Method for producing a three-dimensional body

Abstract

The invention relates to a method for the layer-by-layer production of a three-dimensional body. The method comprises a step (I) of providing a fungal-containing bonding agent (26). The method comprises a step (II) of laying down particles (28) in at least one particle layer (14) over a build-up bed (22). The method comprises a step (III) of applying the fungal-containing bonding agent (26) in a defined region of the particle layer (14). The method comprises a step (IV) of inducing the growth of a fungal mycelium (24) from the fungal-containing bonding agent (26) to structurally connect particles (28) of the particle layer (14) to form a green body (32). The method comprises a step (V) of exposing the green body (32).

Description

Technical area

[0001] The present invention relates to a method for producing a three-dimensional body, in particular a body comprising fungal mycelium. State of the art

[0002] Additive manufacturing processes have been known for many years. They enable the simple production of three-dimensional objects with complex geometries that are impossible or difficult to achieve using conventional manufacturing methods. Processes for producing three-dimensional objects using fungi, particularly fungal mycelium, are still in their infancy. The field is new and experiencing rapid development. Potential applications are still being researched, but applications in art and interior design have already emerged. Description of the invention

[0003] The invention relates to a method for producing a three-dimensional body. The method is a method for additive manufacturing. The three-dimensional body produced by the method extends in all three spatial directions, which are arranged orthogonally to one another. The produced three-dimensional body has at least one fungal mycelium. A fungal mycelium is the mycelium of a fungus. A fungal mycelium is a collection of hyphae. Hyphae form branched, single-row threads. Hyphae and mycelium can transmit oxygen, nutrients, water, and / or signals. A fungal mycelium can grow from fungal spores. The fungal mycelium can transmit forces, in particular tensile forces. The fungal mycelium can decompose lignin, cellulose, glucose, and / or other substances. The fungal mycelium can grow. The fungal mycelium can react to environmental conditions. The fungal mycelium can stop growing under certain environmental conditions.It can also begin growing again under certain environmental conditions. The fungal mycelium can stop and start growing again several times. Environmental conditions can include humidity, oxygen levels, light, temperature, and / or the presence of nutrients.

[0004] The three-dimensional body comprises particles. The particles are connected to one another by the mycelium. The mycelium surrounds the particles. The mycelium may have grown into the particles. The particles may be made of wood, in particular beech or oak. The particles may have an average diameter between 0.01 and 100 millimeters, in particular between 0.1 and 10 millimeters. The particles may be round. The particles may have an irregular shape. The particles may comprise wood pellets. The particles may have a cylindrical shape. The particles may comprise wood chips. The particles may comprise wood chips compressed into wood pellets. The particles may comprise inorganic material. For example, the particles may be made of metal. For example, the particles may comprise aluminum, steel, copper and / or iron.If the particles are made of metal, the mycelium has not grown into the particles, but the particles are only surrounded by mycelium.

[0005] The method comprises a step of providing a fungus-containing connecting agent. Providing can be manufacturing. Providing can also be filling a container. A container can, for example, be a connecting agent reservoir that can be connected to a distribution device, such as a nozzle, via hoses. A fungus-containing connecting agent comprises parts of a fungus, in particular a mycelium-forming fungus. Part of a fungus can be fungal mycelium. Part of a fungus can also be fungal spores. Part of a fungus can also be a fruiting body of a fungus. The part of the fungus is living. The fungus-containing connecting agent comprises fungal mycelium. Alternatively or additionally, the connecting agent can also comprise fungal spores and / or the fruiting body of a fungus, from which the fungal mycelium develops.The connecting agent is a substance designed to mechanically connect particles to one another. The connecting agent does not have to be designed to connect particles immediately upon contact with the particles. The connecting agent is designed to establish a connection between particles over a longer period of time, for example several days, through the growth of fungal mycelium. The connecting agent can partially decompose the particles in the process. The connecting agent is designed to enable the growth of fungal mycelium. For example, the connecting agent can comprise fungal mycelium that can grow. The connecting agent can also comprise fungal spores that are designed to grow into a fungal mycelium. The connecting agent can comprise foodstuffs, for example agar, glucose, fructose, carbohydrates, fatty acids and / or salts. The connecting agent can also comprise wood, lignin and / or cellulose.The bonding agent may additionally contain an adhesive that bonds particles and / or fungal mycelium together, for example, alginate. The bonding agent may contain an antibiotic to inhibit bacterial growth. The bonding agent may contain a nutrient for a fungus. The bonding agent may contain a water content.

[0006] The bonding agent can be viscous and in particular a paste. The bonding agent can be spreadable. A paste can be a suspension, meaning that the paste can have mixed liquid and solid phases. The liquid phase can contain water. The bonding agent can also be a liquid. If the bonding agent is a liquid, the bonding agent contains suspended fungal mycelium and / or fungal spores. The bonding agent can also be solid. If the bonding agent is solid, it can consist of particles. If the bonding agent consists of particles, the particles can be movable relative to one another. If the bonding agent consists of particles, all the particles can have the same or almost the same composition. If the bonding agent consists of particles, the particles can also have different compositions.For example, the bonding agent may comprise particles containing a fungus, nutrients, wood, lignin, cellulose, an antibiotic, and / or an adhesive. The bonding agent may also be liquid. If the bonding agent is liquid, it can be sprayed.

