Thickness measuring device, circuit board degumming apparatus, and laser processing apparatus

Abstract

The application relates to a thickness measuring device, a circuit board glue removing device and a laser processing device. The thickness measuring device is applied to the circuit board glue removing device and comprises a motion assembly and a sensing assembly. The motion assembly is connected to the sensing assembly and is used for driving the sensing assembly to move in a first direction. The sensing assembly is used for obtaining the glue overflow thickness of a to-be-measured circuit board. The sensing assembly is driven by the motion assembly to move to a specified position of the to-be-measured circuit board, and the sensing assembly detects the glue overflow thickness of the to-be-measured circuit board, so that the circuit board glue removing device can adjust working parameters according to the glue overflow thickness, and then accurately removes the glue overflow. The application is favorable for reducing glue overflow residues, accurately removing glue, and improving the processing efficiency of the circuit board.

Description

Technical Field

[0001] This application relates to the field of circuit board processing technology, and in particular to a thickness measuring device, a circuit board adhesive removal device, and a laser processing device. Background Technology

[0002] During the circuit board manufacturing process, after laminating the polymer material ABF (Ajinomoto Build-up Film) onto the carrier board, due to the fluidity of ABF, irregularly thick areas of excess adhesive are squeezed out around the edges after lamination. This overflowing ABF can interfere with subsequent processes; therefore, the overflowed areas must be thoroughly cleaned before a second ABF lamination can be performed.

[0003] However, since the area of ​​adhesive overflow in ABF material is unpredictable and the amount of adhesive overflow varies during each lamination process, laser adhesive removal may result in some areas having excessively thick adhesive overflow, leaving residual adhesive that will affect the quality of subsequent laminations. Therefore, there is a problem with the effective removal of adhesive overflow during the circuit board lamination process. Utility Model Content

[0004] Therefore, it is necessary to provide a thickness measuring device, a circuit board adhesive removal device, and a laser processing device that can improve the accuracy of adhesive overflow removal in response to the above-mentioned technical problems.

[0005] In a first aspect, this application provides a thickness measuring device for use in a circuit board adhesive removal device. The thickness measuring device includes a motion component and a sensing component. The motion component is connected to the sensing component and is used to drive the sensing component to move along a first direction. The sensing component is used to obtain the thickness of the adhesive overflow on the circuit board to be measured.

[0006] In one embodiment, the sensing component includes a first sensor, a second sensor, and a mounting base. Both the first sensor and the second sensor are mounted on the mounting base, which is connected to the motion component. The first sensor is used to acquire the board surface height of the circuit board under test, and the second sensor is used to acquire the excess adhesive height of the circuit board under test.

[0007] In one embodiment, the sensing component further includes a support block disposed on the mounting base and supporting the second sensor, such that the second sensor and the first sensor are misaligned based on horizontal height.

[0008] In one embodiment, the motion component includes a telescopic member, a first end of which is disposed on the circuit board adhesive removal device, and a second end of which is connected to the sensing component.

[0009] In one embodiment, the motion component further includes a drive member for driving the telescopic member to extend or retract.

[0010] In one embodiment, the sensing component further includes a camera connected to the motion component so that the motion component drives the camera to move along the first direction.

[0011] In one embodiment, the thickness measuring device further includes a first fixing plate and a second fixing plate. The first fixing plate is fixed to the circuit board adhesive removal device and is fixedly connected to the second fixing plate. The second fixing plate, the motion component, and the sensing component are all disposed on the first fixing plate, and the second fixing plate connects the motion component and the sensing component.

[0012] In one embodiment, the thickness measuring device further includes a dust extraction and sealing component, which is based on a circuit board adhesive removal device and is used to clean dust.

[0013] Secondly, this application also provides a circuit board adhesive removal device, which includes an adhesive removal laser and a beam conditioning device. The aforementioned thickness measuring device is disposed on the beam conditioning device and connected to the adhesive removal laser. The adhesive removal laser outputs an adhesive removal laser beam based on the adhesive overflow thickness obtained by the thickness measuring device to remove adhesive from the circuit board to be tested.

[0014] Thirdly, this application also provides a laser processing device, which includes the above-mentioned circuit board adhesive removal device and the above-mentioned thickness measuring device.

