Design and method for a hybrid optical component with upper glass cover

Abstract

Optical component (100), comprising: a component substrate (102); a chip of an application-specific integrated circuit (110; 310) arranged on the component substrate (102), wherein the chip of the application-specific integrated circuit (110; 310) includes a detector (112; 312); at least one non-optical sensor chip (116; 316) arranged on the component substrate (102); a preformed polymer field unit cell (128; 328) arranged on the component substrate (102), wherein the preformed polymer field unit cell (128; 328) has at least one cavity (122; 322) and at least one side wall (124; 324) is configured to limit crosstalk between the application-specific integrated circuit (110; 310) and the at least one non-optical sensor chip (116; 316); and a glass cover (134; 334) arranged on the preformed polymer field unit cell (128; 328).

Description

background

[0001] Electronic devices, such as smartphones, tablet computers, digital media players, and so on, increasingly use optical sensors to control the operation of a variety of functions provided by the device. For example, optical sensors are commonly used by electronic devices to detect ambient lighting conditions in order to control the brightness of the device's display screen. Similarly, optical sensors are widely used in proximity and gesture detection applications. Proximity and gesture detection allows for the detection of physical movement (e.g., "gestures") without the user actually touching the device in which the gesture detection device is built. The detected movements can then be used as input commands for the device.Relevant disclosures can be found in documents US 2016 / 0146639 A1, US 2014 / 0191253 A1, and US 2014 / 0340302 A1. US 2016 / 0146639 A1 discloses an optical module comprising a substrate, a cover, a light-emitting component, and a first and a second sensor. The cover has three openings. The light-emitting component is located in the first opening, the first sensor in the second, and the second sensor in the third opening, with the second opening situated between the first and third. US 2014 / 0191253 A1 discloses an optoelectronic device comprising a radiation-receiving or radiation-generating component, a frame with a cavity, a connecting carrier, and a cover. The component is located in the cavity. The cover forms a radiation transmission area, whereby the radiation path between component and transmission area is free of encapsulation material.US patent 2014 / 0340302 A1 discloses an integrated gesture sensor module comprising an optical sensor chip, an ASIC chip, and an optical emitter chip in a single package. The sensor chip and the ASIC are located in a first cavity, and the emitter chip in a second, conical or stepped cavity. An optical barrier between the cavities can consist of a molding compound, laminate, ceramic housing, or metallized vias. Drawings

