A vertical inductor

Abstract

This invention discloses a vertical inductor, relating to the field of electronic component technology. The vertical inductor includes a magnetic core assembly, a winding assembly, a base assembly, a pin assembly, and auxiliary functional components. The magnetic core assembly adopts a split-type snap-fit ​​connection structure to ensure magnetic circuit stability; the winding assembly enhances safety through a multi-layer insulation design; the base assembly integrates positioning, heat dissipation, and anti-slip functions; the pin assembly uses a reinforced connection structure to ensure conductivity; and the auxiliary functional components include shielding and over-temperature protection modules. This device, through multi-dimensional optimization, significantly improves inductance stability, heat dissipation efficiency, installation reliability, and anti-interference capability, making it suitable for high-precision electronic circuits.

Description

Technical Field

[0001] This invention belongs to the field of electronic component technology, and in particular relates to a vertical inductor. Background Technology

[0002] Inductors, as key passive components in electronic circuits, directly affect the stability and reliability of the circuit. Vertical inductors, due to their compact structure, high mounting density, and flexible magnetic circuit design, are widely used in miniaturized electronic devices. However, existing vertical inductors still face several technical bottlenecks in practical applications:

[0003] Insufficient stability of the magnetic core structure: Traditional vertical inductors often use a single magnetic core or a single set of snap-fit ​​connections. A single magnetic core makes winding difficult, while a single set of snap-fit ​​connections is prone to loosening under vibration, causing changes in the air gap of the magnetic circuit, and inductance drift of ±5% or more. Some products use glue to bond the magnetic core, and glue aging under high temperature conditions can cause the magnetic core to separate, seriously affecting reliability.

[0004] Limitations in heat dissipation: Copper and iron losses during inductor operation generate a large amount of heat. Existing products rely on natural convection for heat dissipation, and the magnetic core and base are mostly in point contact, resulting in thermal resistance as high as 15-20℃ / W. In high-power applications (such as above 10A), the temperature can rise to over 80℃, leading to aging of the enameled wire insulation and a lifespan reduction of more than 50%. Utility Model Content

[0005] The summary section of this application is intended to provide a brief overview of the concepts, which will be described in detail in the detailed description section below. This summary section is not intended to identify key or essential features of the claimed technical solutions, nor is it intended to limit the scope of the claimed technical solutions.

[0006] In order to overcome the shortcomings of the prior art, the present invention provides a vertical inductor.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: a vertical inductor, comprising a core assembly, a winding assembly, a base assembly, and a pin assembly. The core assembly consists of an upper core and a lower core. The bottom of the upper core has a stepped protrusion, and the top of the lower core has a matching stepped groove. The protrusion and the groove are connected by symmetrically arranged snap fasteners. The snap fasteners include wedge-shaped heads on both sides of the protrusion and wedge-shaped slots on the inner wall of the groove. The winding assembly comprises a frame, a winding body, and an insulating layer. The frame is fitted onto the middle of the lower core, and the winding body is wound... The insulating layer is wrapped around the outer circumference of the winding body within a spiral groove. The base assembly includes a base body, a positioning groove, and heat dissipation fins. The positioning groove is located at the center of the top surface of the base body. The bottom of the lower magnetic core is embedded in the positioning groove and fixed with high-temperature resistant adhesive. The heat dissipation fins are evenly distributed on both sides of the base body. The pin assembly includes two L-shaped pins. The vertical section of the pins penetrates the base body and is welded to the lead wire of the winding body, while the horizontal section is the welding end. The magnetic core assembly is wrapped with a shielding layer, and a silicone anti-slip pad is provided on the bottom of the base body.

[0008] Furthermore, the upper and lower magnetic cores are made of nickel-zinc ferrite material, and the surface of the magnetic cores is coated with an epoxy resin insulating layer. A circular weight-reducing hole is provided at the center of the top of the upper magnetic core.

[0009] Furthermore, the skeleton is made of LCP liquid crystal polymer material, and the skeleton is provided with annular baffles at both ends. The inner side of the baffles is provided with guide slopes. The groove spacing of the spiral groove is 0.3-0.5mm, and the groove depth is 1.2-1.5 times the diameter of the wire.

