Light-emitting device and light source module containing the same

Abstract

Light source module comprising: a circuit board (PCB; 370); a light-emitting device (100) mounted on the circuit board (PCB; 370), the light-emitting device (100) comprising a plurality of cell blocks (BLK1 - BLK9), each of which comprises a plurality of light-emitting cells (111); and a plurality of controllers (210_1 - 210_9) mounted on the circuit board (370), each of which is configured to control a cell block corresponding to it from the plurality of cell blocks (BLK1 - BLK9), wherein the cell blocks of the plurality of cell blocks (BLK1 - BLK9) are electrically insulated from each other, wherein the plurality of cell blocks (BLK1 - BLK9) comprises a first cell block (BLK7) and a second cell block, wherein a number of first light-emitting cells contained in the first cell block (BLK7) is less than a number of second light-emitting cells contained in the second cell block, wherein the cell blocks of the plurality of cell blocks (BLK1 - BLK9) are arranged in a first row and a second row, where the first cell block (BLK7) is located in the middle of the second row, wherein the plurality of controllers (210_1 to 210_9) comprises a first controller connected to a plurality of first channels and a second controller connected to a plurality of second channels different from the plurality of first channels, wherein the first controller is configured to control the first cell block (BLK7) via the plurality of first channels, and wherein the second controller is configured to control the second cell block via the plurality of second channels.

Description

BACKGROUND1. Area

[0001] Devices and methods according to exemplary embodiments relate to a light-emitting device and a light source module including the same, and more particularly to a light-emitting device including a plurality of blocks having a plurality of light-emitting cells and a light source module including the light-emitting device. 2. Description of the state of the art

[0002] Semiconductor light-emitting devices contain elements such as light-emitting diodes (LEDs) and are increasingly used as light sources because they offer many advantages, such as low power consumption, high brightness, and long lifetimes. In recent years, there has been growing interest in semiconductor light-emitting devices as devices capable of replacing existing halogen or xenon lamps used as light sources for vehicle headlights or taillights.

[0003] When a semiconductor light-emitting device is used as a light source for a lighting device, it may be necessary to adjust the brightness, light direction angle, and light radiation angle of the semiconductor light-emitting device to desired values. In particular, a headlight or tail lamp for a vehicle requires a semiconductor light-emitting device capable of adjusting the brightness of the light according to the ambient conditions.

[0004] From US 2020 / 0 011 518 A1, a light source module is known, which comprises: a light-emitting device mounted on a circuit board and containing a plurality of subarrays, each of the plurality of subarrays containing a plurality of light-emitting cells; and a plurality of driver chips mounted on the circuit board, each of the plurality of driver chips driving a corresponding one of the plurality of subarrays, the plurality of subarrays being electrically isolated from one another.

[0005] From US 2019 / 0 170 316 A1, a light source unit is known, which comprises: a substrate; a first chip array with first light-emitting chips arranged in a horizontal direction on the substrate; a second chip array with second light-emitting chips arranged in a horizontal direction on the substrate; and a third chip array with third light-emitting chips arranged in a horizontal direction on the substrate. The second chip array is positioned below the first chip array in the vertical direction and separated by a first distance. The third chip array is positioned below the second chip array in the vertical direction and separated by a second distance.

[0006] WO 2015 / 091 005 A1 discloses an optoelectronic semiconductor component comprising a carrier. A plurality of active regions configured to generate radiation are provided on a top side of the carrier. At least three electrical contact points are located on a bottom side of the carrier. The semiconductor component comprises at least one control unit for electrically controlling the semiconductor component and for electrically controlling the active region. The active regions are arranged in a regular grid when viewed from above.

[0007] DE 10 2021 102 035 A1, DE 10 2021 108 228 A1 and DE 10 2020 134 932 A1 are state of the art according to Section 3(2) of the Patent Act and also concern such light source modules and / or light-emitting devices. SUMMARY

[0008] Embodiments of the invention are defined in the appended claims.

[0009] One or more exemplary embodiments provide a light-emitting device having improved optical properties and reliability, and a light source module including the light-emitting device.

[0010] According to one aspect of an exemplary embodiment, a light source module includes a circuit board; a light-emitting device mounted on the circuit board, the light-emitting device including a plurality of cell blocks, each including a plurality of light-emitting cells; and a plurality of controllers mounted on the circuit board, each of which is configured to control a corresponding one of the plurality of cell blocks. The plurality of cell blocks are electrically isolated from each other, the plurality of cell blocks include a first cell block and a second cell block, and a number of first light-emitting cells included in the first cell block is less than a number of second light-emitting cells included in the second cell block.

[0011] According to one aspect of an exemplary embodiment, a light-emitting device includes: a plurality of cell blocks that are electrically isolated from each other and each of which includes a plurality of light-emitting cells; and a plurality of contact pads configured to electrically connect the plurality of cell blocks to an external device. The plurality of cell blocks include a first cell block and a second cell block, and a number of first light-emitting cells included in the first cell block is less than a number of second light-emitting cells included in the second cell block.

[0012] According to one aspect of an exemplary embodiment, a light source module includes: a circuit board; a light-emitting device mounted on the circuit board, the light-emitting device including a plurality of cell blocks, each including a plurality of light-emitting cells; and a plurality of controllers mounted on the circuit board, each of which is configured to control a corresponding cell block among the plurality of cell blocks. The plurality of cell blocks are electrically insulated from each other, and the plurality of cell blocks are arranged in a first row and a second row, and a number of light-emitting cells included in cell blocks arranged in the first row is less than a number of light-emitting cells included in cell blocks arranged in the second row. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The above and other objects and features will become more apparent from the following description of exemplary embodiments with reference to the accompanying drawings in which: Fig. 1 is a block diagram of a configuration of a light source module according to an exemplary embodiment; Fig. 2 is a perspective view of a configuration of a light source module according to an exemplary embodiment; Fig. 3 is a block diagram for explaining the connection of controllers to a light-emitting device in a light source module according to an exemplary embodiment; Fig. 4 is a perspective view of a configuration of a light-emitting device according to an exemplary embodiment; Fig. 5 and Fig. 6 are circuit diagrams for explaining connection relationships between light-emitting cells in a light-emitting device according to an exemplary embodiment; Fig. 7 to 9 are diagrams of a light-emitting device according to exemplary embodiments; Fig. 10 and Fig. 11 are circuit diagrams for explaining a connection relationship between light-emitting cells included in a light-emitting device according to an exemplary embodiment; Fig. 12 and Fig. 13 are diagrams of light-emitting devices according to exemplary embodiments; Fig. 14 and Fig. 15 are cross-sectional views of light source modules according to exemplary embodiments; Fig. 16 is a schematic perspective view of a lighting device including a light-emitting device according to an exemplary embodiment; Fig. 17 is a schematic perspective view of a flat panel lighting apparatus including a light-emitting device according to an exemplary embodiment; and Fig. 18 is an exploded perspective view of a lighting device including a light-emitting device according to an exemplary embodiment.

[0014] Here, the Fig. 2 a light source module having all the features of one of the independent claims. DETAILED DESCRIPTION

[0015] The above and other aspects and features will become more apparent from the detailed description of exemplary embodiments with reference to the accompanying drawings. It should be understood that when an element or layer is referred to as being "over," "above," "on," "connected to," or "coupled to" another element or layer, it may be directly over, above, on, connected to, or coupled to the other element or layer, or there may be intervening elements or layers. On the other hand, when an element is referred to as being "directly over," "directly above," "directly on," "directly connected to," or "directly coupled to" another element or layer, no intervening elements or layers are present. In the drawings, like elements are designated by the same reference numerals, and repeated descriptions thereof are omitted.

[0016] Fig. 1 is a block diagram of a configuration of a light source module 10 according to an exemplary embodiment.

[0017] Referring to Fig. 1, the light source module 10 may include a light-emitting device 100 and a driver circuit 200.

[0018] The light-emitting device 100 may include a cell array (CA) containing a plurality of light-emitting cells. The cell array (CA) contained in the light-emitting device 100 may include a plurality of cell blocks (BLK). In an exemplary embodiment, the plurality of cell blocks (BLK) may be electrically isolated from one another.

[0019] The driver circuit 200 may be connected to a power supply. The power supply may generate an input voltage required for operation of the light-emitting device 100. In an exemplary embodiment, when the light source module 10 is a headlight for a vehicle, the power supply may include a battery mounted in the vehicle. In an exemplary embodiment, when the light source module 10 is a household or industrial light fixture, the light source module 10 may further include an alternating current (AC) power supply configured to generate an AC voltage, a rectifier circuit configured to rectify the AC voltage and generate a direct current (DC) voltage, and a voltage regulation circuit.

[0020] The driver circuit 200 may include a plurality of controllers 210. Each of the plurality of controllers 210 may include an integrated circuit (IC).

[0021] The plurality of controllers 210 may control the cell array CA included in the light-emitting device 100. In an exemplary embodiment, each of the controllers 210 may be electrically connected to a corresponding one of the plurality of cell blocks BLK and control an operation of the light-emitting cells included in the corresponding cell block BLK. In an exemplary embodiment, the number of controllers 210 may be equal to the number of cell blocks BLK included in the light-emitting device 100. However, the exemplary embodiments are not limited thereto. For example, the number of controllers 210 may differ from the number of cell blocks BLK.

[0022] Fig. 2 is a perspective view of a configuration of a light source module 10 according to an exemplary embodiment.

[0023] Referring to Fig. 2, the light source module 10 may include a light-emitting device 100 and a plurality of controllers (e.g., first to ninth controllers 210_1 to 210_9) mounted on a circuit board (PCB). In an exemplary embodiment, the light-emitting device 100 may include a chip, and the light source module 10 may include the light-emitting device 100 including a chip.

[0024] The light-emitting device 100 may include a cell array CA in which a plurality of light-emitting cells are arranged in a matrix form. The cell array CA may include a plurality of cell blocks (e.g., first to ninth cell blocks BLK1 to BLK9). Although in Fig. 2 nine cell blocks BLK1 to BLK9 are illustrated, exemplary embodiments are not limited thereto, and the number and arrangement of the cell blocks (e.g., BLK1 to BLK9) may be changed.

