A liquid cooling heat dissipation device for dual graphics cards

Abstract

The utility model belongs to but is not limited to computer heat dissipation technical field, disclose a kind of liquid cooling heat sink of double graphics card, including water route board and two graphics cards, water route board main part is made by cover and bottom plate cover, inside is equipped with four water cooling tank, wherein second, third water cooling tank is connected with two graphics cards respectively by pipeline, first water cooling tank connects air cooling component, fourth water cooling tank connects other heating component, water pump is connected in the water pump groove of cover and is communicated with first water cooling tank.The device realizes the pertinence heat dissipation of double graphics card, improves heat dissipation efficiency in combination with air cooling component, and the structure is reliable, good adaptability, guarantees the stable operation of double graphics card.

Description

Technical Field

[0001] This utility model belongs to, but is not limited to, the field of computer heat dissipation technology, and particularly relates to a liquid cooling heat dissipation device for dual graphics cards. Background Technology

[0002] In computer systems, dual-graphics card configurations are widely used in high-performance computing, gaming, and other scenarios due to their powerful graphics processing capabilities. However, dual graphics cards generate a lot of heat when working, and because they are located close to each other, the heat can easily accumulate, leading to a significant increase in the heat dissipation burden.

[0003] In existing technologies, some water cooling boards are not specifically designed for the cooling of dual graphics cards. They often use a single water circuit or a general water circuit design, which makes it difficult to meet the high-efficiency cooling requirements of two graphics cards at the same time. Moreover, most cooling devices rely solely on water cooling systems and do not effectively combine air cooling components. When dual graphics cards are running at high power, the cooling effect of the water coolant is limited, which can easily cause the graphics card temperature to be too high, affecting its operating performance and lifespan.

[0004] Therefore, there is an urgent need to design a liquid cooling device specifically for dual graphics cards, combining water cooling boards and air cooling components to improve the heat dissipation efficiency of dual graphics cards.

[0005] The currently publicly available plate-type liquid-cooled graphics card cooler (CN106774740A) directly attaches the liquid cooling plate to a single GPU, forming a closed loop through a circulating water pump, radiator, and tubing. This aims to reduce weight and save case space, but the overall design is still geared towards a single heat source. CN202841822U further integrates the water pump and heat exchanger into a single module to simplify tubing, but it is also limited to a single water path and cannot meet the parallel cooling needs of multiple GPUs or CPUs. A similar method can also be seen in US10893631B2, which only installs the pump and water block side by side on the back of the graphics card to form a single-channel liquid path.

[0006] In high-power scenarios with dual graphics cards, the above solution exposes two core problems: First, the liquid circuit series single heat source structure leads to rapid accumulation of flow resistance. If extended to dual GPU + CPU, the pump pressure is insufficient, the circulation flow drops sharply, and the return water temperature rises significantly, making it difficult to meet the 500W level heat dissipation requirements. Second, the separate arrangement of the pump and radiator requires multiple sections of flexible tubing to cross the motherboard and graphics card power supply area. The installation path is complex and the bending radius is limited, increasing the risk of leakage and limiting the compatibility of small form factor (ITX) cases. Utility Model Content

[0007] In view of the problems existing in the prior art, this utility model provides a liquid cooling heat dissipation device with reasonable structure, good heat dissipation effect for dual graphics cards and integrated air cooling components, so as to improve the heat dissipation efficiency of dual graphics cards and ensure their stable operation.

[0008] This utility model is implemented as follows: a liquid cooling heat dissipation device for dual graphics cards includes a water circuit board and two graphics cards. The water circuit board includes a main body, which is composed of a cover plate and a base plate that covers the cover plate. The cover plate is provided with a water pump slot and multiple through holes, which are connected to the water cooling tank inside the main body of the water circuit board. The water cooling tank includes a first water cooling tank, a second water cooling tank, a third water cooling tank, and a fourth water cooling tank, wherein the second water cooling tank and the third water cooling tank are respectively connected to the two graphics cards through pipes.

