Chip card module and manufacturing process

Abstract

Chip card module (300), comprising: a flexible substrate (306) with a first and a second main surface; a first metallization (304) on the first main surface, which provides at least one discrete electrical contact area ( , 304a, 304b, 304c, 304d, 304e, 304f, 304g); a second metallization (305) on the second main surface, which forms at least one discrete electrical conduction (305b, 305f); at least one contact hole (307, 307b, 307f) that establishes an electrical contact between the first metallization (304) and the second metallization (305); a component (302) mounted on the second main surface, wherein the component (302) has at least one electrical contact pad (314) arranged thereon, the contact pad (314) facing away from the second main surface, wherein the at least one discrete electrical conductor (305b, 305f) extends from the at least one contact hole (307, 307b, 307f) in the direction of the component (302); at least one bond wire (310, 310b, 310f) extending from the contact pad (314) to the second metallization (305) and thus electrically connecting the contact pad (314) to the at least one discrete electrical conductor (305b, 305f); and an encapsulation (316) covering the at least one bond wire (310, 310b, 310f), wherein the at least one discrete electrical conductor (305b, 305f) is only partially covered by the encapsulation (316).

Description

[0001] Several aspects of the disclosure relate generally to chip card technology and in particular to chip card modules and chip cards with surface contact areas.

[0002] Chip cards, components containing an integrated circuit and resembling a credit card in size, shape, and material, are widely used in a large number of applications. Standardized chip cards, such as those conforming to ISO 7816 or ISO 7810, with surface contacts, can be used without problems with chip card readers / writers from a wide range of applications and manufacturers due to their standardization. The following publications describe technical background information: DE 39 24 439 A1; DE 195 32 755 C1, DE 103 25 566 A1, US 6 313 524 B1, US 2004 / 0 256 150 A1, and DE 101 42 542 A1.

[0003] According to the standard, contact pads are arranged on a predefined part of a chip card, the contact pads being connected, e.g., by traces, to a semiconductor chip having dimensions suitable for embedding in the standardized chip card. The contact pads and the chip can be prefabricated, including the relevant connections, with the resulting subassembly being referred to as a "chip module".

[0004] Chip modules provide protection for the integrated circuit against environmental influences, both during the manufacturing of the smart card in which the chip module is installed, and afterwards, when the smart card is in normal use. Chip modules should also provide a reliable interface, e.g., with card readers / writers, and should be made of materials that are durable, preferably renewable, and / or cost-effective.

[0005] According to the invention, a chip card module according to claim 1 and a method for manufacturing a chip card module according to claim 10 are disclosed. Embodiments are described in the respective dependent claims. A chip card module with a flat, flexible substrate is disclosed, having two main surfaces, e.g., a front and a back. A metallization on a first main surface provides at least one discrete electrical contact area. A second metallization on the second main surface forms at least one discrete electrical conductor. The contact areas on one side and the conductors on the other are connected to each other by at least one contact hole through the substrate, thereby establishing an electrical contact between the metallizations on each side.

[0006] A component, e.g., an integrated circuit, mounted on the second main surface or back side, has at least one electrical contact pad on its top side. The component is attached to the back side of the substrate such that the contact pad(s) face away from the substrate. Wires bonded to the contact pads electrically connect the integrated circuit to one or more electrical leads on the back side, thereby connecting the integrated circuit to the contact surfaces on the front side.

[0007] According to various aspects of the disclosure, the chip card module is made at least partially of polyester. Furthermore, the substrate can be made of a material, e.g., plastic, that has a melting point below 250 degrees Celsius. In particular, the substrate can be made of a material that has a melting point below 200 degrees Celsius. Most especially, the substrate can be made of a material that has a melting point below 150 degrees Celsius.

[0008] According to another aspect of the disclosure, the bond wire can be made at least partially of aluminum. Likewise, contact surfaces, e.g., those on the front or first main surface, can be provided at least partially without any gold. In particular, all contacts on the front can be free of gold, substantially free of gold, or contain only trace amounts of gold.