[0007] The method comprises a step of laying out particles in at least one particle layer over a print bed. The laying out can be a distribution. The laying out can be carried out via a coater. The laying out can be a distribution into a layer of uniform thickness. The laying out can be a laying out which lays out a smooth or flat particle layer. The laying out can cover an entire area above a print bed. A particle layer comprises particles. A particle layer can be between 0.1 millimeters and 100 millimeters thick. A particle layer can in particular be between 1 millimeter and 10 millimeters thick. A particle layer can have free spaces between the particles. The free spaces can be designed such that a connecting agent can penetrate into them. A particle layer can be arranged vertically above another particle layer.

[0008] A coater is a device that distributes particles into a particle layer. It is designed to deposit particles from a particle reservoir onto the print bed described below. The coater can also remove excess particles and / or smooth a particle layer. The coater is movable horizontally, i.e., parallel to a direction of extension of the print bed. The coater can also be movable vertically, i.e., in the vertical direction of the production system. The coater can have a width that essentially corresponds to a width of the print bed, so that the coater can extend across the print bed. The coater can be mounted along rails, which can be arranged at the edges of the production system. The rails can be suspended above the production system. The coater can be mounted on a crane or on a coating robot.The coater can have a starting position at an outer edge of the production line. The coater can be moved by electric motors. The coater can be moved by a crane or a coating robot.

[0009] A coater can have a particle reservoir. A particle reservoir is a container for particles. The particle reservoir is connected to a coating opening. Particles can exit the coater from a particle reservoir via a coating opening. In particular, they can be distributed into a particle layer via a coating opening. The particle reservoir can be designed so that sufficient particles can be kept in stock to fill an entire print volume. A print volume can be the volume enclosed by the edge regions and located between a first and a second position of the print bed in the vertical direction. The particle reservoir can be designed so that it can be filled during production. The particle reservoir is connected to a coating opening of the coater. The particle reservoir can be connected to the coating opening via a pipe or hose.The coating opening can have a width that is equal to or nearly equal to the width of the print bed. The coating opening is designed to allow particles to exit from a particle reservoir onto a print bed. The particles can be forced outward by gravity. The particles can be forced outward by applying pressure. The particles can be forced outward by a piston. The particles can be forced outward by a screw conveyor.

[0010] A print bed is a device designed to support particle layers. A print bed can be vertically displaceable. A print bed can have a lead screw. A print bed can have a print bed plate. The print bed plate can be moved along a vertical direction. In particular, the print bed plate can be moved downwards by a thickness of the particle layer before laying out a particle layer. A print bed can be vertically movable so that the uppermost layer rests against an upper edge of a production system. The print bed plate can be moved vertically via the lead screw. A lead screw can cause a linear movement from a rotary movement. The lead screw is rotated by a rotational increment, for example, via an electric motor. The print bed plate can be moved vertically in predefined increments.The predefined increments can be determined by a computer, correspond to a particle layer thickness, and / or be specified by a user. The vertical movement of the print bed plate can be a lowering. The print bed plate can also be translated vertically via a pneumatic device. The print bed can have a position sensor to determine the vertical position of the print bed plate. The position sensor can measure a distance to an underside of the print bed plate and / or to a floor of the manufacturing facility. The position sensor can additionally or alternatively count the rotation increments of the electric motor to determine the position of the print bed plate. The print bed can be connected to a ventilation device for ventilating the three-dimensional body.The print bed may include sensors such as a position sensor, an acceleration sensor, a weight sensor, a temperature sensor and / or an oxygen sensor.

[0011] Edge regions of a production system can be arranged around the print bed. The edge regions are designed to prevent the particle layers from escaping from the production system. The edge regions are arranged around a print bed. Fastening means for a coater, for a robot, for a particle reservoir and / or a connecting agent reservoir can be arranged at the edge regions. Devices for moving the coater, the robot, the particle reservoir and / or the connecting agent reservoir can be arranged at the edge regions. In particular, the devices can have rails. The edge regions can have collecting openings. The collecting openings can be designed to collect particles that protrude beyond the edges of the print bed. The collecting openings can be designed to collect particles that are displaced beyond the edges of the print bed by the coater and / or the robot.The collection openings can be connected to a collection reservoir. The particles entering the collection openings can be transported into a collection reservoir by gravity, a screw conveyor, a piston, an air stream, and / or other devices. The particles in the collection reservoir can be used for a further manufacturing process. The particles in the initial reservoir can be returned to the coater's particle reservoir. The particles can be filtered, cleaned, humidified, and / or sterilized before reuse and / or return to the coater's particle reservoir.

