Wafer fixing table

Abstract

The application discloses a wafer fixing table, which adopts a vacuum adsorption mode, and a wafer is placed and fixed through vacuum adsorption and a clamp, and the wafer is released by breaking the vacuum and loosening the clamp, so that a long process such as heating, solidification, cooling or waxing is not needed, operation is simple, processing preparation time is shortened, and through physical vacuum adsorption, any organic matter or chemical medium is not introduced, wax residue and cross contamination risk are eliminated, and high cleanliness of the wafer in key processes such as grinding, polishing or ion implantation is ensured. In addition, at least two adsorption cavities are arranged, the start and stop of each adsorption cavity can be controlled, different diameter wafers can be flexibly adapted, one platform can be compatible with multiple size wafers, a carrier or a base does not need to be replaced, equipment cost and maintenance complexity are reduced, and equipment utilization is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing technology, and in particular to a wafer fixing stage. Background Technology

[0002] In the field of semiconductor material processing, silicon carbide (SiC) wafers are widely used in the manufacture of power devices due to their high hardness, high thermal conductivity, and excellent electrical properties. However, in the front-end processing such as wafer grinding, polishing, or ion implantation, how to efficiently and stably fix the wafer has become a key process step.

[0003] Currently, 8-inch silicon carbide wafers are often fixed after orientation using a "wax adhesion + electromagnetic chuck" method. The specific process involves: adhering the wafer to a metal carrier using high-temperature molten wax, allowing it to cool and solidify, and then placing it on an electromagnetic chuck for processing; after processing, the wax needs to be melted by heating to remove the wafer. This method has the following drawbacks: Long process cycle: The wax bonding, cooling and wax removal process of each wafer takes about 2 hours, which seriously restricts the processing cycle and becomes a bottleneck for production line efficiency. High risk of contamination: Wax residue can easily remain on wafer edges or in equipment cavities, causing cross-contamination and affecting the yield of subsequent processes; Not suitable for scenarios with frequent wafer changes: In R&D or small-batch, multi-variety production, frequent wax application / dewaxing leads to low equipment utilization. Utility Model Content

[0004] The purpose of this application is to provide a wafer stage that eliminates the need for lengthy processes such as heating, curing, cooling, or wax removal. It is simple to operate, shortens the processing preparation time, and, through physical vacuum adsorption, does not introduce any organic matter or chemical media, thus eliminating the risk of wax residue and cross-contamination. Furthermore, it enables a single platform to be compatible with multiple wafer sizes without the need to replace carrier trays or bases, reducing equipment costs and maintenance complexity, and improving equipment utilization.

[0005] The embodiments of this application can be implemented as follows: In a first aspect, this utility model provides a wafer fixing stage, comprising: An adsorption stage has multiple adsorption holes and at least two adsorption chambers, each of the adsorption chambers being connected to a portion of the adsorption holes, wherein any one of the adsorption chambers can generate a negative pressure to adsorb the wafer through the adsorption holes; A clamp is provided on the adsorption stage for holding the wafer.

[0006] In an optional embodiment, two adjacent adsorption cavities may be connected or blocked.

[0007] In an optional embodiment, the adsorption stage is provided with a valve located between two adjacent adsorption chambers, the valve being opened or closed to connect or block the two adjacent adsorption chambers.

[0008] In an optional embodiment, the adsorption stage is provided with a backflush connector for connecting to a compressed gas source. The backflush connector is in communication with the adsorption chamber and is used to introduce compressed gas into the adsorption chamber.

[0009] In an optional embodiment, the backflush connector integrates a first manual valve, which is used to control the opening or closing of the backflush connector.

[0010] In an optional embodiment, the clamp includes a first clamping block and a second clamping block spaced apart along the arrangement direction of each of the adsorption cavities, and the distance between the first clamping block and the second clamping block can be adjusted.

[0011] In an optional embodiment, the first clamp is fixed to the adsorption stage, and the second clamp can be selectively installed at different positions on the adsorption stage.

[0012] In an optional embodiment, the adsorption stage is provided with a vacuum connector for connecting a vacuum pump, the vacuum connector being in communication with the adsorption chamber.