[0009] According to yet another aspect of the disclosure, in which the component on the back of the substrate is an integrated circuit, the contact pads can be aligned in a single plane. This plane can be parallel, generally parallel, substantially parallel, or within 10 degrees parallel to the plane of the back of the substrate. In particular, the metallizations or electrical conductors on the second main surface can also be formed in a single plane. The plane of the contact pads can be parallel, generally parallel, substantially parallel, or within 10 degrees of a parallel alignment to the plane of the electrical conductors on the back of the substrate.

[0010] According to yet another aspect of the disclosure, an encapsulation can be provided that covers the bond wires connecting the contact pads to the backside metallizations or electrical conductors. A conductor radius can be defined as an area extending from the contact pads of the component and at least one contact hole connecting the front and backside metallizations. According to the invention, the encapsulation is provided over an area with a radius (the encapsulation radius) that is smaller than the conductor radius.

[0011] According to one aspect of the present disclosure, a method for manufacturing a chip card module is disclosed. The method may include depositing a first metallization on a first major surface or front side of a flexible substrate, depositing a second metallization on a second major surface or back side of the substrate, establishing an electrical contact between the first and the second metallization, attaching an integrated circuit to the second major surface of the flexible substrate, wherein the integrated circuit has a plurality of chip pads facing away from the second or back side, and bonding wire between the chip pads and the second metallization.

[0012] In other aspects of the disclosure, the method can include encapsulating the bonded wire. Furthermore, chip pads can be aligned in a plane that is parallel, substantially parallel, or less than 10 degrees from a parallel orientation to the second principal surface. Consequently, the disclosed bonding can be performed without rotary head technology.

[0013] In yet another aspect of the disclosure, the process may include a substrate made of polyester, and the bonding may take place at less than 150 degrees Celsius.

[0014] In the drawings, the same reference numerals generally refer to the same parts in all the different views. The drawings are not necessarily to scale, with the emphasis instead generally placed on illustrating the principles of the disclosed embodiments. The following description details various aspects of the disclosure with reference to the following drawings, in which: Fig. 1A - 1B show a chip module that uses an initial setup; Fig. 2A - 2B show a chip module that uses an alternative design; Fig. 3A - 3C show a chip module that employs a structure according to a point of view of the disclosure; Fig. 4 shows a method for manufacturing a chip module according to one aspect of the disclosure.

[0015] The following detailed description refers to the accompanying drawings, which illustrate specific details and aspects of revelation in which these aspects can be exercised. These aspects of revelation are described in sufficient detail to enable experts to exercise them. Other aspects of revelation may be used, and structural, logical, and electrical modifications may be made without compromising the scope of protection afforded by revelation. The various aspects of revelation are not necessarily mutually exclusive, as some aspects of revelation may be combined with one or more other aspects of revelation to form new aspects of revelation.The following detailed description is therefore not made in a restrictive sense and the scope of protection of the present disclosure is defined by the attached claims.

[0016] Different aspects of the disclosure are provided for components, and different aspects of the disclosure are provided for processes. It is understood that fundamental properties of the components also apply to the processes, and vice versa. Consequently, for the sake of brevity, a duplicate description of such properties can be omitted.

[0017] The expression “at least one”, as used herein, can be understood to include any integer greater than or equal to one.

[0018] The expression “a multitude of”, as used herein, can be understood to include any integer greater than or equal to two.

[0019] The terms “coupling” or “connection”, as used herein, may be understood to include a direct “coupling” or direct “connection” as well as an indirect “coupling” or indirect “connection”.

[0020] The term “main surface”, which is used interchangeably with “front” and “back” or simply “side” or “first” and “second” side, e.g. of a strip-like or card-like substrate, is intended to refer to the two surfaces of such a structure which have a significantly larger surface area than the side surfaces extending across the thickness of the substrate.

