A conversion device and a vehicle-mounted communication system
By replacing the SoC with two dedicated conversion chips in the vehicle communication system, efficient and reliable communication between standard Ethernet and vehicle Ethernet is achieved, solving the problems of complex communication links and high costs in existing technologies, and ensuring real-time performance and reliability.
Patent Information
- Application Number
- CN202522165105.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-11
- Publication Date
- 2026-08-25
- Estimated Expiration
- 2035-10-11
AI Technical Summary
In existing technologies, the differences in communication protocols and interface specifications between automotive Ethernet and ordinary standard Ethernet necessitate the introduction of high-cost SoCs for protocol conversion, resulting in complex communication links, numerous points of failure, and lower real-time performance and reliability.
Two dedicated conversion chips are used to replace the SoC, which realizes signal conversion between the physical layer and the data link layer respectively, simplifying the protocol conversion link, reducing hardware costs, and improving communication reliability while ensuring real-time performance.
It effectively reduced the overall hardware cost, simplified the protocol conversion link, reduced the number of failure points, and improved the real-time performance and reliability of communication.
Smart Images

Figure CN224684222U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of communication technology, and in particular to a conversion device and a vehicle-mounted communication system. Background Technology
[0002] In the field of automotive electronics, with the development of intelligence and connectivity, automotive Ethernet has gradually become an important communication method within vehicles. For example, it is widely used in applications such as domain controllers, camera modules, and in-vehicle data centers. Both automotive Ethernet and standard Ethernet are based on the physical layer of the OSI (Open Systems Interconnection) reference model for data transmission. However, due to differences in communication protocols and interface specifications, ordinary computers or other standard Ethernet devices cannot communicate directly with the vehicle controller. Therefore, in actual development, debugging, and operation, additional conversion devices are often needed to achieve protocol and interface adaptation between the two Ethernet types.
[0003] In existing technologies, System-on-a-Chip (SoC) is often used as the core component for protocol conversion. Specifically, automotive Ethernet data must first be parsed and processed by the SoC before being forwarded to standard Ethernet devices via the SoC's Ethernet interface. However, the high integration and cost of SoCs increase the overall system hardware cost. Furthermore, when using SoCs for protocol conversion, the data processing link involves parsing and reassembly at the session layer and even higher layers. The conversion process is highly dependent on the SoC's internal software logic and system stability, resulting in a lengthy communication link and an increase in potential failure points. When the SoC malfunctions or has insufficient processing power, it can easily lead to increased communication latency and even affect the system's reliability and real-time performance. Utility Model Content
[0004] The purpose of this invention is to provide a conversion device and an in-vehicle communication system that uses two dedicated conversion chips to replace the high-cost SoC, which can effectively reduce the overall hardware cost and improve the reliability of communication while ensuring real-time performance, thereby solving the complex link in related technologies that relies on SoC for parsing and reassembly.
[0005] In a first aspect, this utility model provides a conversion device, comprising:
[0006] Standard Ethernet interface, first conversion chip, second conversion chip, and vehicle Ethernet interface;
[0007] The first end of the standard Ethernet interface is connected to a standard device, the second end of the standard Ethernet interface is connected to the physical layer port of the first conversion chip, the data link layer interface of the first conversion chip is connected to the data link layer interface of the second conversion chip, and the physical layer port of the second conversion chip is connected to the vehicle Ethernet interface.
[0008] The first conversion chip is configured to convert the physical layer signal corresponding to its own physical layer port into the data layer signal corresponding to the data layer link interface;
[0009] The second conversion chip is configured to convert the data link layer signal corresponding to its own data link layer interface into an in-vehicle Ethernet physical layer signal.
[0010] Optional, also includes:
[0011] The control unit is connected to the management interface of the first conversion chip and the management interface of the second conversion chip, respectively, and is used to configure the working mode of the first conversion chip and the second conversion chip according to the configuration instructions.
[0012] Optionally, the first conversion chip is provided with a first register, and the second conversion chip is provided with a second register;
[0013] The first register is connected to the management interface of the first conversion chip, and the second register is connected to the management interface of the second conversion chip;
[0014] The first register is configured to adjust the stored value according to the configuration of the control unit;
[0015] The second register is configured to adjust the stored value according to the configuration of the control unit;
[0016] For each register, the operating mode of the corresponding conversion chip is different when the value stored in the register is different.