[0002] The detailed description is provided with reference to the accompanying figures. The use of the same reference numbers in different places in the description and in the figures may indicate similar or identical elements. Fig. Figure 1A is an isometric view of an optical component that uses a preformed enclosing field and a glass cover, according to an embodiment of the present disclosure. Fig. Figure 1B is a partial lateral sectional view of an optical component comprising a preformed polymer field and a glass cover, according to an embodiment of the present disclosure. Fig. Figure 1C is a partial lateral sectional view of an optical component comprising a preformed polymer field and a glass cover, according to an embodiment of the present disclosure. Fig. 2A is a flowchart illustrating a method in an exemplary embodiment for manufacturing an optical component comprising a preformed polymer field and a glass cover according to an embodiment of the present disclosure, such as that described in Fig. Components shown in sections 1A to 1C. Fig. Figure 2B is a flowchart illustrating a method in an exemplary embodiment for manufacturing an optical component comprising a preformed polymer field and a glass cover according to an embodiment of the present disclosure, such as that described in Figure 2B. Fig. Components shown in sections 1A to 1C. Fig. 3A is an isometric view depicting the fabrication of an optical component, such as the one in Fig. Component shown in 1A to 1C, comprising a preformed polymer field and a glass cover, according to the specifications in Fig. 2A and Fig. 2B shown procedure. Fig. 3B is an isometric view depicting the fabrication of an optical component, such as the one in Fig. Component shown in 1A to 1C, comprising a preformed polymer field and a glass cover, according to the specifications in Fig. 2A and Fig. 2B shown procedure. Fig. 3C is an isometric view depicting the manufacturing of an optical component, such as the one in Fig. Component shown in 1A to 1C, comprising a preformed polymer field and a glass cover, according to the specifications in Fig. 2A and Fig. 2B shown procedure. Fig. 3D is an isometric view that represents the manufacturing of an optical component, such as the one in Fig. Component shown in 1A to 1C, comprising a preformed polymer field and a glass cover, according to the specifications in Fig. 2A and Fig. 2B shown procedure. Fig. 3E is an isometric view depicting the fabrication of an optical component, such as the one in Fig. Component shown in 1A to 1C, comprising a preformed polymer field and a glass cover, according to the specifications in Fig. 2A and Fig. 2B shown procedure. Fig. 3F is an isometric view depicting the fabrication of an optical component, such as the one in Fig. Component shown in 1A to 1C, comprising a preformed polymer field and a glass cover, according to the specifications in Fig. 2A and Fig. 2B shown procedure. Fig. 3G is an isometric view depicting the manufacturing of an optical component, such as the one in Fig. Component shown in 1A to 1C, comprising a preformed polymer field and a glass cover, according to the specifications in Fig. 2A and Fig. 2B shown procedure. Fig. 3H is an isometric view depicting the fabrication of an optical component, such as the one in Fig. Component shown in 1A to 1C, comprising a preformed polymer field and a glass cover, according to the specifications in Fig. 2A and Fig. 2B shown procedure. Fig. 3I is an isometric view depicting the fabrication of an optical component, such as the one in Fig. Component shown in 1A to 1C, comprising a preformed polymer field and a glass cover, according to the specifications in Fig. 2A and Fig. 2B shown procedure. Fig. 3J is an isometric view depicting the manufacturing of an optical component, such as the one in Fig. Component shown in 1A to 1C, comprising a preformed polymer field and a glass cover, according to the specifications in Fig. 2A and Fig. 2B shown procedure. Fig. 3K is an isometric view depicting the manufacturing of an optical component, such as the one in Fig. Component shown in 1A to 1C, comprising a preformed polymer field and a glass cover, according to the specifications in Fig. 2A and Fig. 2B shown procedure. Fig. 3L is an isometric view depicting the fabrication of an optical component, such as the one in Fig. Component shown in 1A to 1C, comprising a preformed polymer field and a glass cover, according to the specifications in Fig. 2A and Fig. 2B shown procedure. Detailed description Overview

[0003] Conventional components with sensor / detector pairs always use a molding compound as an encapsulation material to protect the chips and wire connections. These molding compounds are generally known to creep under prolonged exposure to temperature and time. Furthermore, if new functionality is added to an existing optical component using a non-optical sensor operating in a different region of the electromagnetic spectrum than the optical sensor, such molding compounds can no longer be used because they are opaque to the non-optical sensor.

[0004] Accordingly, this document describes an optical component containing optical sensor / detector pairs in the same package as a non-optical sensor, and methods for fabricating the optical component. Conventional component designs require the use of clear molding compounds to protect the sensitive chips, but such compounds degrade over time and with temperature. The optical component described here uses a top cover made of special glass that is transparent across the entire electromagnetic spectral range required by the contained chips.

[0005] In one embodiment, an optical component employing the techniques of the present disclosure comprises a component substrate, wherein the component substrate includes at least one vent hole; a chip of an application-specific integrated circuit arranged on the component substrate, wherein the chip of the application-specific integrated circuit includes a detector; at least one non-optical sensor chip arranged on the component substrate; a preformed polymer field unit cell arranged on the component substrate, wherein the preformed polymer field unit cell includes at least one cavity and at least one side wall, wherein the at least one side wall is configured to limit crosstalk between the application-specific integrated circuit and the at least one non-optical sensor chip; and a custom glass cover arranged over the preformed polymer field unit cell.

[0006] In one embodiment, a method for manufacturing an optical component that uses the techniques of the present disclosure includes placing a chip of an application-specific integrated circuit onto a field-plane substrate, wherein the field-plane substrate includes at least one vent hole; placing at least one non-optical sensor chip onto the field-plane substrate; joining the preformed polymer field to the field-plane substrate; and joining at least one individual glass cover to the preformed polymer field.

