Busbar positioning component

Abstract

Busbar positioning component, which includes: one or more first attachment components (104A-B) designed to attach a busbar layer to the busbar positioning component; at least one mounting position (206) designed to accommodate an arrangement (200) of transistors (302A, 402) and to position them perpendicular to the busbar layer for connection; wherein each of the mounting positions (206) is defined by a side wall (206A), a bottom wall (206B) and an outer surface (206C) of an adjacent slot, a connection opening (205) next to the side wall (206A) and outside the at least one installation space (206); several first slots (102A-B), each first slot (102A-B) being designed to accommodate a busbar (304, 420) and to position it relative to the busbar layer for connection, and each first slot (102A-B) being opposite the at least one installation location (206) of the connection bushing (112, 205, 416); and several second slots (102C) which are arranged adjacent to the surface (206C) and outside the at least one installation position (206); wherein the busbar positioning component electrically insulates busbars (304, 420) in the multiple first slots (102A-B) of busbars (304, 420) in the multiple second slots (102C).

Description

BACKGROUND

[0001] Electronic devices can use a number of different types of components, including transistors or other active switching elements, diodes, and capacitors, to name just a few. One group of electronic devices are power converters, for example, those used to convert high-voltage direct current into alternating current to drive an electric motor (e.g., in an electric vehicle).

[0002] The design of electronic devices typically requires consideration of various competing requirements and constraints. First, the device must be designed to exhibit the desired performance characteristics (e.g., to be sufficiently powerful and efficient). Second, in some applications, available space is limited, so the primary focus must be on creating a compact and power-dense device with adequate thermal management. Third, for devices intended for mass production, ease of manufacture is a critical factor, as the ability to automate and expedite assembly steps directly impacts the device's value in the final product.

[0003] US 2013 / 0 308 362 A1 discloses a clocked power converter with a base plate on which at least one heat sink is mounted. The converter also includes at least one power transistor mounted on one side of the at least one heat sink. At least one spring element presses against the power transistor mounted on one side of the at least one heat sink and against the opposite side of either an adjacent heat sink or a base plate end face running parallel to the at least one heat sink. This has the significant advantage that the spring element exerts a force on the power transistor. This presses the power transistor against the heat sink on which it is mounted. This establishes thermal contact between the power transistor and the heat sink, and heat dissipation from the transistor via the heat sink is considerably facilitated.The spring elements also provide a cost-effective way to achieve high compressive force on the power transistors. US 2008 / 0 158 824 A1 discloses an electronic circuit device comprising a lower substrate with a main circuit, an upper substrate with a drive control circuit for controlling the main circuit, a support body fixed over the lower substrate with cured resin, and a housing with an edge section having an outer surface on which at least a portion of an external connection of the drive control circuit and the main circuit is located, as well as a substrate storage space that accommodates the lower substrate on one side within the edge section. SUMMARY

[0004] The object of the present application is to solve the aforementioned problems by means of an improved device for arranging the power components. This object is achieved by the subject matter of the independent claims. Advantageous further developments are set forth in the dependent claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. Figure 1 shows an example of a busbar positioning component. Fig. Figure 2 shows an example of an arrangement consisting of a busbar positioning component and a capacitor. Fig. Figure 3 shows an example of a busbar positioning component with a transistor arrangement and busbars. Fig. Figure 4 shows an example of a busbar positioning component with transistors, a layered busbar structure and a printed circuit board. Fig. Figure 5 is a flowchart of an example of a procedure for assembling an electronic device. DETAILED DESCRIPTION

[0005] This document describes examples of busbar positioning components suitable for use in positioning busbar layers, transistors, and busbars relative to each other in electronic devices. For example, a busbar positioning component can be used to align transistors and capacitor leads substantially perpendicular to busbar layers and a printed circuit board to facilitate the creation of electrical connections, such as by welding or soldering. As another example, a busbar positioning component can ensure predictable tolerances for positioning parts anywhere in the electronic device. As yet another example, a busbar positioning component can provide electrical isolation, such as to meet requirements for high-voltage components in a power converter.

[0006] Fig. Figure 1 shows an example of a busbar positioning component 100. The component can provide a number of mounting positions 1 to N (N = 2, 3, ...) for positioning electronic components, of which the first and Nth mounting positions are shown here. The intermediate (zero or more) mounting positions are schematically indicated by ellipses.