[0021] Fig. Figure 1 shows a chip module 100, also known as a chip-on-flex module, with a chip 102, typically between 150 and 200 µm thick, mounted on the back side of a contact assembly 104. The contact assembly is formed by one or a plurality of metallized contact surfaces, shown here individually as 104a–104g. The module 100 is structurally supported by a substrate 106, which is often an epoxy resin strip made of fiber-reinforced epoxy resin with a thickness of, for example, approximately 110 µm. Ideally, the strip is supplied in rolls (not shown) to facilitate subsequent processing of multiple modules.

[0022] The contact surfaces of the arrangement 104, located on the front face of the module 100, can be made of laminated copper, for example, with a thickness between 30 and 35 µm. To facilitate electrical contact, the contact surfaces of 104 can be electroplated with nickel and / or gold. Such a coating provides a contact arrangement 104 that is resistant to oxidation and other influences that are detrimental to the reliable establishment of an electrical contact, e.g., by a chip card reader (not shown).

[0023] The holes 108 can be punched into the strip 106, e.g., during a lamination process, thereby exposing the back of the contacts of the arrangement 104. Wires 110 extend from the chip 102 to the respective contacts 104a–104g, establishing an electrical connection between them. Typically, the wires 110 can be made of gold and can be attached to the respective contact pads 114 on the chip 102 and to the contacts of the arrangement 104 by applying thermosonic bonding. In particular, a pick-and-place / chip bonding machine attaches the chip 102 to the back of the module 100, e.g., by means of a chip bonding machine. B. with adhesive 112, whereby the wires 110, which for example have a diameter between 20 µm and 25 µm, are bonded by applying about 150 degrees Celsius to the bonding point, simultaneously with the application of ultrasonic energy to physically secure the wire in electrical contact with it.Variations of this process may be known as thermosonic bonding. More recently, copper wire with a similar diameter has been bonded between the chip and the contact in this way.

[0024] A globe-top cover 116 is provided to protect the chip, wire, and contact structures from damage due to environmental exposure. The resulting module typically has a thickness of approximately 600 µm.

[0025] The material used for the epoxy resin strip 106 must be able to withstand the thermosonic process. In particular, the selection of strip 106 requires a material that is sufficiently temperature-resistant to withstand the application of heat during thermosonic bonding.

[0026] The module of Fig. 1 also presupposes the use of precious materials, e.g., gold, in the form of gold bonding wires 110 and gold plating on contact surfaces. Selective application of gold, for example, only to limited areas of the contact, requires additional process steps that can incur more costs than can be saved in material costs.

[0027] Furthermore, module 100 requires Fig. 1. A globe-top cover extends over the entire area where bond wires 110 are suspended, representing a substantial portion of the module 100's width. The length of the bond wires 110 is also related to the module 100's susceptibility to damage due to expansion or bending. In particular, longer bond wires 110, in combination with the globe-top 116 required to cover them, both contribute to mechanical stresses that can lead to module failure.

[0028] Fig. Figure 2 shows a chip module 200, also known as a flip-chip-on-substrate / flex module, with a chip 202, typically having a thickness between 250 µm and 330 µm, mounted on the back side of a support substrate 206, usually made of polyester (PET) or another highly flexible material. In contrast to the chip module 100, the chip module 200 has metallizations 204, 205 located on both the front (contact side) and back (chip side) of the support substrate 206. In particular, a contact arrangement 204, formed on one or a plurality of metallized contact surfaces or metallizations, shown here individually as 204a–204g, is formed on the front side of the support substrate 206. The metallizations 205 are provided on the back of the support substrate 206.

[0029] The metallizations 204 and 205 are typically made of copper with a thickness of approximately 10 µm. The copper may be electroplated with 2 µm of nickel and / or optionally 0.03 µm of gold. The metallizations 204 and 205 can be photolithographically formed on the front and back sides of the substrate 206. Separate contacts on both sides are shown electrically connected to each other through the substrate 206 by means of contact holes 207. For example, a metallization 205b is shown connected to a contact surface metallization 204b by means of a contact hole 207b.

