Robotic suction cup structure for handling semiconductor wafers

Abstract

This invention discloses a robotic suction cup structure for handling semiconductor wafers, relating to the field of semiconductor wafer technology. It includes a flexible negative pressure mechanism comprising an adjusting ring, an elastic sealing cylinder, and folded ribs. The adjusting ring is fixedly connected to the bottom of the elastic sealing cylinder, and the folded ribs are embedded inside the elastic sealing cylinder. A wafer tray is located at the bottom of the flexible negative pressure mechanism. When the elastic sealing cylinder adsorbs the wafer tray through negative pressure, the wafer tray generates an adsorption force on the semiconductor wafer. A transport seat is located on the top surface of the flexible negative pressure mechanism for driving it. A negative pressure motor is located on the top surface of the transport seat, and the output end of the negative pressure motor is connected to the inner cavity of the elastic sealing cylinder through a pipe. Because the semiconductor wafer is placed on the top surface of the wafer tray, the elastic sealing cylinder does not touch the top surface of the semiconductor wafer when adsorbing the wafer tray, thus protecting the semiconductor wafer in a sealed environment and greatly improving the protection effect on the semiconductor wafer.

Description

Technical Field

[0001] This invention relates to the field of semiconductor wafer technology, and more specifically to a robotic handling suction cup structure for semiconductor wafers. Background Technology

[0002] In the technology of handling semiconductor wafers, the traditional robotic suction cup structure for handling semiconductor wafers uses negative pressure to hold the semiconductor wafer and then transports it to the set work station. In order to ensure that the suction cup does not affect the semiconductor wafer, the contact surface between the suction cup and the semiconductor wafer needs to be cleaned continuously to prevent the suction cup from contaminating the top surface of the semiconductor wafer.

[0003] Although the chucks are cleaned, they can still contaminate the contact surfaces of semiconductor wafers. For example, the wafer adsorption device disclosed in patent application CN114156223A and the multi-wafer edge grinding system disclosed in patent application CN113053789A can affect the yield of semiconductor wafers when transporting them. Specifically, during the adsorption and release of semiconductor wafers, the bottom surface of the chuck is prone to mechanical friction with the top surface of the semiconductor wafer. This mechanical friction can cause scratches on the surface of the semiconductor wafer, further affecting the yield of the semiconductor wafer. Summary of the Invention

[0004] In order to overcome the above-mentioned technical problems, the purpose of this invention is to provide a robot handling suction cup structure for semiconductor wafers, so as to solve the problem that in the prior art, during the process of adsorbing and releasing semiconductor wafers, the bottom surface of the suction cup is prone to mechanical friction with the top surface of the semiconductor wafer. Mechanical friction will cause scratches on the surface of the semiconductor wafer, resulting in a decrease in the yield of the semiconductor wafer.

[0005] The objective of this invention can be achieved through the following technical solutions:

[0006] Specifically, it provides a robotic suction cup structure for handling semiconductor wafers, including a flexible negative pressure mechanism. This mechanism includes an adjusting ring, an elastic sealing cylinder, and folding ribs. The adjusting ring is fixedly connected to the bottom of the elastic sealing cylinder, and the folding ribs are embedded inside the elastic sealing cylinder. A wafer tray is provided at the bottom of the flexible negative pressure mechanism. When the elastic sealing cylinder adsorbs the wafer tray through negative pressure, the wafer tray generates an adsorption force on the semiconductor wafer. A transport seat is provided on the top surface of the flexible negative pressure mechanism for driving the mechanism. A negative pressure motor is provided on the top surface of the transport seat. The output end of the negative pressure motor is connected to the inner cavity of the elastic sealing cylinder through a pipe to control the air pressure inside the elastic sealing cylinder.

[0007] As a further aspect of the present invention: the adjusting ring is a first elastic arc ring, one end of the first elastic arc ring is fixedly connected to a second elastic arc ring, and the other end of the first elastic arc ring is provided with an adjusting air pressure cavity that fits with the second elastic arc ring.

[0008] As a further aspect of the present invention: the adjusting ring is a third elastic arc ring, with an adjusting gear meshing on the outer side of one end of the third elastic arc ring, and the other side of the adjusting gear meshing on the inner side of the other end of the third elastic arc ring.

