Molded housing for light-emitting device and light-emitting device that uses this

Abstract

Mold housing comprising: a mold resin with a recessed section on its upper surface to accommodate a light-emitting component; and a wire partially exposed from a lower surface of the recessed section of the mold resin and extending under a side wall of the recessed section and electrically connected to the light-emitting component;wherein the wire has at least partially formed a groove on a surface of the wire along the side wall, wherein the groove has an inner upper edge and an outer upper edge and is filled with the molding resin such that the inner upper edge is exposed from the lower surface of the recessed section and the upper edge is embedded in the molding resin,(a) wherein the wire comprises a first wire and a second wire spaced apart from each other at the lower surface of the recessed section of the molding resin and the rear surface of the molding resin and exposed from the lower surface and the rear surface;and (b) wherein the wire further comprises an additional groove formed on a surface of the first wire along one side of the first wire, which is arranged on the opposite side of the second wire, the additional groove being completely exposed from the lower surface of the recessed section of the molding resin; (c) wherein the first wire has a rear surface recessed section extending from an edge of the exposed rear surface section towards the front surface side of the first wire, the rear surface recessed section being covered with the molding resin; and (d) wherein a section of the additional groove is formed immediately above the rear surface recessed section.

Description

The present invention relates to a molded housing for a light-emitting device and a light-emitting device that uses this. A frame-insert resin housing for a light-emitting device is known, having a design in which a wire is exposed from a rear surface of a molded resin to enable effective heat dissipation from a light-emitting component mounted on a recessed section of the housing, via the wire to a mounted substrate (see JP 2008-251937 A). Such a housing, in which the formation of an anchoring groove on the wire and the subsequent filling of the molded resin into the anchoring groove result in a larger adhesion area between the wire and the molded resin, is also known (see, for example, JP 2011-146524 A). In the light-emitting device of JP 2008-251937 A, an interface between the wire and the resin is exposed to both a rear surface of the housing and the interior of a recessed section. When the light-emitting device is mounted on a substrate, reflow-melted flux tends to penetrate the interface exposed to a rear surface of the housing. The flux is a component generally mixed with solder to improve its wettability. This flux penetration exacerbates a problem that leads to deterioration of adhesion between the wire and the resin. If the flux reaches the interior of the recessed section of the resin housing along the interface, it further intensifies the problem of the flux absorbing light from the light-emitting device. The light-emitting device of JP 2011-146524 A can be configured to extend the path of the solder entering through the interface (between the wire and the molding resin), which is exposed to the rear surface of the housing, until it reaches the interior of the recessed section, thus filling the molding resin into the anchoring groove formed on the wire. Therefore, the soldering flux can barely reach the interior of the recessed section. However, if a large amount of soldering flux enters the interface, the flux will penetrate into the recessed section. On the other hand, another problem is that a burr of molding resin forms in the recessed section of the housing. As shown in Fig. 16, a mold resin 110 of a mold housing 100 is produced according to a molding process using a metal mold 90, which consists of an upper metal mold 91 and a lower metal mold 92. In particular, a space of the metal mold 90 is filled with molten resin, while the wires 200 and 300 are held between the upper metal mold 91 and the lower metal mold 92. The upper metal mold 91 has a convex section 93, which corresponds to a recessed section 120 of the mold resin 110. It is desirable that no penetration of the mold resin occurs in an area (i.e., the metal mold-wire contact area) where a surface of the convex section 93 and surfaces of the wires 200 and 300 directly touch each other. However, a chamfer (i.e., a bevel) is provided at corners 93c of the convex section 93 of the upper metal mold 91.an R-bevel or C-bevel is provided, which is intended to improve the removability of the upper metal form 91. When the metal form 90 is used for forming, a burr of the molding resin 110 is formed on the surfaces of the wires 200 and 300 that are exposed to the recessed section 120 of the molding resin 110 (see Fig. 17 and Fig. 18). The burr may be formed for the reasons described below. If, as shown in Fig. 19, the corner 93c of the convex section 93 of the upper metal mold 91 is chamfered, a recess CL with a steep angle is created between the corner 93c and each of the wires 200 and 300. After the molten resin is injected into the metal mold 90, a concentric stress is applied by the molten resin to a top surface of the recess CL, causing the resin to ooze out from a top surface of the recess CL into a metal mold-wire contact area. The resin oozing out from the top surface of the recess CL becomes a burr 80 after the molten resin has cured. The spread of the burr 80 over the wires 200 and 300 causes poor bonding after chip bonding between the first wire 200 and the light-emitting component, and poor bonding after wire bonding between the second wire 300 and the light-emitting component. Since the burr 80 forms an irregular shape, it causes a cosmetic defect in the recessed section 120 of the mold housing 100 when viewed from its top (see Fig. 17). JP 2011-119 557 A describes a light-emitting device and a method for its manufacture, wherein reflectors are provided that surround the light-emitting elements. JP 2011-151 069 A describes a conductor frame with a resin that prevents an outer resin section from falling out of a space between a chip pad and a conductor. JP 2011-146 524 A describes a conductor frame and a method for its manufacture, which can reduce the thickness of the semiconductor device without affecting the handling properties of the conductor frame. Consequently, it is an object of the present invention to provide a mold housing that is capable of effectively preventing the soldering flux from entering the recessed section of the mold housing and that is capable of preventing the burr of the mold resin from forming in the recessed section. The task can be accomplished by the features defined in the patent claims. The invention