Cooled infrared thermal imager (miniaturized)
CN309916106SActive Publication Date: 2026-04-14BEIJING BOP OPTO-ELECTRONICS TECH CO
View PDF 0 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- BEIJING BOP OPTO-ELECTRONICS TECH CO
- Filing Date
- 2025-10-17
- Publication Date
- 2026-04-14
Smart Images

Figure 000001_ABST
Abstract
1. Name of the product in this design: Cooled Infrared Thermal Imager (Miniaturized). 2. Application of this design: for long-range reconnaissance, weapon guidance, and battlefield night vision. It enables remote, non-contact fault diagnosis of precision equipment such as high-voltage power grids and aero engines, capturing subtle potential overheating hazards. 3. The key design features of this product are its overall shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.
Need to check novelty before this filing date? Find Prior Art