Elastic contact pad for wafer transfer
By designing vertically movable adjustment components and contact layer structures, the slippage and adhesion problems during wafer transfer were solved, achieving stability in wafer transfer and reliability in release, and comprehensive performance adaptable to different working conditions.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI XIJIA PRECISION TECH CO LTD
- Filing Date
- 2026-05-20
- Publication Date
- 2026-06-23
AI Technical Summary
In existing technologies, there are slippage and adhesion problems during wafer transfer, making it difficult to achieve smooth release while ensuring transfer stability.
A vertically movable adjustment component and a contact layer structure with fixed edges and separable center were designed. By controlling the switching of contact states, anti-slip during wafer transfer and anti-adhesion during release were achieved.
It provides sufficient adsorption force to prevent slippage during wafer transport, ensuring stable and reliable transport. During release, it reduces the contact area for easy release, avoiding wafer damage or positional displacement. It has a simple structure, is easy to process, and is adaptable to different working conditions.
Smart Images
Figure CN224402090U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor manufacturing technology and relates to a wafer transfer carrier between different process equipment, specifically an elastic contact pad for wafer transfer. Background Technology
[0002] In semiconductor manufacturing processes, wafers need to be transferred efficiently and safely between different process equipment. Wafer transfer is typically accomplished by a robotic arm and its end effector. The end effector is equipped with elastic contact pads to directly support the wafer. These elastic contact pads need to have sufficiently strong adhesion to the wafer during transfer to prevent slippage during acceleration, deceleration, or high-speed movement. However, when the robotic arm reaches the target position to release the wafer, excessive adhesion can cause the wafer to stick to the elastic contact pads and prevent smooth release.
[0003] In existing technologies, a common solution is to adjust the adhesion force to the wafer by changing the surface roughness of the elastic contact pad. This method requires calculating the adhesion force needed for stable wafer transport based on the wafer's transport speed and operating conditions, and then adjusting the surface roughness of the elastic contact pad accordingly to minimize wafer adhesion while ensuring stable wafer transport. However, precise control of surface roughness requires high-precision mold processing and extensive testing and verification, resulting in problems such as high mold processing costs, high testing costs, and difficulty in ensuring product consistency. Utility Model Content
[0004] To address the technical problems existing in the background art, this utility model proposes an elastic contact pad for wafer transfer. Through structural design, the contact state between the contact pad and the wafer can be controlled and switched, so as to simultaneously take into account the anti-slip performance during the transfer process and the anti-adhesion performance during the release process.
[0005] The objective of this utility model can be achieved through the following technical solutions:
[0006] An elastic contact pad for wafer transport includes: a base, a contact layer, and an adjustment assembly. The base is mounted on a robotic arm for transporting wafers. The contact layer is horizontally disposed on the base to support the wafer. The peripheral edges of the contact layer are fixedly connected to the base, and the middle part of the contact layer is separated from the base. The adjustment assembly is movably disposed within the base in a vertical direction and can move relative to the base between a first position and a second position. In the first position, the middle part of the contact layer naturally adheres to the base, making the upper surface of the contact layer that contacts the wafer a horizontal plane for complete contact with the wafer. When the adjustment assembly moves to the second position, it lifts the middle part of the contact layer vertically, causing the upper surface of the contact layer to deform into an umbrella-shaped arc surface. The middle part of the arc surface bulges upward to contact the wafer, while the peripheral edges slope downward to separate from the wafer.
[0007] Furthermore, the contact layer includes: a contact portion and a deformation portion. The deformation portion is coaxially disposed around the contact portion. The inner side of the deformation portion is fixedly connected to the contact portion, and the outer side is fixedly connected to the base. The contact portion is mounted on the adjustment assembly so that when the adjustment assembly is lifted, it causes the deformation portion to bulge upward and deform.
[0008] Furthermore, the contact part, the deformation part, and the base are integrally molded from fluororubber material.
[0009] Furthermore, the adjustment assembly includes a screw, a push rod, and an electric motor. A threaded through hole is provided in the middle of the base along the vertical direction. The screw is threaded into the threaded through hole. One end of the push rod is connected to the contact part. The electric motor is installed at the other end of the push rod. The screw is connected to the output end of the electric motor.
[0010] Furthermore, the top end of the threaded through hole is provided with a first limiting boss that matches the top surface of the screw, and the bottom end of the threaded through hole is provided with a second limiting boss that matches the bottom surface of the screw, so that the screw can move vertically between the first position and the second position within the threaded through hole.
[0011] Furthermore, a sealed cavity is formed between the contact layer and the base, and the side of the base is provided with air holes that connect to the sealed cavity in order to balance the air pressure in the sealed cavity when the adjustment component is lifted.
[0012] Furthermore, the base has a mounting connection structure at its bottom to detachably fix the contact pad to the end effector of the robotic arm.