relates to a mold housing comprising a molding resin with a depression on its upper surface section for receiving a light-emitting component, and a wire which is partially exposed from a lower surface of the depression section of the molding resin and extends under a side wall of the depression section and is electrically connected to the light-emitting component, wherein the wire has at least partially formed a groove on the surface of the wire along the side wall, wherein the groove has an inner upper edge and an outer upper edge and is filled with the molding resin, such that the inner upper edge is exposed from a lower surface of the depression section, and the upper edge is embedded in the molten resin.The wire comprises a first wire and a second wire spaced apart from each other at the lower surface of the recessed portion of the mold resin and the rear surface of the mold resin, and exposed from both the lower and rear surfaces. The wire further comprises an additional groove formed on a surface of the first wire along one side of the first wire, which is located on the opposite side of the second wire, the additional groove being fully exposed from the lower surface of the recessed portion of the mold resin. The first wire has a rear surface recessed portion extending from an edge of the exposed rear surface recessed portion toward the front surface of the first wire, the rear surface recessed portion being covered by the mold resin.A section of the additional groove is formed directly above the rear surface recess section. A light-emitting device utilizing the mold housing according to the present invention comprises the mold housing described above, the light-emitting component mounted on the exposed surface of the wire within the recess section, and a sealing resin for sealing the recess section. In the present description, technical terms such as "inside", "outside", "top edge" and "bottom" indicate a position and direction in relation to the center of the lower surface of the depression section. In the present invention, the “inner upper edge” of the groove is an edge section near the center of the lower surface of the recessed section of the molding resin between two edge sections (i.e., upper edges) that are opposite each other in a width direction in an opening of the groove, and the “outer upper edge” indicates an edge section away from the center of the lower surface of the recessed section of the molding resin. In the mold housing of the present invention, the inner upper edge of the groove is exposed to the lower surface of the recessed section of the mold resin, and the outer upper edge of the groove is embedded in the mold resin. The groove is filled with the mold resin. Viewed in cross-section, the mold resin filled into the groove (i.e., a section of the groove filled with resin) is therefore connected to a body of the mold resin on one side of the outer upper edge and is exposed to the lower surface of the recessed section on the side of the inner upper edge. The "groove" of the present invention refers to a groove formed into a recess and constructed such that, within the opening of the wire surface, a side wall of the recessed section of the molding resin faces an inner upper edge. Preferably, the opening of the groove has an almost constant width across the groove. However, the distance between the side wall of the recessed section of the molding resin and the inner upper edge, as well as the width of the opening, can be varied so that they are partially larger or smaller. In the case of manufacturing the light-emitting device using the mold housing described above, the recessed section of the mold housing is sealed with the sealing resin. When the light-emitting device is subjected to reflow soldering after the mold housing has been sealed, the sealing resin in the recessed section expands, pushing the side wall of the recessed section and the bottom surface outward and downward. Furthermore, as the mold resin also expands, the portion of the groove filled with resin pushes the side surfaces and the bottom surface within the groove. Finally, the portion of the groove filled with resin is pushed by the expanded sealing resin because it is in contact with the sealing resin.In other words, due to the synergistic effect between the expansion of the sealing resin and the expansion of the section of the groove filled with resin, the stress exerted downwards (i.e., towards the lower surface of the groove) by the resin-filled section of the groove is increased. After the soldering flux penetrates, it passes between the resin-filled section of the groove and the lower surface of the groove. However, while the soldering flux is in a molten state (i.e., undergoing reflow soldering), the adhesion, particularly between the resin-filled groove and the lower surface of the groove, becomes stronger at the interface. This is because the resin-filled section of the groove is pressed towards the lower surface of the groove due to the expansion of the sealing resin and the resin-filled section of the groove, thus offering greater resistance to the penetration of the soldering flux. In the mold housing of the present invention, the groove, during the molding of the resin, comes into a position directly below the corners of the convex section of the upper metal mold. Therefore, even at the corners of the convex section, which are subjected to chamfering, no recesses with a steep angle between the corner and the corresponding wire can be formed. This prevents the molten resin from oozing out into the metal mold-wire contact area, thus preventing the formation of a burr. If, according to the mold housing of the present invention as described above, the mold housing is used in the light-emitting device, it can be effectively prevented that the soldering flux enters the recessed section of the mold housing, as well as that the formation of a burr of the mold resin within the recessed section can be prevented. The invention is described in detail with reference to the drawings. Fig. 1(a) is a perspective view of an upper surface of the light-emitting device according to the present embodiment, and Fig. 1(b) is a perspective view of its rear surface; Fig. 2 is an upper surface when a sealing resin of the light-emitting device according to the present embodiment has been removed. Fig. 3 is a cross-sectional view of the light-emitting device of Fig. 2 taken along line 2A-2A. Fig. 4 is a cross-sectional view showing a molding process of the mold housing according to the present embodiment. Fig. 5 is a cross-sectional view showing the molding process of the mold housing according to the present embodiment. Fig. 6 is a top view of the mold housing according to the present embodiment. Fig. 7 is a cross-sectional view of the mold housing of Fig. 6 taken along line 6A-6A.Figure 8 is a