[0017] Optional, also includes:
[0018] A status indicator device, connected to the input / output port of the control unit, is configured to display the connection status of the two conversion chips under the drive of the control unit.
[0019] Optionally, the first conversion chip is provided with a third register, and the second conversion chip is provided with a fourth register;
[0020] The third register is connected to the access interface of the first conversion chip, the fourth register is connected to the access interface of the second conversion chip, and the control unit is connected to the access interfaces of the two conversion chips respectively.
[0021] The third register is configured to adjust the value it stores according to the working state and connection state of the first conversion chip;
[0022] The fourth register is configured to adjust the values it stores based on the operating and connection status of the second conversion chip.
[0023] Optional, also includes:
[0024] A configuration input device is configured to connect its output terminal to the input port of the control unit and to provide hardware configuration signals to the control unit according to user requirements.
[0025] Optionally, the configuration input device is a DIP switch, which includes multiple parallel switch branches. Each switch branch includes a switch unit connected in series and a fixed resistor. The common terminal of all switch branches is connected to a reference voltage or a reference ground. The output terminal of each switch branch is connected to a general-purpose input / output pin of the control unit.
[0026] Optionally, it may also include a power module, which includes at least a DC-DC converter;
[0027] The input terminal of the DC-DC converter is used to connect to an external power source, and the output terminal of the DC-DC converter is connected to the power input terminals of the first conversion chip and the second conversion chip, respectively, and is configured to perform DC voltage conversion on the external power source to power the first conversion chip and the second conversion chip.
[0028] Optional, also includes:
[0029] A linear voltage regulator is disposed between the output terminal of the DC-DC converter and the power input terminal of at least one of the conversion chips, configured to regulate the voltage output by the DC-DC converter and provide the regulated voltage to the power input terminal of the correspondingly connected conversion chip.
[0030] Secondly, this application also provides an in-vehicle communication system, including the conversion device as described above.
[0031] This application provides a conversion device and an in-vehicle communication system, relating to the field of communication technology. By using a first conversion chip and a second conversion chip to achieve hierarchical signal conversion between the physical layer and the data link layer, the communication process occurs only at the physical and data link layers. This simplifies the protocol conversion link, reduces potential failure points, and decreases reliance on complex software logic and system stability. Furthermore, replacing the high-cost SoC with two dedicated conversion chips effectively reduces overall hardware costs and improves communication reliability while ensuring real-time performance, thereby resolving the complex link in related technologies that relies on the SoC for parsing and reassembly. Attached Figure Description
[0032] To more clearly illustrate the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0033] Figure 1 This is a schematic block diagram of a conversion device provided by the present invention;
[0034] Figure 2 This is a schematic diagram illustrating a specific implementation of the conversion device provided by this utility model. Detailed Implementation
[0035] The core of this invention is to provide a conversion device and an in-vehicle communication system. By using two dedicated conversion chips to replace the high-cost SoC, the overall hardware cost can be effectively reduced, and the reliability of communication can be improved while ensuring real-time performance. This solves the complex link in related technologies that relies on SoC for parsing and reassembly.
[0036] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0037] like Figure 1 In a first aspect, this utility model provides a conversion device, comprising:
[0038] Standard Ethernet interface 11, first conversion chip 12, second conversion chip 13 and vehicle Ethernet interface 14;
[0039] The first end of the standard Ethernet interface 11 is connected to a standard device, the second end of the standard Ethernet interface 11 is connected to the physical layer port of the first conversion chip 12, the data link layer interface of the first conversion chip 12 is connected to the data link layer interface of the second conversion chip 13, and the physical layer port of the second conversion chip 13 is connected to the vehicle Ethernet interface 14.
[0040] The first conversion chip 12 is configured to convert the physical layer signal corresponding to its own physical layer port into the data layer signal corresponding to the data layer link interface.
[0041] The second conversion chip 13 is configured to convert the data link layer signal corresponding to its own data link layer interface into an in-vehicle Ethernet physical layer signal.
[0042] The conversion device in this embodiment includes a standard Ethernet interface 11, a first conversion chip 12, a second conversion chip 13, and an in-vehicle Ethernet interface 14. Through the above connection method, a signal channel with the data link layer interface as the relay is formed between the standard device and the in-vehicle device, so that the physical layer signals of both sides are transformed by the corresponding conversion chips before and after entering the channel, thereby establishing the docking relationship between the standard Ethernet side and the in-vehicle Ethernet side.