[0030] The chip 202 has contacts 214 which are provided with electrically conductive bumps 215. In contrast to the module 100, the chip 202 of the module 200 is mounted in a flipped orientation, with its contacts 215 facing the substrate 206, thus aligning the bumps 215 with the respective metallizations 205. The chip 202 is held in place with respect to the metallizations using an underfill material 218, e.g., NCP.

[0031] This flip-chip configuration is compatible with a wider range of substrate materials, such as PET, which are not as heat-resistant as the epoxy resin strip 106. In particular, the configuration of module 200 is compatible with a low-temperature process using chip bonding techniques. Securing the chip 202 with a non-conductive adhesive also limits the thermal stress on the support substrate 206 during the fabrication of module 200. By controlling the time, temperature, and pressure, damage to the temperature-sensitive PET material can be limited or prevented.

[0032] Module 200 completely lacks the bond wires found in Module 100. Consequently, Module 200 can be more robust, depending on the likelihood of wire breakage due to bending, bending moment, stress, or pressure exerted on the module during use. Furthermore, there is no need for encapsulation, such as that provided by the Globe-Top Cover 116. It may also be possible to reduce or eliminate the need for expensive materials, such as gold, and / or the time-consuming steps of layering materials onto the metallized surfaces.

[0033] Fig. Figure 3 shows a chip module 300 according to a point of disclosure. A carrier substrate 305, which is flexible and made of a PET-based material, such as FCOS. TM -Band, can be manufactured. Fig. Figure 3C represents the front side 306f and the back side 306r of the substrate 306, wherein an arrangement of contacts 304 for a chip card according to ISO standard is provided in the form of a metallization, which is applied, for example, by photolithography. The contacts 304 can be made of copper with a thickness of 10 µm, nickel / gold coated, for example, with 2 µm nickel and 0.03 µm gold. In addition to or instead of the nickel / gold coatings disclosed herein, other coatings may be present.

[0034] The reverse side 306r of the substrate 306 is shown with conductors 305 formed as metallizations. The conductors 305 can be made of copper with the same thickness and coatings as the contacts 304 and can also be formed lithographically. Alternatively, the materials used for the contacts and conductors on the respective sides f and r of the substrate 306 can differ from each other and / or be formed by different means.

[0035] Fig. 3A is a cross-section of module 300 at line aa, which is in Fig. Figure 3B shows the cross-sectional orientation of the metallization. In particular, conductors 305b and 305f, positioned directly opposite a contact 304b and 304f respectively, can be seen in detail. Contact holes 307 establish an electrical connection between the respective metallizations on the front and back of the carrier substrate 306. For example, contact holes 307b and 307f extend through the carrier substrate 306 to establish contact between the corresponding conductors and contacts.

[0036] The chip 302 is held in place on the back of the carrier substrate 306 by chip adhesive 312. As shown in the Fig. As shown in Figures 3A-3B, the chip 302 is aligned with chip pads 314 facing away from the support substrate 306, and such that the chip pads 314 are generally positioned near the corresponding ends of the lines 306. As shown in Fig. As shown in 3B, chip 302 is positioned such that a chip pad 314b is close to a line 305b.

[0037] Bond wires 310 are shown extending from chip pads 314 to corresponding traces 305. The bond wires 310 can be aluminum wire with a thickness between 20 and 25 µm, and the bond wires can be attached, for example, by aluminum wedge-wedge bonding technology. In particular, the use of aluminum bonding techniques that involve the application of acoustic or ultrasonic energy to the bond wires 310 to bond them to the chip pads 314 and to metallizations on the chip card surface 306, such as traces 305, can be achieved without applying temperatures outside an acceptable temperature range for the substrate 306.