[0025] The first to ninth cell blocks (BLK1 to BLK9) can be electrically isolated from each other. This means that light-emitting cells contained in different cell blocks can be electrically isolated from each other.

[0026] In an exemplary embodiment, the light-emitting device 100 may have a rectangular shape with shorter sides in a second direction Y than in a first direction X. The first direction X and the second direction Y may be parallel to a main surface of a circuit board PCB and perpendicular to each other.

[0027] In an exemplary embodiment, in the light-emitting device 100, the first to ninth cell blocks BLK1 to BLK9 may be arranged in a first row and a second row. In this case, each of the first row and the second row may refer to cell blocks arranged in parallel in the first direction X. Since the first to ninth cell blocks BLK1 to BLK9 are arranged in two rows, it may be structurally simple to form a plurality of pads configured to connect the light-emitting device 100 to the first to ninth controllers 210_1 to 210_9.

[0028] The light-emitting cells may be arranged taking into account a type of light distribution required for the light source module 10. The number of light-emitting cells included in cell blocks arranged in the first row (e.g., BLK1 to BLK4) may be less than the number of light-emitting cells included in cell blocks arranged in the second row (e.g., BLK5 to BLK9). The number of cell blocks arranged in the first row may be different from the number of cell blocks arranged in the second row. For example, the first to fourth cell blocks BLK1 to BLK4 may be sequentially arranged in the first row in the first direction X, and the fifth to ninth cell blocks BLK5 to BLK9 may be sequentially arranged in the second row in a direction opposite to the first direction X.

[0029] In an exemplary embodiment, the number of light-emitting cells included in the first cell block BLK1 located at one end of the first row may be less than the number of light-emitting cells included in another of the first to ninth cell blocks BLK1 to BLK9. For example, the number of light-emitting cells in the first cell block BLK1 may be less than the number of light-emitting cells in the second cell block BLK2 adjacent to the first cell block BLK1.

[0030] In an exemplary embodiment, the number of light-emitting cells included in the seventh cell block BLK7 (corresponding to the first cell block in the claims) in the middle of the second row may be less than the number of light-emitting cells included in another (corresponding to the second cell block in the claims) of the first to ninth cell blocks BLK1 to BLK9. For example, the number of light-emitting cells included in the seventh cell block BLK7 may be less than the number of light-emitting cells included in the sixth cell block BLK6 adjacent to the seventh cell block BLK7, or less than the number of light-emitting cells included in the eighth cell block BLK8 adjacent to the seventh cell block BLK7.

[0031] In the light source module 10, the light-emitting cells may be arranged considering a light distribution type required by the light source module 10. For example, when the light source module 10 is used as a headlight for a vehicle, it may be relatively unnecessary to irradiate light to an upper outer area in front of a user in a direction in which the user is traveling. The first cell block BLK1 and the fourth cell block BLK4, located at the two ends of the first row, may contain a smaller number of light-emitting cells than other cell blocks, and thus the light source module 10 cannot separately irradiate light to unnecessary areas.

[0032] In addition, when the light source module 10 is used as a headlight for a vehicle, for example, the light source module 10 may need to radiate light with a relatively high luminous intensity toward a central portion of a road ahead of the user in the direction the user is traveling. The seventh cell block BLK7 in the center of the second row may include a relatively small number of light-emitting cells. Even if the light source module 10 is controlled to emit light with a high intensity by applying a relatively large current to the seventh cell block BLK7, the power consumption of the seventh cell block BLK7 can be reduced because the seventh cell block BLK7 includes fewer light-emitting cells.

[0033] Each of the first to ninth controllers 210_1 to 210_9 can control an operation of light-emitting cells included in a corresponding one of the first to ninth cell blocks BLK1 to BLK9. For example, the first controller 210_1 can be electrically connected to the first cell block BLK1 and control an operation of the first cell block BLK1. The second controller 210_2 can be electrically connected to the second cell block BLK2 and control an operation of the second cell block BLK2. The description of the first and second controllers 210_1 and 210_2 can be equally applied to the third to ninth controllers 210_3 to 210_9.

[0034] In the light-emitting device 100, the plurality of light-emitting cells in the cell array CA can be divided into the first to ninth cell blocks BLK1 to BLK9, and an operation of the first to ninth cell blocks BLK1 to BLK9 can be controlled by different controllers, respectively. In this way, it can be easy to control a light-emitting operation of the light-emitting device 100. The control of the brightness of the light-emitting device 100 can be divided, and a brightness adjustment speed can be increased.

[0035] In an exemplary embodiment, the first to ninth controllers 210_1 to 210_9 may be arranged in an order in which cell blocks corresponding to the first to ninth controllers 210_1 to 210_9 are arranged. For example, in the light-emitting device 100, the first to fourth cell blocks BLK1 to BLK4 may be sequentially arranged in the first direction X, and the first to fourth controllers 210_1 to 210_4 corresponding to the first to fourth cell blocks BLK1 to BLK4 may also be sequentially arranged in the first direction X.Furthermore, in the light-emitting device 100, the fifth to ninth cell blocks BLK5 to BLK9 may be sequentially arranged in a direction opposite to the first direction X, and the fifth to ninth controllers 210_5 to 210_9 corresponding to the fifth to ninth cell blocks BLK5 to BLK9 may also be sequentially arranged in the direction opposite to the first direction X. In the light source module 10, the first to ninth controllers 210_1 to 210_9 and the first to ninth cell blocks BLK1 to BLK9 may be arranged such that the order in which the first to ninth controllers 210_1 to 210_9 are arranged corresponds to the order in which the first to ninth cell blocks BLK1 to BLK9 are arranged.This can make it easy to form wirings or wires configured to electrically connect the first to ninth controllers 210_1 to 210_9 to the first to ninth cell blocks BLK1 to BLK9.

[0036] However, the arrangement of the plurality of controllers 210_1 to 210_9 is not limited thereto, and only some of the first to fourth controllers 210_1 to 210_4 may be sequentially arranged in the first direction X, and only some of the fifth to ninth controllers 210_5 to 210_9 may be sequentially arranged in a direction opposite to the first direction X.

[0037] In an exemplary embodiment, the number of controllers (e.g., 210_1 to 210_9) may be equal to the number of cell blocks (e.g., BLK1 to BLK9). However, the exemplary embodiments are not limited thereto. At least two different controllers may be connected to and control a cell block. Alternatively, one controller may control at least two different cell blocks.

[0038] The light-emitting device 100 may be mounted on a central region CA_P of the circuit board, and the first to ninth controllers 210_1 to 210_9 may be located in first and second peripheral regions PA_P1 and PA_P2 of the circuit board, which are adjacent to the light-emitting device 100. For example, the first to fourth controllers 210_1 to 210_4 may be located in the first peripheral region PA_P1, and the fifth to ninth controllers 210_5 to 210_9 may be located in the second peripheral region PA_P2. Since the light-emitting device 100 is arranged between the first to ninth controllers 210_1 to 210_9 in the first and second peripheral regions PA_P1 and PA_P2 of the circuit board PCB, it may be easy to form wirings or wires configured to electrically connect the first to ninth controllers 210_1 to 210_9 to the first to ninth cell blocks BLK1 to BLK9.

[0039] In an exemplary embodiment, the light-emitting device 100 may overlap the first to ninth controllers 210_1 to 210_9 in a direction (e.g., the first direction X or the second direction Y) parallel to the main surface of the circuit board PCB. In an exemplary embodiment, the second peripheral region PA_P2, the central region CA_P, and the first peripheral region PA_P1 may be arranged sequentially in the second direction Y.

[0040] In the light source module 10, a light-emitting device 100 including light-emitting cells configured to emit light may be located in the central region CA_P of the board, and the first to ninth controllers 210_1 to 210_9, which are configured to drive the light-emitting device 100 and each include separate chips, may be located in the first and second peripheral regions PA_P1 and PA_P2. Since the light-emitting device 100 including the plurality of light-emitting cells and the first to ninth controllers 210_1 to 210_9 are implemented as separate chips, designing the first to ninth controllers 210_1 to 210_9 may not be affected by the structures of the plurality of light-emitting cells. Accordingly, the design efficiency of the first to ninth controllers 210_1 to 210_9 can be increased.

[0041] Furthermore, the light-emitting device 100 can be implemented as an LED chip and arranged in the central region CA_P of the circuit board PCB, and thus the light emitted by the light source module 10 can be concentrated in the central region CA_P. Since the emitted light is concentrated in the central region CA_P, the number of additional components (e.g., lenses) configured to concentrate the emitted light can be reduced. For example, the light source module 10 may not include any lenses. The more lenses the light source module 10 includes, the greater the light loss through the lenses may be. Thus, the luminous efficacy of the light source module 10 can be increased.

[0042] The light source module 10 may further include an input unit configured to receive signals required for the operation of the light source module 10 from the outside. The first to ninth controllers 210_1 to 210_9 may receive control signals from the input unit, and the first to ninth controllers 210_1 to 210_9 may control their operation in response to the control signals.

[0043] In an exemplary embodiment, the first to ninth controllers 210_1 to 210_9 may be electrically connected to each other in sequential order. For example, the first controller 210_1 may be electrically connected to the second controller 210_2, the second controller 210_2 may be electrically connected to the first controller 210_1 and the third controller 210_3, and the third controller 210_3 may be electrically connected to the second controller 210_2 and the fourth controller 210_4. The first controller 210_1 may receive a control signal from the input unit and transmit the control signal to the second controller 210_2, and the second controller 210_2 may receive a control signal from the first controller 210_1 and transmit the control signal to the third controller 210_3. The description of the first and second controllers 210_1 and 210_2 can be equally applied to the third to ninth controllers 210_3 to 210_9.

[0044] The PCB can contain a metal and a metal compound. The board can be a metal-core printed circuit board (MCPCB), which contains, for example, copper (Cu).