[0010] Furthermore, the winding body is made of multi-strand stranded enameled wire, the enameled layer of the wire is made of polyimide, and a polytetrafluoroethylene separator is provided between the winding body and the frame.

[0011] Furthermore, the insulating layer consists of a polyester film layer, a fiberglass cloth layer, and a silicone coating layer from the inside out, and the surface of the insulating layer is printed with a temperature resistance mark.

[0012] Furthermore, the base body is made of aluminum alloy with an anodized surface, and the inner wall of the positioning groove is provided with a ceramic insulating bushing.

[0013] Furthermore, the pins are made of oxygen-free copper and have a silver plating layer on their surface. The vertical section has two annular bosses, which are integrally molded with the base body. The horizontal section has spherical solder joints at its ends.

[0014] Furthermore, the shielding layer is made of permalloy foil, an air gap is left between the shielding layer and the magnetic core assembly, and the bottom of the shielding layer is connected to the base body by conductive adhesive.

[0015] Furthermore, the surface of the silicone anti-slip mat is provided with diamond-shaped anti-slip patterns, and the anti-slip mat is fixed to the base body by double-sided adhesive, with positioning protrusions at the four corners.

[0016] Furthermore, the vertical inductor also includes an over-temperature protection component, which includes an NTCthermistor attached to the outside of the winding assembly and a thermal fuse connected in series with the pin assembly. The NTCthermistor is led out to a test point on the side of the base body via a wire.

[0017] The advantages of this invention are:

[0018] Significantly improved magnetic circuit stability: The stepped concave-convex design with double snap-fit ​​connection ensures a core mating accuracy of 0.01mm, and inductance drift under vibration is ≤±0.8% (compared to ±5% for traditional products), making it suitable for precision oscillation circuits. The nickel-zinc ferrite material expands the high-frequency application range (1-100MHz), increasing the upper limit by 10 times compared to manganese-zinc ferrite.

[0019] Doubled heat dissipation efficiency: The aluminum alloy base + fin design increases the heat dissipation area by 200%, and the ceramic bushing contact design between the magnetic core and the base reduces the thermal resistance to 7℃ / W (18℃ / W for traditional products). The operating temperature at 10A current is only 55℃, which is 30℃ lower than similar products, and the enameled wire life is extended by more than 2 times. Attached Figure Description

[0020] The accompanying drawings, which form part of this application, are used to provide a further understanding of the application and to make other features, objects, and advantages of the application more apparent. The illustrative embodiments and descriptions of this application are used to explain the application and do not constitute an undue limitation of the application.

[0021] Furthermore, throughout the accompanying drawings, the same or similar reference numerals denote the same or similar elements. It should be understood that the drawings are schematic, and the elements are not necessarily drawn to scale.

[0022] In the attached diagram:

[0023] Figure 1 This is a schematic diagram of the structure of a vertical inductor in one embodiment of the present invention.

[0024] Figure 2 for Figure 1 A cross-sectional view of the vertical inductor in the illustrated embodiment.

[0025] Figure 3 for Figure 2 Enlarged view of point A in the image.

[0026] The meanings of the reference numerals in the figure are as follows:

[0027] 101. Base body; 102. Upper magnetic core; 103. Pin; 104. Heat sink fins; 105. Lower magnetic core; 106. Annular boss; 107. Protrusion; 108. Groove; 109. Locking block; 110. Locking slot; 111. Frame; 112. Winding body; 113. Helical groove; 114. Annular baffle; 115. Anti-slip pad. Detailed Implementation

[0028] Embodiments of this disclosure will now be described in more detail with reference to the accompanying drawings. While some embodiments of this disclosure are shown in the drawings, it should be understood that this disclosure can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of this disclosure. It should be understood that the accompanying drawings and embodiments of this disclosure are for illustrative purposes only and are not intended to limit the scope of protection of this disclosure.

[0029] It should also be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings. Unless otherwise specified, the embodiments and features described in this disclosure can be combined with each other.

[0030] It should be noted that the concepts of "first" and "second" mentioned in this disclosure are used only to distinguish different devices, modules or units, and are not used to limit the order of functions performed by these devices, modules or units or their interdependencies.

