Bluetooth headset component (D08)
CN309989971SActive Publication Date: 2026-05-19DONGGUAN DUCAI ELECTRONICS CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- DONGGUAN DUCAI ELECTRONICS CO LTD
- Filing Date
- 2025-11-13
- Publication Date
- 2026-05-19
Smart Images
Figure 000025_ABST
Abstract
1. Name of the product in this design: Bluetooth headset assembly (D08). 2. Intended use of this design: for wireless communication, audio playback, headphone storage and charging, etc. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design points: 3D diagram of the combined state 1.
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