[0038] In particular, according to one aspect of the disclosure, a polyester substrate (PET substrate) with limited temperature resistance, for example above 150 degrees Celsius, could be advantageously used with wedge-wedge bonding technology, in contrast to a thermosonic bonding technique, which uses temperatures outside the substrate's tolerance. It will be recognized that the wedge-wedge bonding technique, which in aspects that are in Fig. 3 are disclosed, is used, can be applied to any substrate suitable for the construction of chip card modules, including epoxy resin-based substrates, without regard to their resistance to temperatures typically associated with thermosonic bonding, including polyethylene, polypropylene, polyvinyl chloride or polycarbonate.

[0039] According to another aspect of the disclosure, the manufacture of chip card modules can be carried out in accordance with the one in Fig. The structure disclosed in Section 3 can be carried out without requiring any changes to production techniques due to a change, for example, in the substrate materials. Likewise, any suitable material used for the bond wires, including aluminum, or for the metallized conductors 305, including Ni, Au, Pd, Ag, can be used without significant modification of the manufacturing equipment or processes. Materials such as Ni, Au, Pd used for the contacts 304 can also be varied with similar results. For example, contacts without gold plating or without any gold component can be advantageously used. Consequently, the structure of Fig. 3 tolerant according to one aspect of the present disclosure with regard to changes in the materials as may be required by cost, availability and design requirements.

[0040] For example, the materials of Fig. 1 and Fig. 2 can be used in combination, including without the use of a flip-chip alignment. In this respect, advantageous aspects of the Fig. 1 and Fig. 2 can be combined. Although the “flip chip” from Fig. 2 the bond wires 110 of Fig. 1 replaced by the bumps 215 and the metallizations 204, 205, it may be advantageous to use wire bonding technology with metallizations, as in Fig. 3 shown. For example, the use of bond wires, including aluminium or other materials, to create connections between the bond pads 314 and the metallization on the support substrate 306 combines the double-sided structured metallization of the flip-chip configuration of Fig. 2. by wire bonding, although with the advantageous use of other or less expensive materials or processes.

[0041] A rotary head wire bonding device can, for example, provide a multi-axis movement that can be used to achieve the bonding of the wire 110 by Fig. 1 is required. However, according to one aspect of the disclosure, a wedge-wedge bonding technology can be employed without the use of a rotary head. In particular, by applying a wire angle of less than 10 degrees, for example between the chip pads 314 and the respective metallizations 305, most especially 0° ± 7.5°. Such an application can avoid the implementation of otherwise costly rotary head process technologies.

[0042] Similarly, shorter lengths of the bond wires 310, particularly limited to the distance from the chip pads 314 to the metallizations 305, represent a smaller radius of protection, which is required for relatively sensitive bonding structures. As in Fig. As shown in Figure 3, a Globe-Top 316 will therefore have a smaller volume compared to the Globe-Top 116. Fig. 1 provided. Since the bond wires 110 extend from the chip 102 all the way to the holes 108, the diameter of the globe top 116 is significantly larger than that of the globe top 316 (given the implementation of a chip module according to the ISO standard). In contrast, the globe top 316 can protect sensitive structures, such as wiring, even though it only extends to the interface between the bond wires 310 and the metallizations 305. A smaller globe top area can reduce manufacturing costs and / or increase the robustness of the chip card module, depending on the materials used. Furthermore, the underfill 218, as in the flip-chip implementation 200 of Fig. 2 shown, in the chip module 300 of Fig. 3 can be omitted.

[0043] According to yet another aspect of the present disclosure, the replacement of materials, e.g. gold, by less noble metals, and / or the elimination of process steps, e.g. coating of contact or bonding surfaces, can also be advantageously implemented.

[0044] A process 400 for manufacturing a chip card module is described in Fig. 4 disclosed. In particular, process 402 includes the deposition of a first metallization on a first side of a flexible substrate. Fig. For example, figure 3 discloses a chip card module that uses polyester material (PET material) for the carrier substrate 306. In accordance with figure 402, the first side of the substrate can, for example, be provided with one or an arrangement of contacts 304.

