Chip Tin - Planting Positioning Tweezers

CN309339831SActive Publication Date: 2025-06-17GUANGZHOU XINXUN VENTURE CAPITAL TECH CO LTD
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Patent Information

Application Number
CN202430624303.5
Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Filing Date
2024-09-30
Publication Date
2025-06-17
Estimated Expiration
2039-09-30

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Abstract

1. Name of the Design Product: Chip Solder Paste Positioning Tweezers. 2. Use of the Design Product: Used for clamping chips and applying solder paste. 3. Design Key Points of the Design Product: Lies in the shape. 4. Picture or Photo that Best Illustrates the Design Key Points: Perspective view.
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