Memory heatsink
CN309917405SActive Publication Date: 2026-04-14DONGGUAN CHANGXING FUTURE ELECTRONIC TECHNOLOGY CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- DONGGUAN CHANGXING FUTURE ELECTRONIC TECHNOLOGY CO LTD
- Filing Date
- 2025-03-06
- Publication Date
- 2026-04-14
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Figure 000007_ABST
Abstract
1. Name of this product design: Memory Heatsink. 2. Purpose of this design: This design is used for heatsinks on computer case memory. 3. The key design features of this product are the combination of shape and pattern. 4. The image or photograph that best illustrates the design's key points: a 3D model.
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