (908) is fixedly sleeved on the outside of the sealing ring (907). Four pressure blocks (916) are fixedly connected on the outside of the air bag (908). The compression blocks (909) movably abut against the outside of the pressure blocks (916).

7. The vacuum chucking and loading device for chips according to claim 6, wherein The lower ring (906) is fixedly fitted with a protruding ring (913) on its outer side. The bottom of the upper ring (905) is fixedly connected with an elastic part (912). The bottom of the elastic part (912) is fixedly connected with a retaining ring (914). The retaining ring (914) is movably engaged with the bottom of the protruding ring (913). The outer side of the upper ring (905) is provided with an external thread (910). The outer thread of the external thread (910) is fitted with a nut (911). The nut (911) is movably abutted against the outer side of the elastic part (912).

8. A convenient chip vacuum adsorption loading device according to claim 5, characterized in that, The sealing ring (907) is movably abutted against the connection between the connection port (904) and the air extraction pipe (903).