[0031] It should be noted that the terms "a" and "a plurality of" used in this disclosure are illustrative rather than restrictive, and those skilled in the art should understand that, unless otherwise expressly indicated in the context, they should be understood as "one or more".

[0032] The names of messages or information exchanged between multiple devices in the embodiments of this disclosure are for illustrative purposes only and are not intended to limit the scope of such messages or information.

[0033] This disclosure will now be described in detail with reference to the accompanying drawings and embodiments.

[0034] like Figures 1-3 As shown, a vertical inductor includes a core assembly, a winding assembly, a base assembly, a pin 103 assembly, and auxiliary function components.

[0035] The magnetic core assembly is the core component that determines the inductance. It adopts a split structure design and consists of an upper magnetic core 102 and a lower magnetic core 105.

[0036] Material selection: Nickel-zinc ferrite (NXO-100) is used, with an initial permeability μi=1000±20% and a Curie temperature ≥200℃, which has better high-frequency characteristics than traditional manganese-zinc ferrite (applicable frequency 1-100MHz).

[0037] Structural design: The bottom of the upper magnetic core 102 is designed with a stepped protrusion 107, and the top of the lower magnetic core 105 is a matching stepped groove 108. Precise docking is achieved through dual positioning, and the air gap control accuracy can reach ±0.01mm.

[0038] Connection method: The elastic buckles are symmetrically arranged (one set on the left and one on the right). The buckles are composed of wedge-shaped buckles (30° angle) on both sides of the protrusion 107 and wedge-shaped buckles 110 on the inner wall of the groove 108. After engagement, the axial tensile force is ≥10N and there is no loosening after vibration test (10-2000Hz, 10g acceleration).

[0039] Auxiliary design: A Φ3mm weight-reducing hole is set at the center of the top of the upper magnetic core 102 to reduce weight and wind resistance; the surface of the magnetic core is coated with a 0.08mm thick epoxy resin insulating layer with a volume resistivity ≥10. 14 Ω・cm.

[0040] The winding assembly is responsible for current conduction and magnetic energy conversion, and adopts a multi-layer insulation reinforcement design:

[0041] The skeleton 111 structure uses an LCP liquid crystal polymer skeleton 111, which has a heat distortion temperature ≥280℃ and a linear expansion coefficient of 15ppm / ℃ (close to that of a magnetic core), thus reducing temperature stress. The outer circumference of the skeleton 111 is provided with a spiral groove 113, with a groove spacing of 0.4mm and a groove depth of 0.15mm (suitable for 0.1mm wire diameter). The annular baffles 114 at both ends are 2mm high, and the inner guide slope (45°) facilitates the start of winding.

[0042] Winding body 112: Uses 7 strands of stranded enameled wire (each strand Φ0.1mm), with a total cross-sectional area of ​​0.055mm². 2 It has a current carrying capacity of up to 1.5A (temperature rise ≤40℃). The enameled layer is made of polyimide, with a temperature resistance rating of 220℃ and a breakdown voltage ≥3000V.

[0043] Insulation layer:

[0044] Bottom layer: A 0.1mm polytetrafluoroethylene (PTFE) separator (temperature resistant 260℃) is provided between the winding and the bobbin 111.

[0045] Interlayer: A 0.05mm polyester film pad is placed every 5 layers;

[0046] Outer layer: from the inside out, it consists of a polyester film layer (0.08mm), a fiberglass cloth layer (0.1mm), and a silicone coating (0.1mm), with a total insulation thickness of 0.28mm and a withstand voltage of ≥1500VAC.

[0047] The base assembly provides support, heat dissipation, and positioning.

[0048] Base body 101: Made of 6061 aluminum alloy (thermal conductivity 160W / m・K), with anodized surface (15μm thickness) to improve corrosion resistance. Base dimensions: 20×15×8mm, weight ≤15g.

[0049] Positioning structure: A positioning groove (Φ8×3mm) is opened in the center of the top surface, and a 0.5mm thick ceramic bushing (Al2O3) is embedded in the inner wall to ensure insulation (breakdown strength ≥10kV / mm) and improve thermal conductivity. After the bottom of the lower magnetic core 105 is embedded in the positioning groove, it is bonded with high-temperature resistant silicone rubber (temperature resistance 200℃) with a bonding strength ≥2MPa.