[0009] As a further aspect of the present invention: the folded rib includes a first reinforcing rib and a second reinforcing rib, the first reinforcing rib and the second reinforcing rib are staggered, and the joint is movably connected by a pivot.

[0010] As a further aspect of the present invention: the wafer tray includes a tray body, a wafer chuck is fixedly connected to the center of the top surface of the tray body, a first docking groove is provided at the edge of the top surface of the tray body, a rotating ring is provided at the bottom surface of the first docking groove, and a second docking groove is provided at the edge of the bottom surface of the tray body.

[0011] As a further aspect of the present invention: the surface of the rotating ring is provided with a plurality of first mating holes, and the bottom surface of the first mating groove is provided with a plurality of second mating holes, the positions of the plurality of first mating holes and the positions of the plurality of second mating holes being one-to-one.

[0012] As a further aspect of the present invention: the bottom surface of the rotating ring is provided with a driving groove, the bottom of the driving groove is provided with a driving motor, the driving motor is fixed inside the tray body, the output shaft of the driving motor is fixedly connected with a driving gear, and the driving gear meshes with the side wall of the driving groove.

[0013] As a further aspect of the present invention: the wafer chuck has an internal cavity, a sealed piston is provided inside the internal cavity, a driving block is provided on the top of the inner side of the internal cavity, a lever is movably connected to the top of the driving block, and a sealed slider is movably connected to the end of the lever away from the driving block.

[0014] As a further aspect of the present invention: a fixed shaft is installed at the middle position of the lever, and the ratio of the distance from the fixed shaft to the drive block to the distance from the fixed shaft to the sealing slider is 4:1.

[0015] As a further aspect of the present invention: an X-axis threaded rod is inserted inside the transport seat, and a movable seat is fixedly connected to both ends of the X-axis threaded rod. A Y-axis threaded rod is inserted inside the movable seat, and one end of the Y-axis threaded rod is mounted on the robot. A hydraulic cylinder is fixedly connected to the top surface of the transport seat, and the bottom end of the hydraulic cylinder is fixedly connected to the top surface of the elastic sealing cylinder through a hydraulic rod.

[0016] The beneficial effects of this invention are:

[0017] 1. In this invention, through the flexible negative pressure mechanism, when the elastic sealing cylinder is sleeved on the outside of the wafer tray, the wafer tray will move into the interior of the elastic sealing cylinder under the action of external high air pressure, thereby achieving the adsorption of the wafer tray. Since the semiconductor wafer is placed on the top surface of the wafer tray, the elastic sealing cylinder will not touch the top surface of the semiconductor wafer when adsorbing the wafer tray, and at the same time, it protects the semiconductor wafer in a sealed environment, which greatly improves the protection effect of the semiconductor wafer. Furthermore, the elastic sealing cylinder can adsorb multiple wafer trays at the same time, that is, the elastic sealing cylinder can transport multiple semiconductor wafers, which will improve the efficiency of the robot's suction cup structure in transporting semiconductor wafers.

[0018] 2. In this invention, by using a wafer chuck, when a semiconductor wafer is placed on the top surface of the wafer chuck, the bottom surface of the semiconductor wafer simultaneously contacts the top surface of the wafer chuck and the top surface of the sealing slider. When the sealing slider moves downward, a vacuum cavity is formed between the sealing slider and the bottom surface of the semiconductor wafer. The adsorption force formed by this cavity will make the semiconductor wafer stick tightly to the top surface of the wafer chuck, ensuring that the semiconductor wafer will not shake during the movement of the wafer tray.

[0019] 3. In this invention, by means of an adjusting ring, after the elastic sealing cylinder adsorbs the wafer tray, the air pump draws air into the adjusting air pressure chamber through the pipeline. This causes a section of the second elastic arc ring inside the adjusting air pressure chamber to move further in, making the diameter of the ring formed by the first and second elastic arc rings smaller, until the diameter of the ring formed by the first and second elastic arc rings is smaller than the diameter of the wafer tray. In this way, the elastic sealing cylinder can ensure that the wafer tray will not slip out of the elastic sealing cylinder during the transportation of the wafer tray. Attached Figure Description

[0020] The invention will now be further described with reference to the accompanying drawings.