[0043] In this embodiment, in the direction from the standard device to the vehicle-mounted device, the standard Ethernet interface 11 receives the physical layer signal from the standard device and inputs it to the physical layer port of the first conversion chip 12. The first conversion chip 12, according to its function, converts the physical layer signal corresponding to the physical layer port into a data link layer signal corresponding to its data link layer interface. This data link layer signal is transmitted to the second conversion chip 13 via the data link layer interface connection between the two chips. The second conversion chip 13 further converts the data link layer signal corresponding to its own data link layer interface into a vehicle-mounted Ethernet physical layer signal and outputs it to the vehicle-mounted device through the vehicle-mounted Ethernet interface 14. Thus, the physical layer electrical form on the standard side is elevated to a data link layer expression after entering this embodiment, and then restored to the corresponding vehicle-mounted Ethernet physical layer expression on the vehicle side, completing one directional inter-layer conversion and transmission.
[0044] In this embodiment, in the direction from the vehicle-mounted device to the standard device, the vehicle-mounted Ethernet interface 14 introduces the physical layer signal from the vehicle-mounted device into the physical layer port of the second conversion chip 13. The second conversion chip 13 converts the physical layer signal into a data link layer signal corresponding to its data link layer interface, and transmits it to the first conversion chip 12 through the data link layer interface connection between the two chips; the first conversion chip 12 then converts the received data link layer signal into a physical layer signal corresponding to its physical layer port, and outputs it to the standard device via the standard Ethernet interface 11. Through this reverse process, this embodiment completes the conversion from the vehicle side to the standard side at the same layer boundary, so that the same data appears on both sides in their respective adapted physical layer forms, while in the middle it is connected and transmitted using data link layer signals.
[0045] Furthermore, in this embodiment, the first end of the standard Ethernet interface 11 is connected to a standard device via an RJ45 connector. This RJ45 connector serves as a standard Ethernet interface connector, enabling the standard device to establish a physical layer connection with the system using the 1000BASE-T Gigabit physical layer communication protocol, thereby achieving data transmission access on the standard Ethernet side. The first conversion chip 12 can use MICROCHIP's KSZ9031. The second conversion chip 13 can use BROADCOM's BCM89884. It should be understood that "standard" here refers to a generally accepted protocol that is not limited to the 1000BASE-T Gigabit physical layer communication protocol.
[0046] In this embodiment, the decoupling and connection between the two physical layers are achieved through the data link layer interface. The first conversion chip 12 is responsible for uplinking the standard physical layer signal to the data link layer representation, and the second conversion chip 13 is responsible for downlinking the data link layer representation to the vehicle-side physical layer representation. The two are directly connected at the data link layer interface, allowing data to be transmitted at this layer using Ethernet frames as the carrier, without involving the processing or rewriting of higher-layer protocols. Through this clear hierarchical conversion relationship, this embodiment achieves interoperability between standard Ethernet and vehicle Ethernet without changing the data link layer frame structure, and the overall structure is a cascaded conversion link of "physical layer ↔ data link layer ↔ physical layer".
[0047] like Figure 2 In one exemplary embodiment, it further includes:
[0048] The control unit is connected to the management interface of the first conversion chip 12 and the management interface of the second conversion chip 13, respectively, and is used to configure the working mode of the first conversion chip 12 and the second conversion chip 13 according to the configuration instructions.
[0049] In this embodiment, the control unit is connected to the management interface of the first conversion chip 12 and the second conversion chip 13, enabling it to access and write to the internal registers of both. In this way, the control unit can determine and set the operating mode of each chip according to externally issued configuration commands, such as determining the communication method of its data link layer interface or the operating speed of its physical layer port.
[0050] In this embodiment, the control unit executes a configuration process when the system is powered on or when a mode switch is required. It manages the state of the first conversion chip 12 and the second conversion chip 13 by reading and writing to the management interface. This allows the chips to complete initialization according to configuration instructions before entering the working state, ensuring that subsequent signal conversion between the data link layer and the physical layer meets system requirements.
[0051] The control unit can use a TC234 MCU, which uses its own GPIO to simulate the MDIO protocol through software code and access internal registers via the SMI (Serial Management Interface) interface of the PHY chip.
