integrated circuit package
CN309456520SActive Publication Date: 2025-08-22NORTH CHINA UNIVERSITY OF TECHNOLOGY
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Patent Information
- Application Number
- CN202430800004.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-17
- Publication Date
- 2025-08-22
- Estimated Expiration
- 2039-12-17
Smart Images
Figure 000007_ABST
Abstract
1. Name of the product of this design: integrated circuit package. 2. Purpose of this design product: used to encapsulate and protect integrated circuits. 3. The key point of the design of this product lies in its shape. 4. The picture or photo that best illustrates the design points: Stereoscopic drawing 1.
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