[0007] In one embodiment, a method for manufacturing an optical component, which uses the techniques of the present disclosure, includes placing a chip of an application-specific integrated circuit onto a field-plane substrate, wherein the field-plane substrate includes at least one vent hole; placing at least one non-optical sensor chip onto the field-plane substrate; placing a first adhesive film element onto the field-plane substrate; placing a preformed polymer field onto the first adhesive film element; placing a second adhesive film element onto the preformed polymer field; placing at least one individual glass cover onto the second adhesive film element; and curing the first adhesive film element and the second adhesive film element.

[0008] The optical component and the methods described here create an integrated component in which chips are protected from the outside world by a glass cover. The glass cover is carefully selected to be transparent to both the optical and non-optical sensor elements of the component. Examples of implementation

[0009] Fig. Figures 1A to 1C represent an optical component 100, implemented according to various embodiments of this disclosure. Those skilled in the art will understand that the embodiments shown in the drawing and / or described herein can be combined in whole or in part to give additional embodiments. Substitutions and other modifications can also be made without departing from the scope of this disclosure. Accordingly, the illustrated and described embodiments should be understood as illustrative and not as limiting the present disclosure.

[0010] The optical component 100 can include a component substrate 102 configured to mechanically and / or electrically support the optical component 100. In embodiments, the component substrate 102 can, for example, contain a laminate and / or a ceramic material. In one particular example, the component substrate 102 can contain a printed circuit board incorporating FR-4 glass epoxy. In another particular example, the component substrate 102 can contain a ceramic substrate. It is considered that the component substrate 102 can contain other materials and components, such as a metal core plate (e.g., made of aluminum), a silicon substrate, a composite film, vias, signal traces, dielectric materials, etc. In some embodiments, the component substrate 102 can include at least one vent hole 106 extending through the component substrate 102.In these specific embodiments, the at least one vent hole 106 can be configured to prevent the substrate from suffering structural damage ("popcorning") during component reflow soldering processes. The at least one vent hole 106 can be located at various points on the component substrate 102, such as near at least one non-optical sensor chip 116 and / or near a chip of an application-specific integrated circuit (ASIC chip) 110. Furthermore, the component substrate 102 can include at least one contact surface 104 and / or a terminal arrangement 342 of contact surfaces.

[0011] In some embodiments, the optical component 100 can include at least one socket 108 arranged on the component substrate 102. In these optional embodiments, the socket 108 can cause a chip and / or a sensor to be raised from the component substrate 102, for example, for field-of-view positioning. In embodiments, the socket 108 can include a spacer chip and / or laminate / ceramic layers. In the embodiments described in Fig. In the embodiments shown in Figures 1A to 1C, the optical component 100 is depicted with multiple sockets 108. However, it is considered that the optical component 100 may not contain any sockets 108 or may contain a combination of sensors / chips with and without sockets 108.

[0012] Fig. 1A to 1C represent an optical component 100 containing an ASIC chip 110. In the Fig. In the embodiments shown in Figures 1A to 1C, the ASIC chip 110 is arranged on a socket 108, and a chip mounting area 140 is arranged on the socket 108. In other specific embodiments, the ASIC chip 110 can be arranged directly on the component substrate 102 or on a chip mounting area 140 located on the component substrate 102. As used herein, the term “application-specific integrated circuit chip” can refer to a substrate composed of materials such as, but not limited to, silicon, silicon dioxide, aluminum dioxide, sapphire, germanium, gallium arsenide (GaAs), silicon-germanium alloys, and / or indium phosphide (InP). Furthermore, for the purposes of this disclosure, a chip and / or substrate can be configured as a semiconductor or as an electrical insulator and can contain layers of both semiconducting and insulating material.For example, in embodiments, a chip / substrate can be formed using an insulator, such as silicon oxide, with a layer of semiconducting material, such as silicon, formed on it. Electrical components, such as transistors and diodes, can be fabricated in the semiconductor to form integrated circuits. For example, the ASIC chip 110 can contain integrated circuits that can be electrically connected to a contact pad (e.g., a contact pad 104, a chip mounting pad 140, etc.). In one particular embodiment, the ASIC chip 110 contains a quad-flat-no-leads (QFN) chip, although it is considered that the ASIC chip 110 can contain various other types of integrated circuit chips. Furthermore, the ASIC chip 110 can contain at least one chip contact pad configured as an electrical connection and can contain other components.