[0045] In 404, the deposition of a second metallization on a second side of the substrate can involve providing one or more structured metallizations, for example in the form of conduits 305, as in Fig. Figure 3 shows. Similarly, the establishment of an electrical contact between the first and / or second metallizations can be achieved, for example, by the formation of contacts by the substrate, as described in Figure 406. An example of such a contact is shown in Figure 3. Fig. 3 shown as contact holes 307.

[0046] In 408, advantageously arranging an integrated circuit on the second side of the flexible substrate involves facing the chip pads of the integrated circuit away from the second side, i.e., in a non-reversed orientation, as in the Fig. 1 and Fig. Figure 3 shows. Optionally, in 408a, the integrated circuit can be attached to the second side of the flexible substrate with chip pads aligned in a plane less than 10 degrees from a parallel alignment with the second metallizations.

[0047] Wire bonding is performed in 410. In particular, wire bonds connecting chip pads to their respective second metallizations establish an electrical contact between the chip pads and the second metallizations and, according to 406, thereby with first metallizations. The wire bonding step can be performed using wedge-wedge bonding technology at a temperature of less than, for example, 150 °C, according to 410a. In addition, provided that the chip pads are aligned in a plane that is less than 10 degrees from a parallel orientation to the plane of the second metallizations, as provided in 408a, 410b discloses wire bonding, e.g., wire bonding, performed using wedge-wedge bonding technology but without rotary head technology.

[0048] According to 412, the bond area (which usually contains the chip and its wire bonds) is encapsulated, e.g. by a globe-top cover.

[0049] With particular reference to the in Fig. Disclosed chip module structure 3. Disclosed in section 400 is a method that leads to a chip module structure integrating features that together increase the functionality of the chip module and / or reduce material and / or manufacturing costs. For example, if the flexible substrate 306 has a specific temperature sensitivity, e.g., a polyester substrate, 310 optionally provides 410a, in which wire bonding is used that does not involve temperatures above 150 °C, thereby adapting the production technique (i.e., wedge-wedge bonding) to the substrate used. Likewise, a person skilled in the art will recognize that wedge-wedge bonding can be used with other temperature ranges, depending on the temperature sensitivity characteristics of the substrate. Furthermore, 408 optionally provides the fastening of the integrated circuit such that the layer of the second metallization (e.g., layer 330 of 408) is not exposed. Fig. 3C) is within 10 degrees of a parallel orientation to the plane occupied by the chip pads (e.g., plane 320 of Fig. 3C). This orientation enables wire bonding without rotary head technology, as described in 410b, provided that the correct relative orientation between the surfaces to be joined by wire bonding is maintained. Likewise, bonding technologies requiring other angles of relative orientation, either more or less than 10 degrees, are considered as part of the disclosure of 400.

[0050] It is understood that 400 reveals a flexible manufacturing process for a chip card module that incorporates one or more cost-saving features of the chip card 300, as in Fig. 3 reveals, can integrate. The advantages of any replacement or omission of a single material can be aligned with the design requirements for a specific smart card module, and design flexibility is enhanced by the combinability of selected features of the components listed in the Fig. 1 and Fig. 2 in addition to the application of specific reduction technologies, particularly supported by one or more aspects of the Fig. 1 and Fig.2. may be incompatible. For example, structure 300 does not employ a flip chip. Accordingly, wedge-wedge bonding can be successfully employed, and the specific requirements of the flip-chip configuration can be omitted. Likewise, the introduction of secondary metallizations, as in 404, allows for shorter bond wire lengths, a smaller bonding area requiring encapsulation, and, provided that proper orientation according to 408a is maintained, preferred wire bonding technologies can be employed.

[0051] A person skilled in the art will recognize that combinations of the exemplary embodiments described above can be formed. Although the invention has been shown and described with particular reference to specific aspects of the disclosure, those skilled in the art should understand that various modifications to its form and details can be made without departing from the meaning and scope of protection of the invention as defined by the appended claims. The scope of protection of the invention is thus shown by the appended claims, and all modifications that fall within the meaning and equivalence of the claims are therefore intended to be included.