[0015] In the aforementioned thickness measuring device, circuit board adhesive removal equipment, and laser processing equipment, the thickness measuring device is applied to the circuit board adhesive removal equipment. It includes a motion component and a sensing component. The motion component is connected to the sensing component and drives the sensing component to move along a first direction. The sensing component is used to acquire the adhesive thickness of the circuit board under test. The motion component moves the sensing component to a designated position on the circuit board under test, where the sensing component detects the adhesive thickness. This allows the circuit board adhesive removal equipment to adjust its operating parameters based on the adhesive thickness, thereby accurately removing the adhesive. This helps reduce adhesive residue, ensures accurate adhesive removal, and improves the processing efficiency of the circuit board. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the thickness measuring device in one embodiment;

[0017] Figure 2 This is a schematic diagram of the thickness measuring device in one embodiment;

[0018] Figure 3 This is a schematic diagram of the thickness measuring device in another embodiment;

[0019] Figure 4This is a physical schematic diagram of the thickness measuring device in another embodiment;

[0020] Figure 5 This is a schematic diagram illustrating the path setting in one embodiment;

[0021] Figure 6 This is a schematic diagram illustrating the setting of a path in another embodiment. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0023] It is understood that the terms "first," "second," etc., used herein may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of this application, a first resistor may be referred to as a second resistor, and similarly, a second resistor may be referred to as a first resistor. Both the first resistor and the second resistor are resistors, but they are not the same resistor.

[0024] It is understood that the term "connection" in the following embodiments should be understood as "electrical connection," "communication connection," etc., if the connected circuits, modules, units, etc., have electrical signal or data transmission with each other.

[0025] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising,” “including,” or “having,” etc., specify the presence of the stated feature, whole, step, operation, component, part, or combination thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0027] In the fabrication and assembly of circuit boards, transparent polymer materials such as ABF (Ajinomoto Build-up Film) are used to laminate onto a carrier board. During lamination, due to the fluidity of ABF, irregular adhesive material will be squeezed out around the edges, a phenomenon known as adhesive overflow. The location of the overflow is called the adhesive overflow area. Since adhesive overflow is difficult to avoid during processing and the process is uncontrollable, the resulting adhesive overflow area is also difficult to control.

[0028] Currently, laser adhesive removal is commonly used to clean areas of excess adhesive to facilitate subsequent circuit board processing. However, due to the uncontrollable nature of excess adhesive and the unpredictable extent of the excess area, direct laser removal may result in some areas having excessively thick excess adhesive that cannot be completely removed. This leaves residual adhesive in these areas, affecting the quality of subsequent secondary lamination.

[0029] This application provides a thickness measuring device for use in circuit board adhesive removal equipment. For example... Figure 1 As shown, the thickness measuring device includes a motion component 102 and a sensing component 104. The motion component 102 is connected to the sensing component 104 and is used to drive the sensing component 104 to move along a first direction. The sensing component 104 is used to obtain the thickness of the adhesive overflow of the circuit board under test.

[0030] The circuit board under test (PCB) is a PCB in the lamination and assembly process, an incomplete product of the manufacturing process. During the processing of the PCB, different materials from the PCB preparation raw materials need to be laminated using ABF (Alternating Acid Fluidized Fabrication) material. For example, copper foil and substrate may need to be laminated using ABF as a dielectric. Alternatively, a film containing ABF material may need to be laminated to a substrate; in this case, the ABF material overflows from one side of the lamination due to its fluidity. The lamination process of the PCB using lamination equipment is called lamination processing. After lamination, there will be excess adhesive on the PCB, which needs to be removed before continuing lamination or subsequent processing.

[0031] The thickness measuring device can be integrated with the PCB adhesive removal equipment 100, for example, fixed to the outer casing of the PCB adhesive removal equipment 100, through nesting or bonding. When the PCB adhesive removal equipment 100 needs to remove adhesive from the PCB under test, the operator can use the thickness measuring device to inspect the PCB under test, obtain the thickness of the excess adhesive, and adjust the operating parameters of the PCB adhesive removal equipment 100 based on the excess adhesive thickness to remove adhesive from the PCB under test accurately.

[0032] The thickness measuring device includes a motion component 102 and a sensing component 104. The first end of the motion component 102 is fixed to the circuit board adhesive removal device 100, and the second end of the motion component 102 is connected to the sensing component 104 and is used to drive the sensing component to move along a first direction. The sensing component 104 is used to obtain the thickness of the adhesive overflow of the circuit board to be measured.