[0045] In an exemplary embodiment, the PCB may be a flexible printed circuit board (FPCB), which is flexible and can be easily changed into various shapes. Furthermore, the board may be an FR4 board and may contain a resin material including epoxy, triazine, silicon, and polyimide, or a ceramic material such as silicon nitride, aluminum nitride (AlN), and aluminum oxide (Al 2 O 3 ), contains.

[0046] Fig. 3 is a block diagram illustrating the connection of controllers to a light-emitting device 100 in a light source module 10 according to an exemplary embodiment. For the sake of brevity, Fig. 3 only a first cell block and a second cell block are shown, which are connected to a first controller and a second controller, wherein the same description can also be applied to other controllers (e.g. the third to ninth 210_3 to 210_9) and other cell blocks (e.g. the third to ninth BLK3 to BLK9).

[0047] Referring to Fig. 3, the light-emitting device 100 may include a first cell block BLK1 containing a plurality of first light-emitting cells and a second cell block BLK2 containing a plurality of second light-emitting cells. The light-emitting device 100 may include a plurality of first contact pads PAD1 connected to the first cell block BLK1 and a plurality of second contact pads PAD2 connected to the second cell block BLK2.

[0048] In an exemplary embodiment, the number of first light-emitting cells in the first cell block BLK1 may be less than the number of second light-emitting cells in the second cell block BLK2. The number of first contact points PAD1 connected to the first cell block BLK1 may be less than the number of second contact points PAD2 connected to the second cell block BLK2. Although Fig. 3 illustrates a case where the number of first contact points PAD1 is one less than the number of second contact points PAD2, exemplary embodiments are not limited thereto, and the number of first contact points PAD1 may be at least two less than the number of second contact points PAD2.

[0049] A first controller 210_1 may be connected to a plurality of first channels CH11 to CH1n and may control the first cell block BLK1, which is a cell block corresponding to the first controller 210_1, through at least some (e.g., CH11 to CH1n-1) of the plurality of first channels CH11 to CH1n. The first controller 210_1 may apply a voltage to the corresponding first cell block BLK1 through the at least some first channels CH11 to CH1n-1 and adjust the intensity of the light emitted by the first cell block BLK1.

[0050] A second controller 210_2 may be connected to a plurality of second channels CH21 to CH2n and may drive a second cell block BLK2, which is a cell block corresponding to the second controller 210_2, through at least some of the plurality of second channels CH21 to CH2n. The second controller 210_2 may apply a voltage to the second cell block BLK2 corresponding thereto through at least some of the second channels CH21 to CH2n and adjust the intensity of the light emitted by the second cell block BLK2.

[0051] In an exemplary embodiment, the plurality of first channels CH11 to CH1n connected to the first controller 210_1 may be different channels than the plurality of second channels CH21 to CH2n connected to the second controller 210_2. Accordingly, the first controller 210_1 and the second controller 210_2, which are different controllers, may each individually control corresponding cell blocks.

[0052] In an exemplary embodiment, the first controller 210_1 and the second controller 210_2 may be connected to the same number of channels. For example, the first controller 210_1 may be connected to n first channels CH11 to CH1n and apply a voltage to each of the first channels CH11 to CH1n. The second controller 210_2 may be connected to n second channels CH21 to CH2n and apply a voltage to each of the second channels CH21 to CH2n.

[0053] In an exemplary embodiment, the number (e.g., (n-1)) of the first contact points PAD1 may be smaller than the number (e.g., n) of the first channels CH11 to CH1n connected to the first controller 210_1. At least one channel (e.g., CH1n) of the plurality of first channels CH11 to CH1n may not be connected to the plurality of first contact points PAD1, but may be electrically isolated from the first cell block BLK1. Accordingly, the number of channels connected to the first to ninth controllers 210_1 to 210_9 of the light source module 10 of Fig. 2 do not correspond to the number of contact points formed in the light-emitting device 100.

[0054] However, exemplary embodiments are not limited to the representation of Fig. 3. Since the number of first light-emitting cells included in the first cell block BLK1 is less than the number of second light-emitting cells included in the second cell block BLK2, the number of first channels CH11 to CH1n connected to the first controller 210_1 configured to control an operation of the first cell block BLK1 may be less than the number of second channels CH21 to CH2n connected to the second controller 210_2 configured to control an operation of the second cell block BLK2.

[0055] Fig. 4 is a perspective view of a configuration of a light-emitting device 100 according to an exemplary embodiment.

[0056] Referring to Fig. 4, the light-emitting device 100 may include a cell array region PXR in which a cell array CA is formed, and first and second pad regions PDR1 and PDR2 in which a plurality of pad regions PAD are formed. The cell array region PXR may be located in a central region of the light-emitting device 100, and the first and second pad regions PDR1 and PDR2 may be located in a peripheral region surrounding the central region. For example, the second pad region PDR2, the cell array region PXR, and the first pad region PDR1 may be arranged sequentially in a second direction Y.

[0057] The cell array CA may include a plurality of cell blocks (e.g., first to ninth cell blocks BLK1 to BLK9). In this case, the first to ninth cell blocks BLK1 to BLK9 may be electrically isolated from each other. Although in Fig. 4, a total of nine cell blocks BLK1 to BLK9 are shown, the light-emitting device 100 is not limited thereto, and the number and arrangement of the cell blocks (e.g., BLK1 to BLK9) can be changed.

[0058] The first to ninth cell blocks BLK1 to BLK9 may be arranged in a first row and a second row that are parallel to each other in the second direction Y. For example, the first to fourth cell blocks BLK1 to BLK4 may be arranged in the first row, and the fifth to ninth cell blocks BLK5 to BLK9 may be arranged in a second row. At least one of the plurality of cell blocks BLK1 to BLK9 may include a different number of light-emitting cells 111 than the other cell blocks. In an exemplary embodiment, the first cell block BLK1 and the fourth cell block BLK4 at both ends of the first row may include a smaller number of light-emitting cells 111 than at least one of the other cell blocks.For example, the first cell block BLK1 and the fourth cell block BLK4, which are located at both ends of the cell array CA, may include a smaller number of light-emitting cells 111 than other cell blocks arranged adjacent thereto. The first cell block BLK1 may include a smaller number of light-emitting cells 111 than the second cell block BLK2, which is adjacent to the first cell block BLK1 in a first direction X. Alternatively, the first cell block BLK1 may include a smaller number of light-emitting cells 111 than the ninth cell block BLK9, which is adjacent to the first cell block BLK1 in a direction opposite to the second direction Y. The fourth cell block BLK4 may include a smaller number of light-emitting cells 111 than the third cell block BLK3, which is adjacent to the fourth cell block BLK4 in a direction opposite to the first direction X.Alternatively, the fourth cell block BLK4 may include a smaller number of light-emitting cells 111 than the fifth cell block BLK5, which is adjacent to the fourth cell block BLK4 in a direction opposite to the second direction Y.

[0059] In an exemplary embodiment, the seventh cell block BLK7 in the center of the cell array CA may contain a smaller number of light-emitting cells 111 than at least one of the other cell blocks. For example, the seventh cell block BLK7 may contain the smallest number of light-emitting cells 111 among the first to ninth cell blocks BLK1 to BLK9.

[0060] Fig. 4 shows an example in which each of the second, third, fifth, sixth, eighth, and ninth cell blocks BLK2, BLK3, BLK5, BLK6, BLK8, and BLK9 includes twelve light-emitting cells 111, each of the first and fourth cell blocks BLK1 and BLK4 includes eleven light-emitting cells, and the seventh cell block BLK7 includes eight light-emitting cells, but exemplary embodiments are not limited thereto. In this regard, the number of light-emitting cells 111 included in each of the first to ninth cell blocks BLK1 to BLK9 can be selected differently.

[0061] In an exemplary embodiment, among the light-emitting cells included in the cell blocks arranged in the first row, the light-emitting cells arranged adjacently in the second direction Y may be driven (or turned on) or not driven (or turned off) at the same time. In an exemplary embodiment, no partition walls may be formed between the light-emitting cells arranged adjacently in the second direction Y among the light-emitting cells included in the cell blocks arranged in the first row. In an exemplary embodiment, the first to ninth cell blocks BLK1 to BLK9 may be arranged in a rectangular shape such that the length L1 of the light-emitting device 100 in the first direction X is greater than a length L2 of the light-emitting device 100 in the second direction Y.For example, the first to ninth cell blocks BLK1 to BLK9 may be arranged in a total of two rows, for example in a first row and a second row.

[0062] In an exemplary embodiment, the length L1 of the light-emitting device 100 in the first direction X may be about 1.1 times or more of the length L2 of the light-emitting device 100 in the second direction Y. In an exemplary embodiment, a thickness of the light-emitting device 100 (i.e., a length of the light-emitting device 100 in a third direction Z) may be several tens of µm to several hundred µm and less than or equal to about 1 / 10 of the length L1 of the light-emitting device 100 in the first direction X. Since the light-emitting device 100 with the dimensions described above has dimensions optimized for resistance to physical stress, the warpage of the light-emitting device 100 can be minimized.

[0063] The first to fourth cell blocks BLK1 to BLK4 may be sequentially arranged in the first row in the first direction X, and the fifth to ninth cell blocks BLK5 to BLK9 may be sequentially arranged in the second row in a direction opposite to the first direction X. Although Fig. 4 shows the first to ninth cell blocks BLK1 to BLK9 arranged in two rows, exemplary embodiments are not limited thereto, and the cell array CA may include first to ninth cell blocks BLK1 to BLK9 arranged in at least three rows.

[0064] The first to fourth cell blocks BLK1 to BLK4 arranged in the first row can be electrically connected to the first to fourth controllers (e.g., 210_1 to 210_4 of Fig. 2). The fifth to ninth cell blocks BLK5 to BLK9 arranged in the second row can be connected to fifth to ninth controllers (e.g., 210_5 to 210_9 of Fig. 2) be electrically connected.

