Heat sink (magnetic semiconductor astronaut spin cap)

CN310077145SActive Publication Date: 2026-07-07曾银平
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
曾银平
Filing Date
2025-12-23
Publication Date
2026-07-07

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Abstract

1. The name of the design product: heat sink (magnetic semiconductor astronaut spin cap type). 2. The use of the design product: heat dissipation products for cooling mobile phones. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view 1.
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