[0052] In one exemplary embodiment, the first conversion chip 12 is provided with a first register, and the second conversion chip 13 is provided with a second register;
[0053] The first register is connected to the management interface of the first conversion chip 12, and the second register is connected to the management interface of the second conversion chip 13;
[0054] The first register is configured to adjust the stored value according to the configuration of the control unit;
[0055] The second register is configured to adjust the stored values according to the configuration of the control unit;
[0056] For each register, the operating mode of the corresponding conversion chip varies depending on the value stored in the register.
[0057] In this embodiment, the first register and the second register are located inside the first conversion chip 12 and the second conversion chip 13, respectively, serving as important parameter storage units that determine the chip's operating mode. The control unit accesses the registers through a management interface and writes different values according to external configuration instructions, thereby changing the configuration information stored in the registers.
[0058] When the value stored in the first register changes, the internal circuitry of the first conversion chip 12 adjusts its operating mode according to the setting corresponding to that value, such as adjusting the interaction mode between the physical layer port and the data link layer interface. Correspondingly, when the value stored in the second register changes, the second conversion chip 13 also adjusts its operating mode according to that value, enabling it to complete the predetermined conversion between the vehicle-side physical layer and the data link layer.
[0059] This embodiment utilizes the correspondence between registers and operating modes, enabling the chip to enter different operating states based on different values stored in the registers. Thus, the control unit only needs to write the value corresponding to the configuration instruction to the register to complete the chip's mode switching. The entire process is direct and explicit, involving no additional software protocol processing, ensuring the stability and determinism of the configuration process.
[0060] Therefore, this embodiment achieves fine-grained control of the chip's operating mode at the register level, enabling the system to complete the mode configuration of the two types of conversion chips through simple numerical adjustments, ensuring that they execute according to preset logic during the signal conversion process between the standard Ethernet side and the automotive Ethernet side.
[0061] In one exemplary embodiment, it further includes:
[0062] A status indicator device, connected to the input / output port of the control unit, is configured to display the connection status of the two conversion chips under the drive of the control unit.
[0063] In this embodiment, the status indication device operates under the drive of the control unit and can display the connection status of the first conversion chip 12 and the second conversion chip 13 according to the signal output by the control unit. During operation, the control unit periodically or as needed reads the management interface information of the two conversion chips, converts the obtained status data into output signals, and transmits them to the status indication device.
[0064] After receiving the output signal from the control unit, the status indicator device displays the corresponding connection status via indicator lights or other display methods, allowing users to intuitively understand whether the two conversion chips are currently in a normal connection state. This embodiment, through this method, enables timely feedback on system operation at the hardware level, facilitating direct observation by the user to determine the system's availability.
[0065] In one exemplary embodiment, the first conversion chip 12 is provided with a third register, and the second conversion chip 13 is provided with a fourth register;
[0066] The third register is connected to the access interface of the first conversion chip 12, the fourth register is connected to the access interface of the second conversion chip 13, and the control unit is connected to the access interfaces of the two conversion chips respectively.
[0067] The third register is configured to adjust the value it stores according to the working state and connection state of the first conversion chip 12;
[0068] The fourth register is configured to adjust the value it stores based on the operating and connection status of the second conversion chip 13.
[0069] In this embodiment, the third and fourth registers are respectively located inside the two conversion chips and are used to record the status information generated by the chips during operation. When the operating state or connection state of the first conversion chip 12 changes, its internal circuitry updates the third register to ensure that the value stored in the register is consistent with the current state. Similarly, when the operating state or connection state of the second conversion chip 13 changes, the value of the fourth register is also adjusted accordingly to reflect the real-time state of the chip.
[0070] The control unit can read the values of the third and fourth registers through the access interface, thereby obtaining the operating status and connection status of the two conversion chips. During system operation, the stored values in the registers are dynamically adjusted according to changes in the chip status, so the control unit can directly monitor the real-time operation of the two chips without the need for additional communication protocols.
[0071] This embodiment achieves hardware-level feedback on operating and connection states by storing the correspondence between numerical values and chip states in registers. In this way, the system can acquire and utilize this state information in real time at the control unit level, ensuring that the chip's operating status is accurately recorded and read, providing a reliable data foundation for further control or instruction.