[0033] Specifically, the motion component 102 can move in the first direction, causing the sensing component disposed thereon to move in the first direction. When the motion component 102 moves in the first direction, the relative distance between the first end and the second end of the motion component 102 increases, causing the spatial relative positional relationship between the sensing component 104 and the circuit board under test to change, adjusting the area of ​​the circuit board under test detected by the sensing component 104, which is beneficial for the sensing component 104 to detect the thickness of the adhesive overflow on the circuit board under test more accurately and comprehensively.

[0034] Optionally, the way in which the motion component 102 drives the sensing component 104 to move in the first direction is not unique. It can be that a guide rail, pulley or other auxiliary is provided in the first direction, and the motion component 102 drives the sensing component 104 to move along the guide rail in the first direction; or the motion component 102 can include a mechanical linkage mechanism, which can drive the sensing component 104 located at the second end to move by changing the mechanical connection structure, so that the sensing component 104 can move in the first direction to detect the thickness of the adhesive overflow on the circuit board under test.

[0035] Furthermore, in one embodiment, the motion component 102 includes a telescopic member, with a first end disposed on the circuit board adhesive removal device 100 and a second end connected to the sensing component 104. Specifically, the motion component 102 can move the sensing component 104 by telescoping. When the telescopic member is extended, the distance between the second end and the first end of the telescopic member is greater; when the telescopic member is retracted, the distance between the second end and the first end of the telescopic member is smaller. The spatial position adjustment of the sensing component 104 is achieved by telescoping.

[0036] In one embodiment, the motion component 102 further includes a drive member for driving the telescopic member to extend and retract. To accurately control the extension and retraction of the telescopic member, a drive member can be configured on the telescopic member to achieve precise control of the extension and retraction; for example, the drive member can be a motor.

[0037] For example, the telescopic component can be a push rod, hydraulic cylinder, elastic component, or pneumatic cylinder, etc., which changes shape by extending or retracting its own structure, thereby causing the sensing component 104 to generate displacement. The motor can be combined with pneumatic cylinders, push rods, and other components to achieve more precise telescopic control.

[0038] For example, in one embodiment, the telescopic component is a cylinder. A cylinder is an actuator that converts the pressure energy of compressed air into mechanical energy. It operates based on Pascal's law (the uniform transmission of pressure in a closed fluid) and the gas law (the behavior of an ideal gas in an isothermal or adiabatic process), and drives work through a cycle of four stages: intake, compression, operation, and exhaust. In this embodiment, the cylinder's work is used to drive the sensing component 104 to change the spatial relative position between the sensing component 104 and the circuit board under test, so that the sensing component 104 can accurately detect the thickness of the adhesive overflow on the circuit board under test.

[0039] The sensing component 102 is a device capable of detecting the height of the circuit board under test. It can detect the height by measuring the distance between different locations on the circuit board, or by detecting changes in the height of the surface of the circuit board after lamination, thus determining the thickness of the excess adhesive. After the sensing component 102 detects the thickness of the excess adhesive in the area of ​​the circuit board under test, the operator can adjust the operating parameters of the circuit board adhesive removal equipment 100 accordingly to remove the excess adhesive from the area of ​​the circuit board under test.

[0040] In this embodiment, the thickness measuring device is applied to a circuit board adhesive removal equipment, including a motion component and a sensing component. The motion component is connected to the sensing component and is used to drive the sensing component to move along a first direction. The sensing component is used to obtain the adhesive overflow thickness of the circuit board under test. By moving the sensing component to a designated position on the circuit board under test, the motion component detects the adhesive overflow thickness of the circuit board under test, so that the circuit board adhesive removal equipment can adjust its operating parameters according to the adhesive overflow thickness, thereby accurately removing the adhesive overflow. This helps reduce adhesive overflow residue, accurately remove adhesive, and improve the processing efficiency of the circuit board.

[0041] In one embodiment, the sensing component includes a first sensor, a second sensor, and a mounting base. Both the first and second sensors are mounted on the mounting base, which is connected to a motion component. The first sensor is used to acquire the height of the circuit board under test, and the second sensor is used to acquire the amount of adhesive overflow on the circuit board under test.