[0013] In an optional embodiment, the vacuum connector integrates a second manual valve for controlling the opening or closing of the vacuum connector.

[0014] In an optional embodiment, the adsorption stage is equipped with a negative pressure gauge, which is used to detect the pressure in the adsorption chamber.

[0015] The beneficial effects of the embodiments of this application include, for example: Employing vacuum adsorption, wafers are placed and secured by vacuum adsorption and clamps. Releasing the vacuum and releasing the clamps releases the wafer, eliminating lengthy processes like heating, curing, cooling, or wax removal. This simplifies operation, shortens preparation time, and, through physical vacuum adsorption, avoids the introduction of any organic or chemical media, eliminating wax residue and cross-contamination risks. This ensures high cleanliness of the wafer during critical processes like grinding, polishing, and ion implantation, contributing to improved reliability and consistency of the final device. Furthermore, by using at least two adsorption chambers, the system can flexibly adapt to wafers of different diameters by controlling the activation and deactivation of each chamber. For example, when processing small wafers (e.g., 6-inch), only one chamber is vacuumed to prevent edge leakage and insufficient adsorption force; when processing large wafers (e.g., 8-inch), two or more chambers are vacuumed simultaneously to create a continuous adsorption surface. This allows for a single platform compatible with multiple wafer sizes, eliminating the need to change carriers or bases, reducing equipment costs and maintenance complexity, and improving equipment utilization. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of a wafer fixing platform according to an embodiment of this application; Figure 2 for Figure 1 Schematic diagram of the adsorption stage; Figure 3 for Figure 2 AA sectional view.

[0018] Icons: 100-Adsorption stage; 110-Adsorption hole; 120-Adsorption chamber; 121-First adsorption chamber; 122-Second adsorption chamber; 130-Valve; 140-Mounting hole; 200-Clamp; 210-First clamping block; 220-Second clamping block; 300-First switch; 310-Second switch; 320-Backflush connector; 321-First manual valve; 330-Vacuum connector; 331-Second manual valve; 340-Negative pressure gauge. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0020] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0021] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0022] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this application is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0023] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0024] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0025] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0026] refer to Figures 1 to 3 This application discloses a wafer fixing stage, which includes: The adsorption stage 100 has a plurality of adsorption holes 110 and at least two adsorption cavities 120, each adsorption cavity 120 being connected to a portion of the adsorption holes 110, wherein any adsorption cavity 120 can generate a negative pressure to adsorb the wafers in the adsorption holes 110. The clamp 200 is mounted on the adsorption stage 100 and is used to hold the wafer.

[0027] This vacuum adsorption method simplifies wafer placement by using vacuum adsorption and clamps 200 for fixation. Releasing the clamps 200 releases the wafer, eliminating lengthy processes like heating, curing, cooling, or wax removal. This simplifies operation, shortens preparation time, and avoids the introduction of organic or chemical media through physical vacuum adsorption, thus eliminating wax residue and cross-contamination risks. This ensures high cleanliness of the wafer during critical processes like grinding, polishing, and ion implantation, contributing to improved reliability and consistency of the final device. Furthermore, by using at least two adsorption chambers 120, the operation of each chamber can be controlled to flexibly adapt to wafers of different diameters. For example, when processing small wafers (e.g., 6-inch), only one adsorption chamber 120 is vacuumed to prevent edge leakage and insufficient adsorption force; when processing large wafers (e.g., 8-inch), two or more adsorption chambers 120 are vacuumed simultaneously to form a continuous adsorption surface. This allows for a single platform compatible with multiple wafer sizes, eliminating the need to change carriers or bases, reducing equipment costs and maintenance complexity, and improving equipment utilization.

[0028] The adsorption stage 100 can be made of materials such as aluminum alloy or stainless steel, possessing characteristics such as high rigidity, corrosion resistance, good thermal stability, and high surface flatness, while also ensuring vacuum sealing and processability. The surfaces on the adsorption stage 100 that come into contact with the wafer can be subjected to ultra-precision grinding or polishing to ensure good adhesion to the back of the wafer and prevent air leakage.

