Module housing of interconnection module assembly (including interconnection module, ring socket and its components)
CN309070905SActive Publication Date: 2025-01-14SAMTEC INC
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Patent Information
- Application Number
- CN202330505171.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Priority Date
- 2023-06-29
- Filing Date
- 2023-08-09
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2038-08-09
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Figure 000007_ABST
Abstract
1. Name of the product of this design: Module housing of an interconnection module assembly (including interconnection modules, ring sockets and their components). 2. Purpose of the product of this design: The overall purpose is for an interconnection module assembly, including an interconnection module configured to cooperate with a ring socket, and a ring socket configured to cooperate with the interconnection module. In particular, it is used for components of interconnection modules in the form of optical transceivers, module housings of interconnection modules, components of interconnection modules in the form of electrical transceivers, components of ring sockets, latches of ring sockets and cable latches of interconnection modules in the form of optical transceivers; local use is the module housing of the interconnection module assembly. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: Stereoscopic diagram 1. 5. Other situations requiring explanation Other explanations: Dashed lines do not constitute part of the design, and dot-dash lines indicate design boundaries that do not constitute part of the design.
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