[0009] The through hole in the middle of the cover plate connects to the second, third, and fourth water-cooling tanks. The water pump tank and the two through holes on the far right of the cover plate connect to the first water-cooling tank. The fourth water-cooling tank is connected to other heat-generating components inside the chassis via a pipe through the through hole in the middle of the cover plate. The water pump is snapped into the water pump tank and connected to the left end of the first water-cooling tank through a through hole. The right end of the first water-cooling tank is connected to the air-cooling assembly through two through holes.

[0010] Furthermore, the air-cooling assembly includes a fan and fins, the fins being connected to a pipe connected to the right end of the first water-cooling tank, and the fan being used to accelerate the heat dissipation of the fins.

[0011] Furthermore, the cover plate and the base plate are made of acrylic material, the water cooling tank is milled onto the base plate using CNC machining technology, and the cover plate is milled with textures that are compatible with the structure of the water cooling tank.

[0012] Furthermore, the cover plate and the base plate are provided with corresponding screw holes, and the cover plate and the base plate are fixedly connected by screws passing through the screw holes.

[0013] Furthermore, a sealing gasket is provided at the connection between the water pump and the first water-cooling tank.

[0014] Furthermore, the pipes connecting the graphics card and other heat-generating components are L-shaped water pipes.

[0015] Based on the above technical solutions and the technical problems solved, the advantages and positive effects of the technical solution to be protected by this utility model are as follows:

[0016] (1) Highly targeted: This utility model is specially designed to connect the second and third water cooling tanks to the two graphics cards respectively, so as to achieve independent and targeted heat dissipation of the two graphics cards, avoid heat interference between the two graphics cards, and improve the heat dissipation effect.

[0017] (2) High-efficiency synergistic heat dissipation: The present invention integrates air cooling components with the first water cooling tank. After the water coolant flows through the first water cooling tank, it is further cooled by the air cooling components, which improves the heat dissipation capacity of the water coolant and ensures continuous and efficient heat dissipation for dual graphics cards and other heat-generating components.

[0018] (3) Reliable structure: The cover plate and the bottom plate are made of acrylic material. The precision of the water cooling tank and the matching pattern is ensured by CNC machining technology, which facilitates the sealing and reduces the risk of water coolant leakage. The cover plate and the bottom plate are fixed by screws, and the connection is stable.

[0019] (4) Good adaptability: The pipeline adopts an L-shaped design, which is convenient to adapt to the installation space layout of dual graphics cards in the chassis, making the overall installation of the device more convenient.

[0020] (5) Easy maintenance: The water pump is installed in the water pump slot by snap-fit, which is convenient for disassembly, maintenance and replacement in the later stage. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the liquid cooling heat dissipation device for dual graphics cards provided in an embodiment of the present invention;

[0022] Figure 2 This is a structural diagram of the water channel plate provided in an embodiment of this utility model;

[0023] Figure 3 This is a diagram of the internal structure of the water circuit board provided in this embodiment of the utility model;

[0024] Figure 4 This is a front view of the air-cooled component provided in this embodiment of the utility model;

[0025] Figure 5 This is a schematic diagram of the back of the air-cooled component provided in this embodiment of the utility model;

[0026] Figure 6 This is a schematic diagram of a water pump provided in an embodiment of the present invention;

[0027] In the diagram: 1. Water circuit board body; 2. Cover plate; 3. Base plate; 4. Water cooling tank; 4-1. First water cooling tank; 4-2. Second water cooling tank; 4-3. Third water cooling tank; 4-4. Fourth water cooling tank; 5. Water pump tank; 6. Through hole; 7. Water pump; 8. Air cooling assembly; 9. Piping; 10. Graphics card. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this utility model clearer, the following detailed description is provided in conjunction with embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this utility model.

[0029] like Figure 1As shown, the liquid cooling device for dual graphics cards of this utility model includes a water cooling board and two graphics cards 10. The main body 1 of the water cooling board is formed by a cover plate 2 and a base plate 3, both of which are made of acrylic material. A first water cooling tank 4-1, a second water cooling tank 4-2, a third water cooling tank 4-3, and a fourth water cooling tank 4-4 are milled on the base plate 3 using CNC machining technology. Corresponding textures are milled on the cover plate 2 to match the structure of each water cooling tank, ensuring a sealed water cooling tank after closing and preventing coolant leakage.