[0029] The adsorption stage 100 has multiple adsorption holes 110 arranged in a rectangular array across the entire stage surface, meaning the adsorption holes 110 are arranged at equal intervals in both the horizontal and vertical directions, forming a regular grid-like distribution. This regular grid-like distribution ensures that the negative pressure is evenly distributed across the entire stage surface, avoiding fluctuations in adsorption force caused by disordered hole placement, ensuring that the wafer remains flat during high-force processing such as grinding and polishing, and suppressing warping or vibration.

[0030] Optionally, two adjacent adsorption chambers 120 can be connected or blocked. In this way, by controlling the connection or blocking state of adjacent adsorption chambers 120, the effective adsorption area can be flexibly adjusted. For example, when processing large-size wafers, the two chambers can be connected to form a continuous large-area negative pressure area to ensure uniform adsorption of the entire wafer. When processing small-size wafers, the two chambers can be blocked to activate only the adsorption chamber 120 covering the wafer area, avoiding vacuum failure caused by edge exposure. In this way, there is no need to replace the carrier or base, and one platform can be compatible with multiple wafer sizes, reducing equipment investment and changeover costs.

[0031] In detail, the adsorption stage 100 is equipped with a valve 130 located between two adjacent adsorption chambers 120. The valve 130 is opened or closed to connect or block the two adjacent adsorption chambers 120. In this way, the opening or closing of the valve 130 is used to control the connection or blockage between the two chambers, realizing dynamic, controllable, and on-demand configuration of the vacuum adsorption area. This structural design not only solves the inherent defects of traditional wafer fixing stages in terms of multi-size compatibility, but also improves adsorption stability, energy efficiency ratio, and the level of intelligent operation.

[0032] In some embodiments, in order to facilitate the user's quick operation of the conduction or blocking state between adjacent adsorption chambers 120, a first switch 300 is also provided on the adsorption stage 100. The first switch 300 is electrically connected or mechanically linked to the valve 130 located between adjacent adsorption chambers 120, and is used to directly control the opening or closing of the valve 130.

[0033] This integrates the control function into the adsorption table 100 body, allowing operators to switch between conduction and blocking by manually toggling or pressing the first switch 300 while standing next to the equipment, without needing to start software or enter a menu.

[0034] The first switch 300 is located on the outer side of the adsorption platform 100, in a conspicuous and easily accessible position.

[0035] The first switch 300 can be a physical operation switch such as a toggle switch, push button switch or rotary switch, while the valve 130 is a solenoid valve that performs opening and closing actions after receiving the control signal from the first switch 300. The first switch 300 leads out a control line through a waterproof and dustproof connector and connects to the valve 130 drive module to ensure stable operation in a vacuum or clean environment.

[0036] The first switch 300 can be designed to switch between manual and automatic modes. In manual mode, the operator can directly control the valve 130 through the first switch 300. In automatic mode, the control is handed over to the host computer for remote scheduling.

[0037] It is understood that, in some embodiments, the connection or blockage between two adjacent adsorption chambers 120 is not limited to being controlled by a solenoid valve or an electric valve; it can also be achieved using various other mechanical, pneumatic, or material-driven methods to meet the needs of different application scenarios regarding cost, response speed, cleanliness, or driving method. For example: 1. Manual stopcock valve or needle valve: A manually operated stopcock valve or needle valve is installed on the connecting channel between the two adsorption chambers 120. The channel is opened or closed by rotating the handle or screw. This method has a simple structure, low cost, and good sealing performance. Users can manually adjust the on / off state according to the wafer size.

[0038] 2. Mechanical slide valve or rotary switching mechanism: An internal guide (such as a slider or turntable) that can slide or rotate is provided. Driven by an external lever or motor, the flow path is changed, thereby realizing the connection or isolation of the two adsorption chambers 120.

[0039] It should be noted that after the vacuum is broken, the adsorption chamber 120 may have residual negative pressure due to good sealing or excessively tight surface adhesion, which may prevent the wafer from falling off naturally. Operators often need to use plastic spatulas or tweezers to forcibly pry up the wafer, which can easily cause edge chipping, surface scratches or even the entire wafer to break.