[0007] The component has slots 102 designed to hold individual busbars for the electronic device. For example, slots 102A-B can hold individual DC busbars connected to a DC power source (e.g., a battery pack). One or more slots 102C can also hold an AC busbar carrying an output of the electronic device. For example, if the device is a power converter that converts DC to three-phase AC (e.g., to drive an electric motor), the busbar positioning component can have three slots 102C, each holding an AC busbar for one of the phases. That is, each of the mounting positions 1 to N can have a corresponding slot 102C.

[0008] The busbar positioning component 100 has fastening or attachment parts 104A-B for attaching one or more busbar layers (not shown). For example, an attachment part 104A is a tapered pin that corresponds to an opening in the busbar layer. As another example, an attachment part 104B includes an opening designed to receive a fastening element (e.g., a screw) that is inserted through an opening in the busbar layer.

[0009] Each slot can have a releasable locking element to hold the corresponding busbar within the slot. For example, slots 102A-C can each have snap-in elements 106A-C. Other types of locking elements can also be used.

[0010] This means that by providing mounting positions 1 to N and the attachment parts 104A-B, the busbar positioning component 100 enables the transistor assemblies to be received and positioned for connection essentially perpendicular to the busbar layers. It also receives each of the busbars (in the slots 102) and positions it relative to the busbar layers for connection.

[0011] One or more of the mounting locations 1 to N may have an extension at one of its ends. The extension may comprise extensions 108A and 108B, which are essentially parallel to the mounting location, and a support structure 108C, which bridges the respective ends of the extensions together. In some implementations, the extension may provide structural protection around the end of a heat sink in the mounting location. For example, the heat sink may have coolant flowing through it (via an inlet and an outlet), and the extension may then shield the inlet or outlet to protect it from mechanical damage.

[0012] The busbar positioning component 100 has mounting parts 110A-B for attaching a printed circuit board (not shown). Mounting parts 110A near slot 102A are spaced further apart than mounting parts 110B near mounting position N. For example, mounting parts 110A-B are positioned higher than mounting parts 104A-B, which makes it possible to position the printed circuit board above the busbar layer(s).

[0013] Each of the installation positions 1 to N further includes a connection feedthrough 112, which is arranged transversely to the installation position from the corresponding AC busbar slot. The connection feedthrough is designed so that at least one connection (not shown) extends through it from below the busbar positioning component. This allows the connection to reach the busbar layer, thereby connecting, for example, a capacitor to the busbar layers.

[0014] The busbar positioning component 100 can be used to ensure predictable tolerances for positioning parts anywhere in the electronic device. To achieve accurate component positioning, a single tolerance chain of parallel tolerances should be defined so that the positioning of each part is determined by a master part in the assembly. Here, the busbar positioning component is a solid part (e.g., made of polymer) manufactured in a mold (e.g., by an injection molding process) and therefore establishes predictable tolerances for all other parts in the assembly.

[0015] In some implementations, the busbar positioning component is designed such that the tolerance on the slots near mounting position 1 is tighter than on the slots for subsequent mounting positions 2 to N. This allows, for example, the dimensional tolerance of the DC busbar slots to determine the tolerance of the AC busbar slots, which are located further away on the busbar positioning component.

[0016] Fig. Figure 2 shows an example of an arrangement 200 consisting of a busbar positioning component 202 and a capacitor 204. The capacitor comprises a housing 204A containing capacitor leads (e.g., foil or film), a support structure 204B extending from the housing, and relatively wide planar terminals 204C, each with its own leads formed at its upper edge. A feedthrough 205 is provided in the busbar positioning component, accommodating the support structure and the planar terminals. In some implementations, the capacitor serves as a DC link capacitor in a power converter.

[0017] The busbar positioning component forms a mounting location 206, which is used to position a transistor array (not shown). The mounting location 206 is defined here by a side wall 206A, a bottom wall 206B, and a surface 206C. The surface 206C can, for example, be the outer surface of a slot 208 adjacent to the mounting location 206.

[0018] Fig. Figure 3 shows an example of a busbar positioning component 300 with a transistor array 302 and busbars 304. The transistor array here comprises transistors 302A (e.g., IGBTs) sandwiched onto a heat sink 302B. The busbars include DC busbars 304A-B and an AC busbar 304C, which is connected to a wire 306 for supplying current to a load (e.g., an electric motor). Other implementations may have different numbers of busbars; for example, they may have three AC busbars for supplying three-phase alternating current from the electronic device. The busbars may be made of a conductive material such as copper.

