Badge heat transfer mold

CN310059575SActive Publication Date: 2026-06-30HUNAN SIJIU TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
HUNAN SIJIU TECH CO LTD
Filing Date
2025-07-09
Publication Date
2026-06-30

Smart Images

  • Figure 000005_ABST
    Figure 000005_ABST
Patent Text Reader

Abstract

1. Name of this design product: Badge heat transfer mold. 2. Purpose of this design: To mount badges during vacuum heat transfer printing of badges. 3. The key design feature of this product is its shape. 4. The picture or photo that best illustrates the key design points: Design 1 3D diagram 1. 5. Design 1 is designated as the basic design.
Need to check novelty before this filing date? Find Prior Art