[0040] Therefore, in this embodiment, the adsorption stage 100 is provided with a backflush connector 320 for connecting to a compressed gas source. The backflush connector 320 is connected to the adsorption chamber 120 and is used to introduce compressed gas into the adsorption chamber 120.

[0041] By introducing compressed gas through the backflush connector 320, positive pressure is actively injected into the adsorption chamber 120, quickly balancing the pressure difference and forcing the wafer to detach from the mesa, ensuring reliable and thorough wafer removal each time. This pneumatic backflush method can achieve non-contact desorption, completely avoiding mechanical intervention and protecting the wafer integrity.

[0042] In some embodiments, in order to facilitate the user's rapid response and local control of the compressed gas backflush operation, a second switch 310 is also provided on the outer surface of the adsorption stage 100. The second switch 310 is used to control the on / off of the compressed gas source to the backflush connector 320, so as to realize one-button start and stop of the backflush gas.

[0043] After processing is completed, the operator only needs to press a button to immediately trigger the backflush action, and the compressed gas instantly enters the adsorption chamber 120, realizing rapid release of the wafer and shortening the desorption preparation time.

[0044] In the illustrated embodiment, for example, the adsorption stage 100 has two adsorption chambers 120, which are a first adsorption chamber 121 and a second adsorption chamber 122, respectively.

[0045] The second switch 310 is located on the outer side of the adsorption table 100, in a conspicuous and easily accessible position.

[0046] The second switch 310 can be a physical operation switch such as a toggle switch, push button switch, or rotary switch; the second switch 310 leads out a control line through a waterproof and dustproof connector and connects to the compressed air on / off drive module to ensure stable operation.

[0047] The second switch 310 can be designed as a manual / automatic dual-mode switch. In manual mode, the operator can directly control the supply of compressed air through the second switch 310. In automatic mode, the control is handed over to the host computer for remote scheduling.

[0048] The backflush connector 320 integrates a first manual valve 321 (e.g., a plug valve, needle valve, or ball valve), which controls the opening or closing of the backflush connector 320. In the event of a false triggering of the automation system or abnormal gas pressure, the first manual valve 321 acts as a physical isolation measure, preventing compressed gas from accidentally entering the adsorption chamber 120 and causing wafer ejection or equipment impact. Operators can independently determine the appropriate timing and manually open the valve 130 only after confirming safety, ensuring the backflush action is performed under controlled conditions. Furthermore, even if the second switch 310 malfunctions, operators can still directly operate the gas path through the first manual valve 321 to maintain basic backflush functionality, preventing wafers from remaining trapped for extended periods due to inability to desorb, and ensuring production continuity.

[0049] The adsorption stage 100 is equipped with a vacuum connector 330 for connecting a vacuum pump, and the vacuum connector 330 is connected to the adsorption chamber 120. The vacuum connector 330 serves as a standard interface between the adsorption stage 100 and the vacuum pump, ensuring that negative pressure can be stably introduced into the adsorption chamber 120 and guaranteeing the normal operation of the vacuum adsorption function.

[0050] Vacuum connector 330 integrates a second manual valve 331 (e.g., a vacuum-specific shut-off valve or needle valve). The second manual valve 331 controls the opening or closing of the vacuum connector 330. In the event of a false triggering of the automation system or incorrect wafer placement, the second manual valve 331 acts as a physical isolation measure, preventing accidental vacuum activation that could force wafer adsorption or displacement. Operators can independently determine the timing and manually open valve 130 after confirming wafer alignment, ensuring the adsorption process is performed under control and preventing equipment damage or product scrap. Furthermore, if the host computer malfunctions in operating the suction cylinder, operators can still independently control the vacuum flow via the second manual valve 331 to perform basic adsorption and desorption operations, preventing prolonged equipment downtime due to control system failure and ensuring production continuity.