[0013] Furthermore, the ASIC chip 110 can contain a detector 112. A detector 112 can be a part of the ASIC chip 110 configured to detect, for example, light. In one specific example, the detector 112 can be a photodetector. In another specific example, the detector 112 can be an infrared detector. It is also conceivable that the detector 112 can contain other types of optical and / or non-optical detectors.

[0014] The optical component 100 can contain at least one non-optical sensor chip 116. The at least one non-optical sensor chip 116 can be arranged directly on the component substrate 102 and / or on a chip mounting area 140 arranged on the component substrate 102 and / or a socket 108. Some examples of a non-optical sensor chip 116 can include an inertial sensor, a microphone, a temperature sensor, a pressure sensor, etc. In the Fig. In the embodiments shown in Figures 1A to 1C, a non-optical sensor chip 116 is arranged on a part of the ASIC chip 110 (e.g., not on the detector 112). It is considered that other arrangements could be implemented, such as an ASIC chip 110 without a non-optical sensor chip 116.

[0015] As in Fig. As shown in Figures 1A to 1C, the optical component 100 can contain a preformed liquid crystal polymer field unit cell 128. The preformed polymer field unit cell 128 can contain a pre-isolated portion of a preformed polymer field 120, which is coupled to and arranged on a portion of the component substrate 102. Furthermore, the preformed polymer field unit cell 128 contains several cavities 122 and several side walls 124, which can form an opening 130. A single side wall 124 can be repeatedly coupled to another single side wall 124 to form a cavity 122. In embodiments, the cavity 122 can be configured to accommodate at least one ASIC chip 110, a non-optical sensor chip 116, and / or other components. As shown in Figures 1A to 1C, the preformed polymer field unit cell 128 can contain several cavities 122 and several side walls 124, which can form an opening 130. Fig. As shown in Figures 1A to 1C, the preformed polymer field unit cell 128 comprises side walls 124 coupled together to form a first cavity 122, which accommodates an ASIC chip 110, and a second cavity 122, which accommodates several non-optical sensor chips 116. The preformed polymer field unit cell 128 may contain a material that is optically opaque and acts as a light-blocking material. In one particular embodiment, the preformed polymer field unit cell 128 contains a liquid crystal polymer (LCP). It is considered that the preformed polymer field unit cell 128 may contain other materials, such as ceramics, silicon, epoxy, etc. In some embodiments, the preformed polymer field unit cell 128 may be coupled to the component substrate 102 using a first adhesive film element 136. The first adhesive film element 136 can, for example, contain a UV-curable glue or adhesive.It is considered that the preformed polymer field unit cell 128 can be connected to the component substrate 102 using other materials and / or methods.

[0016] In the Fig. In the specific embodiment shown in Figure 1B, the preformed polymer field unit cell 128 comprises several side walls 124 forming an outer circumference, with a central side wall 124 forming two cavities 122. An ASIC chip 110 is arranged in the first cavity 122, and at least one non-optical sensor chip 116 is arranged in the second cavity 122. In a similar embodiment, in Fig. In the embodiment shown in Figure 1C, a central side wall 124 includes a cornice structure 132. The cornice structure 132 can be formed at the top (e.g., distal to the component substrate 102) of the central side wall 124 and can have a projecting arrangement and / or an overhang. In embodiments, the cornice structure 132 can overhang one or more cavities. In some embodiments, the cornice structure 132 can also be contained in the circumferential side walls 124 of the preformed polymer field unit cell 128.

[0017] An individual glass cover 134 is arranged on the preformed polymer field unit cell 128. As in Fig. As shown in Figures 1A to 1C, the individual glass cover 134 can be adhesively bonded to the preformed polymer field unit cell 128 using an adhesive, such as a second adhesive film element 138. In one case, the second adhesive film element 138 and / or the other adhesive can contain a UV-curable adhesive. The second adhesive film element 138 can be configured as a field-plane adhesive that is applied to the preformed polymer field unit cell 128 prior to singulation. The individual glass cover 134 can contain glass material that is transparent to the non-optical sensor chip(s) 116, the ASIC chip 110, and / or other components in the optical component 100. Exemplary processes

[0018] The following description provides exemplary techniques for processing an optical component 100, such as the one in Fig. Shown in 1A to 1C. Fig. 2A and Fig. 2B represent an exemplary process 200 and an exemplary process 210 for manufacturing an optical component 100. Fig. 3A to 3L represent a section 300 of an optical component and a field plane arrangement 126 of optical components during manufacturing (such as the one in Fig. Optical component shown in 1A to 1C (100).