[0042] Specifically, the mounting base, serving as a fixed carrier for the first and second sensors, can be a rigid structure used to support both sensors. Simultaneously, the mounting base connects to the second end of the motion component, effectively fixing the spatial relationship between the two sensors and the second end of the motion component. The first and second sensors can be fixed to the second end of the motion component via the mounting base, preventing accidental detachment, loosening, or displacement of the sensors during the detection of adhesive thickness, thus ensuring the reliability of the thickness measuring device.

[0043] The thickness of the excess adhesive is the thickness of the adhesive that overflows from the surface of the circuit board under test. In this embodiment, a first sensor and a second sensor are provided. The first sensor is used to obtain the height of the circuit board under test, which is the thickness of the circuit board under test that is not covered by excess adhesive and adhesive residue. The second sensor is used to obtain the height of the excess adhesive on the circuit board under test, which is the thickness of the circuit board under test at the location where excess adhesive exists.

[0044] Once the first and second sensors acquire the board height and the excess adhesive height respectively, the operator can subtract the two to calculate the excess adhesive thickness. Optionally, the thickness measuring device can also be equipped with a computing chip connected to the first and second sensors, capable of calculating the excess adhesive thickness through logical operations on the board height and the excess adhesive height, so that the operator can complete the subsequent excess adhesive removal.

[0045] For example, such as Figure 2 As shown, the first sensor can be a board thickness sensor, and the second sensor can be a film thickness sensor. Both the board thickness sensor and the film thickness sensor are mounted on the mounting base. The board thickness sensor is used to detect the edge height of the circuit board under test, and the film thickness sensor is used to detect the excess adhesive height of the circuit board under test.

[0046] For example, in one embodiment, the film thickness sensor is a Keyence coaxial displacement meter. The Keyence coaxial displacement meter can measure height based on the spot of the emitted focused light beam. Furthermore, it can adaptively adjust the focus of the emitted light beam based on the received light beam reflected from the surface of the object being measured, thereby improving measurement accuracy. For example, a Keyence coaxial displacement meter with a range of ±3.5 mm and linearity of ±1 μm is selected, enabling accurate detection even when the circuit board under test has insufficient flatness.

[0047] In this embodiment, by setting a first sensor and a second sensor to detect the edge height and overflow height of the board, the overflow thickness can be calculated and obtained more easily. Furthermore, the first sensor and the second sensor can work simultaneously, which can improve the detection efficiency of the thickness measuring device.

[0048] In one embodiment, the board thickness sensor can be a distance sensor, such as a laser distance sensor, photoelectric sensor, or cylinder sensor. The height of the circuit board under test can be obtained by measuring the difference between the processing platform on which the circuit board is placed and the circuit board itself. Alternatively, the height can be obtained by measuring the distance to the edge region of the circuit board and comparing it with a stored preset distance from the processing platform. Optionally, both the film thickness sensor and the board thickness sensor can be distance sensors, such as laser distance sensors, photoelectric sensors, or cylinder sensors. For example, a Keyence coaxial displacement gauge.

[0049] Furthermore, in one embodiment, such as Figure 2 As shown, the sensing component also includes a carrier block, which is set based on the mounting base and carries the second sensor, so that the second sensor and the first sensor are misaligned based on horizontal height.

[0050] The support block is placed between the second sensor and the mounting base to make the second sensor and the first sensor misaligned based on their horizontal height, forming a fixed horizontal height difference, which facilitates the simultaneous detection of the edge height and excess glue height of the circuit board under test.

[0051] In this embodiment, by setting a support block to make the first sensor and the second sensor form a staggered layout at the same horizontal height, it is beneficial to simultaneously measure different areas of the circuit board under test, realize the simultaneous measurement of the board edge height and the overflow height, and thus improve the detection efficiency of the thickness measuring device.

[0052] In one embodiment, the sensing component further includes a camera connected to a motion component, such that the motion component moves the camera along a first direction. The camera can be used to determine the excess adhesive area of ​​the circuit board under test, enabling the motion component 102 to accurately control the sensing component 104 to move in the first direction, precisely to the corresponding position of the excess adhesive area for detection. The excess adhesive area can be defined as the area where excess adhesive occurs during the lamination process. The sensing component 104 assists in determining the position of the circuit board under test, facilitating the lamination and adhesive removal processes of the circuit board.