[0051] The adsorption stage 100 is equipped with a negative pressure gauge 340, which is used to detect the pressure in the adsorption chamber 120. This allows operators to directly confirm whether an effective negative pressure has been established in the adsorption chamber 120 by checking the pointer or reading of the negative pressure gauge 340 without relying on a software interface or indirect judgment. This quickly verifies whether the wafer is firmly fixed and avoids wafer displacement or damage caused by starting processing before the vacuum is in place.

[0052] Among them, the negative pressure gauge 340 is a mechanical vacuum gauge or a digital pressure sensor, which is fixedly installed on the outer side or top edge of the adsorption table 100. The position is conspicuous and easy for operators to read directly.

[0053] In this embodiment, the vacuum connector 330, backflush connector 320, negative pressure gauge 340, first switch 300, and second switch 310 are all located on the same side of the adsorption stage 100. This allows operators to change wafers or debug equipment without having to navigate around the equipment or search for interfaces on multiple sides; they only need to face a single operating surface of the adsorption stage 100 to complete the following: check the negative pressure status (negative pressure gauge 340); switch the adsorption mode (first switch 300); control the vacuum on / off (vacuum connector 330 and second manual valve 331); and perform backflush desorption (second switch 310 and backflush connector 320). This simplifies operation and improves efficiency.

[0054] It is understood that, since adjacent adsorption chambers 120 can be connected or blocked in this embodiment, based on this design, when adjacent adsorption chambers 120 are in a conductive state, their internal gas pressure tends to be consistent, forming a continuous negative or positive pressure region. Therefore, it is not necessary to set independent vacuum connectors 330 and backflush connectors 320 on each adsorption chamber 120, but only one vacuum connector 330 and one backflush connector 320 need to be set on the same side of the adsorption stage 100, corresponding to the position of one of the adsorption chambers 120.

[0055] For example, the two adsorption chambers 120 are the first adsorption chamber 121 and the second adsorption chamber 122, respectively. The vacuum connector 330 and the backflush connector 320 are both connected to the first adsorption chamber 121. In this way, when the valve 130 between the first adsorption chamber 121 and the second adsorption chamber 122 is opened, the vacuum pump can simultaneously evacuate the two adsorption chambers 120 through the single vacuum connector 330, thereby achieving large-size wafer fixation. Similarly, when compressed gas is introduced into the backflush connector 320, the gas can enter the two adsorption chambers 120 through the conductive channel, achieving overall backflush desorption. When the valve 130 is closed, the vacuum connector 330 and the backflush connector 320 only function for the connected first adsorption chamber 121, while the second adsorption chamber 122 remains isolated, achieving zoned control and fixing small-size wafers.

[0056] The negative pressure gauge 340 is connected to the second adsorption chamber 122 for real-time monitoring of its internal pressure. Although the vacuum and backflushing functions are introduced through the first adsorption chamber 121, the negative pressure gauge 340 is directly connected to the second adsorption chamber 122, allowing for real-time reflection of the actual pressure state of the second adsorption chamber 122. Even in long pipelines or with minor leaks, it can accurately determine whether the second chamber has reached the effective adsorption pressure.

[0057] Of course, in some embodiments, adjacent adsorption chambers 120 may be physically isolated and not interconnected, meaning the two adsorption chambers 120 are completely independent in the gas path and have no internal channel connection. Based on this, each adsorption chamber 120 is provided with an independent vacuum connector 330 and a backflush connector 320. For example, the first adsorption chamber 121 is provided with a first vacuum connector 330 and a first backflush connector 320; the second adsorption chamber 122 is provided with a second vacuum connector 330 and a second backflush connector 320. The first vacuum connector 330 is used to connect to a first vacuum pump or an independent vacuum pipeline; the second vacuum connector 330 is used to connect to a second vacuum pump or another independent vacuum branch; the first backflush connector 320 and the second backflush connector 320 are respectively connected to independent branches or a shared main line of the compressed gas source, controlled separately by solenoid valves.