[0019] In the Fig. In the process shown in 2A, a chip of an application-specific integrated circuit (ASIC chip) is placed onto a field-plane substrate (block 202). As in Fig. As shown in Figures 3A to 3D, placing an ASIC chip 310 with a detector 312 onto the field-plane substrate 318 can include receiving a substrate (e.g., a printed circuit board, a laminate field, a ceramic field, etc.) with at least one chip mounting surface 340, at least one contact surface 304, a connection arrangement 342, and at least one vent hole 306. In some embodiments, receiving the field-plane substrate 318 can include receiving a field-plane substrate 318 with at least one socket 308 formed on the field-plane substrate 318. A socket 308 can be configured to raise a chip (e.g., a non-optical sensor chip 316, an ASIC chip 310, etc.), often for viewing purposes.In certain embodiments, receiving the field-plane substrate 318 may include forming at least one socket 308, which may further include placing and / or forming a spacer chip, laminate material, and / or ceramic material. Furthermore, placing an ASIC chip 310 may include using a placement operation to place and / or couple the ASIC chip 310 onto a chip mounting surface 340, a socket 308, and / or the field-plane substrate 318.

[0020] Then at least one non-optical sensor chip is placed on the field-plane substrate (block 204). As in Fig. As shown in Figure 3C, at least one non-optical sensor chip 316 can be placed on the field-plane substrate 318. Placing the at least one non-optical sensor chip 316 can involve using a placement operation to position and / or attach the at least one non-optical sensor chip 316 to the field-plane substrate 318, a chip mounting area 340, and / or a socket 308. The at least one non-optical sensor chip 316 can be placed and positioned on the field-plane substrate 318 such that, when a preformed polymer field 320 is placed, the at least one non-optical sensor chip 316 is located in a different cavity 322 than the ASIC chip 310. In some specific cases, a non-optical sensor chip 316 can be placed on the ASIC chip 310, which may involve a placement operation.

[0021] A pre-formed polymer field is bonded to the field-plane substrate (Block 206). As in Fig. As shown in Figures 3E to 3H, a preformed polymer field 320 can be connected and coupled to the field-plane substrate 318 using, for example, a placement process. In some embodiments, the preformed polymer field 320 can be coupled to the field-plane substrate 318 using an adhesive, such as a UV-curable glue. Furthermore, connecting and coupling the preformed polymer field 320 can involve aligning the preformed polymer field 320 with the field-plane substrate 318. Fig. 3G represents a partial field plane substrate 318, a partial preformed polymer field 320 and a partial field plane arrangement 326 of optical components. Fig. Figure 3H represents a preformed polymer field unit cell 328 and shows a side wall 324 with a cornice structure 332. Placing the preformed polymer field 320 onto the field plane substrate 318 forms an optical opening 330.

[0022] Next, at least one individual glass cover is connected to the preformed polymer field (block 208). In embodiments, several individual glass covers 334 can be connected and coupled to the preformed polymer field 320 and a preformed polymer field unit cell 328. The connection of at least one individual glass cover 334 may include the connection of an individual glass cover 334 that is transparent in the electromagnetic spectral range detected by the ASIC chip 310 and the non-optical sensor chip 316.