[0050] Heat dissipation design: Eight heat dissipation fins are symmetrically distributed on both sides of the base. Each fin is 5×3×1mm (height×width×thickness) with a spacing of 3.5mm, increasing the heat dissipation area to twice the surface area of ​​the base and reducing the thermal resistance to 7℃ / W.

[0051] The pin 103 assembly ensures current conduction and mechanical fixation:

[0052] Pin 103 structure: L-shaped oxygen-free copper pin 103 (purity 99.95%), vertical section length 8mm, horizontal section length 5mm. The vertical section is provided with two annular bosses 106 (Φ2mm), which are integrally injection molded with the base, increasing the pull-out force to 8N (the traditional structure is only 3N).

[0053] Surface treatment: Overall silver plating (4μm thickness), contact resistance ≤1mΩ, and spherical solder joints (Φ1.5mm) on the welding end (horizontal section) to enhance the welding reliability with the PCB board.

[0054] Shielding layer: The magnetic core assembly is wrapped with 0.12mm thick permalloy (Ni80Fe20) foil, with a 0.25mm air gap between the shielding layer and the magnetic core (to reduce eddy current losses). The bottom is sealed with conductive adhesive (volume resistivity ≤10⁻). 3 (Ω・cm) is connected to the base to achieve grounding shielding, and leakage magnetic flux attenuation ≥40dB.

[0055] Anti-slip structure: A 1.2mm thick silicone anti-slip pad 115 is pasted on the bottom of the base. The surface has a diamond pattern (2mm side length, 0.2mm depth) and a friction coefficient ≥0.8. It is soldered with pin 103 and can withstand 10g acceleration vibration without displacement.

[0056] Over-temperature protection:

[0057] The NTCthermistor (accuracy ±1%) is attached to the outside of the winding, with a monitoring range of -55~125℃, and is led out to the test point on the side of the base through 0.1mm enameled wire;

[0058] A thermal fuse (blows at 130℃) is connected in series in the vertical segment of pin 103, with a response time of ≤5s to prevent overheating failure.

[0059] This utility model, through systematic optimization, possesses the following significant advantages:

[0060] Significantly improved magnetic circuit stability: The stepped concave-convex design with double snap-fit ​​connection ensures a core mating accuracy of 0.01mm, and inductance drift under vibration is ≤±0.8% (compared to ±5% for traditional products), making it suitable for precision oscillation circuits. The nickel-zinc ferrite material expands the high-frequency application range (1-100MHz), increasing the upper limit by 10 times compared to manganese-zinc ferrite.

[0061] Doubled heat dissipation efficiency: The aluminum alloy base + fin design increases the heat dissipation area by 200%, and the ceramic bushing contact design between the magnetic core and the base reduces the thermal resistance to 7℃ / W (18℃ / W for traditional products). The operating temperature at 10A current is only 55℃, which is 30℃ lower than similar products, and the enameled wire life is extended by more than 2 times.

[0062] Enhanced anti-interference capability: The permalloy shielding layer reduces the leakage magnetic flux density to 0.8mT (at 5cm), which is 40dB lower than the unshielded design, reducing electromagnetic interference to surrounding components and meeting Class BEMI standard requirements.

[0063] Improved insulation reliability: The three-layer composite insulation system enables a withstand voltage of up to 1500VAC and an insulation resistance of ≥1500MΩ (compared to 500MΩ for traditional products). It also passed a 1000-hour damp heat test (40℃, 95%RH) without any breakdown.

[0064] Enhanced mechanical strength: The dual-protrusion pin 103 design increases the pull-out force to 8N, and the silicone anti-slip pad 115 + positioning groove fixation achieves zero displacement after vibration testing (10-2000Hz), with a tilt angle ≤0.5°, making it suitable for vibration environments such as automotive electronics.

[0065] Enhanced safety redundancy: Integrated NTC temperature measurement and 130℃ temperature fuse enable dual functions of over-temperature warning and protection, with a response time of ≤5s, eliminating fire hazards and meeting UL60950 safety standards.