cross-sectional view of the mold housing of Figure 6 taken along line 6B-6B. Figure 9 is a top view showing a wire frame according to the present embodiment, to which wires are attached. Figure 10 is a rear view of the wire frame according to the present embodiment, to which wires are attached. Figures 11(a) to 11(c) are partial cross-sectional views of the wires according to the present embodiment. Figures 12(a) to 12(c) are partial cross-sectional views of the wires according to the present invention. Figure 13(a) is a perspective view of a front surface of a modification of the light-emitting device according to the present embodiment, and Figure 13(b) is a perspective view of its rear surface. Figure 14(a) is a photograph of a front surface of a comparison mold housing, and Figure 14(b) is a photograph of a front surface of the mold housing of the present invention.Figure 15 is a photograph of a cross-section of the mold housing according to the embodiment of the present invention. Figure 16 is a cross-sectional view illustrating the molding process of the conventional mold housing. Figure 17 is a top view of the conventional mold housing. Figure 18 is a cross-sectional view of the conventional mold housing. Figure 19 is a cross-sectional view showing the state of the conventional mold housing before it is subjected to the molding process. <Erste Ausführungsform> As shown in Fig. 1, Fig. 2 to Fig. 3, a light-emitting device 50 of the present embodiment comprises a mold housing 10, a light-emitting component 40 and a sealing resin 52. In the present patent specification, the “light-emitting component 40” refers to a component that includes a light-emitting element and comprises the light-emitting element (e.g., an LED) itself and a component composed of the light-emitting element and a submount. In the present embodiment, the light-emitting component 40 consists of a light-emitting element. The sealing resin 52 seals a recessed section 12 of a molded resin 11 after the inclusion of the light-emitting component 40 in the recessed section 12, in order to protect the light-emitting component 40 from the external environment. A mold housing 10 of the present invention comprises a molding resin 11 and at least one wire (i.e. two wires 20 and 30 in the present embodiment). The molding resin 11 has a recessed section 12 on its upper surface to accommodate the light-emitting component 40 in the recessed section 12. The recessed section 12 is enclosed by the side wall 13. The wires 20 and 30 are exposed from a lower surface 121 of the recessed section 12 of the molding resin 11 and extend downwards from the side wall 13 of the recessed section 12 of the molding resin 11 (see Fig. 2 and Fig. 3). The two wires 20 and 30 are spaced apart from each other, and the space between them is filled with the molding resin 11. In the light-emitting device 50 of the present embodiment, an exposed surface 21a of one of the wires (i.e., the first wire) 20 is provided with one or more (e.g., two in Fig. 2) light-emitting components 40 (41 and 42). The second wire 30 is used as a wire bonding area and is provided with a Zener diode 43 arranged thereon. The second wire 30 has a recessed section between the wire bonding area and the area provided with the Zener diode, thereby improving the adhesion area between the second wire 30 and the sealing resin. The recessed section of the second wire is designed to connect to a groove 24X described below, which is to be filled with the molding resin 11, thus preventing a connecting element of the Zener diode from eroding the wire bonding area. The light-emitting component 40, the first wire 20, and the second wire 30 are electrically connected to each other via a bond wire BW. If, as shown in Fig. 2, the light-emitting device comprises two light-emitting components 41 and 42, the wire bonding can be configured such that the first light-emitting component 41 is connected to the first wire 20 via the bond wire BW, the second light-emitting component 42 is connected to the second wire 30 via the bond wire BW, and furthermore, the first light-emitting component 41 is connected to the second light-emitting component 42 via the bond wire BW (i.e., series wiring). Alternatively, each of the two light-emitting components 41 and 42 can be connected to the first wire 20 and the second wire 30 respectively via the bond wire BW (i.e., parallel wiring). As shown in Fig. 2, the first wire 20 and the second wire 30 have grooves 24 formed on surfaces 21 and 31 of the wires at least along the side wall 13 (i.e., a circumferential surface). Each groove 24 has an inner upper edge 241 and an outer upper edge 242. In the present patent specification, the “at least one section of the side wall” specifies “a section of a circumference” of the inner surfaces of the side wall 13, which, viewed from its top side, is arranged circumferentially as shown in Fig. 6 (i.e. formed into a closed ring shape). In the present invention, the inner upper edge 241 of each groove 24 is free from the lower surface 121 of the recessed section 12 of the molding resin 11, and the outer upper edge 242 of each groove 24 is embedded in the molding resin 11. For example, as shown in Fig. 3, edging sections of the side wall 13 of the recessed section 12 (i.e., a section of the molding resin 11) are embedded in the groove 24 to form a section of a lower surface 121 of the recessed section 12. A portion of the molding resin 11 (i.e., a section of the groove filled with the resin 11a) is substantially filled into the entire groove 24. In the present invention, the inner upper edge 241 of each groove 24 is free from the lower surface 121 of the recessed section 12 of the molding resin 11, and the outer upper edge 242 of each groove 24 is embedded in the molding resin 11, so that the resin-filled section of the groove, as seen from the cross-section (Fig. 3), is connected within the groove 24 to the body 11b of the molding resin 11 on one side of the outer upper edge 242, and the resin-filled section of the groove, as seen from the upper surface, appears as a section of the lower surface 121 of the recessed section 12 on one side of the inner upper edge 241. As shown in Fig. 3, a region on one side of the inner upper rim 241 (i.e., a region exposed by the lower surface 121 of the recessed section 12) seamlessly continues from a surface 21a of the first wire 20 and the section of the resin-filled groove 11a in the inner upper rim 241, i.e., it has essentially no step. The region on the side of the inner upper rim 241 can only be formed with a curved surface, but is preferably formed at least partially with a horizontal surface flush with the exposed surface 21a of the wire 20 (e.g., the adjacent section of the inner upper rim 241). The region on the side of the inner upper rim 241 of the resin-filled groove section 11a is