[0053] For example, the camera is a CCD camera, such as Figure 2 As shown. Its full name is Charge-Coupled Device (CCD) camera, which is a camera that uses a CCD as an image sensor. It can be used to identify and detect defects, locations, and shapes of circuit boards under test, including but not limited to identifying target holes and glue overflow areas, in order to facilitate target hole positioning and auxiliary measurement.

[0054] In this embodiment, the high-precision visual positioning and real-time quality monitoring of the CCD camera facilitate intelligent path planning, thereby improving the measurement efficiency, processing accuracy, and automation level of the thickness measuring device.

[0055] In one embodiment, such as Figure 2 As shown, the thickness measuring device also includes a first fixed plate and a second fixed plate. The first fixed plate is fixed to the circuit board adhesive removal device and connected to the second fixed plate. The second fixed plate, the motion component, and the sensing component are all disposed on the first fixed plate. The second fixed plate connects the motion component and the sensing component.

[0056] The first and second fixed plates serve as the core support structure, connecting the circuit board adhesive removal equipment, motion components, and sensing components. The first and second fixed plates are fixedly connected and can support different components on different platforms. Furthermore, the camera in the sensing components can be mounted on the first fixed plate, while the first sensor, second sensor, and support block can be mounted on the second fixed plate.

[0057] In this embodiment, the collaborative design of the first fixing plate and the second fixing plate, through structural optimization and functional integration, facilitates the installation and disassembly of the sensing components and motion components, improves the reliability of the setup, and enhances the measurement reliability, motion stability, and maintenance efficiency of the thickness measuring device.

[0058] In one embodiment, the thickness measuring device further includes a dust extraction and sealing component, which is based on a circuit board adhesive removal device and is used to clean dust. Figure 2 , Figure 3 as well as Figure 4 As shown, the dust extraction sealing component is a dust extraction sealing device installed in the circuit board adhesive removal equipment.

[0059] Specifically, the dust extraction and sealing components are key components that ensure the long-term stable operation of the equipment and maintain measurement accuracy. They are mainly used to remove dust / adhesive debris generated during laser adhesive removal or measurement, which helps protect optical components and prevent dust contamination.

[0060] In this embodiment, by setting up a dust extraction and sealing component, dust control and optical protection are achieved, which helps to improve the reliability and stability of laser processing and optimize the performance and service life of laser equipment.

[0061] Based on the same technical concept, this application also provides a circuit board adhesive removal device, which includes an adhesive removal laser and a beam conditioning device. The thickness measuring device described in the above embodiments is disposed on the beam conditioning device and connected to the adhesive removal laser. The adhesive removal laser outputs an adhesive removal laser beam based on the adhesive overflow thickness obtained by the thickness measuring device to remove adhesive from the circuit board to be tested.

[0062] Specifically, the adhesive removal laser is used to remove adhesive from the circuit board under test. The adhesive removal laser generates an adhesive removal laser beam. When this laser beam irradiates the excess adhesive on the circuit board under test, the energy within the laser beam is sufficient to remove the ABF adhesive from the surface of the circuit board. For example, the adhesive removal laser can be a carbon dioxide laser or an ultraviolet laser.

[0063] Specifically, after determining the thickness of the excess adhesive, the adhesive removal laser of the circuit board removal equipment can be adjusted accordingly. The output power of the adhesive removal laser can be adjusted to change its power: the greater the thickness of the excess adhesive, the greater the power of the adhesive removal laser beam, so as to accurately remove the excess adhesive on the circuit board under test and reduce the amount of excess adhesive residue.

[0064] Furthermore, there can be multiple adhesive overflow thicknesses, each corresponding to the adhesive overflow thickness in different areas of the circuit board under test. For different areas, the adhesive removal laser can be adjusted to output different power laser beams based on the different adhesive overflow thicknesses, facilitating accurate adhesive removal and further reducing residual adhesive. For example, regions with different adhesive overflow thicknesses can be divided according to the different edges of the circuit board under test. For instance, the four rectangular sides of the circuit board under test correspond to four regions, with each side divided for detecting adhesive overflow thickness, and the adhesive removal laser outputting a laser beam with a power corresponding to the adhesive overflow thickness. Alternatively, regions can be divided according to the function or circuit structure of different locations on the circuit board under test, with the adhesive overflow thickness detected for each function or circuit structure, and the adhesive removal laser outputting a laser beam with a power corresponding to the adhesive overflow thickness. It should be noted that the circuit board under test can also be divided into more detailed regions, and adhesive overflow thickness can be detected accordingly; however, this will not be elaborated upon here.

