Leek packing device
CN310018932SActive Publication Date: 2026-06-05YIWU INDAL & COMMERICAL COLLEGE
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- YIWU INDAL & COMMERICAL COLLEGE
- Filing Date
- 2025-11-23
- Publication Date
- 2026-06-05
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Figure 000007_ABST
Abstract
1. The name of the present design: leek packing device. 2. The use of the present design product: belongs to tool class product, mainly used for arranging and packing leek. 3. The design points of the present design product: in its overall shape. 4. The picture or photo that can best show the points of the present design: perspective view.
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