[0065] In the light-emitting device 100, the first and second pad regions PDR1 and PDR2 may not be located in the cell arrangement region PXR, but are arranged parallel to each other and extend in the second direction Y. That is, the first and second pad regions PDR1 and PDR2, in which the plurality of pad regions PAD are arranged, may not overlap the cell arrangement region PXR in the third direction Z, which is perpendicular to a main surface of a substrate. Since the light-emitting device 100 includes the first and second pad regions PDR1 and PDR2 separate from the cell arrangement region PXR, the density of the light-emitting cells 111 in the cell arrangement region PXR can be increased. Furthermore, a plurality of pad regions PAD can be located in the peripheral region of the light-emitting device 100, and therefore, it can be easy to install components (e.g.,bond wires) configured to connect chips to the plurality of contact pads PAD.

[0066] In exemplary embodiments, in a top view, an area of ​​the cell array region PXR may be in a range of about 50% to about 90% of a total area of ​​the light-emitting device 100, and an area of ​​the first and second pad regions PDR1 and PDR2 may be in a range of about 10% to about 50% of the total area of ​​the light-emitting device 100, but is not limited thereto.

[0067] Fig. 5 and Fig. 6 are circuit diagrams for explaining connection relationships between light-emitting cells in a light-emitting device 100 according to an exemplary embodiment. Fig. 5 and Fig. 6 are equivalent circuit diagrams of the first cell block BLK1 and the second cell block BLK2 of Fig. 4. In Fig. 5 and Fig. 6, a light-emitting cell can correspond to a diode. The description of the first and second cell blocks BLK1 and BLK2 of Fig. 5 and Fig. 6 can equally be applied to the third to ninth cell blocks BLK3 to BLK9 of Fig. 4 can be applied.

[0068] Referring to Fig. 4 and Fig. 5, the first cell block BLK1 may include a plurality of first light-emitting cells 111_1, each implemented as an LED, and the second cell block BLK2 may include a plurality of second light-emitting cells 111_2, each implemented as an LED. The number of first light-emitting cells 111_1 may be less than the number of second light-emitting cells 111_2. The first cell block BLK1 and the second cell block BLK2 may be electrically isolated from each other, and an operation of the first cell block BLK1 and an operation of the second cell block BLK2 may be controlled by different controllers.

[0069] Cathodes or anodes of the light-emitting cells (see 111 in Fig. 4) included in each of the first to ninth cell blocks BLK1 to BLK9 may be electrically connected to each other. For example, the cathodes or anodes of the plurality of first light-emitting cells 111_1 included in the first cell block BLK1 may be electrically connected to each other.

[0070] In an exemplary embodiment, the light-emitting cells 111 included in each of the first to ninth cell blocks BLK1 to BLK9 may be connected in series with other light-emitting cells 111 within the same block. For example, the plurality of first light-emitting cells 111_1 in the first cell block BLK1 may be connected in series with each other, and the plurality of second light-emitting cells 111_2 in the second cell block BLK2 may be connected in series with each other. The plurality of first light-emitting cells 111_1 in the first cell block BLK1 may be electrically insulated from the plurality of second light-emitting cells 111_2 in the second cell block BLK2. The two ends of each of the plurality of first light-emitting cells 111_1 and the plurality of second light-emitting cells 111_2 may be connected to different contact pads, respectively.

[0071] Since the plurality of first light-emitting cells 111_1 are connected in series and the plurality of second light-emitting cells 111_2 are connected in series, an operation of the plurality of first light-emitting cells 111_1 and the plurality of second light-emitting cells 111_2 can be controlled when voltages are applied to nodes at which the plurality of first light-emitting cells 111_1 are connected and to nodes at which the plurality of second light-emitting cells 111_2 are connected.Accordingly, the number of first contact pads PAD1 connected to the plurality of first light-emitting cells 111_1 may be less than twice the number of first light-emitting cells 111_1, and the number of second contact pads PAD2 connected to the plurality of second light-emitting cells 111_2 may be less than twice the number of second light-emitting cells 111_2.

[0072] A first controller 210_1 may be electrically connected to a plurality of first contact pads PAD1. The first controller 210_1 may adjust voltages applied to two different contact pads among the plurality of first contact pads PAD1, and thus a light-emitting cell, a cathode and an anode of which are respectively connected to the two contact pads, may be driven. For example, the first controller 210_1 may adjust a brightness of each of the first light-emitting cells 111_1 using a pulse width modulation (PWM) scheme. That is, the first controller 210_1 may adjust the brightness of each of the plurality of first light-emitting cells 111_1 by modulating a pulse width of a voltage applied to each of the plurality of first contact pads PAD1.

[0073] A second controller 210_2 may be electrically connected to a plurality of second contact pads PAD2. The second controller 210_2 may adjust voltages applied to two different contact pads from the plurality of second contact pads PAD2, and thus may control a light-emitting cell, a cathode and an anode of which are respectively connected to the two contact pads.

[0074] According to an order in which the first cell block BLK1 and the second cell block BLK2 are arranged, the plurality of first contact points PAD1 and the plurality of second contact points PAD2 corresponding to the first cell block BLK1 and the second cell block BLK2, respectively, may be arranged in a sequential order. The first cell block BLK1 and the plurality of first contact points PAD1 may be arranged in parallel and extend along a second direction Y, and the second cell block BLK2 and the plurality of second contact points PAD2 may be arranged in parallel and extend along the second direction Y.

[0075] Referring to Fig. 6, a first cell block BLK1' may further include a plurality of first light-emitting cells 111_1 and a dummy light-emitting cell 111_1', each of which is implemented as an LED. The dummy light-emitting cell 111_1' may not be connected to the plurality of first contact pads PAD1 and may be substantially inoperative. In an exemplary embodiment, the number of first light-emitting cells 111_1 and dummy light-emitting cells 111_1' included in the first cell block BLK1' may be equal to the number of second light-emitting cells 111_2 included in the second cell block BLK2.

[0076] Fig. 7 to 9 are diagrams of a light-emitting device 100 according to exemplary embodiments. Fig. 7 is an enlarged plan view of the area BX of Fig. 4. Fig. 7 illustrates an example of the light-emitting device 100 in which a first cell block does not include a dummy light-emitting cell, as in Fig. 5 shown. Fig. Figure 8 is an enlarged cross-sectional view taken along line II-II' of Fig. 7 of configurations of some components according to an exemplary embodiment. Fig. 9 is an enlarged view of the area CX2 of Fig. 8.

[0077] Referring to the Fig. 7 to 9, a partition wall structure WS may be located on a plurality of light-emitting structures 120. As in Fig. As shown in Figure 7, the partition wall structure WS may include a plurality of partition walls WSI and an outer partition wall WSO. The plurality of partition walls WSI may define a plurality of cell spaces PXS in a cell arrangement region PXR, and the outer partition wall WSO may be located at the outermost edges of the plurality of partition walls WSI. Light-emitting cells may be arranged in the plurality of cell spaces PXS, respectively.

[0078] The partition wall structure WS can include rounded-cornered side wall units PWC facing the plurality of cell spaces PXS. The plurality of cell spaces PXS, whose corners are rounded by the rounded-cornered side wall units PWC of the partition wall structure WS, can be defined respectively.

[0079] Each of the plurality of partition walls WSI may have a first width w11 of about 10 µm to about 100 µm in a lateral direction (i.e., a second direction Y). The outer partition wall WSO may have a second width w12 of about 10 µm to about 1 mm in the lateral direction (i.e., the second direction Y). The partition wall structure WS may be configured such that the outer partition wall WSO is configured such that the second width w12 is greater than the first width w11 of the plurality of partition walls WSI. This may improve the structural stability of the light-emitting device 100.For example, the reliability of the light-emitting device 100 can be improved even under repeated vibrations and impacts applied to the light-emitting device 100 when the light-emitting device 100 is used as a headlight for a vehicle by providing excellent structural stability between the partition wall structures WS and the fluorescent layer 160 disposed within the partition wall structures WS.

[0080] Each of the plurality of light-emitting structures 120 may include a first conductive semiconductor layer 122, an active layer 124, and a second conductive semiconductor layer 126. An insulating liner 132, a first contact 134A, a second contact 134B, and a wiring pattern 140 may be located on a bottom surface of each of the plurality of light-emitting structures 120.

[0081] For the sake of brevity, as in Fig. 9, a surface of the light-emitting structure 120 facing the plurality of partition walls WSI may be referred to as an upper surface of the light-emitting structure 120, while a surface of the light-emitting structure 120 opposite to the upper surface of the light-emitting structure 120 (i.e., a surface of the light-emitting structure 120 located far from the plurality of partition walls WSI) may be referred to as a lower surface of the light-emitting structure 120. For example, the first conductive semiconductor layer 122, the active layer 124, and the second conductive semiconductor layer 126 may be stacked in the vertical direction (i.e., in a third direction Z) from the upper surface of the light-emitting structure 120 to the lower surface thereof.Thus, the top side of the light-emitting structure 120 may correspond to a top side of the first conductive semiconductor layer 122, and the bottom side of the light-emitting structure 120 may correspond to a bottom side of the second conductive semiconductor layer 126.

[0082] The first conductive semiconductor layer 122 may be a nitride semiconductor having a composition of n-type In x Al y Ga (1-x-y) N (where 0≤x<1, 0≤y<1, and 0≤x+y<1). The n-type impurities may be, for example, silicon (Si). For example, the first conductive semiconductor layer 122 may contain GaN, which contains n-type impurities.

[0083] In an exemplary embodiment, the first conductive semiconductor layer 122 may include a first conductive semiconductor contact layer and a current diffusion layer. An impurity concentration of the first conductive semiconductor contact layer may be in a range of 2 × 10 18 cm -3up to 9 × 10 19 cm -3 A thickness of the first conductive semiconductor contact layer may be about 1 µm to about 5 µm. The current diffusion layer may have a structure in which a plurality of In x Al y Ga (1-x-y) N layers (where 0≤x, y≤1 and 0≤x+y≤1) with different compositions or different impurity contents are alternately stacked. For example, the current diffusion layer may have an n-type superlattice structure in which n-type GaN layers and / or Al x In y Ga z N -layers (where 0≤x,y,z≤1 and x+y+z≠0) with a thickness of about 1 nm to about 500 nm are alternately stacked. The impurity concentration of the current diffusion layer can be in the range of 2 × 10 18 cm -3 up to 9 × 10 19 cm -3 lay.