[0030] The cover plate 2 has a water pump slot 5 and multiple through holes 6: the middle through hole 6 connects to the second water cooling slot 4-2, the third water cooling slot 4-3 and the fourth water cooling slot 4-4, and the water pump slot 5 and the two rightmost through holes 6 connect to the first water cooling slot 4-1. The water pump 7 is fixed in the water pump slot 5 by a snap-fit, and its output end is connected to the left end of the first water cooling slot 4-1 through the through hole 10. A rubber sealing gasket is provided at the connection to enhance the sealing performance. The right end of the first water cooling slot 4-1 is connected to the pipe 9 through the two through holes 6. The other end of the pipe 9 is connected to the air cooling component 8. The air cooling component 8 includes a fan and fins. The fins contact the pipe 9 to absorb heat from the coolant, and the fan is aimed at the fins to accelerate heat dissipation.

[0031] The second water-cooling tank 4-2 and the third water-cooling tank 4-3 are connected to the two graphics cards 10 via pipes 9 through the through-hole 6 in the middle of the cover plate 2. The fourth water-cooling tank 4-4 is connected to other heat-generating components (such as the CPU) inside the chassis via pipes 9 through the through-hole 6 in the middle of the cover plate 2. The pipes 9 connecting the heat-generating components are L-shaped water pipes, and there are two or more of them to adapt to the space layout inside the chassis. The edges of the cover plate 2 and the base plate 3 have corresponding screw holes, which are fixed by stainless steel screws passing through the screw holes, making the overall structure stable.

[0032] During operation, water pump 7 drives the coolant to circulate throughout the entire device:

[0033] The water pump 7 delivers the coolant to the left end of the first water cooling tank 4-1. During the flow of the coolant in the first water cooling tank 4-1, it absorbs some heat and then flows from the right end of the first water cooling tank 4-1 into the air cooling component 8 through the pipe 9. The fins absorb the heat in the coolant, and the fan accelerates the heat dissipation of the fins, which lowers the temperature of the coolant. The cooled coolant then flows back to the water pump 7, completing the first cycle.

[0034] Meanwhile, the coolant enters the second water cooling tank 4-2 and the third water cooling tank 4-3 respectively, flows to the two graphics cards 10 through the pipe 9, absorbs the heat generated by the graphics cards 10, and then flows back to the corresponding water cooling tank through the pipe 9 to achieve independent heat dissipation cycle for the two graphics cards.

[0035] The coolant in the fourth water-cooling tank 4-4 flows through pipe 9 to other heat-generating components, absorbs heat, and then circulates back.

[0036] The multiple water cooling tanks work independently and are combined with the auxiliary heat dissipation of the air cooling component 8, which significantly improves the heat dissipation efficiency of the dual graphics cards and other heat-generating components.

[0037] Example 1

[0038] This embodiment is for a desktop computer with dual graphics cards side-by-side: the water cooling board body 1 is CNC precision-milled from an acrylic cover plate 2 and a base plate 3, and then fixed with stainless steel screws. The base plate contains four water cooling tanks (4-1, 4-2, 4-3, 4-4) arranged in a U-shape series. A miniature diaphragm water pump 7 is fitted into the water pump tank 5, and its outlet is sealed to the left end of the first water cooling tank 4-1 via a through hole 6. Two pipes 9 pass through the through hole 6 from the right end of the first water cooling tank 4-1 to the air cooling assembly 8. The air cooling assembly consists of a 120mm PWM fan and 40 aluminum fins, which can maintain the coolant return temperature below 45℃.

[0039] The coolant flow is as follows: Graphics Card 1 → Graphics Card 2 → CPU → Air Cooling Component 8, with a total cooling capacity covering a TDP of 300W. All pipes 9 utilize... High-temperature resistant silicone hoses are used and clamps are used for sealing; the contact surfaces of the cover plate 2 and the base plate 3 are coated with silicone grease-matrix sealant, and the system showed no leakage during a 24-hour full-load aging test.

