Memory model (3D stacked NAND)

CN310046776SActive Publication Date: 2026-06-23冯翔
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
冯翔
Filing Date
2025-12-04
Publication Date
2026-06-23

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Abstract

1. Name of the product in this design: Memory Model (3D Stacked NAND). 2. Purpose of this design: For use in 3D stacked NAND memory models. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.
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