[0072] In one exemplary embodiment, it further includes:
[0073] The configuration input device, whose output is connected to the input port of the control unit, is configured to provide hardware configuration signals to the control unit according to user requirements.
[0074] In this embodiment, the configuration input device receives user operations and converts the operation results into corresponding hardware configuration signals. Users can select different operating modes or parameters through the configuration input device, and the generated configuration signals are transmitted to the control unit as the basis for subsequent configuration of the two conversion chips.
[0075] After receiving a hardware configuration signal from the configuration input device, the control unit executes the corresponding configuration process according to the signal content, controlling the internal logic and register writing process. In this way, this embodiment can perform flexible configuration operations at the hardware level according to user needs, ensuring that the system's operating mode meets the requirements of the actual application scenario.
[0076] In one exemplary embodiment, the input device is configured as a DIP switch, which includes multiple parallel switch branches. Each switch branch includes a switch unit connected in series and a fixed resistor. The common terminal of all switch branches is connected to a reference voltage or a reference ground. The output terminal of each switch branch is connected to a general-purpose input / output pin of the control unit.
[0077] In this embodiment, the DIP switch implements different configuration information inputs through multiple parallel switch branches. Each switch branch consists of a switch unit connected in series with a fixed resistor. When the switch unit is in the on or off state, the voltage level at the output terminal of the branch changes, thereby forming different logic signals.
[0078] The control unit reads the level status of each branch output terminal through general purpose input / output pins and combines and parses these logic signals into user-defined hardware configuration information. Thus, this embodiment can visually reflect the physical on / off state of the DIP switches as level signals, enabling the control unit to obtain explicit configuration input at the hardware level.
[0079] In one exemplary embodiment, a power module is also included, which includes at least a DC-DC converter;
[0080] The input terminal of the DC-DC converter is used to connect to an external power supply, and the output terminal of the DC-DC converter is connected to the power input terminals of the first conversion chip 12 and the second conversion chip 13 respectively. It is configured to perform DC voltage conversion on the external power supply to power the first conversion chip 12 and the second conversion chip 13.
[0081] In this embodiment, the DC-DC converter in the power module is responsible for adjusting the DC voltage input from the external power supply to the voltage level required for the operation of the first conversion chip 12 and the second conversion chip 13. Through this conversion process, the external power supply can be input within a wide voltage range, while the voltage output by the converter remains within a stable operating range to ensure the normal operation of the chips.
[0082] This embodiment achieves voltage transformation and stabilization control through a DC-DC converter, enabling the first conversion chip 12 and the second conversion chip 13 to maintain a continuous and reliable operating state when powered. Thus, the system can enter the normal signal conversion process immediately after power-on, without depending on whether the external power supply voltage is within a fixed range.
[0083] The DC-DC converter can use the LM61460 chip to provide the main power supply for the system, efficiently converting the input 5~36V DC power into 3.3V to power the two conversion chips.
[0084] In one exemplary embodiment, it further includes:
[0085] A linear voltage regulator is disposed between the output terminal of a DC-DC converter and the power input terminal of at least one conversion chip, configured to regulate the voltage output by the DC-DC converter and provide the regulated voltage to the power input terminal of the correspondingly connected conversion chip.
[0086] In this embodiment, a linear voltage regulator is installed after the output of the DC-DC converter to further regulate the output voltage. This regulation process keeps the supply voltage within a small fluctuation range, thereby meeting the power supply voltage stability requirements of the conversion chip.
[0087] When there are slight fluctuations or ripples in the voltage at the output of the DC-DC converter, the linear regulator suppresses these voltage fluctuations and provides a stable DC voltage at its output. In this way, at least one conversion chip can operate continuously at a stable voltage, ensuring the reliability of the circuit function during long-term operation. The linear regulator can be a TPS74501 chip.
[0088] In one specific embodiment, after the device is powered on, the MCU pulls the reset pins of the first conversion chip 12 and the second conversion chip 13 high to the enable state. Based on the hardware configuration signal provided by the configuration input device, it uses GPIO to simulate the MDIO protocol to configure the registers of the two conversion chips, for example, setting the data link layer interface to RGMII communication mode. After configuration, the data link channel between the standard Ethernet interface 11 and the vehicle Ethernet interface 14 is established. The standard Ethernet device can send data to the vehicle Ethernet device at any time, and can also receive data from the vehicle Ethernet device.
