Microjet laser machining apparatus
CN309778266SActive Publication Date: 2026-02-06西安晟光硅研半导体科技有限公司
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Patent Information
- Application Number
- CN202530237982.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-28
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2040-04-28
Smart Images
Figure 000007_ABST
Abstract
1. The name of the design product: micro-jet laser processing equipment. 2. The use of the design product: for laser shock peening processing. 3. The design points of the design product: in the combination of shape and pattern. 4. The picture or photo that best shows the design points: perspective view.
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