pressed by a voltage F1 during reflow soldering.If at this time the area on the side of the inner upper edge 241 includes a horizontal section, the stress F1in is oriented vertically (i.e. downwards) with respect to the horizontal surface (detailed description follows below). As shown in Fig. 1(a) and Fig. 3, the first wire 20 and the second wire 30 are exposed from a rear surface 14 of the molding resin 11. Consequently, the heat generated by the light-emitting element 40 can be effectively dissipated outside the recessed section 12 via the first wire 20 and the second wire 30. With such a configuration, a boundary section of an interface 61 (i.e., a boundary 61a) between the first wire 20 and the molten resin 11 and a boundary section of an interface 62 (i.e., a boundary 62a) between the second wire 30 and the molding resin 11 are exposed from the rear surface 14 of the molding resin 11. The interface surfaces 61 and 62 extend through an area between the lower surface 243 of the groove 24 and the section of the groove filled with the resin 11a, so that they continue into the recessed section 12 of the molten housing 10. When the light-emitting device is manufactured with a structure shown in Fig. 3 in the conventional mold housing 100 (see Fig. 16, Fig. 17 to Fig. 18), the soldering flux can extend from a boundary 610a of a rear surface 140 of the mold housing 100 to reach a recessed section 120 through an interface surface 610 when the light-emitting device is mounted on the substrate. On the other hand, in the light-emitting device 50 of the present invention, the sealing resin 52 filled into the recessed section 12 of the mold housing 10 expands due to heat during reflow soldering to generate a stress F1 that presses the area on the side of the inner upper edge 241 of the resin 11a-filled section (i.e., the area exposed by the lower surface 121 of the recessed section 12) downwards (i.e., towards the lower surface 243 of the groove 24). Furthermore, the mold resin 11 also expands, so that the resin 11a-filled section of the groove presses against the side surfaces and the lower surface 243 within the groove 24. In other words, due to the synergistic effect between the thermal expansion of the sealing resin 52 and the thermal expansion of the section of the groove filled with resin 11a, the stress that pushes the section of the groove filled with resin 11a downwards (i.e.in the direction of the lower surface 243 of the groove 24), the adhesion becomes stronger, particularly between the section of the groove filled with the resin 11a and the lower surface 243 of the groove 24 of the interface 61, thus exerting a high resistance to the penetration of the soldering flux. As a result, the disadvantage of the soldering flux reaching the recessed section 12 can be reduced compared to a case of the light-emitting device using the conventional housing 500. One direction of the stress F1 is vertical with respect to a surface of the resin-filled section of the groove 24. Consequently, if, as shown in Fig. 3, at least one region adjacent to the inner upper edge 241 of the surface of the resin-filled section of the groove is formed to form a horizontal surface flush with the exposed surface 21a of the wire 20, the stress F1 applied to the horizontal surface is directed vertically downwards. As a result, a contact surface between the resin-filled section of the groove 24 and the lower surface 243 of the groove 24 can be effectively brought into tight adhesion. If the surface of the resin-filled section of the groove is formed into a curved surface, the stress F1, applied to the curved surface in a direction perpendicular to a tangential direction of the curved surface, is oblique with respect to a contact surface between the resin-filled section of the groove and the lower surface 243 of the groove 24. As a result, an adhesive effect of the contact surface can be generated due to a component in a vertical downward direction of the stress F1. Since the stress F1 is generated to press the section of the groove filled with resin 11a during reflow soldering, the mold resin 11 can be effectively prevented from separating from the first wire 20 and the second wire 30. In particular, due to the thermal expansion of the sealing resin 52 during reflow soldering, the outward-acting stress F2 is applied to the side wall 13 of the mold resin 11. The stress F2 can act to separate the mold resin 11 from the first wire 20 and the second wire 30. However, the generation of the stress F1, which presses downwards the section of the groove filled with the resin 11a, allows a firm connection of the mold resin 11 with respect to the first wire 20 and the second wire 30. Compared to the anchoring groove, which, as discussed in JP 2011-146524 A, is completely embedded in the mold housing, the effect to prevent the mold resin 11 from separating from the first wire 20 and the second wire 30 can be improved by providing the groove 24 exposed on the inner upper edge 241 of the present invention. Since in the light-emitting device 50 of the present invention an area of ​​the connection section between the sealing resin 52 and the molding resin 11 increases according to the section of the groove 24 filled with the resin 11a, a connection force between the sealing resin 52 and the mold housing 10 can be made stronger. The sealing resin 52 is attached to the mold housing 10, so that the sealing resin 52 bonds to the mold resin 11, the first wire 20, and the second wire 30, which are exposed in the recessed section 12. The sealing resin 52 bonds more strongly to the mold resin 11 than to the wires 20 and 30. Since the area where the sealing resin 52 and the mold resin 11 are bonded together becomes larger, the bonding force between the sealing resin 52 and the mold housing 10 is therefore stronger. The direction of the connection area between the sealing resin 52 and the mold resin 11 (i.e., a direction orthogonal to a tangential direction of the area) differs between a section between the side wall 13 and the sealing resin 52 and a section between the section of the groove filled with resin 11a and the sealing resin 52 in the connection area. Therefore, the resistance force to the stress applied to the sealing resin 52 also differs. If a stress is applied in a direction that separates the sealing resin 52 from the mold housing 10, the resistance force to stresses from all directions improves as a result, because the resistance force generated between the side wall 13 and the sealing resin 52 and the resistance force generated between the section of the groove filled with resin 11a and the sealing resin 52 are complementary. Therefore, the manufacture of the light-emitting device 50 using the mold housing 10 of the present invention makes it possible to prevent the sealing resin 52 from being separated from the mold housing 