[0084] The active layer 124 may be disposed between the first conductive semiconductor layer 122 and the second conductive semiconductor layer 126. The active layer 124 may emit light with a certain energy through recombination of electrons and holes during driving of the light-emitting device 100. The active layer 124 may have a multiple quantum well (MQW) structure in which quantum well layers and quantum barrier layers are alternately stacked. For example, each of the quantum well layers and each of the quantum barrier layers may x Al y Ga (1-x-y) N -layers (with 0≤x, y≤1 and 0≤x+y≤1) with different compositions. For example, the quantum well layer In x Ga 1-xN (where 0≤x≤1), and the quantum barrier layer may contain GaN or AlGaN. Thicknesses of the quantum well layer and the quantum barrier layer may range from about 1 nm to about 50 nm. The active layer 124 is not limited to having the MQW structure and may have a single quantum well structure.

[0085] The second conductive semiconductor layer 126 may be a nitride semiconductor layer having a composition of p-type In x Al y Ga (1-x-y) N (where 0≤x<1, 0≤y<1, and 0≤x+y<1). The p-type impurities can be, for example, magnesium (Mg).

[0086] In an exemplary embodiment, the second conductive semiconductor layer 126 may include an electron blocking layer, a low-concentration p-type GaN layer, and a high-concentration p-type GaN layer stacked in the vertical direction. For example, the electron blocking layer may have a structure in which a plurality of In x Al y Ga (1-x-y) N layers (where 0≤x, y≤1 and 0≤x+y≤1) with a thickness of about 5 nm to about 100 nm and with different compositions are alternately stacked, or it may contain a single layer containing Al y Ga (1-y) N (with 0 <y≤1) enthält. Eine Energiebandlücke der Elektronensperrschicht kann in einer Richtung weg von der aktiven Schicht 124 verringert sein. Beispielsweise kann der Aluminium (Al)-Gehalt in der Elektronensperrschicht in der Richtung weg von der aktiven Schicht 124 reduziert sein.

[0087] Each of the plurality of light-emitting structures 120 may be spaced apart from the adjacent light-emitting structures 120, with a device isolation region IA disposed therebetween. A distance s11 between the plurality of light-emitting structures 120 may be smaller than, but not limited to, the first width w11 of each of the plurality of partition walls WSI.

[0088] The insulating liner 132 may be arranged to conformally cover an inner wall of the device isolation region IA and a side surface of each of the plurality of light-emitting structures 120. Furthermore, the insulating liner 132 may be located on an inner wall of the opening E, which completely passes through the active layer 124 and the second conductive semiconductor layer 126. In an exemplary embodiment, the insulating liner 132 may include silicon oxide, silicon oxynitride, or silicon nitride. In an exemplary embodiment, the insulating liner 132 may have a structure in which a plurality of insulating layers are stacked.

[0089] The first contact 134A may be connected to the first conductive semiconductor layer 122 in the opening E, which penetrates the active layer 124 and the second conductive semiconductor layer 126. The second contact 134B may be located on the underside of the second conductive semiconductor layer 126. The insulating liner 132 may electrically isolate the first contact 134A from the active layer 124 and the second conductive semiconductor layer 126. The insulating liner 132 may be disposed between the first contact 134A and the second contact 134B on the underside of the second conductive semiconductor layer 126 and electrically isolate the first contact 134A from the second contact 134B.Each of the first contact 134A and the second contact 134B may include silver (Ag), aluminum (Al), nickel (Ni), chromium (Cr), gold (Au), platinum (Pt), palladium (Pd), tin (Sn), tungsten (W), rhodium (Rh), iridium (Ir), ruthenium (Ru), magnesium (Mg), zinc (Zn), titanium (Ti), copper (Cu), or a combination thereof. Both the first contact 134A and the second contact 134B may include a metal material with high reflectivity.

[0090] A lower reflective layer 136 may be located on the insulating liner 132, which is disposed on the inner wall of the device isolation region 1A. The lower reflective layer 136 may reflect light emitted from the sidewalls of the plurality of light-emitting structures 120 and direct the reflected light into the plurality of cell spaces PXS.

[0091] In an exemplary embodiment, the lower reflective layer 136 may include Ag, Al, Ni, Cr, Au, Pt, Pd, Sn, W, Rh, Ir, Ru, Mg, Zn, Ti, Cu, or a combination thereof. The lower reflective layer 136 may include a metal material with high reflectivity. In an exemplary embodiment, the lower reflective layer 136 may include a distributed Bragg reflector (DBR). For example, the DBR may have a structure in which a plurality of insulating layers with different refractive indices are repeatedly stacked. Each of the insulating layers in the DBR may include an oxide, a nitride, or a combination thereof, for example, SiO 2 , SiN, SiO x N y , TiO 2 , Si 3 N 4 , Al 2 O 3 , TiN, AlN, ZrO 2 , TiAlN or TiSiN.

[0092] A wiring structure 140 may be located on the insulating liner 132, the first contact 134A, the second contact 134B, and the lower reflective layer 136. The wiring structure 140 may include a plurality of insulating layers 142 and a plurality of wiring layers 144. The plurality of wiring layers 144 may electrically connect each of the first contact 134A and the second contact 134B to the pad PAD. Some of the plurality of wiring layers 144 may be located on the inner wall of the device isolation region IA, and the plurality of insulating layers 142 may each cover the plurality of wiring layers 144 and fill the device isolation region IA. As shown in Fig. As shown in Figure 9, the plurality of wiring layers 144 may include at least two wiring layers 144 located at different levels in the vertical direction, but example embodiments are not limited thereto. Each of the plurality of wiring layers 144 may include Ag, Al, Ni, Cr, Au, Pt, Pd, Sn, W, Rh, Ir, Ru, Mg, Zn, Ti, Cu, or a combination thereof.

[0093] In an exemplary embodiment, the plurality of wiring layers 144 may electrically connect the first contact 134A of one light-emitting structure 120 to the second contact 134B of another light-emitting structure 120 connected in series with the one light-emitting structure 120, so that the plurality of light-emitting cells included in a cell block may be connected in series with each other.

[0094] Alternatively, in another exemplary embodiment, contrary to the illustration in Fig. 8, the plurality of wiring layers 144 electrically connect the first contact 134A of one light-emitting structure 120 to the first contact 134A of another light-emitting structure 120 connected in parallel to the one light-emitting structure 120, so that the plurality of light-emitting cells included in one cell block can be connected in parallel to each other.

[0095] The contact pad PAD may be located in the contact pad region PDR and connected to the plurality of wiring layers 144. The contact pad PAD may be located at a lower level than the partition wall structure WS. In exemplary embodiments, a sidewall and a bottom surface of the contact pad PAD may be covered by the plurality of insulating layers 142, and a top surface of the contact pad PAD may be located at a lower level than the top surfaces of the plurality of light-emitting structures 120. In other exemplary embodiments, in contrast to the illustration in Fig. 8, some of the plurality of light-emitting structures 120 may be located in the pad region PDR, and the pad PAD may be located in openings formed in the plurality of light-emitting structures 120. In this case, the top surface of the pad PAD may be at the same level as the top surfaces of the plurality of light-emitting structures 120. Connecting elements (e.g., bonding wires) for electrical connection to a controller may be located on the pad PAD.

[0096] The partition wall structures WS can be located on the upper sides of the plurality of light-emitting structures 120. The partition wall structures WS can be made of silicon (Si), silicon carbide (SiC), sapphire (Al 2 O 3 ) or gallium nitride (GaN). In an exemplary method, after the plurality of light-emitting structures 120 are formed on a substrate (see 110 in Fig. 18A), the partition wall structures WS are formed by removing parts of the substrate 110. In this case, the partition wall structures WS may be portions of the substrate 110 that serve as a growth substrate for forming the light-emitting structures 120.

[0097] The plurality of partition walls WSI may be arranged in a matrix shape in a plan view, and the plurality of cell spaces PXS may be defined by the plurality of partition walls WSI. Each of the plurality of partition walls WSI may include a recess region RS located at a bottom of each of the plurality of partition walls WSI to vertically overlap the device isolation region IA. The recess region RS may be formed by removing a portion of the substrate 110 during an etching process for separating a light-emitting stack into the plurality of light-emitting structures 120. The insulating liner 132 may be arranged to contact the recess region RS on a bottom surface of each of the plurality of partition walls WSI.

[0098] The top surfaces of the plurality of light-emitting structures 120 may be exposed at the bottoms of the plurality of cell spaces PXS. For example, concave / convex portions 120P may be formed in the top surfaces of the plurality of light-emitting structures 120 arranged at the bottoms of the plurality of cell spaces PXS. Light extraction efficiency of the plurality of light-emitting structures 120 may be improved by the concave / convex portions 120P, but exemplary embodiments are not limited thereto.

[0099] A passivation structure 150 may be located on a top surface WST and a sidewall WSS of each of the plurality of partition walls WSI. The passivation structure 150 may include a first passivation layer 152 and a second passivation layer 154 conformally located on the top surface WST and the sidewall WSS of each of the plurality of partition walls WSI. The passivation structure 150 may also be conformally located on the top surfaces of the light-emitting structures 120 (e.g., on the concave / convex portions 120P) arranged at the bottoms of the plurality of cell spaces PXS. Although Fig. 8 shows two passivation layers (e.g., 152 and 154), exemplary embodiments are not limited thereto, and the passivation structure 150 may include three or more passivation layers.

[0100] In an exemplary embodiment, the first passivation layer 152 may include a first insulating material, and the second passivation layer 154 may include a second insulating material different from the first insulating material. Each of the first insulating material and the second insulating material may include at least one of silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, and aluminum nitride.