[0021] Figure 1 This is a schematic diagram of the structure of the present invention;

[0022] Figure 2 This is a schematic diagram of the structure of the elastic sealing cylinder in this invention;

[0023] Figure 3 This is a partial front view of the folded rib in this invention;

[0024] Figure 4 This is a schematic diagram of the structure of the wafer tray in this invention;

[0025] Figure 5 This is a top view of the wafer tray in this invention;

[0026] Figure 6This is a schematic diagram of the bottom structure of the wafer tray in this invention;

[0027] Figure 7 This is a partial cross-sectional view of the rotating ring in this invention;

[0028] Figure 8 This is a cross-sectional view of the wafer tray in this invention;

[0029] Figure 9 yes Figure 8 A magnified view of a section at point A in the middle;

[0030] Figure 10 This is a schematic diagram of the adjusting ring structure in Embodiment 2 of the present invention;

[0031] Figure 11 This is a schematic diagram of the adjusting ring structure in Embodiment 3 of the present invention;

[0032] Figure 12 This is a diagram showing the state of the elastic sealing cylinder adsorbing the wafer tray in this invention.

[0033] In the diagram: 1. Flexible negative pressure mechanism; 11. Adjusting ring; 111. First elastic arc ring; 112. Second elastic arc ring; 113. Adjusting air pressure chamber; 114. Third elastic arc ring; 115. Adjusting gear; 12. Elastic sealing cylinder; 13. Folded rib; 131. First reinforcing rib; 132. Second reinforcing rib; 2. Wafer tray; 21. Tray body; 22. Wafer suction cup; 221. Internal cavity; 222. Sealing piston; 223. Drive block; 224. Lever; 225. Sealing slider; 23. First docking groove; 24. Rotary ring; 241. First docking hole; 242. Drive groove; 243. Drive motor; 244. Drive gear; 25. Second docking groove; 251. Second docking hole; 3. Transport seat; 31. Hydraulic cylinder; 32. X-axis threaded rod; 33. Moving seat; 34. Y-axis threaded rod; 4. Negative pressure motor. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] Example 1:

[0036] like Figure 1 and Figure 2As shown, the present invention discloses a robot handling suction cup structure for semiconductor wafers, including a flexible negative pressure mechanism 1, which includes an adjusting ring 11, an elastic sealing cylinder 12, and a folding rib 13. The adjusting ring 11 is fixedly connected to the bottom of the elastic sealing cylinder 12, and the folding rib 13 is embedded inside the elastic sealing cylinder 12. A wafer tray 2 is provided at the bottom of the flexible negative pressure mechanism 1. When the elastic sealing cylinder 12 adsorbs the wafer tray 2 through negative pressure, the wafer tray 2 generates an adsorption force on the semiconductor wafer. A transport seat 3 is provided on the top surface of the flexible negative pressure mechanism 1 for driving the flexible negative pressure mechanism 1. A negative pressure motor 4 is provided on the top surface of the transport seat 3. The output end of the negative pressure motor 4 is connected to the inner cavity of the elastic sealing cylinder 12 through a pipe to control the air pressure inside the elastic sealing cylinder 12.

[0037] It should be noted that the inner diameter of the adjusting ring 11 is larger than the diameter of the wafer tray 2. During the processing and transportation of semiconductor wafers, the semiconductor wafers are placed on the top surface of the wafer tray 2. When it is necessary to transport the semiconductor wafers to the corresponding processing station, the robot moves the flexible negative pressure mechanism 1 to the top surface of the wafer tray 2 via the transport seat 3, and then turns on the negative pressure motor 4. The negative pressure motor 4 can create a negative pressure inside the elastic sealing cylinder 12, and the folding rib 13 will support the inside of the elastic sealing cylinder 12 to prevent the elastic sealing cylinder 12 from collapsing due to the internal negative pressure. When the elastic sealing cylinder 12 is fitted over the outside of the wafer tray 2, the wafer tray... When the disk 2 is subjected to high external air pressure, it moves into the interior of the elastic sealing cylinder 12, thereby adsorbing the wafer tray 2. Since the semiconductor wafer is placed on the top surface of the wafer tray 2, the elastic sealing cylinder 12 will not touch the top surface of the semiconductor wafer when adsorbing the wafer tray 2, and at the same time protects the semiconductor wafer in a sealed environment, which greatly improves the protection effect of the semiconductor wafer. Furthermore, the elastic sealing cylinder 12 can adsorb multiple wafer trays 2 at the same time, which means that the elastic sealing cylinder 12 can transport multiple semiconductor wafers, which will improve the efficiency of the robot's suction cup structure in transporting semiconductor wafers.