[0065] A beam conditioning device, such as a galvanometer, can manipulate the characteristics of a laser beam, including its light beam direction, intensity, frequency, and phase. It allows for precise control of the laser beam's shape, direction, and energy distribution, enabling high-precision processing. By configuring a beam conditioning device, rapid scanning and precise control of the adhesive removal laser beam can be achieved, resulting in efficient adhesive removal from the circuit board under test and improved processing efficiency and quality.

[0066] Furthermore, the beam conditioning device may include laser processing components such as reflectors, optical components, and focusing lenses. The beam conditioning device may also be a galvanometer scanning system including a galvanometer, which achieves mechanical deflection through a galvanometer or rotating mirror, thereby adjusting the deflection direction of the laser beam to achieve laser beam scanning processing of different processing areas and positions on the workpiece. The beam conditioning device may also include optoelectronic control devices such as AOD (Acousto-Optic Deflector) and AOM (Acousto-Optic Modulator) to adjust the power of the adhesive removal laser beam or to shape the laser beam.

[0067] In one embodiment, this application also provides a laser processing device, which includes the circuit board adhesive removal device described in the above embodiments and the thickness measuring device described in the above embodiments.

[0068] In the circuit board manufacturing process, after lamination, target hole positioning, also known as target gripping, is required on the circuit board under test. This involves locating the marked points or target holes on the circuit board to ensure the accurate relative positions of the various parts of the circuit board during lamination and other process steps. These marked points or target holes are referred to as targets and are used as markers on the circuit board under test. Optical, mechanical, or laser methods are used to identify these markers to complete the target hole positioning.

[0069] For example, the circuit board under test can be considered as a flat rectangular object. Target holes can be set at each corner of the rectangle as markers for target positioning. During target hole positioning, the target holes at each corner can be detected, and the circuit board under test can be positioned based on the position of the target holes. Alternatively, specific materials can be pasted, coated, or embedded at each corner of the rectangle as markers for target positioning. In this embodiment, the markers for target hole positioning are not limited to target holes; in practical applications, they can be arbitrarily selected according to processing requirements.

[0070] Optionally, when detecting the position of the target hole, the detection can be achieved by controlling the movement of the circuit board under test or by controlling the movement of the sensor for detecting the target hole, thereby changing the relative position of the circuit board under test and the sensor for detecting the target hole; alternatively, the detection direction of the sensor for detecting the target hole can be deflected, or an additional image analysis device can be set up to capture images of the target hole position. The sensor for detecting the target hole can be a sensing component of the thickness measuring device or another separately installed sensor, which will not be elaborated further here.

[0071] Furthermore, since the markings are usually located in the edge area, the edge area of ​​the circuit board under test needs to be scanned or detected during the target hole positioning process. For example, the spatial position of the circuit board under test may need to be changed so that the markings can be located. Therefore, during the target hole positioning process, the sensing component of the thickness measuring device can also be used to detect the excess adhesive thickness of the circuit board under test. This overlaps the detection time of the excess adhesive thickness with the detection time of the target hole positioning, which helps reduce the time spent on repeated measurements and improves the adhesive removal efficiency.

[0072] Furthermore, in one embodiment, the laser processing equipment may also include a controller connected to the circuit board adhesive removal equipment and the thickness measuring device. The controller may store a control program for executing the target grabbing (one of the process flows in the circuit board processing) and may correspondingly control the output of the adhesive removal laser beam from the circuit board adhesive removal equipment. Furthermore, the controller is connected to the thickness measuring device and can acquire the height of the circuit board to be tested detected by the thickness measuring device, such as the board edge height or the adhesive overflow height. The controller can subtract the board edge height from the detected adhesive overflow height of the circuit board to obtain a determined adhesive overflow thickness and display it to the operator to facilitate the operation of the circuit board adhesive removal equipment.