10. In the light-emitting device 50 of the present invention, a burr is formed on the lower surface 121 of the recessed section 12 of the mold housing 10. The reasons for this are explained below. The molding resin 11 of the mold housing 10 is formed using the metal mold 90, which consists of the upper metal mold 91 and the lower metal mold 92 (see Fig. 4 and Fig. 5). The upper metal mold 91 has a convex section 93, which corresponds to the recessed section 12 of the molding resin 11. Corners 93c of the convex section 93 are subjected to the chamfering process (i.e., R-chamfering or C-chamfering). As shown in Fig. 4, the upper metal form 91 and the lower metal form 92 hold the first wire 20 together, just as they hold the second wire 30 together during the forming of the molding resin 11. Since, as shown in Fig. 5, the groove 24 is positioned directly below the corner 93c of the convex section 93 of the upper metal form 91, no recess CL with a steep angle (see Fig. 19) is formed between the corner 93c and the wires 20 and 30. In other words, there is no section where the stress tends to concentrate at the time the molten resin is poured into the metal form 90 (e.g., no top of the recess CL with a steep angle). Therefore, the molten resin does not ooze out into the area where the metal mold 90 touches the first wire 20 (and the area where the metal mold 90 touches the second wire 30), so that no burr 80 of the mold resin 11 (see Fig. 17 and Fig. 18) is formed.18 ) is produced on the surfaces of the first wire 20 and the second wire 30. In the resulting mold housing 10, no burr is produced at the boundary between the mold resin 11 (11a) and the surfaces 21 and 31 of the wires 20 and 30, so that the boundary coincides with the inner upper edge 241 of the groove 24 (see Fig. 6, Fig. 7 to Fig. 8). As described above, in the mold housing 10 of the present invention, the grooves 24, which are provided on the wires 20 and 30, are provided during the manufacture of the mold housing 10 directly below the corners 93c of the convex section 93 of the upper metal mold 91. As a result, the formation of the burr 80 can be effectively prevented. Therefore, in the light-emitting device 50, when using the mold housing 10 of the present invention, no poor bonding occurs due to the burr 80, and therefore the burr 80 does not detract from the appearance of the light-emitting device 50. In the light-emitting device 50 of the present embodiment, the grooves are recessed sections extending in a belt-like shape and having openings of constant width in the surfaces 21 and 31 of the wires 20 and 30 (i.e., a constant distance between the inner upper edge 241 and the outer upper edge 242). As shown, for example, in Fig. 9, the groove 24 is provided on each of the wires 20 and 30, such that the groove forms a channel shape extending along three sides of each of the wires 20 and 30, and each corresponding inner upper edge 241 and outer upper edge 242 can be connected to an upper end edge 244 of the groove 24.Since an opening of each groove 24 is enclosed by the inner upper edge 241, the outer upper edge 242, and the upper end edge 244, the soldering flux must rise to an upper edge of the opening of the groove 24 in order to enter the groove 24 when the soldering flux entering from the boundaries 61a and 62a enters the groove 24. Consequently, the entry of the soldering flux can be better controlled. The rear surfaces 22 and 32 of the first wire 20 and the second wire 30 are exposed from the rear surface 14 of the molding resin 11 and extend from the edges of the exposed rear surface section to the concave sections on the sides of the front surfaces of the wires. The concave sections (i.e., the concave rear surface sections) 221 and 321 are covered by the molding resin 11 (see Fig. 10). The circumferential sections of the rear surfaces 22 and 32 of the first wire 20 and the second wire 30 are cap-shaped, thus lengthening the entry path (i.e., interface surfaces 61 and 62) through which the solder flux enters the recess section 12 during reflow soldering, thereby reducing the amount of solder flux entering the recess section 12. The "cap shape" indicates a shape in which, as in Fig.Figure 10 shows that one side of the surface 21 of the wire 20 protrudes further than one side of the rear surface 23 of the wire 20. Since the thickness of the wires 20 and 30 decreases considerably when the grooves 24 are formed directly above the rear surface recess sections 221 and 321, the strength of the wires 20 and 30 decreases. Consequently, the grooves 24 are preferably formed in positions further inward than those directly above the rear surface recess sections 221 and 321 (see Fig. 7, Fig. 8, Fig. 9 to Fig. 10). However, if the surface areas of the wires 20 and 30 become narrower due to the reduction in size of the light-emitting device 50, the grooves 24 can be formed partially or entirely directly above the rear surface recess sections 221 and 321. In the present patent specification, the "rear surface recession section" can have an inner surface which, as shown in Figs. 11(a) to 11(c) and Figs. 12(a) and 12(b), is formed as a curved surface. Alternatively, the "rear surface recession section" can be formed as a step, as shown in Fig. 12(c). The cross-sectional shape of the groove 24 can be formed into various shapes, such as a rectangular shape (see Fig. 11(a) and Fig. 12(c) ), a trapezoidal shape (see Fig. 11(b) and Fig. 11(c) ), a circular shape (see Fig. 12(a) ) and a polygonal shape (see Fig. 12(b) ). As shown in Figs. 11(b) and 11(c) and Figs. 12(a) and 12(b), the groove 24 preferably has a maximum width 24Wmax, which is greater than a width 24W, between the inner upper edge 241 and the outer upper edge 242 in a depth direction D. In the present patent specification, the “depth direction D” is a direction oriented from the surfaces 21 and 31 of the first wire 20 to the rear surfaces 22 and 32 of the first wire 20. In other words, the groove 24 preferably has a cross-section whose maximum width 24Wmax of the interior of the groove 24 is greater than the width 24W of the opening in the surface 21 of the first wire 20. As is evident from Figs. 11(a) to 11(c), in three types of grooves 24a to 24c with the same width 24W of the opening and the same depth 24D of the groove 24, the grooves 24b and 24c with the cross-section whose width 24W is narrower than the maximum width 24Wmax have an interior surface of the groove 24 seen in cross-section that is longer than the groove 24a with the cross-section whose width 24W is equal to the maximum width 24Wmax. Therefore, when the mold housing 10 is manufactured using the wire 20, the entry path through which the solder flux enters the recessed section 12 during reflow soldering (i.e.,the interface 61 between the first wire 20 and the molding resin 11) is longer, which results in the