[0013] The beneficial effects of this utility model are as follows: The elastic contact pad for wafer transport provided by this utility model, through the setting of a vertically movable adjustment component and a contact layer structure with fixed edges and separable center, realizes the controllable switching of the contact state between the contact layer and the wafer. During wafer transport, the adjustment component is in the first position, the upper surface of the contact layer remains flat and is in complete contact with the wafer, which can provide a sufficiently large contact area and adsorption force to ensure that the wafer will not slip and the transport is stable and reliable. After the wafer is transported to the position, the adjustment component moves to the second position to lift the center of the contact layer, so that the upper surface of the contact layer is deformed into an umbrella-shaped arc surface, and its edge is gradually peeled off from the wafer, thereby greatly reducing the contact area and realizing easy release of the wafer. The structure is simple, easy to process and use, can dynamically adapt to different wafer transport conditions, and has excellent anti-slip and anti-adhesion comprehensive performance. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the adjusting component of this utility model in the first position.
[0015] Figure 2 This is a schematic diagram of the adjusting component of this utility model in the second position.
[0016] Figure 3 This is a schematic diagram of the contact layer of this utility model.
[0017] Figure 4 This is a schematic diagram of the base of this utility model.
[0018] Figure 5 This is a schematic diagram of the adjustment component of this utility model. Detailed Implementation
[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.
[0020] like Figures 1-2 As shown, this utility model provides an elastic contact pad for wafer transport, comprising: a base 1, a contact layer 2, and an adjustment assembly 3. The base 1 is mounted on a robotic arm for transporting wafers 4, serving as the supporting foundation for the entire contact pad. The contact layer 2 is horizontally disposed on the base 1, directly supporting the wafers 4. The peripheral edges of the contact layer 2 are fixedly connected to the base 1, while the middle portion of the contact layer 2 is separated from the base 1 to allow for a movable space that can be lifted.
[0021] The adjustment component 3 is vertically movable within the base 1 and can move between a first position and a second position relative to the base 1. When the adjustment component 3 is in the first position, the middle part of the contact layer 2 naturally adheres to the base 1, making the upper surface of the contact layer 2 in contact with the wafer 4 a horizontal plane, thus achieving complete contact with the wafer 4. This planar contact state provides the maximum contact area, generating sufficient adsorption force during wafer 4 transfer, effectively preventing wafer 4 slippage and ensuring transfer stability. When the adjustment component 3 moves to the second position, it lifts the middle part of the contact layer 2 vertically, deforming the upper surface of the contact layer 2 into an umbrella-shaped arc surface. The middle part of this arc surface bulges upward, contacting only the central area of the wafer 4, while the peripheral edges slope downward, completely separating from the wafer 4. This significantly reduces the normal contact area between the contact layer 2 and the wafer 4, allowing the robotic arm to easily separate the wafer 4 when releasing it, preventing the wafer from sticking to the contact pad, and effectively preventing damage or positional displacement of the wafer 4.
[0022] Specifically, such as Figure 3As shown, the contact layer 2 includes a contact portion 21 and a deformation portion 22. The deformation portion 22 is coaxially disposed around the contact portion 21. The inner side of the deformation portion 22 is fixedly connected to the contact portion 21, and the outer side is fixedly connected to the base 1. The area of the contact portion 21 accounts for approximately 40% of the total area of the upper surface of the contact layer 2. The contact portion 21 is mounted on the adjustment assembly 3. When the adjustment assembly 3 is lifted, the contact portion 21 is pushed upward, thereby causing the deformation portion 22 to bulge upward and undergo elastic deformation. By concentrating the deformation on the deformation portion 22, only the deformation portion 22 is separated from the wafer 4 during the lifting process, while the contact portion 21 remains in contact with the wafer 4. This avoids excessive lifting that could cause the wafer 4 to slip, ensuring the reliability of the lifting action.
[0023] The contact portion 21, the deformation portion 22, and the base 1 are integrally molded from fluororubber material, simplifying the manufacturing process, reducing production costs, and eliminating gaps between components, thereby improving the overall structural strength and sealing performance. Fluororubber material possesses excellent high-temperature resistance and chemical corrosion resistance, enabling it to withstand the high-temperature environment that may exist during wafer 4 transport. Preferably, those skilled in the art can also coat the surface of the contact layer 2 with a nanoscale coating as needed to further reduce the normal adhesion between the contact layer 2 and the wafer 4. The thickness of the nanoscale coating is less than 500 nanometers, and it can be selected from fluorocarbon coatings, diamond-like carbon coatings, or chemical vapor deposition coatings.
[0024] like Figures 4-5 As shown, the adjustment assembly 3 includes a screw 31, a push rod 32, and an electric motor 33. A threaded through hole 11 is vertically arranged in the center of the base 1, and the screw 31 is threadedly connected to the threaded through hole 11. One end of the push rod 32 is connected to the contact part 21, and the electric motor 33 is installed at the other end of the push rod 32. The screw 31 is connected to the output end of the electric motor 33. During operation, the electric motor 33 drives the screw 31 to rotate. The screw 31 moves linearly in the vertical direction within the threaded through hole 11 through threaded engagement, thereby driving the push rod 32 to lift or lower the contact part 21. The structure is compact, the movement is smooth, and the control precision is high, enabling precise control of the lifting height and accurate adjustment of the deformation of the contact layer 2.