[0040] Example 2

[0041] To improve structural strength, the main body 1 of the water cooling board was replaced with anodized aluminum alloy, and the cover plate 2 was coated with a 50μm fluorocarbon layer to reduce electrochemical corrosion. The bottom of the first water cooling tank 4-1 is embedded with a copper heat conduction plate and aligned with the GPU die through thermal grease, reducing thermal resistance by about 15%. The water pump 7 was replaced with a threaded ceramic shaft centrifugal pump with a rated head of 1.2m, which can support a vertical chassis layout; the air cooling component 8 was moved to the top of the chassis, and dual 92mm fans blow air in opposite directions to form an up-down convection, keeping the overall heat dissipation noise below 30dB(A).

[0042] A φ4mm vent hole was added next to the through hole 6 in the cover plate and fitted with a silicone check valve, which can automatically vent air during the first filling, shortening the venting time to 3 minutes. After a 48-hour cyclic impact test, the average return water temperature of the system was ≤42℃, meeting the peak load requirement of 400W.

[0043] Example 3

[0044] For multi-GPU deep learning workstations, this embodiment installs an NTC temperature sensor and a turbine flow meter at the inlet of the third and fourth water-cooling tanks (4-3, 4-4), respectively. These sensors are connected via I / O. 2 The C bus output is sent to the motherboard monitoring software. When any sensor detects a coolant temperature >50℃ or a flow rate <300mL·min... -1At that time, water pump 7 automatically switches to full load at 3,800 rpm and simultaneously increases the speed of chassis fan and air cooling component 8.

[0045] In addition, quick-connect metal self-sealing connectors are added to key nodes of pipeline 9 to facilitate hot-swapping of graphics cards 10; a Y-shaped flow is used between the first and second water cooling tanks (4-1, 4-2) to deliver coolant in parallel to the two graphics cards 10, and then converges through the fourth water cooling tank 4-4 to the CPU. The overall system supports a peak power consumption of 600W and the GPU junction temperature remains stable at ≤70℃, meeting the reliability requirements of long-term training tasks.

[0046] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In addition, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0047] The above description is only a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any modifications, equivalent substitutions and improvements made by those skilled in the art within the technical scope disclosed in this utility model, and within the spirit and principles of this utility model, should be included within the protection scope of this utility model.

Claims

1. A liquid cooling heat dissipation device for dual graphics cards, characterized in that, The device includes a water cooling board and two graphics cards. The water cooling board includes a main body, which is composed of a cover plate and a base plate that covers the cover plate. The cover plate has a water pump slot and multiple through holes, which are connected to water cooling tanks inside the main body of the water cooling board. The water cooling tanks include a first water cooling tank, a second water cooling tank, a third water cooling tank, and a fourth water cooling tank, wherein the second and third water cooling tanks are respectively connected to the two graphics cards through pipes. The through hole in the middle of the cover plate connects to the second, third, and fourth water-cooling tanks. The water pump tank and the two through holes on the far right of the cover plate connect to the first water-cooling tank. The fourth water-cooling tank is connected to other heat-generating components inside the chassis via a pipe through the through hole in the middle of the cover plate. The water pump is snapped into the water pump tank and connected to the left end of the first water-cooling tank through a through hole. The right end of the first water-cooling tank is connected to the air-cooling assembly through two through holes.

2. The liquid cooling device for dual graphics cards according to claim 1, characterized in that, The air-cooling assembly includes a fan and fins. The fins are connected to a pipe connected to the right end of the first water-cooling tank. The fan is used to accelerate the heat dissipation of the fins.

3. The liquid cooling device for dual graphics cards according to claim 1, characterized in that, The cover plate and the base plate are made of acrylic. The water cooling tank is milled onto the base plate using CNC machining technology, and the cover plate is milled with textures that match the structure of the water cooling tank.

4. The liquid cooling device for dual graphics cards according to claim 1, characterized in that, The cover plate and the base plate are provided with corresponding screw holes, and the cover plate and the base plate are fixedly connected by screws passing through the screw holes.

5. The liquid cooling device for dual graphics cards according to claim 1, characterized in that, A sealing gasket is provided at the connection between the water pump and the first water-cooling tank.

6. The liquid cooling device for dual graphics cards according to claim 1, characterized in that, The pipes connecting the graphics card and other heat-generating components are L-shaped water pipes.

Images