[0038] like Figure 3 As shown, the folded rib 13 includes a first reinforcing rib 131 and a second reinforcing rib 132. The first reinforcing rib 131 and the second reinforcing rib 132 are staggered and connected at the joint by a rotating shaft.

[0039] It should be noted that the reason why the joint of the first reinforcing rib 131 and the second reinforcing rib 132 is connected by a rotating shaft is that when a negative pressure is formed inside the elastic sealing cylinder 12, the first reinforcing rib 131 and the second reinforcing rib 132 will expand and contract along the axis of the elastic sealing cylinder 12. This will reduce the inner diameter of the elastic sealing cylinder 12. When the elastic sealing cylinder 12 adsorbs the wafer tray 2, the inner wall of the elastic sealing cylinder 12 will exert a squeezing force on the side of the wafer tray 2, further improving the adsorption effect on the wafer tray 2 and ensuring that the wafer tray 2 is stable inside the elastic sealing cylinder 12.

[0040] like Figure 4 , Figure 5 and Figure 6 As shown, the wafer tray 2 includes a tray body 21. A wafer chuck 22 is fixedly connected to the center of the top surface of the tray body 21. A first docking groove 23 is provided at the edge of the top surface of the tray body 21. A rotating ring 24 is provided on the bottom surface of the first docking groove 23. A second docking groove 25 is provided at the edge of the bottom surface of the tray body 21. A plurality of first docking holes 241 are passed through the surface of the rotating ring 24. A plurality of second docking holes 251 are passed through the bottom surface of the first docking groove 23. The positions of the plurality of first docking holes 241 correspond one-to-one with the positions of the plurality of second docking holes 251.

[0041] It should be noted that when the elastic sealing cylinder 12 grasps two or more round wafer trays 2, the following steps shall be followed:

[0042] First, the elastic sealing cylinder 12 is placed on the outside of the first circular crystal tray 2. Then, the negative pressure motor 4 is turned on. The negative pressure motor draws air from the elastic sealing cylinder 12 through the pipe, so that a negative pressure is formed inside the elastic sealing cylinder 12. In this way, the pressure on the top surface of the circular crystal tray 2 is less than the pressure on the bottom surface. Under the action of the pressure difference, the circular crystal tray 2 will move into the interior of the elastic sealing cylinder 12.

[0043] When the elastic sealing cylinder 12 needs to adsorb the second cylindrical tray 2, the elastic sealing cylinder 12 is first placed over the outside of the second cylindrical tray 2, such as... Figure 12 As shown, the rotating ring 24 in the first wafer tray 2 then rotates, causing the first docking hole 241 and the second docking hole 251 to align. This connects the first docking groove 23 and the second docking groove 25, allowing the air between the two wafer trays 2 to pass through the first wafer tray 2 and enter the negative pressure motor 4, where it is then discharged. This creates a negative pressure on the top surface of the second wafer tray 2. However, the folding rib 13 on the top surface of the first wafer tray 2 has a large curvature, which limits the upward movement of the first wafer tray 2. Eventually, the second wafer tray 2 will move to the bottom surface of the first wafer tray 2.

[0044] The same applies when the elastic sealing cylinder 12 adsorbs the third wafer tray 2, which allows the elastic sealing cylinder 12 to adsorb multiple wafer trays 2 at the same time, thus achieving the purpose of transporting multiple semiconductor wafers simultaneously.

[0045] When multiple wafer trays 2 need to be placed, air is first injected into the elastic sealing cylinder 12 by the negative pressure motor 4. This causes the multiple wafer trays 2 inside the elastic sealing cylinder 12 to move downwards. When the bottom wafer tray 2 contacts the placement surface, the rotating ring 24 on the second to last wafer tray 2 is rotated to make the first mating hole 241 and the second mating hole 251 on the wafer tray 2 misaligned, and the elastic sealing cylinder 12 is resealed.