[0073] Optionally, the controller can store the correspondence between the glue overflow thickness and the laser beam power, and determine the power intensity of the laser beam generated by the glue removal laser in the PCB glue removal equipment based on the glue overflow thickness. When the laser beam emitted by the glue removal laser irradiates the glue overflow area, the glue removal of the PCB under test is completed. Since the power intensity of the laser beam is determined based on the real-time detected glue overflow thickness, laser beams of different intensities can be generated for different glue overflow thicknesses in different areas to accurately remove the glue overflow, thereby reducing residual glue on the surface of the PCB under test and facilitating subsequent secondary lamination processing of the PCB under test.

[0074] Specifically, the target hole positioning process is as described above. During the target hole positioning process, it is necessary to detect the markings (such as target holes) on the circuit board to be tested. At the same time, the first sensor of the thickness measuring device can be controlled to detect the edge height of the circuit board to be tested. The edge height refers to the height of the edge area of ​​the circuit board to be tested. The edge area can be defined as the area where there is no excess glue, usually located near the outer edge of the circuit board to be tested.

[0075] After the target hole positioning is performed and the board height is obtained, it is still necessary to detect the excess adhesive height. Specifically, the second sensor of the thickness measuring device can detect the excess adhesive height of the circuit board under test. That is, the motion component controls the second sensor to move in the first direction to the corresponding position of the excess adhesive detection area, and detects the excess adhesive area. The excess adhesive area can be defined as the area where excess adhesive occurs during the lamination process.

[0076] It should be noted that when the thickness measuring device measures the circuit board under test according to a certain preset path, this preset path can be as follows: Figure 5 As shown, the detection path is consistent with the target hole positioning. After lamination, the surface of the circuit board under test includes the lamination area, the excess adhesive area, and the edge area. When detecting the edge height of the board, the path is completed within the edge area; when detecting the excess adhesive height, the path is completed within the excess adhesive area.

[0077] The thickness measuring device can also move along other preset paths during the detection process. These preset paths pass through the edge region and the excess adhesive region, and can be either a zigzag path or a parallel sinusoidal path between the edge region and the excess adhesive region. Figure 6 As shown, this allows for the simultaneous detection of the board edge height and excess adhesive height during the target hole positioning process.

[0078] Specifically, the target hole positioning process is as described in the previous embodiment. When the circuit board under test is rotated, the thickness measuring device is controlled to move along a set path to detect the edge height of the board surface at different positions and the overflow height of the sub-overflow glue at different positions. Then, the board edge height and overflow glue height are calculated respectively. The specific detection process is as described in the previous embodiment and will not be repeated here.

[0079] Based on the same technical concept, this application can also provide a circuit board processing system, which may include a pressing device and a laser processing device described in the foregoing embodiments. The pressing device is used to press the circuit board to be tested, and the laser processing device is used to perform laser processing on the circuit board to be tested.

[0080] Specifically, the laminating equipment presses together raw materials for circuit boards such as copper foil and carrier boards. Excess adhesive during the laminating process is removed by the circuit board adhesive removal equipment. The laminating equipment can then perform laminating processing again on the circuit board to be tested after adhesive removal.

[0081] It is understood that a circuit board processing system may include an independent processor, which can be used to coordinate the laminating equipment and laser processing equipment within the circuit board processing system; alternatively, the controller in the laser processing equipment can serve as the overall controller of the circuit board processing system, achieving unified control of the laminating equipment and laser processing equipment. Optionally, the controller may be, but is not limited to, various personal computers, laptops, smartphones, and tablets.

[0082] In one embodiment, this application also describes a circuit board that can be processed based on the circuit board processing system described in the foregoing embodiments. The circuit board has accurate glue removal in the lamination process, which improves the lamination quality and thus enhances the performance of the circuit board.

[0083] To better understand the above scheme, combined with Figure 2-4 The circuit board adhesive removal equipment shown will be explained in detail below with reference to a specific embodiment.

[0084] In one embodiment, a circuit board processing system is provided, including a laminating device and a laser processing device. The laser processing device includes a circuit board adhesive removal device and a thickness measuring device. The circuit board adhesive removal device includes an adhesive removal laser and a beam conditioning device. The thickness measuring device is disposed within the beam conditioning device, which is a galvanometer. The thickness measuring device includes a sensing component, a motion component, a dust extraction and sealing component, a first fixed plate, and a second fixed plate. The motion component includes a telescopic component and a driving component. The sensing component includes a first sensor, a second sensor, a camera, a support block, and a mounting base. The telescopic component is a cylinder, the second sensor is a Keyence coaxial displacement meter, and the camera is a CCD camera.