[0023] In the Fig. In the process shown in Figure 2B, a chip of an application-specific integrated circuit (ASIC chip) is placed onto a field-plane substrate (block 212). As in Fig. As shown in Figures 3A to 3D, placing an ASIC chip 310 onto the field-plane substrate 318 can involve receiving a substrate (e.g., a printed circuit board, a laminate field, a ceramic field, etc.) with at least one chip mounting surface 340, at least one contact surface 304, and at least one venting hole 306. In some embodiments, receiving the field-plane substrate 318 can involve receiving a field-plane substrate 318 with at least one socket 308 formed on the field-plane substrate 318. A socket 308 can be configured to raise a chip (e.g., a non-optical sensor chip 316, an ASIC chip 310, etc.), often for viewing purposes. In some specific embodiments, receiving the field-plane substrate 318 may include forming at least one base 308, which may further include placing and / or forming a spacer chip, laminate material and / or ceramic material.Furthermore, the placement of an ASIC chip 310 may include the use of a placement operation to place and / or couple the ASIC chip 310 onto a chip mounting surface 340, a socket 308 and / or the field-level substrate 318.

[0024] Then at least one non-optical sensor chip is placed on the field-plane substrate (block 214). As in Fig. As shown in Figure 3C, at least one non-optical sensor chip 316 can be placed on the field-plane substrate 318. Placing the at least one non-optical sensor chip 316 can involve using a placement operation to position and / or attach the at least one non-optical sensor chip 316 to the field-plane substrate 318, a chip mounting area 340, and / or a socket 308. The at least one non-optical sensor chip 316 can be placed and positioned on the field-plane substrate 318 such that, when a preformed polymer field 320 is placed, the non-optical sensor chip 316 is located in a different cavity 322 than the ASIC chip 310. In some specific cases, a non-optical sensor chip 316 can be placed on the ASIC chip 310, which may involve a placement operation.

[0025] A first adhesive film element is placed on the field-level substrate (block 216). In the Fig. 3 years and Fig. In the embodiment shown in Figure 3L, the placement of the first adhesive film element 336 can include the placement of a preformed field-plane adhesive element that is formed on and / or placed on the field-plane substrate 318. In other specific embodiments, the placement of the first adhesive film element 336 can include the application of a gel-like and / or liquid adhesive to the field-plane substrate 318.

[0026] Next, a pre-formed polymer field is placed onto the first adhesive film element and bonded to the field-plane substrate (Block 218). As in Fig. 3 years and Fig. As shown in Figure 3L, a preformed polymer field 320 can be connected and coupled to the first adhesive film element 336 and the field-plane substrate 318 using, for example, an assembly process. Furthermore, connecting and coupling the preformed polymer field 320 can involve aligning the preformed polymer field 320 with the first adhesive film element 336.

[0027] A second adhesive film element is then placed onto the pre-formed polymer field (Block 220). In the Fig. 3K and Fig. In the embodiment shown in Figure 3L, the placement of the second adhesive film element 338 can include the placement of a preformed field-plane adhesive element that is formed on and / or placed upon the preformed polymer field 320. In other specific embodiments, the placement of the first adhesive film element 336 can include the application of a gel-like and / or liquid adhesive to the preformed polymer field 320.

[0028] An individual glass cover is placed onto the second adhesive film element and the preformed polymer field and the second adhesive film element (block 222). The individual glass cover 334 can be placed onto the second adhesive film element 338 using, for example, a placement process. In embodiments, several individual glass covers 334 can be connected and coupled to the second adhesive film element 338 and a preformed polymer field unit cell 328 (e.g., a portion of the preformed polymer field 320). Connecting at least one individual glass cover 334 can include connecting an individual glass cover 334 that is transparent in the electromagnetic spectral range detected by the ASIC chip 310 and the non-optical sensor chip 316.

[0029] Then the first adhesive film element and the second adhesive film element are cured (block 224). The curing of the first adhesive film element 336 and / or the second adhesive film element 338 may involve the use of a heating and / or an ultraviolet (UV) exposure process to cure each adhesive on a field plane.

[0030] An additional process may involve separating individual optical components 100 from the field-plane array 126 optical components. For example, separating the field-plane array 326 optical components may involve using a dicing saw to cut each individual optical component 100. Furthermore, an optical component 100 may be coupled with another device (e.g., a printed circuit board, a microprocessor) to form a larger electronic device / system.

[0031] It is considered that other processes may be used in the manufacture of an optical component 100, such as soldering and reflow soldering, the application of an additional adhesive or an additional glass cover, the placement of an optical filter on an individual glass cover 334, etc.