[0058] The fixture 200 includes a first clamping block 210 and a second clamping block 220 spaced apart along the arrangement direction of each adsorption cavity 120. The distance between the first clamping block 210 and the second clamping block 220 can be adjusted so that the conduction or blocking state between the two adsorption cavities 120 can be adapted to the wafer size. This allows the same fixture 200 to stably clamp wafers of different diameters such as 6 inches and 8 inches without the need for additional configuration of multiple sets of dedicated fixtures 200, thus reducing equipment costs and warehouse management burden.

[0059] The first clamping block 210 is fixed to the adsorption stage 100, and the second clamping block 220 can be selectively installed at different positions on the adsorption stage 100 to adjust the distance between it and the first clamping block 210, thereby adapting to wafers of different diameters. This requires only one movable component (the second clamping block 220), eliminating the need for complex transmission components such as lead screws, guide rails, and motors. The structure is simple, with few parts and low cost, making it suitable for mass production and high reliability requirements.

[0060] Optionally, the adsorption stage 100 has adsorption holes 110 on one side, and mounting holes 140 are spaced apart along the arrangement direction of the adsorption chamber 120. The second clamping block 220 has a connection structure (such as a threaded hole, pin or quick-release buckle) that matches the mounting holes 140, and is fixed to any preset position by screws, pins or elastic locking mechanisms. The first clamping block 210 and the second clamping block 220 may have a flexible contact layer (such as polyurethane, POM or ceramic coating) on ​​the side close to each other to prevent scratching the wafer edge.

[0061] In addition, in some embodiments, the distance between the first clamping block 210 and the second clamping block 220 can also be adjusted by external components, such as a lead screw and nut pair: the lead screw is driven by a manual knob or a stepper motor, which drives one of the clamping blocks to slide along the guide rail; a gear and rack mechanism: the central gear links the racks on both sides to achieve synchronous and symmetrical adjustment; a linear module: the clamping blocks are moved by an electric slide or a cylinder, which supports automatic control.

[0062] Finally, it should be noted that in this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0063] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A wafer fixing stage, characterized in that, include: The adsorption stage (100) has a plurality of adsorption holes (110) and at least two adsorption chambers (120), each of the adsorption chambers (120) being connected to a portion of the adsorption holes (110), wherein any of the adsorption chambers (120) can generate a negative pressure to adsorb the wafers in the adsorption holes (110); A clamp (200) is disposed on the adsorption stage (100) for holding the wafer.

2. The wafer fixing stage according to claim 1, characterized in that, The two adjacent adsorption cavities (120) can be connected or blocked.

3. The wafer fixing stage according to claim 2, characterized in that, The adsorption stage (100) is provided with a valve (130) located between two adjacent adsorption chambers (120). The valve (130) is opened or closed to connect or block the two adjacent adsorption chambers (120).

4. The wafer fixing stage according to claim 1, characterized in that, The adsorption platform (100) is provided with a backflush connector (320) for connecting a compressed gas source. The backflush connector (320) is connected to the adsorption chamber (120) and is used to introduce compressed gas into the adsorption chamber (120).

5. The wafer fixing stage according to claim 4, characterized in that, The backflush connector (320) integrates a first manual valve (321), which is used to control the opening or closing of the backflush connector (320).

6. The wafer fixing stage according to claim 1, characterized in that, The clamp (200) includes a first clamping block (210) and a second clamping block (220) spaced apart along the arrangement direction of each of the adsorption cavities (120), and the distance between the first clamping block (210) and the second clamping block (220) is adjustable.

7. The wafer fixing stage according to claim 6, characterized in that, The first clamp (210) is fixed to the adsorption stage (100), and the second clamp (220) can be selectively installed at different positions on the adsorption stage (100).

8. The wafer fixing stage according to claim 1, characterized in that, The adsorption stage (100) is provided with a vacuum connector (330) for connecting a vacuum pump, and the vacuum connector (330) is connected to the adsorption chamber (120).

9. The wafer fixing stage according to claim 8, characterized in that, The vacuum connector (330) integrates a second manual valve (331), which is used to control the opening or closing of the vacuum connector (330).

10. The wafer fixing stage according to claim 1, characterized in that, The adsorption stage (100) is equipped with a negative pressure gauge (340), which is used to detect the pressure of the adsorption chamber (120).

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