soldering flux hardly entering the recessed section 12. If the groove 24 is constructed so that it has a cross-section with a width 24W, which is narrower than the maximum width 24Wmax, the maximum width (corresponding to the maximum width 24Wmax of the groove 24) of the section of the groove 24 filled with resin 11a will be greater than the width 24W of the groove 24. Therefore, the section of the groove filled with resin 11a should not extend beyond the groove 24. As a result, separation of the molding resin 11 from the first wire 20 can be effectively prevented. As shown in Fig. 12(a) and Fig. 12(b), a design in which the cross-section of each of the grooves 24d and 24e narrows from the surface 21 to the rear surface 23 of the wire 20, after having widened previously, allows for a reduction of the area required for the groove 24 in the surface of the wire and also a reduction of the depth of the groove 24. This allows for a lengthening of the entry path through which the soldering flux enters the recessed section 12, while simultaneously reducing the area required to form the groove 24. The groove 24d, with a circular cross-section, can be formed by wet forming, which is therefore suitable for a small light-emitting device 50, where the groove 24 is hardly produced by machine. The groove 24 and the variation of the rear surface recess section 221 formed on the first wire 20 are described with reference to Fig. 11 and Fig. 12. A similar variation can also be applied to the groove 24 and the rear surface recess section 221 formed on the second wire 30. As shown in Fig. 1(b), it is preferred that the first wire 20 and the second wire 30 are exposed from the rear surface 14 to the side surfaces 15 of the molding resin 11. With the above configuration, such an effect can be achieved that the light-emitting device 50 is not angled with respect to the mounted substrate 50 when the light-emitting device 50 is mounted on a substrate (not shown). A description of its effect is given below. Since the wettability of the molten solder with respect to the mold resin 11 is low, the molten solder pools when the light-emitting device 50 is mounted to contact the first wire 20 and the second wire 30, which are exposed by the mold resin 11. If the wires 20 and 30 protrude only from the rear surface 53 of the mold resin 11, the molten solder pools only on the rear surface 53 of the light-emitting device 50. If an excess of molten solder is applied, the excess molten solder can partially lift the light-emitting device 50, causing it to be mounted at an angle. In contrast, if the wires 20 and 30 are exposed from the rear surface 14, which is connected to the side surface 15 of the mold resin 11, the molten solder expands from a rear surface 53 of the light-emitting device 50 to a side surface 54. Even with excess molten solder, the excess is released in one direction along the side surface 54, and thus only a suitable amount of solder remains between the rear surface 53 of the light-emitting device 50 and the mounted substrate. Therefore, it is possible to prevent the light-emitting device 50 from being mounted at an angle. As also shown in Fig. 1(b) and Fig. 7, ridges (i.e., depressions) are provided on the rear surfaces 22 and 32 of the wires 20 and 30, which are exposed from the side surfaces 15.Consequently, the effect of absorbing excess solder can be improved, and the area of ​​the contact surface between the molten solder and the wires 20 and 30 can be increased. When the wires 20 and 30 are exposed from their respective opposing side surfaces 15 of the mold resin 11, as shown in Fig. 7, the soldering flux can enter the interface 61 between the wires 20 and 30 and the mold resin 11 from the boundary 61b, which is exposed to the side surface 15 of the mold resin 11. Therefore, it is preferred to provide the groove 24 along the entry path of the soldering flux from the side surface 15 to prevent soldering flux entering from the boundary 61b from reaching the recessed section 12. In other words, the groove 24 (i.e., 24X) is preferably formed along a section 13X of the side wall 13 provided between the side surface 15 and the recessed section 12 of the mold resin 11 (see Fig. 2 and Fig. 7). Consequently, the entry of the soldering flux from the side surface 15 through the groove 24X can be controlled. If both grooves 24X and 24Y are formed, it is preferred that groove 24X and groove 24Y be joined together to form a channel shape (see Fig. 2). Consequently, the gap between groove 24X and groove 24Y can be eliminated. As a result, the inflow of solder flux can be effectively controlled. As shown in Fig. 9, the wires 20 and 30 are connected to the wire frame LF via profile webs TB. The profile webs TB have a width narrower than that of the wires 20 and 30, so that the profile webs TB can be easily cut later. The wires 20 and 30, which are exposed from the side surfaces 15 of the mold resin 11, also act as the profile webs TB. Therefore, such a configuration, in which the length 24XL of the groove 24X is longer than the width TBW of the profile webs TB, can improve the control of the ingress of the soldering flux from the side surfaces 15.When, as shown in Fig. 2, the soldering flux enters from the opposing side wall 13Y near the side surfaces of the light-emitting component 40, the amount of light absorption by the light-emitting component 40 increases. As shown in Fig. 6 and Fig. 8, it is therefore preferred that the grooves 24Y be formed along the side wall 13Y to generate stresses (i.e., the stress generated due to the thermal expansion of the sealing resin 52 and the resin-filled section 11a of the groove) to press the areas of the sides of the inner upper edges 241 of the resin-filled section 11a of the groove during reflow soldering. In other words, in the mold housing 10, the grooves 24Y are preferably formed on the surface 21 of the first wire 20 along the sections 13Y in the vicinity of the section (i.e.,the mounting area) on which the light-emitting component 40 is subsequently mounted on the side wall 13. Consequently, the adhesion, in particular between the section of the groove filled with the resin 11a and the corresponding bottom surface 243 of the groove 24Y of the interface surface 61, can be improved. Therefore, the soldering flux is strongly prevented from entering the area adjacent to the light-emitting component 40 within the recess section 12 from the interface 61a during reflow soldering. As a result, the soldering flux can be controlled from the side wall 13Y through the groove 24Y. Preferably, the first wire 20 is provided with an additional groove 24Z on its surface 21 along a side 26 opposite the second wire 30 (see Fig. 6). The additional groove 24Z is fully exposed from the lower surface 121 of the recessed section 12 of the mold resin 11. The additional groove 24Z creates