[0046] like Figure 7 As shown, a drive groove 242 is provided on the bottom surface of the rotating ring 24, and a drive motor 243 is provided at the bottom of the drive groove 242. The drive motor 243 is fixed inside the tray body 21, and a drive gear 244 is fixedly connected to the output shaft of the drive motor 243. The drive gear 244 meshes with the side wall of the drive groove 242.

[0047] It should be noted that when the rotating ring 24 needs to be rotated, the drive motor 243 is turned on. The output shaft of the drive motor 243 will drive the drive gear 244 to rotate. The rotating drive gear 244 will drive the rotating ring 24, causing the rotating ring 24 to rotate on the bottom surface of the first docking groove 23, thereby realizing the adjustment of the docking and non-dating of the first docking hole 241 and the second docking hole 251.

[0048] like Figure 8 and Figure 9 As shown, the wafer chuck 22 has an internal cavity 221, and a sealing piston 222 is provided inside the internal cavity 221. A driving block 223 is provided on the top inner side of the internal cavity 221. A lever 224 is movably connected to the top of the driving block 223. A sealing slider 225 is movably connected to the end of the lever 224 away from the driving block 223. The sealing piston 222 seals the internal cavity 221, and the internal cavity 221 is filled with atmospheric pressure air.

[0049] It should be noted that when the elastic sealing cylinder 12 adsorbs the wafer tray 2, the top surface of the wafer tray 2 is under negative pressure. At this time, the pressure at the end of the sealing piston 222 that is connected to the inner cavity of the elastic sealing cylinder 12 is less than the pressure at the end of the sealing piston 222 that is close to the inner cavity 221. Therefore, the sealing piston 222 will move towards the port of the inner cavity 221 under the action of air pressure. During the process of the sealing piston 222 moving towards the port of the inner cavity 221, the sealing piston 222 will squeeze the driving block 223, causing the driving block 223 to move upward. The driving block 223 can then drive the sealing slider 225 through the lever 224, causing the sealing slider 225 to move downward.

[0050] It needs to be further explained that the semiconductor wafer is placed on the top surface of the wafer chuck 22, and the top surface of the sealing slider 225 is flush with the top surface of the wafer chuck 22. When the semiconductor wafer is placed on the top surface of the wafer chuck 22, the bottom surface of the semiconductor wafer is in contact with both the top surface of the wafer chuck 22 and the top surface of the sealing slider 225. When the sealing slider 225 moves downward, a vacuum cavity is formed between the sealing slider 225 and the bottom surface of the semiconductor wafer. The adsorption force formed by this cavity will make the semiconductor wafer stick tightly to the top surface of the wafer chuck 22, ensuring that the semiconductor wafer will not shake during the movement of the wafer tray 2.

[0051] Specifically, such as Figure 5 and Figure 9 As shown, there are at least three sets of sealing pistons 222, which are arranged in a circular shape at equal intervals to ensure uniform adsorption force on the bottom surface of the semiconductor wafer. After the elastic sealing cylinder 12 transports the wafer tray 2 to the designated position and is lowered, the sealing slider 225 will move towards the inside of the inner cavity 221 under the action of external high air pressure. In this way, the driving block 223 will move downward under its own weight and the action of a vacuum cavity formed between the sealing slider 225 and the bottom surface of the semiconductor wafer, automatically releasing the adsorption of the semiconductor wafer and ensuring that the semiconductor wafer can cooperate with subsequent processes.

[0052] like Figure 9 As shown, a fixed shaft is installed at the middle position of lever 224. The ratio of the distance from the fixed shaft to the drive block 223 to the distance from the fixed shaft to the sealing slider 225 is 4:1. To ensure that the drive block 223 can drive the lever 224 normally, the lever 224 adopts a telescopic long rod.

[0053] It should be noted that the negative pressure generated by the elastic sealing cylinder 12 exerts a force on the sealing piston 222 that is greater than one-quarter of the gravity of the driving block 223 and the adsorption force generated by the sealing slider 225. In this way, the sealing piston 222 can push the driving block 223 to move upward.

[0054] like Figure 1 As shown, an X-axis threaded rod 32 is inserted inside the transport seat 3. The two ends of the X-axis threaded rod 32 are fixedly connected to a movable seat 33. A Y-axis threaded rod 34 is inserted inside the movable seat 33. One end of the Y-axis threaded rod 34 is mounted on the robot. A hydraulic cylinder 31 is fixedly connected to the top surface of the transport seat 3. The bottom end of the hydraulic cylinder 31 is fixedly connected to the top surface of the elastic sealing cylinder 12 through a hydraulic rod.