[0066] Material compatibility optimization: The thermal expansion coefficients of LCP skeleton 111 (15ppm / ℃) and nickel-zinc ferrite (10ppm / ℃) are matched. No cracking was observed after temperature cycling test (1000 cycles) from -40℃ to 125℃, and the failure rate was reduced to below 0.1%.

[0067] The above description is merely a selection of preferred embodiments of this disclosure and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in the embodiments of this disclosure is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the above-described inventive concept. For example, technical solutions formed by substituting the above-described features with (but not limited to) technical features with similar functions disclosed in the embodiments of this disclosure.

Claims

1. A vertical inductor, comprising a core assembly, a winding assembly, a base assembly, and a lead assembly, characterized in that: The magnetic core assembly consists of an upper magnetic core and a lower magnetic core. The upper magnetic core has a stepped protrusion at its bottom, and the lower magnetic core has a matching stepped groove at its top. The protrusion and groove are connected by symmetrically arranged snap fasteners. The snap fasteners include wedge-shaped heads on both sides of the protrusion and wedge-shaped slots on the inner wall of the groove. The winding assembly includes a skeleton, a winding body, and an insulating layer. The skeleton is fitted into the middle of the lower magnetic core, and the winding body is wound in a spiral groove on the outer circumference of the skeleton. The insulating layer wraps around the outside of the winding body. The base assembly includes a base body, a positioning groove, and heat dissipation fins. The positioning groove is located at the center of the top surface of the base body. The bottom of the lower magnetic core is embedded in the positioning groove and fixed with high-temperature resistant adhesive. The heat dissipation fins are evenly distributed on both sides of the base body. The pin assembly includes two L-shaped pins. The vertical section of the pins penetrates the base body and is welded to the lead wire of the winding body, while the horizontal section is the welding end. The magnetic core assembly is wrapped with a shielding layer, and the bottom of the base body is provided with a silicone anti-slip pad.

2. The vertical inductor according to claim 1, characterized in that: The upper and lower magnetic cores are made of nickel-zinc ferrite material, and the surface of the magnetic cores is coated with an epoxy resin insulating layer. A circular weight-reducing hole is provided at the center of the top of the upper magnetic core.

3. The vertical inductor according to claim 1, characterized in that: The skeleton is made of LCP liquid crystal polymer material. The skeleton has annular baffles at both ends and guide slopes on the inner side of the baffles. The groove spacing of the spiral groove is 0.3-0.5mm and the groove depth is 1.2-1.5 times the diameter of the wire.

4. The vertical inductor according to claim 1, characterized in that: The winding body is made of multi-strand stranded enameled wire, the enameled layer of which is made of polyimide, and a polytetrafluoroethylene separator is provided between the winding body and the frame.

5. The vertical inductor according to claim 1, characterized in that: The insulating layer consists of a polyester film layer, a fiberglass cloth layer, and a silicone coating layer from the inside out, and the surface of the insulating layer is printed with a temperature resistance mark.

6. The vertical inductor according to claim 1, characterized in that: The base body is made of aluminum alloy with an anodized surface, and the inner wall of the positioning groove is equipped with a ceramic insulating bushing.

7. The vertical inductor according to claim 1, characterized in that: The pins are made of oxygen-free copper and have a silver plating layer on the surface. The vertical section has two annular protrusions, which are integrally molded with the base body. The horizontal section has spherical solder joints at the end.

8. The vertical inductor according to claim 1, characterized in that: The shielding layer is made of permalloy foil, and an air gap is left between the shielding layer and the magnetic core assembly. The bottom of the shielding layer is connected to the base body by conductive adhesive.

9. The vertical inductor according to claim 1, characterized in that: The surface of the silicone anti-slip mat is provided with diamond-shaped anti-slip texture. The anti-slip mat is fixed to the base body by double-sided adhesive, and positioning protrusions are provided at the four corners.

10. The vertical inductor according to claim 1, characterized in that: It also includes an over-temperature protection component, which includes an NTCthermistor attached to the outside of the winding assembly and a thermal fuse connected in series with the pin assembly. The NTCthermistor is led out to a test point on the side of the base body via a wire.

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