an effect such that, for the following reason, the soldering flux entering from side 26 is prevented from reaching the light-emitting component 40. As shown in Fig. 2, the light-emitting component 40 can be positioned near side 26. Since the soldering flux absorbs light, it is essential to control the soldering flux so that it does not reach the area near the light-emitting component 40, even if the soldering flux enters from side 26. If the additional groove 24Z is not formed, the soldering flux entering from the rear surface 14 of the mold resin 11 through the interface 63 between the first wire 20 and the mold resin 11 can enter the mounting area for mounting the light-emitting component 40 along the interface 64 between the surface 21 of the first wire 20 and the sealing resin 52. As shown in Figs. 6 and 7, it is preferred to form the additional groove 24Z on the first wire 20 and to fill a section of the molding resin 11 (i.e., the section of the groove filled with resin 11a) into the additional groove 24Z. The sealing resin 52 bonds well with the molding resin 11 within the additional groove 24Z, so that the soldering flux cannot penetrate between the sealing resin 52 and the molding resin 11. In other words, the entry path of the soldering flux is diverted along the additional groove 24Z. In the section of the groove 24Z filled with resin 11a, the downward pressure F1 is generated due to the thermal expansion of the sealing resin 52 and the resin 11a-filled section of the groove during reflow soldering.Consequently, the adhesion at a particular position between the section of the groove filled with resin 11a and the bottom surface 243 of the groove 24Z of the interface 61 is stronger, and thus the ingress of the soldering flux can be strongly controlled. As a result, the groove 24Z can prevent the soldering flux from entering from the interface 66. Since in a small light-emitting device 50 the area of ​​the second wire 30 is small, forming the additional groove on the second wire 30 is considered difficult; however, the additional groove can also be formed on the second wire 30. A method for manufacturing the light-emitting device 50 is described below. <1. Production of the molded housing 10> A wire frame LF with several pairs of the first wire 20 and the second wire 30 is formed by punching a metal plate, with the first wire 20 and the second wire 30 facing each other within the wire frame LF. The first wire 20 and the second wire 30 are connected to the wire frame LF via the profile webs TB. Then, the grooves 24 are formed at predetermined positions of the first wire 20 and the second wire 30 according to the wet die. The wire frame LF is held by a metal mold 90 with recesses for the molding resin 11 at positions corresponding to the respective wire pairs. A resin material for the molding resin 11 is then injected into the recess of the metal mold 90. After the resin material has cured, the metal mold 90 is removed to obtain the mold housing 10 attached to the wire frame LF. <2. Mounting the light-emitting component 40> Each of the light-emitting components 40 (41, 42) shown in Fig. 2 is provided with a pair of electrodes on its upper surface. The light-emitting components 40 are mounted on the first wire 20 of the mold housing 10 via chip bonding. As shown in Fig. 2, the first electrode (e.g., a p-electrode) of the first light-emitting component 41 is connected to the first wire 30 via the bond wire BW. The second electrode (e.g., an n-electrode) of the first light-emitting component 41 is connected to the first electrode (e.g., a p-electrode) of the second light-emitting component 42 via the bond wire BW. The second electrode (e.g., an n-electrode) of the second light-emitting component 42 is connected to the second wire 30 via the bond wire BW. Consequently, the first light-emitting component 41 and the second light-emitting component 42 are connected in series via the bond wire BW. The first electrodes (e.g., p-electrodes) of the first light-emitting component 41 and the second light-emitting component 42 are connected to the first wire 20 via the bond wire BW, and their second electrodes (e.g., an n-electrode) can also be connected to the second wire 30 via the bond wire BW. Consequently, the first light-emitting component 41 and the second light-emitting component 42 are connected in parallel via the bond wire BW. The light-emitting component, which has the first electrode on its upper surface and the second electrode on its lower surface, can also be used. In this case, the lower surface is attached to the first wire 20 using a conductive paste, thereby connecting the second electrode to the first wire 20. The first electrode provided on the upper surface is electrically connected to the second wire 30 using the bond wire BW. <3. Mounting the Zener diode 43> Each of the Zener diodes shown in Fig. 2 is provided with the first electrode (e.g., p-electrode) on its upper surface and the second electrode (e.g., the n-electrode) on its lower surface. The lower surface of the Zener diode 43 is bonded to the second wire 30 using conductive paste, thus electrically connecting the second electrode to the second wire 30. The first electrode provided on the upper surface is electrically connected to the first wire 20 using bond wire BW. <4. Pouring the sealing resin 52> The sealing resin is provided in a liquid state by pouring into the recessed section 12 of the mold housing 10, after which it cures. If the sealing resin is manufactured to form a double layer, a first sealing resin (e.g., an underfill resin) is provided by pouring into the recessed section 12 so that the first sealing resin cures, and then the second sealing resin (e.g., an overfill resin) is provided by pouring into the recessed section 12 so that the second sealing resin cures. <5. Division of light-emitting devices 50> The profile webs TB of the wire frame LF are cut into cubes along an outer surface of the molding resin 11 to divide the light-emitting device 50 into pieces. A material suitable for each compositional element of the light-emitting device 50 is described below. (First wire 20 and second wire 30) The first wire 20 and the second wire 30 can be manufactured using a conductive element comprising at least one or more elements of aluminum, iron, nickel, and copper, considering the processability and strength of the resulting products. Preferably, the first wire 20 and the second wire 30 are coated using gold, silver, or an alloy thereof. (Molding resin 11) Examples of the molding material of the molding resin 11 include a thermosetting resin, such as an epoxy resin or a silicone resin; and a thermoplastic resin, such as a liquid crystal polymer, a polyphthalamide resin, or polybutylene terephthalate (PBT). Furthermore, a white pigment, such as titanium dioxide, is mixed into the molding material