[0019] Fig. Figure 4 shows an example of a busbar positioning component 400 with transistors 402, a layered busbar structure 404, and a printed circuit board 406. Together, these components form part of an electronic device. In this example, the transistors extend essentially vertically downwards from the busbar layers in the structure 404 and are arranged on opposite sides of a heat sink for temperature management. The busbar layers are made of a conductive material such as copper.

[0020] The transistors have leads that connect to the printed circuit board 406 and / or to one of the busbar layers in the structure 404 via a tab 410. The transistor can be connected to the printed circuit board either by means of the tab 410, which extends to the printed circuit board, or by the lead itself, which extends to the printed circuit board. Electrical connections can be made by welding (e.g., for high-power connections) or by soldering, to name two examples.

[0021] The electronic device also includes a capacitor 412 (the housing of which is shown) with terminals 414A and 414B. If, for example, the electronic device is a power converter that converts direct current to alternating current, the capacitor can be a DC link capacitor. The terminals 414A-B can have leads or tabs at their ends. For example, this can facilitate connecting the capacitor to the busbar layers in the structure 404.

[0022] The busbar positioning component 400 serves to lock and position these and other components relative to each other in a manner that promotes efficient temperature management, ensures dimensional tolerances for reliable manufacturing, and electrically isolates parts from one another. For example, the busbar positioning component defines a mounting location for the assembly consisting of the heat sink and the transistors 402. As another example, the busbar positioning component defines a connection bushing 416 for the terminals 414A-B to position the capacitor and the busbar positioning component relative to each other. As yet another example, the busbar positioning component defines one or more slots 418 to mount a busbar 420 (e.g.,to help position an AC or DC busbar relative to the other components of the electronic device.

[0023] Fig. Figure 5 is a flowchart of an example of Method 500 for assembling an electronic device. The method can be carried out in various contexts; here, the fabrication of a power converter is used for illustration. Reference is made to some examples described here (e.g., Fig. 1-4) Reference is made to this procedure; however, the procedure can also be carried out for other types of electronic devices. The steps can be performed manually (i.e., by a person), with the aid of robots, or in a combination thereof. The steps can also be performed in a different order unless otherwise specified.

[0024] In 510, a capacitor and a busbar positioning component are assembled. For example, the terminals 414A-B can be inserted through the feedthrough 416. In implementations with multiple mounting locations, this operation can also be performed simultaneously on all mounting locations.

[0025] In the 520 series, busbars are inserted into their respective slots. In some implementations, the 304A-B DC busbars are inserted into their respective slots, and one or more 304C AC busbars are inserted into their respective slots. For example, one or more snap-in elements can hold each busbar in position.

[0026] In the 530 series, an array of transistors is placed in each mounting location. For example, the transistors are mounted on a heatsink, and this array is then installed in the mounting location.

[0027] In 540, one or more busbar layers are installed. For example, the busbar layers of structure 404 can be installed sequentially, or structure 404 can be pre-assembled (with separating insulation layers) and then installed on the busbar positioning component.

[0028] Welding operations are performed in section 550. The busbar positioning component positions the workpieces to be welded in contact with each other or in close proximity to each other. For example, one or more of the feeders 408 can be welded to respective tabs (e.g., tab 410). As another example, feeders from terminals 414A-B can be welded to respective busbar layers.

[0029] A printed circuit board is attached in position 560. For example, the printed circuit board can be positioned on the mounting components 110A and 110B.

[0030] Soldering operations are performed in module 570. For example, control leads of transistors 402, which reach the circuit board, can be soldered to a circuit or component on the circuit board. As another example, the tab 410, which extends from a welded connection with one of the leads 408, can itself be soldered to the circuit board.

