Power device of a pcb embedded power module
CN310007717SActive Publication Date: 2026-05-29HANGZHOU SILAN MICROELECTRONICS CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- HANGZHOU SILAN MICROELECTRONICS CO LTD
- Filing Date
- 2025-10-11
- Publication Date
- 2026-05-29
Smart Images
Figure 000007_ABST
Abstract
1. The name of the design product: power device of PCB embedded power module. 2. The use of the design product: for PCB embedded power module. 3. The design points of the design product: in shape. 4. The picture or photo that can best show the design points: design 1 perspective view. 5. Designate design 1 as the basic design. 6. Other circumstances that need to be explained: designs 2 to 4 are similar designs of design 1.
Need to check novelty before this filing date? Find Prior Art