to improve the light reflection ratio within the recessed section 12 of the molding resin 11. (Bond wire BW) A metal-made wire, for example made of gold, silver, copper, platinum and aluminum and alloys thereof, can be used as the BW bond wire. (Sealing resin 52) A silicone resin, an epoxy resin, an acrylic resin, or a resin containing at least one of the aforementioned resins can be used as a material for the sealing resin. The sealing resin 52 can be formed as a single layer or as a multiple layer (e.g., a double layer consisting of the base coat and the top coat). Light scattering particles, such as titanium oxide, silicon dioxide, titanium dioxide, zirconium dioxide, aluminum oxide and aluminum nitride, can be distributed within the sealing resin 52. Particles made of a material with a wavelength of light emitted by the light-emitting element 40 (e.g., phosphorus) can be dispersed in the sealing resin 52. For example, in the light-emitting device 50 for emitting white light, the light-emitting element 40 for emitting blue light and phosphorus particles for absorbing blue light (e.g., YAG particles) can be combined to emit yellow light. (Lot) Examples of solder to be used in the present embodiment include Sn-Ag-Cu, Sn-Zi-Bi, Sn-Cu, Pb-Sn, Au-Sn and Au-Ag. <modifikation> Fig. 1 shows the light-emitting device 50 of a type that is attached to the (not shown) mounted substrate on one side of the rear surface 53 of the light-emitting device 50. However, the grooves can also be provided on the surfaces of the wires in the light-emitting device 50' shown in Fig. 13. The light-emitting device 50' differs from the light-emitting device 50 of Fig. 1 in that both the first wire 20' and the second wire 30' are exposed from the same side surface 54 to allow the side surface 54 to be attached to the mounted substrate. The other configurations of the light-emitting device 50' are identical to those of the light-emitting device 50 of Fig. 1. [First example] As an example of the present invention, the mold housing 10 and a comparison mold housing 100 are produced to confirm the presence or absence of the generation of the burr 80. The manufacturing process of the mold housing 10 of the present invention is described below. First, the wire frame LF, which is connected to the first wire 20 and the second wire 30 via the profile webs TB, is subjected to wet etching to form the grooves 24 at predetermined positions. Then, the wire frame LF is held by the metal mold 90, forming an assembly of the mold housings 10 by injecting a resin into the metal mold 90. The molding resin 11 and the profile webs TB are then cut into cubes along predetermined positions to divide the mold housings 10 into pieces. The comparative mold housing 100 is manufactured in the same way as the mold housing 10 of the present invention, except that the method for forming the grooves 24 at the predetermined positions by wet etching is omitted. As shown in Fig. 14(a), in the comparative mold housing 100, the burr 80 is produced between the wires 20 and 30 and the side wall 13 of the mold resin 11. On the other hand, as shown in Fig. 14(b) and Fig. 15, no burr was produced in the mold housing 10 of the present invention. Reference numbers used in the description are listed. 10 Mold housing 11 Mold resin 11a Resin-filled groove 11b Body 12 Recess section 13 Side wall 20 First wire 30 Second wire 24 Groove 241 Inner upper rim 242 Outer upper rim 40 Light-emitting component BW Bond wire 50 Light-emitting device 52 Sealing resin 90 Metal mold< / modifikation>

Claims

Mold housing comprising: a mold resin with a recessed section on its upper surface to accommodate a light-emitting component; and a wire partially exposed from a lower surface of the recessed section of the mold resin and extending under a side wall of the recessed section and electrically connected to the light-emitting component;wherein the wire has at least partially formed a groove on a surface of the wire along the side wall, wherein the groove has an inner upper edge and an outer upper edge and is filled with the molding resin such that the inner upper edge is exposed from the lower surface of the recessed section and the upper edge is embedded in the molding resin,(a) wherein the wire comprises a first wire and a second wire spaced apart from each other at the lower surface of the recessed section of the molding resin and the rear surface of the molding resin and exposed from the lower surface and the rear surface;and (b) wherein the wire further comprises an additional groove formed on a surface of the first wire along one side of the first wire, which is arranged on the opposite side of the second wire, the additional groove being completely exposed from the lower surface of the recessed section of the molding resin; (c) wherein the first wire has a rear surface recessed section extending from an edge of the exposed rear surface section towards the front surface side of the first wire, the rear surface recessed section being covered with the molding resin; and (d) wherein a section of the additional groove is formed immediately above the rear surface recessed section. Molded housing according to claim 1, wherein the groove is enclosed by connecting the inner upper edge and the outer upper edge together. Molded housing according to claim 1 or 2, wherein a cross-section of the groove has a greater width than a width between the inner upper edge and the outer upper edge. Mold housing according to one of claims 1 to 3, wherein the first wire has a concavity extending from the edge of the exposed rear surface section towards the front surface side of the wire, wherein the concavity is covered with the molding resin. Mold housing according to one of claims 1 to 4, wherein the wire is exposed from the rear surface to the side surface of the mold resin; and wherein the groove is formed on the surface of the wire such that the groove extends along a portion of the side wall located between the side surface and the recessed section. Light-emitting device comprising: the mold housing according to any one of claims 1 to 5; the light-emitting component mounted on the exposed surface of the wire within the recessed section; and a sealing resin for sealing the recessed section. Light-emitting device according to claim 6, wherein the wire comprises a first wire and a second wire spaced apart from the lower surface of the recessed section of the molded resin and the rear surface of the molded resin; wherein the light-emitting component is mounted on the exposed surface of the first wire and is electrically connected to the exposed surface of the second wire within the recessed section; and wherein the groove is further formed along a section of the side wall near the light-emitting component on the surface of the first wire.

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