Claims

[1] Busbar positioning component, which includes: one or more first attachment components (104A-B) designed to attach a busbar layer to the busbar positioning component; at least one mounting position (206) designed to accommodate an arrangement (200) of transistors (302A, 402) and to position them perpendicular to the busbar layer for connection; wherein each of the mounting positions (206) is defined by a side wall (206A), a bottom wall (206B) and an outer surface (206C) of an adjacent slot, a connection opening (205) next to the side wall (206A) and outside the at least one installation space (206); several first slots (102A-B), each first slot (102A-B) being designed to accommodate a busbar (304, 420) and to position it relative to the busbar layer for connection, and each first slot (102A-B) being opposite the at least one installation location (206) of the connection bushing (112, 205, 416); and several second slots (102C) which are arranged adjacent to the surface (206C) and outside the at least one installation position (206); wherein the busbar positioning component electrically insulates busbars (304, 420) in the multiple first slots (102A-B) of busbars (304, 420) in the multiple second slots (102C). [2] Busbar positioning component according to claim 1, wherein each of the first slots (102A-B) has at least one releasable locking element (106A / B) designed to hold the corresponding busbar within the first slot (102A-B). [3] Busbar positioning component according to claim 1 or 2, wherein the busbar positioning component is implemented in a converter designed to convert direct current to alternating current, wherein DC busbars are positioned in adjacent slots on one side of the busbar positioning component and wherein each of the mounting locations (206) has an AC busbar (304C) in a respective AC busbar slot. [4] Busbar positioning component according to claim 3, wherein at least two AC busbar slots are provided, each having an extension (108A, 108B) that extends past one end of the respective installation location (206), wherein the busbar positioning component further comprises a support structure (108C, 204B) which connects the respective ends of the extensions (108A, 108B) in a bridge-like manner. [5] Busbar positioning component according to claim 3 or 4, further comprising one or more second attachment parts (110A-B) designed for attaching at least one printed circuit board (406) to the busbar positioning component, wherein the printed circuit board (406) is positioned on a side of the busbar layer opposite the installation locations (206). [6] Busbar positioning component according to claim 3, 4 or 5, wherein each of the installation positions (206) further comprises a connection feedthrough (112, 205, 416) arranged transversely to the installation position (206) from the corresponding AC busbar slot, wherein the connection feedthrough (112, 205, 416) is designed such that at least one capacitor connection (414A) extends from below the busbar positioning component through it to the busbar layer in order to connect a capacitor to the busbar layer. [7] Busbar positioning component according to one of the preceding claims, wherein several mounting positions (206) are provided and the arrangement (200) of transistors (302A, 402) in each of the mounting positions (206) comprises a heat sink (302B) which extends in the mounting position (206) from one end to the other, wherein each of the mounting positions (206) is also designed to accommodate and position the corresponding heat sink, wherein the transistors (302A, 402) of the arrangement (200) are positioned such that they are in contact with the heat sink (302B) on at least one side. [8] Busbar positioning component according to claim 7, wherein the first attachment parts (104A-B) are designed to position the busbar layer transversely to a top surface of the busbar positioning component, wherein the transistors (302A, 402) extend vertically downwards from the busbar layer. [9] Method for assembling a busbar positioning component according to any one of the preceding claims, the method comprising: Inserting a respective busbar into each of the several first slots or the one or several second slots; Inserting an arrangement (200) of transistors (302A, 402) into the at least one installation location (206); Attaching the busbar layer to the busbar positioning component by one or more first attachments (104A-B) on the busbar positioning component; and Welding, after attaching the busbar layer, the transistors (302A, 402) and the busbars (304, 420) to the busbar layer. [10] Method according to claim 9, which further comprises attaching at least one printed circuit board (406) to the busbar positioning component by means of one or more second attachments (110A-B) on the busbar positioning component, after the busbar layer has been attached. [11] Method according to claim 10, which further comprises soldering a lead (408) of each of the transistors (302A, 402) to the printed circuit board (406) after the printed circuit board (406) has been attached. [12] Converter comprising a busbar positioning component according to any one of claims 1 to 8. [13] Converter according to claim 12, wherein each connection feedthrough (112, 205, 416) extends over the entire length of the corresponding installation space (206). [14] Converter according to claim 12 or 13, further comprising means for receiving and positioning the arrangement of transistors, wherein the means comprise: (i) a first installation position (206) adjacent to the AC busbar slot and the adjacent slots for the first and second DC busbars, and (ii) several second installation positions (206) adjacent to each other and parallel to the first installation position (206), each of the second installation positions having a corresponding AC busbar in a corresponding AC busbar slot. [15] Converter according to claim 14, wherein the means are designed with a dimensioning of the adjacent slots for the first and second DC busbar which determines a dimensioning of the AC busbar slots for each of the second installation positions, such that a dimensional tolerance on the adjacent slots is tighter than on each of the AC busbar slots.

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