[0101] In exemplary embodiments, the passivation structure 150 may include a first portion 150P1 arranged on the top surface WST of each of the plurality of partition walls WSI, a second portion 150P2 arranged on the sidewall WSS of each of the plurality of partition walls WSI, and a third portion 150P3 arranged on the top surfaces of the plurality of light-emitting structures 120. In some exemplary embodiments, a first thickness t11 of the first portion 150P1 may be less than or equal to a second thickness t12 of the second portion 150P2. Likewise, a third thickness t13 of the third portion 150P3 may be less than or equal to the second thickness t12 of the second portion 150P2.In an exemplary embodiment, the first thickness t11 of the first portion 150P1 may be in a range from about 0.1 µm to about 2 µm, and the second thickness t12 of the second portion 150P2 may be in a range from about 0.5 µm to about 5 µm.

[0102] As in Fig. 9, portions of the first passivation layer 152 included in the first portion 150P1 (i.e., portions of the first passivation layer 152 on the top surfaces WST of the plurality of partition wall structures WS) may have a thickness that is less than a thickness of portions of the first passivation layer 152 included in the second portion 150P2 (i.e., portions of the first passivation layer 152 on the sidewalls WSS of the plurality of partition wall structures WS). Similarly, portions of the second passivation layer 154 included in the first portion 150P1 (i.e., portions of the second passivation layer 154 on the top surfaces WST of the plurality of partition wall structures WS) may have a thickness that is less than a thickness of portions of the second passivation layer 154 included in the second portion 150P2 (i.e.,Sections of the second passivation layer 154 on the sidewalls WSS of the plurality of partition wall structures WS).

[0103] In exemplary embodiments, the first passivation layer 152 may have a relatively uniform thickness on the sidewall WSS of each of the plurality of partition walls WSI. Here, the term "relatively uniform thickness" may mean that a minimum thickness of the first passivation layer 152 arranged on the sidewall WSS of each of the plurality of partition walls WSI is within about 10% of a maximum thickness thereof. The second passivation layer 154 may also have a relatively uniform thickness on the sidewall WSS of each of the plurality of partition walls WSI. In an exemplary manufacturing method, the first and second passivation layers 152 and 154 may be formed using a material with excellent step coverage properties or a manufacturing method (e.g.,an atomic layer deposition (ALD) process), which is advantageous in the formation of materials with excellent step coverage properties.

[0104] For example, the first thickness t11 may be less than a critical thickness for the passivation structure 150 to function as a light guide. For example, if the first thickness t11 of the first portion 150P1 of the passivation structure 150 disposed on the upper surface WST of each of the plurality of partition walls WSI is greater than the critical thickness, light emitted from one light-emitting cell may be guided through the first portion 150P1 of the passivation structure 150 into an adjacent light-emitting cell. Accordingly, when a light-emitting cell is turned on, light may be absorbed or penetrate into a light-emitting cell adjacent to it, and thus, it may be difficult to bring the adjacent light-emitting cell into a completely off state.If the first thickness t11 of the first portion 150P1 is less than the critical thickness, the light emitted by a light-emitting cell from a neighboring light-emitting cell may be blocked by the first portion 150P1 of the passivation structure 150. The first thickness t11 of the first portion 150P1 may be less than or equal to the second thickness t12 of the second portion 150P2. In particular, the first thickness t11 of the first portion 150P1 may be less than the critical thickness for the passivation structure 150 to act as a light guide. Accordingly, the second portion 150P2 of the passivation structure 150 may provide a sufficient thickness to prevent contamination of the fluorescent layer 160, while unwanted crosstalk of light between neighboring pixels PX due to the first portion 150P1 of the passivation structure 150 may be prevented.

[0105] A fluorescent layer 160 may be located within the plurality of cell spaces PXS on the top surfaces of the plurality of light-emitting structures 120. As in Fig. As shown in Figure 8, the fluorescent layer 160 may fill substantially the entire space of the plurality of cell spaces PXS on the passivation structure 150. A top surface of the fluorescent layer 160 may be located at the same height as the top surface WST of each of the plurality of partition walls WSI, but exemplary embodiments are not limited thereto.

[0106] The fluorescent layer 160 may contain a single material capable of converting the color of the light emitted by the light-emitting structure 120 into a desired color. That is, a fluorescent layer 160 associated with the same color may be located in the plurality of cell spaces PXS. However, exemplary embodiments are not limited thereto. The color of a fluorescent layer 160 in some of the plurality of cell spaces PXS may differ from the color of a fluorescent layer 160 in the remaining cell spaces PXS.

[0107] The fluorescent layer 160 may include a resin in which a fluorescent material is dispersed or a film containing a fluorescent material. For example, the fluorescent layer 160 may include a film of fluorescent material in which fluorescent material particles are uniformly dispersed at a specific concentration. The fluorescent material particles may be a wavelength conversion material that changes the wavelength of the light emitted by the plurality of light-emitting structures 120. The fluorescent layer 160 may include at least two types of fluorescent material particles with different size distributions to improve the density and color uniformity of the fluorescent material particles.

[0108] In exemplary embodiments, the fluorescent material may have different colors and different compositions, such as an oxide-based composition, a silicate-based composition, a nitride-based composition, and a fluoride-based composition. For example, β-SiAlON:Eu 2+ (green), (Ca,Sr)AlSiN 3 :Eu 2+ (red), La 3 Si 6 N 11 :Ce 3+ (yellow), K 2 SiF 6 :Mn 4 + (red), SrLiAl 3 N 4 :Eu (red), Ln 4-x (Eu z M 1-z ) x Si 12-y Al y O 3+x+y N 18-x-y (0.5≤x≤3, 0 <z<0.3, 0<y≤4) (rot), K 2 TiF 6 :Mn 4 + (red), NaYF 4 :Mn 4 + (red), NaGdF 4 :Mn 4 +(red) and the like can be used as fluorescent materials. However, the type of fluorescent material is not limited to these.

[0109] In other exemplary embodiments, a wavelength conversion material, such as a quantum dot, may be further disposed over the fluorescent layer 160. The quantum dot may have a core-shell structure using a III-V or II-VI compound semiconductor. For example, the quantum dot may have a core, such as CdSe and InP, and a shell, such as ZnS and ZnSe. Furthermore, the quantum dot may include a ligand to stabilize the core and shell.

[0110] A support substrate 170 may be located on the wiring structure 140, and an adhesive layer 172 may be interposed between the support substrate 170 and the wiring structure 140. In an exemplary embodiment, the adhesive layer 172 may include an electrically insulating material, such as silicon oxide, silicon nitride, a polymer material such as an ultraviolet (UV) curable material, or resin. In an exemplary embodiment, the adhesive layer 172 may include a eutectic adhesive material such as AuSn or NiSi. The support substrate 170 may include, but is not limited to, a sapphire substrate, a glass substrate, a transparent conductive substrate, a silicon substrate, or a silicon carbide substrate.

[0111] Generally, a light source module including a plurality of light-emitting device chips can be used for an intelligent lighting system (e.g., a headlight for a vehicle), and each of the light-emitting device chips can be individually controlled to implement different lighting modes depending on the ambient conditions. When a plurality of light-emitting devices arranged in a matrix form is used, light emitted from each of the plurality of light-emitting devices may be absorbed by or penetrate into a light-emitting device adjacent thereto. Therefore, the contrast characteristics of the light source module may be poor.However, according to exemplary embodiments, by forming the partition wall structures WS on the plurality of light-emitting structures 120, the absorption or penetration of light emitted from one light-emitting cell into an adjacent light-emitting cell can be reduced or prevented.

[0112] During a process of forming a passivation layer covering the partition wall structure WS, a thickness of a portion of the passivation layer formed on the upper surface of the partition wall structure WS may be greater than a thickness of a portion of the passivation layer formed on a sidewall of the partition wall structure WS. In this case, the portion of the passivation layer formed on the upper surface of the partition wall structure WS may act as a light guide, and thus, light emitted from one light-emitting cell may be absorbed in or penetrate into an adjacent light-emitting cell. However, according to exemplary embodiments, the first portion 150P1 of the passivation structure 150 may be formed with a thickness less than or equal to the thickness of the second portion 150P2.Thereby, the absorption or penetration of light emitted from one light-emitting cell into a neighboring light-emitting cell can be prevented or reduced by the first portion 150P1 of the passivation structure 150. Accordingly, the contrast characteristics of the light-emitting device 100 can be excellent.

[0113] Furthermore, the fluorescent layer 160 can be firmly fixed in each of the cell spaces PXS by the partition wall structure WS. Even if repeated vibrations and impacts are applied to the light-emitting device 100 when the light-emitting device 100 is used as a headlight for a vehicle, the reliability of the light-emitting device 100 can be improved.

[0114] Fig. 10 and Fig. 11 are circuit diagrams for explaining a connection relationship between light-emitting cells included in a light-emitting device 100 according to an exemplary embodiment. Fig. 10 and Fig. 11 are equivalent circuit diagrams of the first cell block BLK1 and the second cell block BLK2 of Fig. 4 according to exemplary embodiments. In the Fig. 10 and Fig. 11, a light-emitting cell may correspond to a diode. The description of the first and second cell blocks BLK1 and BLK2 of Fig. 10 and Fig. 11 can equally apply to the third to ninth cell blocks BLK3 to BLK9 of Fig. 4 can be applied.

[0115] Referring to Fig. 4 and Fig. 10, a first cell block BLK1A may include a plurality of first light-emitting cells 111_1A, each implemented as an LED, and a second cell block BLK2A may include a plurality of second light-emitting cells 111_2A, each implemented as an LED. The number of first light-emitting cells 111_1A may be less than the number of second light-emitting cells 111_2A. The first cell block BLK1A and the second cell block BLK2A may be electrically isolated from each other, and operation of the first cell block BLK1A and the second cell block BLK2A may be controlled by different controllers.

[0116] In an exemplary embodiment, the light-emitting cells 111 included in each of the first to ninth cell blocks BLK1A to BLK9 may be connected in parallel to other light-emitting cells 111 within the same block. For example, the plurality of first light-emitting cells 111_1A included in the first cell block BLK1A may be connected in parallel, and the plurality of second light-emitting cells 111_2A included in the second cell block BLK2A may be connected in parallel. One end of each of the plurality of first light-emitting cells 111_1A and the plurality of second light-emitting cells 111_2A may be connected to different contact pads, respectively, and another end of each of the plurality of first light-emitting cells 111_1A and the plurality of second light-emitting cells 111_2A may be connected to a common contact pad.