[0085] The lamination equipment laminates the circuit board under test and then performs target hole positioning. During target hole positioning, the first sensor detects the edge height of the circuit board, and the second sensor detects the excess adhesive height. The difference between the two is used as the measured excess adhesive thickness. The setting path for detecting the edge height and excess adhesive height can be as follows: Figure 5 or Figure 6 As shown, staff can also adjust the set path as needed, which will not be elaborated here.

[0086] Once the adhesive overflow thickness is obtained, the operator can determine the corresponding laser adhesive removal power based on the thickness and control the adhesive removal laser to generate an adhesive removal laser beam that matches the laser adhesive removal power. Optionally, the operator can also input the correspondence between the adhesive overflow thickness and the laser adhesive removal power into the controller, which will then select the appropriate laser adhesive removal power to control the adhesive removal laser. With the cooperation of the PCB adhesive removal equipment and the laminating equipment, a PCB based on the PCB processing system is thus produced.

[0087] Optionally, before using the sensing component, its accuracy and reliability can be tested: Operators can place a calibration block (with precise, known height values) on the processing platform and verify the sensing component's detection data based on the calibration block's values. When the detection data and the calibration block's values ​​are within a certain range, they can be considered equal, indicating successful verification and reliable operation of the sensing component, requiring no adjustment. If the deviation between the sensing component's detection data and the calibration block's values ​​exceeds an error threshold, the sensing component is considered faulty and can be replaced.

[0088] In this embodiment, during the lamination process of the circuit board, a sensing component is set up to detect the thickness of the excess adhesive when positioning the target hole, and an adhesive removal laser is set up. The laser beam power of the adhesive removal laser is adjusted according to the thickness of the excess adhesive, which is beneficial to accurately output different laser beams for different thicknesses of excess adhesive, thereby accurately removing the excess adhesive and improving the processing efficiency and quality of the circuit board.

[0089] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0090] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A thickness measuring device, applied to circuit board adhesive removal equipment, characterized in that, It includes a motion component and a sensing component, wherein the motion component is connected to the sensing component and is used to drive the sensing component to move along a first direction, and the sensing component is used to obtain the thickness of the adhesive overflow on the circuit board under test.

2. The thickness measuring device according to claim 1, characterized in that, The sensing component includes a first sensor, a second sensor, and a mounting base. Both the first sensor and the second sensor are mounted on the mounting base, which is connected to the motion component. The first sensor is used to obtain the board surface height of the circuit board under test, and the second sensor is used to obtain the excess adhesive height of the circuit board under test.

3. The thickness measuring device according to claim 2, characterized in that, The sensing component further includes a support block, which is set based on the mounting base and carries the second sensor, causing the second sensor and the first sensor to be misaligned based on horizontal height.

4. The thickness measuring device according to claim 1, characterized in that, The motion component includes a telescopic member, the first end of which is disposed on the circuit board adhesive removal device, and the second end of which is connected to the sensing component.

5. The thickness measuring device according to claim 4, characterized in that, The motion component also includes a drive component for driving the telescopic member to extend and retract.

6. The thickness measuring device according to claim 1, characterized in that, The sensing component also includes a camera connected to the motion component, such that the motion component drives the camera to move along the first direction.

7. The thickness measuring device according to claim 1, characterized in that, The thickness measuring device further includes a first fixing plate and a second fixing plate. The first fixing plate is fixed to the circuit board adhesive removal device and is fixedly connected to the second fixing plate. The second fixing plate, the motion component, and the sensing component are all disposed on the first fixing plate. The second fixing plate connects the motion component and the sensing component.

8. The thickness measuring device according to claim 1, characterized in that, The thickness measuring device also includes a dust extraction and sealing component, which is based on the circuit board adhesive removal equipment and is used to clean dust.

9. A circuit board adhesive removal device, characterized in that, The device includes a glue removal laser and a beam conditioning device. The thickness measuring device as described in any one of claims 1-8 is disposed in the beam conditioning device, and the thickness measuring device is connected to the glue removal laser. The glue removal laser outputs a glue removal laser beam based on the glue overflow thickness obtained by the thickness measuring device to remove glue from the circuit board under test.

10. A laser processing device, characterized in that, It includes the circuit board adhesive removal equipment as described in claim 9 and the thickness measuring device as described in any one of claims 1-8.

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