Claims

[1] Chip card module (300), comprising: a flexible substrate (306) with a first and a second main surface; a first metallization (304) on the first main surface, which provides at least one discrete electrical contact area ( , 304a, 304b, 304c, 304d, 304e, 304f, 304g); a second metallization (305) on the second main surface, which forms at least one discrete electrical conduction (305b, 305f); at least one contact hole (307, 307b, 307f) that establishes an electrical contact between the first metallization (304) and the second metallization (305); a component (302) mounted on the second main surface, wherein the component (302) has at least one electrical contact pad (314) arranged thereon, the contact pad (314) facing away from the second main surface, wherein the at least one discrete electrical conductor (305b, 305f) extends from the at least one contact hole (307, 307b, 307f) in the direction of the component (302); at least one bond wire (310, 310b, 310f) extending from the contact pad (314) to the second metallization (305) and thus electrically connecting the contact pad (314) to the at least one discrete electrical conductor (305b, 305f); and an encapsulation (316) covering the at least one bond wire (310, 310b, 310f), wherein the at least one discrete electrical conductor (305b, 305f) is only partially covered by the encapsulation (316). [2] Chip card module (300) according to claim 1, wherein the flexible substrate (306) is made at least partly of polyester. [3] Chip card module (300) according to claim 1 or 2, wherein the at least one bond wire (310, 310b, 310f) is made at least partly of aluminium. [4] Chip card module (300) according to one of claims 1 to 3, wherein the electrical contact surface (304a, 304b, 304c, 304d, 304e, 304f, 304g) is provided at least partially without any gold. [5] Chip card module (300) according to any one of claims 1 to 4, wherein the component (302) has a plurality of contact pads aligned in a first plane, and wherein the second metallization has a plurality of electrical conductors aligned in a second plane, wherein the first and second planes are aligned within 10 degrees of a parallel alignment to each other. [6] Chip card module (300) according to any one of claims 1 to 5, wherein the first metallization (304) extends only to the first main surface and wherein the second metallization (305) extends only to the second main surface. [7] Chip card module (300) according to one of claims 1 to 6, wherein a distance between one of the at least one contact pad (314) and one of the at least one contact hole (307, 307b, 307f) defines a conductor radius and wherein the encapsulation is defined by a radius that is smaller than the conductor radius. [8] Chip card module (300) according to any one of claims 1 to 7, wherein the substrate (306) has a melting point of less than 260 degrees Celsius. [9] Chip card module (300) according to claim 8, wherein the substrate (306) has a melting point of less than 200 degrees Celsius. [10] Method for manufacturing a chip card module (300), comprising: Deposition of a first metallization (304) on a first main surface of a flexible substrate (306); Deposition of a second metallization (305) on a second main surface of the substrate (306) forming at least one discrete electrical conduction (305b, 305f); Forming at least one contact hole (307, 307b, 307f) to establish an electrical contact between the first and the at least one discrete electrical conductor (305b, 305f); Attaching an integrated circuit (302) to the second main surface of the flexible substrate (306), wherein the integrated circuit (302) has a plurality of chip pads (314) facing away from the second main surface, wherein the at least one discrete electrical conductor (305b, 305f) extends from the at least one contact hole (307, 307b, 307f) in the direction of the component (302); Bonding of wire (310, 310b, 310f) between the chip pads (314) and the second metallization (305); and Encapsulating the bonded wire (310, 310b, 310f) to cover it, wherein the at least one discrete electrical conductor (305b, 305f) is only partially encapsulated. [11] Method according to claim 10, wherein at least one of the plurality of chip pads (314) is aligned in a plane which is less than 10 degrees from a parallel orientation to the second main surface. [12] Method according to one of claims 10 or 11, wherein the bonding is carried out at less than 150 degrees Celsius. [13] Method according to any one of claims 10 to 12, wherein bonding is carried out without rotary head technology. [14] Method according to any one of claims 10 to 13, wherein the substrate (306) is polyester.

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