[0025] To limit the movement range of the adjustment component 3, a first limiting boss 12 adapted to the top surface of the screw 31 is provided at the top of the threaded through hole 11, and a second limiting boss 13 adapted to the bottom surface of the screw 31 is provided at the bottom of the threaded through hole 11. The first limiting boss 12 and the second limiting boss 13 together limit the movement stroke of the screw 31 within the threaded through hole 11, so that the screw 31 can only move between the first position and the second position, avoiding the problem of damage to the contact layer 2 due to excessive lifting or retraction, and improving reliability and safety.
[0026] Furthermore, since a closed cavity is formed by the reserved lifting space between the contact layer 2 and the base 1, an air hole is provided on the side of the base 1 to connect the closed cavity. When the adjusting component 3 lifts the contact part 21, the volume of the closed cavity increases, the internal air pressure decreases, and external air enters the closed cavity through the air hole to balance the internal and external air pressure, making the lifting action smooth and unobstructed. When the contact part 21 falls back, the volume of the closed cavity decreases, and excess gas is discharged through the air hole, effectively avoiding additional resistance or negative pressure adsorption caused by air pressure changes, and ensuring the sensitivity of the deformation and reset of the contact layer 2.
[0027] Finally, a mounting connection structure 14 is provided at the bottom of the base 1 for detachably fixing the contact pad to the end effector of the robotic arm. The mounting connection structure 14 can be in the form of common forms such as slots, snaps, threaded connecting posts or adhesive layers, which facilitates quick installation, replacement and maintenance by those skilled in the art according to actual needs, improving the versatility and convenience of the product.
[0028] The above description is merely an example and illustration of the structure of this utility model. Those skilled in the art can make various modifications or additions to the specific embodiments described or use similar methods to replace them, as long as they do not deviate from the structure of the utility model or exceed the scope defined in the claims, they should all fall within the protection scope of this utility model.
Claims
1. An elastic contact pad for wafer transmission, characterized in that, include: The base (1), contact layer (2), and adjustment assembly (3) are mounted on a robotic arm for transferring wafers (4). The contact layer (2) is horizontally positioned on the base (1) to support the wafers (4). The peripheral edge of the contact layer (2) is fixedly connected to the base (1), and the middle part of the contact layer (2) is separated from the base (1). The adjusting component (3) is vertically movably disposed within the base (1) and can move relative to the base (1) between a first position and a second position. Adjust the component (3) in the first position, so that the middle part of the contact layer (2) naturally adheres to the base (1), so that the upper surface of the contact layer (2) in contact with the wafer (4) is a horizontal plane to fully contact the wafer (4); Adjust the component (3) to the second position, lift the middle part of the contact layer (2) vertically, so that the upper surface of the contact layer (2) is deformed into an umbrella-shaped arc surface, the middle part of the arc surface bulges upward and contacts the wafer (4), and the peripheral edge tilts downward and separates from the wafer (4).
2. The contact pad according to claim 1, characterized in that, The contact layer (2) includes a contact part (21) and a deformation part (22). The deformation part (22) is coaxially disposed around the contact part (21). The inner side of the deformation part (22) is fixedly connected to the contact part (21), and the outer side is fixedly connected to the base (1). The contact part (21) is mounted on the adjustment assembly (3) so that when the adjustment assembly (3) is lifted, the deformation part (22) will bulge upward and deform.
3. The contact pad according to claim 2, characterized in that, The contact part (21), the deformation part (22) and the base (1) are integrally molded from fluororubber material.
4. The contact pad according to claim 2, characterized in that, The adjustment assembly (3) includes a screw (31), a push rod (32), and an electric motor (33). A threaded through hole (11) is provided in the middle of the base (1) along the vertical direction. The screw (31) is threaded into the threaded through hole (11). One end of the push rod (32) is connected to the contact part (21). The electric motor (33) is installed at the other end of the push rod (32). The screw (31) is connected to the output end of the electric motor (33).
5. The contact pad according to claim 4, characterized in that, The top end of the threaded through hole (11) is provided with a first limiting boss (12) that is adapted to the top surface of the screw (31), and the bottom end of the threaded through hole (11) is provided with a second limiting boss (13) that is adapted to the bottom surface of the screw (31), so that the screw (31) can move in the threaded through hole (11) between the first position and the second position in the vertical direction.
6. The contact pad according to claim 1, characterized in that, A sealed cavity is formed between the contact layer (2) and the base (1). The side of the base (1) is provided with an air hole that connects to the sealed cavity, so as to balance the air pressure in the sealed cavity when the adjustment component (3) is lifted.
7. The contact pad according to claim 1, characterized in that, The base (1) has a mounting connection structure (14) at its bottom to detachably fix the contact pad to the end effector of the robotic arm.