[0117] Anodes of the plurality of first light-emitting cells 111_1A may be connected to each other, and anodes of the plurality of second light-emitting cells 111_2A may be connected to each other. In contrast to the illustration in Fig. 10, the cathodes of the plurality of first light-emitting cells 111_1A may be connected to each other, and the cathodes of the plurality of second light-emitting cells 111_2A may be connected to each other. The number of first contact pads PAD1A connected to the plurality of first light-emitting cells 111_1A may be less than twice the number of first light-emitting cells 111_1A. The number of second contact pads PAD2A connected to the plurality of second light-emitting cells 111_2A may be less than twice the number of second light-emitting cells 111_2A.

[0118] A first controller may be electrically connected to the plurality of first contact points PAD1A. The first controller may adjust voltages applied to two different contact points from the plurality of first contact points PAD1A and drive a light-emitting cell, a cathode and an anode of which are respectively connected to the two contact points. A second controller may adjust voltages applied to two different contact points from the plurality of second contact points PAD2A and drive a light-emitting cell, a cathode and anode of which are respectively connected to the two contact points.

[0119] Referring to Fig. 11, a first cell block BLK1A' may further include a plurality of first light-emitting cells 111_1A and a dummy light-emitting cell 111_1A', each of which is implemented as an LED. The dummy light-emitting cell 111_1A' may not be connected to a plurality of first contact pads PAD1A and may be substantially inoperative. In an exemplary embodiment, the number of first light-emitting cells 111_1A and dummy light-emitting cell 111_1A' included in the first cell block BLK1A' may be equal to the number of second light-emitting cells 111_2A included in the second cell block BLK2.

[0120] Fig. 12 is a cross-sectional view of a light-emitting device 300 according to example embodiments. Fig. 13 is an enlarged view of the area CX4 of Fig. 12. Fig. 12 is an enlarged cross-sectional view taken along line II-II' of Fig. 7 of some components of the light-emitting device 300, which is glued to a circuit board 370 according to an exemplary embodiment. In the descriptions of Fig. 12 and Fig. 13, repeated descriptions of the same reference numerals as used in relation to Fig. 8 and Fig. 9 were made, omitted.

[0121] Referring to Fig. 12 and Fig. 1, the light-emitting device 300 may further include a buffer structure BS provided between a first conductive semiconductor layer 122 and a partition wall structure WS. The buffer structure BS may include a nucleation layer 310, a dislocation-removing structure 320, and a buffer layer 330, which are sequentially arranged on a bottom surface of the partition wall structure WS toward the first conductive semiconductor layer 122. The dislocation-removing structure 320 may include a first dislocation-removing material layer 322 and a second dislocation-removing material layer 324.

[0122] In exemplary embodiments, the nucleation layer 310 may be a layer for forming nuclei for crystal growth or for assisting in the wetting of the dislocation-removing structures 320. For example, the nucleation layer 310 may include aluminum nitride (AlN). The first dislocation-removing material layer 322 may be B x Al y In z Ga 1-x-y-zN contain (with 0≤x<1, 0 <y<1, 0≤z<1, und 0≤x+y+z<1). Bei einigen beispielhaften Ausführungsformen kann der Aluminium (Al)-Gehalt der ersten versetzungsentfernenden Materialschicht 322 etwa 25 Atom-% (at%) bis etwa 75 at% betragen. Die zweite versetzungsentfernende Materialschicht 324 kann eine andere Gitterkonstante als die erste versetzungsentfernende Materialschicht 322 aufweisen und z. B. Aluminiumnitrid (AlN) enthalten. An einer Grenzfläche zwischen der ersten und der zweiten versetzungsentfernenden Materialschicht 322 und 324 kann eine Versetzung (engl. dislocation) gebogen werden oder eine Versetzungshalbschleife (engl. dislocation half-loop) kann aufgrund eines Unterschieds in der Gitterkonstante zwischen den ersten und der zweiten versetzungsentfernenden Materialschichten 322 und 324 gebildet werden, um die Versetzung zu reduzieren. Die Dicke der zweiten versetzungsentfernenden Materialschicht 324 kann geringer sein als die Dicke der Keimbildungsschicht 310.Thus, the tensile stress generated in the second dislocation-removing material layer 324 can be reduced to prevent the occurrence of cracks.

[0123] The buffer layer 330 may reduce differences in the lattice constant and the coefficient of thermal expansion (CTE) between a layer formed on the buffer structure BS (e.g., the first conductive semiconductor layer 122) and the second dislocation-removing material layer 324. For example, the buffer layer 330 B x Al y In z Ga 1-x-y-z N contain (with 0≤x<1, 0 <y<1, 0≤z<1 und 0≤x+y+z<1).

[0124] According to exemplary embodiments, the buffer structure BS can not only prevent the occurrence of cracks in a plurality of light-emitting structures 120, but also prevent the propagation of dislocations into the plurality of light-emitting structures 120. This can improve the crystal quality of the light-emitting structures 120.

[0125] In exemplary embodiments, a wiring structure 140 may be disposed over a top surface of a support structure 360 ​​with a first adhesive layer 352 therebetween, and a printed circuit board (PCB) 370 may be disposed on a bottom surface of the support structure 360 ​​with a second adhesive layer 354 therebetween. The support structure 360 ​​may include a support substrate 362, a first insulating layer 364, and a second insulating layer 366. The first insulating layer 364 may be in contact with the first adhesive layer 352, and the second insulating layer 366 may be in contact with the second adhesive layer 354.

[0126] The carrier substrate 362 may include an insulating substrate or a conductive substrate. The carrier substrate 362 may have an electrical resistance of at least a few MΩ, for example, at least 50 MΩ. The carrier substrate 362 may be made of, for example, doped silicon, undoped silicon, Al 2 O 3, tungsten (W), copper (Cu), a bismaleimide triazine (BT) resin, an epoxy resin, polyimide, a liquid crystal (LC) polymer, a copper-clad laminate, or a combination thereof. The support substrate 362 may have a thickness of at least 150 µm (e.g., about 200 µm to about 400 µm) in the vertical direction (i.e., in the Z direction).

[0127] Each of the first insulating layer 364 and the second insulating layer 366 may have an electrical resistance of at least several tens of MΩ, for example, at least 50 MΩ. For example, each of the first insulating layer 364 and the second insulating layer 366 may contain at least one of SiO 2 , Si 3 N 4 , Al 2 O 3 , HfSiO 4 , Y 2 O 3 , ZrSiO 4 , HfO 2 , ZrO 2 , Ta 2 O 5 and La 2 O 3 contain.

[0128] According to exemplary embodiments, since the support structure 360 ​​has a relatively high electrical resistance, the occurrence of errors due to the formation of an undesirable conduction path from the wiring structure 140 through the support structure 360 ​​to the board 370 in the vertical direction can be prevented.

[0129] Fig. 14 is a cross-sectional view of a light-emitting package 1000 containing a light-emitting device 100, according to an exemplary embodiment. In Fig. 14, the same reference numerals are used to identify the same elements as in Fig. 1 to 13.

[0130] Referring to Fig. 14, the light-emitting package 1000 may include the light-emitting device 100 and a semiconductor drive chip 210 mounted on a package substrate 410. The semiconductor drive chip 210 may be one of the first to ninth controllers 210_1 to 210_9 of Fig. 2, and the assembly substrate 410 may be a circuit board PCB of Fig. 2.

[0131] A lower insulating layer 412, an inner conductive pattern layer 413, and an upper insulating layer 414 may be sequentially stacked on a portion of a base plate 411, and at least one driving semiconductor chip 210 may be mounted on a conductive pattern disposed on the upper insulating layer 414.

[0132] An interposer 450 may be located on another portion of the base plate 411 with an adhesive layer 440 therebetween, and the light-emitting device 100 may be mounted on the interposer 450. In an exemplary embodiment, the interposer 450 may be the same as the support substrate included in the light-emitting device 100 (see 170 in Fig. 8), but is not limited thereto. The at least one semiconductor drive chip 210 may be electrically connected to a pad PAD of the light-emitting device 100 via a bonding wire 480 connected to a pad 470. The at least one semiconductor drive chip 210 may drive a plurality of light-emitting cells of the light-emitting device 100 individually or collectively.

[0133] The bonding wire 480 may be encapsulated with a molding resin 460. The molding resin 460 may include, for example, an epoxy molding compound (EMC), but is not particularly limited. The molding resin 460 may partially encapsulate the light-emitting device 100 so as not to interfere with the light emitted by the plurality of light-emitting cells of the light-emitting device 100.

[0134] A heat sink 420 may be bonded to a bottom surface of the base plate 411, and a TIM layer 430 may be further selectively disposed between the heat sink 420 and the base plate 411.

[0135] The light-emitting devices and / or the light source module described with reference to Fig. 1 to 13 may be mounted alone or in combination in the light-emitting assembly 1000.

[0136] Fig. 15 is a cross-sectional view of a light-emitting assembly 1000 including a light-emitting device 100 according to an exemplary embodiment.

[0137] Referring to Fig. 15, a conductive line CL may connect a first contact 134A of a light-emitting structure (e.g., the light-emitting structure 120 of the Fig. 8, Fig. 9, Fig. 12) to a second contact 134B of another light-emitting structure 120 connected in series with a specific light-emitting structure, so that a plurality of light-emitting cells included in a cell block are connected in series. Alternatively, in an exemplary embodiment, the conductive line CL may electrically connect the first contact 134A of one light-emitting structure 120 to the first contact 134A of another light-emitting structure 120 connected in parallel with the one light-emitting structure 120, so that a plurality of light-emitting cells included in a cell block are connected in parallel.

[0138] The conductive line CL may not be formed only in the light-emitting device 100. For example, the conductive line CL may include a conductive pattern formed in a package substrate 410. The conductive line CL may include a conductive pattern formed in an intermediate carrier 450.