[0055] It should be noted that a ball nut is fixedly installed inside the transport seat 3, and the ball nut is engaged with the X-axis threaded rod 32. A motor is installed inside the moving seat 33, and the output shaft of the motor is fixedly connected to the X-axis threaded rod 32 through a coupling. When the motor is turned on, the motor can directly drive the X-axis threaded rod 32 to rotate. The rotating X-axis threaded rod 32, in conjunction with the ball nut inside the transport seat 3, enables the transport seat 3 to move in the X-axis direction.

[0056] One end of the Y-axis threaded rod 34 is also connected to the motor via a coupling. The motor is fixed on the robot. Inside the moving seat 33, there is a ball nut that mates with the Y-axis threaded rod 34. This enables the moving seat 33 to move in the Y-axis direction, which in turn enables the transport seat 3 to move in the Y-axis direction.

[0057] The hydraulic cylinder 31 can directly drive the elastic sealing cylinder 12 through the hydraulic rod, so as to realize the vertical movement of the elastic sealing cylinder 12. With the cooperation of the transport seat 3, the elastic sealing cylinder 12 can be adjusted in various positions in space.

[0058] Example 2:

[0059] like Figure 10 As shown, the adjusting ring 11 is a first elastic arc ring 111, one end of the first elastic arc ring 111 is fixedly connected to a second elastic arc ring 112, and the other end of the first elastic arc ring 111 is provided with an adjusting air pressure chamber 113 that fits into the second elastic arc ring 112.

[0060] It should be noted that the regulating air pressure chamber 113 is connected to an air pump via a pipe. The air pump can either fill the regulating air pressure chamber 113 with air or draw air from it via the pipe. When the elastic sealing cylinder 12 needs to adsorb the cylindrical tray 2, the air pump fills the regulating air pressure chamber 113 with air via the pipe. This causes a section of the second elastic arc ring 112 inside the regulating air pressure chamber 113 to move outside, increasing the diameter of the ring formed by the first elastic arc ring 111 and the second elastic arc ring 112. This allows it to accommodate cylindrical trays 2 of different sizes. After the elastic sealing cylinder 12 holds the wafer tray 2 in place, the air pump draws air into the regulating air pressure chamber 113 through the pipeline. This causes a section of the second elastic arc ring 112 inside the regulating air pressure chamber 113 to move further in, making the diameter of the ring formed by the first elastic arc ring 111 and the second elastic arc ring 112 smaller, until the diameter of the ring formed by the first elastic arc ring 111 and the second elastic arc ring 112 is smaller than the diameter of the wafer tray 2. In this way, the elastic sealing cylinder 12 can ensure that the wafer tray 2 will not slip out of the elastic sealing cylinder 12 during the transportation of the wafer tray 2.

[0061] Example 3:

[0062] like Figure 11 As shown, the adjusting ring 11 is a third elastic arc ring 114. One end of the third elastic arc ring 114 is engaged with an adjusting gear 115 on its outer side, and the other side of the adjusting gear 115 is engaged with the inner side of the other end of the third elastic arc ring 114.

[0063] Unlike Embodiment 2, a motor is fixedly installed on the outer side of the third elastic arc ring 114. The output shaft of the motor is directly connected to the adjusting gear 115. The size of the annular diameter formed by the third elastic arc ring 114 can be adjusted by rotating the adjusting gear 115. When the elastic sealing cylinder 12 needs to adsorb the wafer tray 2, the annular diameter formed by the third elastic arc ring 114 is increased by rotating the adjusting gear 115. After the elastic sealing cylinder 12 adsorbs the wafer tray 2, the annular diameter formed by the third elastic arc ring 114 is decreased by rotating the adjusting gear 115 until the annular diameter formed by the third elastic arc ring 114 is smaller than the diameter of the wafer tray 2. In this way, the elastic sealing cylinder 12 can ensure that the wafer tray 2 will not slip out of the elastic sealing cylinder 12 during the transportation of the wafer tray 2.

[0064] The foregoing has provided a detailed description of one embodiment of the present invention, but this description is merely a preferred embodiment and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the claims of this invention should still fall within the patent coverage of this invention.

