Memory module casing
CN310070078SActive Publication Date: 2026-07-03SHENZHEN CHUQI TECHNOLOGY CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- SHENZHEN CHUQI TECHNOLOGY CO LTD
- Filing Date
- 2026-01-22
- Publication Date
- 2026-07-03
Smart Images
Figure 000007_ABST
Abstract
1. Name of this design product: Memory module casing. 2. Purpose of this product design: To be installed on the exterior of a memory module for protection and heat dissipation. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.
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