[0139] In an exemplary embodiment, the light-emitting device 100 may not include a plurality of contact pads formed on an emission surface (e.g., a surface formed in a third direction (Z)). The light-emitting device 100 may be connected to a semiconductor drive chip 210 via the conductive line CL formed in the package substrate 410.

[0140] Fig. 16 is a schematic perspective view of a lighting device including a light-emitting device according to an exemplary embodiment.

[0141] Referring to Fig. 16, a headlight module 2020 may be installed in a headlight unit 2010 of a vehicle. A side mirror lamp module 2040 may be installed in an outside mirror unit 2030, and a taillight module 2060 may be installed in a taillight unit 2050. At least one of the headlight module 2020, the side mirror lamp module 2040, and the taillight module 2060 may include one of the light source modules 10 that includes at least one of the light-emitting devices 100 described above.

[0142] Fig. 17 is a schematic perspective view of a flat panel lighting device 2100 including a light emitting device, according to an exemplary embodiment.

[0143] Referring to Fig. 17, the flat panel lighting device 2100 may include a light source module 2110, a power supply 2120, and a housing 2130.

[0144] The light source module 2110 may include an array of light-emitting devices as a light source. The light source module 2110 may be one of the light source modules 10, which includes at least one of the light-emitting devices 100 described above as a light source. The light source module 2110 may have a flat shape as a whole.

[0145] The power supply 2120 may be configured to supply power to the light source module 2110. The housing 2130 may form a receiving space for receiving the light source module 2110 and the power supply 2120. The housing 2130 may be shaped to have a hexahedral shape with an open side, but is not limited thereto. The light source module 2110 may be arranged to emit light toward the open side of the housing 2130.

[0146] Fig. 18 is an exploded perspective view of a lighting device 2200 including a light-emitting device according to an exemplary embodiment.

[0147] Referring to Fig. 18, the lighting device 2200 may include a socket 2210 (or base), a power supply 2220, a heat sink 2230, a light source module 2240, and an optical unit 2250.

[0148] The socket 2210 may be configured to be interchangeable with an existing lighting device. The lighting device 2200 may be powered via the socket 2210. The power supply 2220 may be separated into a first power supply 2221 and a second power supply 2222. The heat sink 2230 may include an internal heat sink 2231 and an external heat sink 2232. The internal heat sink 2231 may be directly connected to the light source module 2240 and / or the power supply 2220 and transfer heat to the external heat sink 2232 via the light source module 2240 and / or the power supply 2220. The optical unit 2250 may include an internal optical unit and an external optical unit. The optical unit 2250 may be configured to evenly diffuse the light emitted by the light source module 2240.

[0149] The light source module 2240 may receive power from the power supply 2220 and emit light to the optical unit 2250. The light source module 2240 may include at least one light-emitting assembly 2241, a circuit board 2242, and a controller 2243. The controller 2243 may store control information of the light-emitting assembly 2241. The light-emitting assembly 2241 may include at least one of the light-emitting devices 100 described above, and the light source module 2240 may be one of the light source modules 10 described above.

Claims

[1] Light source module comprising: a circuit board (PCB; 370); a light-emitting device (100) mounted on the circuit board (PCB; 370), the light-emitting device (100) comprising a plurality of cell blocks (BLK1 - BLK9), each of which comprises a plurality of light-emitting cells (111); and a plurality of controllers (210_1 - 210_9) mounted on the circuit board (370), each of which is configured to control a cell block corresponding to it from the plurality of cell blocks (BLK1 - BLK9), wherein the cell blocks of the plurality of cell blocks (BLK1 - BLK9) are electrically insulated from each other, wherein the plurality of cell blocks (BLK1 - BLK9) comprises a first cell block (BLK7) and a second cell block, wherein a number of first light-emitting cells contained in the first cell block (BLK7) is less than a number of second light-emitting cells contained in the second cell block, wherein the cell blocks of the plurality of cell blocks (BLK1 - BLK9) are arranged in a first row and a second row, where the first cell block (BLK7) is located in the middle of the second row, wherein the plurality of controllers (210_1 to 210_9) comprises a first controller connected to a plurality of first channels and a second controller connected to a plurality of second channels different from the plurality of first channels, wherein the first controller is configured to control the first cell block (BLK7) via the plurality of first channels, and wherein the second controller is configured to control the second cell block via the plurality of second channels. [2] The light source module according to claim 1, wherein a number of the plurality of first channels connected to the first controller is equal to a number of the plurality of second channels connected to the second controller. [3] Light source module according to claim 1, wherein the light-emitting device (100) is arranged in a central region (CA_P) of the circuit board (PCB; 370), and wherein the plurality of controllers (210_1 - 210_9) are arranged in a peripheral region (PA_P1, PA_P2) of the circuit board (PCB; 370) surrounding the central region (CA_P). [4] The light source module according to claim 1, wherein the first light-emitting cells included in the first cell block (BLK7) are electrically connected to each other. [5] The light source module according to claim 4, wherein the first light-emitting cells in the light-emitting device (100) are electrically connected to each other. [6] The light source module according to claim 4, wherein the first light-emitting cells are electrically connected to each other by conductive lines formed on the circuit board (PCB, 370). [7] Light source module according to claim 1, wherein the cell blocks of the plurality of cell blocks (BLK1 - BLK9) are arranged in a first row and a second row, and wherein the plurality of cell blocks (BLK1 - BLK9) further comprises a third cell block (BLK1; BLK4), wherein a number of third light-emitting cells contained in the third cell block (BLK1; BLK4) is less than a number of second light-emitting cells contained in the second cell block, wherein the third cell block (BLK1; BLK4) is arranged at one end of the first row. [8] The light source module according to claim 1, wherein the first cell block (BLK7) has a smallest number of light-emitting cells (111) among the plurality of cell blocks (BLK1 - BLK9). [9] A light-emitting device comprising: a plurality of cell blocks (BLK1 - BLK9) electrically insulated from one another, each of which has a plurality of light-emitting cells (111); and a plurality of contact points (PAD; PAD1; PAD2) configured to electrically connect the plurality of cell blocks (BLK1 - BLK9) to an external device (200), wherein the plurality of cell blocks (BLK1 - BLK9) comprises a first cell block (BLK7) and a second cell block, wherein a number of first light-emitting cells contained in the first cell block (BLK7) is less than a number of second light-emitting cells contained in the second cell block, wherein the cell blocks of the plurality of cell blocks (BLK1 - BLK9) are arranged in a first row and a second row, where the first cell block (BLK7) is located in the middle of the second row, wherein the plurality of controllers (210_1 to 210_9) comprises a first controller connected to a plurality of first channels and a second controller connected to a plurality of second channels different from the plurality of first channels, wherein the first controller is configured to control the first cell block (BLK7) via the plurality of first channels, and wherein the second controller is configured to control the second cell block via the plurality of second channels. [10] Light-emitting device according to claim 9, wherein the first light-emitting cells are connected in series, and wherein the second light-emitting cells are connected in series. [11] The light-emitting device according to claim 9, wherein a total number of light-emitting cells (111) included in cell blocks (BLK1 - BLK4) arranged in the first row is less than a total number of light-emitting cells (111) included in cell blocks (BLK5 - BLK9) arranged in the second row. [12] Light-emitting device according to claim 9, wherein the cell blocks of the plurality of cell blocks (BLK1 - BLK9) are arranged in a first row and a second row, and wherein the plurality of cell blocks (BLK1 - BLK9) further comprises a third cell block (BLK1; BLK4), wherein a number of third light-emitting cells contained in the third cell block (BLK1; BLK4) is less than a number of second light-emitting cells contained in the second cell block, wherein the third cell block (BLK1) is arranged at one end of the first row. [13] The light-emitting device according to claim 12, wherein the third light-emitting cells further comprise a dummy light-emitting cell electrically isolated from the plurality of contact pads. [14] Light-emitting device according to claim 9, wherein the plurality of cell blocks (BLK1 - BLK9) are arranged in a central region (PXR) of the light-emitting device (100), and wherein the plurality of contact points (PAD; PAD1; PAD2) are arranged in a peripheral region (PDR1; PDR2) of the light-emitting device (100) surrounding the central region (PXR). [15] Light source module comprising: a circuit board (PCB; 370); a light-emitting device (100) mounted on the circuit board (PCB; 370), the light-emitting device (100) comprising a plurality of cell blocks (BLK1 - BLK9), each of which comprises a plurality of light-emitting cells (111); and a plurality of controllers (210_1 - 210_9) mounted on the circuit board (PCB; 370), each of which is configured to control a cell block (BLK1; BLK2) corresponding to it from the plurality of cell blocks (BLK1 - BLK9), wherein the cell blocks of the plurality of cell blocks (BLK1 - BLK9) are electrically insulated from each other, wherein the plurality of cell blocks (BLK1 - BLK9) comprises a first cell block (BLK7) and a second cell block, wherein the cell blocks of the plurality of cell blocks (BLK1 - BLK9) are arranged in a first row and a second row, and a number of light-emitting cells contained in cell blocks (BLK1 - BLK4) arranged in the first row is less than a number of light-emitting cells contained in cell blocks (BLK5 - BLK9) arranged in the second row, wherein a cell block (BLK7) arranged in the middle of the second row has a smaller number of light-emitting cells than other cell blocks (BLK6, BLK8) arranged adjacent thereto, wherein the plurality of controllers (210_1 to 210_9) comprises a first controller connected to a plurality of first channels and a second controller connected to a plurality of second channels different from the plurality of first channels, wherein the first controller is configured to control the first cell block (BLK7) via the plurality of first channels, and wherein the second controller is configured to control the second cell block via the plurality of second channels. [16] The light source module according to claim 15, wherein two cell blocks (BLK1, BLK4) arranged at two ends of the first row have a smaller number of light-emitting cells than other cell blocks (BLK2, BLK3) arranged adjacent thereto. [17] The light source module according to claim 15, wherein the plurality of light-emitting cells (111) included in one cell block of the plurality of cell blocks (BLK1 - BLK9) are electrically connected to each other by conductive lines formed on the circuit board (PCB; 370).

Images