Claims

1. A robot handling chuck structure for semiconductor wafers, characterized by, include: The flexible negative pressure mechanism (1) includes an adjusting ring (11), an elastic sealing cylinder (12) and a folding rib (13). The adjusting ring (11) is fixedly connected to the bottom of the elastic sealing cylinder (12), and the folding rib (13) is embedded inside the elastic sealing cylinder (12). The wafer tray (2) is located at the bottom of the flexible negative pressure mechanism (1). When the elastic sealing cylinder (12) adsorbs the wafer tray (2) through negative pressure, the wafer tray (2) generates an adsorption force on the semiconductor wafer. The transport seat (3) is located on the top surface of the flexible negative pressure mechanism (1) and is used to drive the flexible negative pressure mechanism (1). The negative pressure motor (4) is located on the top surface of the transport seat (3). The output end of the negative pressure motor (4) is connected to the inner cavity of the elastic sealing cylinder (12) through a pipe to control the air pressure inside the elastic sealing cylinder (12). The wafer tray (2) includes a tray body (21), a wafer chuck (22) is fixedly connected to the center of the top surface of the tray body (21), a first docking groove (23) is opened at the edge of the top surface of the tray body (21), a rotating ring (24) is provided on the bottom surface of the first docking groove (23), and a second docking groove (25) is opened at the edge of the bottom surface of the tray body (21). The surface of the rotating ring (24) is perforated with a plurality of first docking holes (241), and the bottom surface of the first docking groove (23) is perforated with a plurality of second docking holes (251). The positions of the plurality of first docking holes (241) correspond one-to-one with the positions of the plurality of second docking holes (251). The wafer chuck (22) has an internal cavity (221) inside, and a sealing piston (222) is provided inside the internal cavity (221). A driving block (223) is provided on the top of the inner side of the internal cavity (221). A lever (224) is movably connected to the top of the driving block (223). A sealing slider (225) is movably connected to the end of the lever (224) away from the driving block (223).

2. The robot handling chuck structure for semiconductor wafers according to claim 1, characterized in that, The adjusting ring (11) is a first elastic arc ring (111). One end of the first elastic arc ring (111) is fixedly connected to a second elastic arc ring (112). The other end of the first elastic arc ring (111) is provided with an adjusting air pressure chamber (113) that matches the second elastic arc ring (112).

3. The robot handling chuck structure for semiconductor wafers according to claim 1, wherein, The adjusting ring (11) is a third elastic arc ring (114). An adjusting gear (115) is engaged on the outer side of one end of the third elastic arc ring (114), and the other side of the adjusting gear (115) is engaged with the inner side of the other end of the third elastic arc ring (114).

4. The robot handling chuck plate structure for semiconductor wafers according to claim 2 or 3, characterized in that, The folded rib (13) includes a first reinforcing rib (131) and a second reinforcing rib (132). The first reinforcing rib (131) and the second reinforcing rib (132) are staggered and connected at the joint by a rotating shaft.

5. The robotic suction cup structure for handling semiconductor wafers according to claim 4, characterized in that, The bottom surface of the rotating ring (24) is provided with a drive groove (242), and a drive motor (243) is provided at the bottom of the drive groove (242). The drive motor (243) is fixed inside the tray body (21), and the output shaft of the drive motor (243) is fixedly connected to a drive gear (244). The drive gear (244) meshes with the side wall of the drive groove (242).

6. The robotic suction cup structure for handling semiconductor wafers according to claim 5, characterized in that, A fixed shaft is installed at the middle position of the lever (224), and the ratio of the distance from the fixed shaft to the drive block (223) to the distance from the fixed shaft to the sealing slider (225) is 4:

1.

7. The robotic suction cup structure for handling semiconductor wafers according to claim 1, characterized in that, The transport seat (3) has an X-axis threaded rod (32) inserted inside. The two ends of the X-axis threaded rod (32) are fixedly connected to a movable seat (33). The movable seat (33) has a Y-axis threaded rod (34) inserted inside. One end of the Y-axis threaded rod (34) is mounted on the robot. The top surface of the transport seat (3) is fixedly connected to a hydraulic cylinder (31). The bottom end of the hydraulic cylinder (31) is fixedly connected to the top surface of the elastic sealing cylinder (12) through a hydraulic rod.

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