Claims

[1] Optical component (100), comprising: a component substrate (102); a chip of an application-specific integrated circuit (110; 310) arranged on the component substrate (102), wherein the chip of the application-specific integrated circuit (110; 310) includes a detector (112; 312); at least one non-optical sensor chip (116; 316) arranged on the component substrate (102); a preformed polymer field unit cell (128; 328) arranged on the component substrate (102), wherein the preformed polymer field unit cell (128; 328) has at least one cavity (122; 322) and at least one side wall (124; 324) is configured to limit crosstalk between the application-specific integrated circuit (110; 310) and the at least one non-optical sensor chip (116; 316); and a glass cover (134; 334) arranged on the preformed polymer field unit cell (128; 328). [2] Optical component (100) according to claim 1, wherein the component substrate (102) contains at least one vent hole (106; 306) extending through the component substrate (102). [3] Optical component (100) according to claim 1, wherein the component substrate (102) comprises a laminate. [4] Optical component (100) according to claim 1, wherein the component substrate (102) comprises a ceramic. [5] Optical component (100) according to claim 1, further comprising: at least one socket (108; 308) wherein the application-specific integrated circuit chip (110; 310) and / or the at least one non-optical sensor chip (116; 316) is arranged on the at least one socket (108; 308). [6] Optical component (100) according to claim 5, wherein the at least one socket (108; 308) contains a spacer chip. [7] Optical component (100) according to claim 1, further comprising: a first adhesive film element (136; 336) that is arranged between the preformed polymer field unit cell (128; 328) and the component substrate (102). [8] Optical component (100) according to claim 1, further comprising: a second adhesive film element (138; 338) that is arranged between the preformed polymer field unit cell (128; 328) and the glass cover (134). [9] Method for manufacturing an optical component (100), comprising: the placement of a chip of an application-specific integrated circuit (110; 310) onto a field-plane substrate (318); the placement of at least one non-optical sensor chip (116; 316) on the field-plane substrate (318); connecting a preformed polymer field (120; 320) with the field-plane substrate (318); and connecting at least one glass cover (134) to the preformed polymer field (120; 320). [10] Method for manufacturing the optical component (100) according to claim 9, wherein the field plane substrate (318) contains at least one vent hole (106; 306) extending through the field plane substrate (318). [11] Method for manufacturing the optical component (100) according to claim 9, wherein the component substrate (102) comprises a laminate. [12] Method for manufacturing the optical component (100) according to claim 9, wherein the component substrate (102) comprises a ceramic. [13] Method for manufacturing the optical component (100) according to claim 9, further comprising: the placement of the application-specific integrated circuit chip (110; 310) and / or the at least one non-optical sensor chip (116; 316) onto at least one socket (108; 308). [14] Method for manufacturing the optical component (100) according to claim 9, further comprising: the placement of at least one non-optical sensor chip (116; 316) onto the chip of the application-specific integrated circuit (110; 310). [15] Method for manufacturing the optical component (100) according to claim 9, further comprising: the singulation of the optical component (100) from the field plane substrate (318). [16] Method for manufacturing an optical component (100), comprising: the placement of a chip of an application-specific integrated circuit (110; 310) onto a field-plane substrate (318), wherein the field-plane substrate (318) contains at least one vent hole (106; 306); the placement of at least one non-optical sensor chip (116; 316) on the field-plane substrate (318); the placement of a first adhesive film element (136; 336) onto the field-plane substrate (318); the placement of a preformed polymer field (120; 320) onto the first adhesive film element (136; 336); the placement of a second adhesive film element (138; 338) onto the preformed polymer field (120; 320); placing at least one glass cover (134) onto the second adhesive film element (138; 338); and the curing of the first adhesive film element (136; 336) and the second adhesive film element (138; 338). [17] Method for manufacturing the optical component (100) according to claim 16, wherein the field plane substrate (318) contains at least one vent hole (106; 306). [18] Method for manufacturing the optical component (100) according to claim 16, further comprising: the singulation of the optical component (100) from the field plane substrate (318). [19] Method for manufacturing the optical component (100) according to claim 16, wherein the component substrate (102) comprises a laminate. [20] Method for manufacturing the optical component (100) according to claim 16, wherein the component substrate (102) comprises a ceramic.

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