[0089] During device operation, the MCU periodically reads the register values of the two conversion chips and drives the device to display the corresponding connection status based on the register status. Since the entire link only involves the data link layer interface and does not rely on higher-level protocol stacks or SOC systems, the system communication latency is low, real-time performance is high, and the hardware and control logic remain stable and reliable.
[0090] Secondly, this application also provides an in-vehicle communication system, including the conversion device as described above.
[0091] In this embodiment, the vehicle communication system includes the aforementioned conversion device. The system establishes a communication channel between standard Ethernet devices and vehicle Ethernet devices through the conversion device, enabling the two types of devices to achieve data interoperability even when their physical layer specifications are different, thereby completing cross-network connection in the vehicle environment.
[0092] It should also be noted that, in this specification, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, article, or apparatus that includes said element.
[0093] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A conversion device, characterized in that, include: Standard Ethernet interface, first conversion chip, second conversion chip, and vehicle Ethernet interface; The first end of the standard Ethernet interface is connected to a standard device, the second end of the standard Ethernet interface is connected to the physical layer port of the first conversion chip, the data link layer interface of the first conversion chip is connected to the data link layer interface of the second conversion chip, and the physical layer port of the second conversion chip is connected to the vehicle Ethernet interface. The first conversion chip is configured to convert the physical layer signal corresponding to its own physical layer port into the data layer signal corresponding to the data layer link interface; The second conversion chip is configured to convert the data link layer signal corresponding to its own data link layer interface into an in-vehicle Ethernet physical layer signal.
2. The conversion device as described in claim 1, characterized in that, Also includes: The control unit is connected to the management interface of the first conversion chip and the management interface of the second conversion chip, respectively, and is used to configure the working mode of the first conversion chip and the second conversion chip according to the configuration instructions.
3. The conversion device as described in claim 2, characterized in that, The first conversion chip has a first register, and the second conversion chip has a second register; The first register is connected to the management interface of the first conversion chip, and the second register is connected to the management interface of the second conversion chip; The first register is configured to adjust the stored value according to the configuration of the control unit; The second register is configured to adjust the stored value according to the configuration of the control unit; For each register, the operating mode of the corresponding conversion chip is different when the value stored in the register is different.
4. The conversion device as described in claim 2, characterized in that, Also includes: A status indicator device, connected to the input / output port of the control unit, is configured to display the connection status of the two conversion chips under the drive of the control unit.
5. The conversion device as described in claim 2, characterized in that, The first conversion chip has a third register, and the second conversion chip has a fourth register; The third register is connected to the access interface of the first conversion chip, the fourth register is connected to the access interface of the second conversion chip, and the control unit is connected to the access interfaces of the two conversion chips respectively. The third register is configured to adjust the value it stores according to the working state and connection state of the first conversion chip; The fourth register is configured to adjust the values it stores based on the operating and connection status of the second conversion chip.
6. The conversion device as described in claim 2, characterized in that, Also includes: A configuration input device is configured to connect its output terminal to the input port of the control unit and to provide hardware configuration signals to the control unit according to user requirements.
7. The conversion device as described in claim 6, characterized in that, The configuration input device is a DIP switch, which includes multiple parallel switch branches. Each switch branch includes a switch unit connected in series and a fixed resistor. The common terminal of all switch branches is connected to a reference voltage or a reference ground. The output terminal of each switch branch is connected to a general-purpose input / output pin of the control unit.
8. The conversion device according to any one of claims 1-7, characterized in that, It also includes a power module, which at least includes a DC-DC converter; The input terminal of the DC-DC converter is used to connect to an external power source, and the output terminal of the DC-DC converter is connected to the power input terminals of the first conversion chip and the second conversion chip, respectively, and is configured to perform DC voltage conversion on the external power source to power the first conversion chip and the second conversion chip.
9. The conversion device as described in claim 8, characterized in that, Also includes: A linear voltage regulator is disposed between the output terminal of the DC-DC converter and the power input terminal of at least one of the conversion chips, configured to regulate the voltage output by the DC-DC converter and provide the regulated voltage to the power input terminal of the correspondingly connected conversion chip.
10. A vehicle-mounted communication system, characterized in that, Includes the conversion device as described in any one of claims 1-9.