[0012] The method comprises a step of applying the bonding agent in a defined region of the particle layer. Application may comprise placing the bonding agent onto the particle layer. Application may also comprise pressing into the particle layer, displacing the particles of the particle layer, seeping between the particles, wetting the particles, and / or sticking the particles of the particle layer together. A defined region may be a point. A defined region may also be a line or a path. A defined region may also be a volume. The set of defined regions corresponds to the volume or geometry of the manufactured three-dimensional body. For example, a defined region may be a cross-section of the manufactured three-dimensional body. For example, a defined region may be the entire volume of a manufactured body.Defined areas can correspond to the areas where fasteners are applied.

[0013] Application can be carried out using a robot. The robot can have an effector, a nozzle, and a bonding agent reservoir. The robot can be designed to apply the bonding agent via the effector and the nozzle from the bonding agent reservoir into a defined area of ​​the particle layer. The robot can be designed to move the effector over a print layer. The robot can be arranged outside the print bed or next to the print bed. However, the robot can also be arranged at the edges and / or above the print bed. The robot can be mobile or movable, for example, it can be mounted on rails. The robot can be a 2-, 3-, 4-, 5-, or 6-axis robot. The robot can be an industrial robot. The robot can be a collaborative robot. The robot can be an articulated-arm robot, a delta robot, or a Cartesian robot.

[0014] The effector can be arranged at one end of the robot. The effector can be configured to apply the bonding agent from the bonding agent reservoir to a layer of particles. The effector can be a peristaltic effector. The effector can have a spray device. The effector can be connected to a bonding agent reservoir. The effector can be connected to the bonding agent reservoir via a hose or pipe. The nozzle can be attached to the effector. The nozzle can be configured to convey the bonding agent through the nozzle. The nozzle can convey solid substances. The nozzle can also convey liquid substances. The bonding agent can be forced through the nozzle from the bonding agent reservoir via a peristaltic pump, a screw conveyor, gravity, a piston, and / or the application of pressure.The connecting agent is applied by forcing it outwards over the particle layer.

[0015] The connecting agent reservoir can be arranged above the effector. The connecting agent reservoir can also be arranged next to or in the effector, or even not on the effector. The connecting agent reservoir can also be arranged, for example, on the robot or in an edge area. The connecting agent reservoir can be designed to hold the connecting agent described above in stock. The connecting agent reservoir can be designed such that sufficient connecting agent can be kept in stock to be able to carry out a manufacturing process. The connecting agent reservoir can be designed such that it can be filled during production. The connecting agent can be applied from the connecting agent reservoir via the nozzle onto a particle layer. The connecting agent can be introduced into the particle layer and arranged between the particles.

[0016] The robot, the print bed, and the coater can be controlled via a control device. The control device can be configured to transmit control signals. In addition, the control device can control a ventilation device. The control device can comprise a computer. The computer can be a personal computer, such as a desktop computer or a laptop computer. However, the computer can also be an integrated microcontroller or another type of computer. The control device can be connected electronically to the controlled components, for example via a bus system. However, the control device can be connected to the controlled components via data cables or wirelessly. The control device can also comprise a plurality of computers, each of which can be connected to the connected components. The plurality of computers can be arranged on the respective connected component or at remote locations.

[0017] The control device can be configured to store data for the production of a three-dimensional body and, based on this data, to provide control signals for the production of a three-dimensional body. The control signals can be transmitted from the control device to the connected components in order to control the connected components via the control signals. The stored data can be, for example, a digital three-dimensional model of a body to be manufactured. The stored data can also be digital representations of cross-sections of a body to be manufactured, which are also referred to as "slices." The stored data can also be specifications for movement paths and movement speeds of the robot, the effector, the coater, and / or the print bed.The stored data may also be specifications for the operation of a ventilation device, in particular a compressor, and may contain specifications for the air quantity and oxygen concentration.

[0018] The construction of the three-dimensional body can take place in a separate room or chamber, which is filled in particular with a special atmosphere, which can be a gas mixture or sterile air, which is in particular under slight overpressure in order to prevent contamination of the object during construction. The separate room or chamber can be filled with the special atmosphere before a growth step. The separate room or chamber can also be filled with the special atmosphere after a particle laying step. The special atmosphere can be maintained during a growth step. The special atmosphere can also be maintained beyond the growth step. It is also possible to combine the special atmosphere differently in the various process phases.The composition of the special atmosphere can, in particular, include a temperature, humidity, and / or oxygen content. The special atmosphere can be sterilized and / or purified using filters and / or UV radiation. The separate space or chamber can surround the particle layers, the fungus-containing bonding agent, an adhesive, and / or other bodies surrounded by the particle layers. The separate space or chamber can also surround the entire production facility. The separate space or chamber can also surround part of the production facility.

[0019] The method comprises a step of inducing the growth of mycelium from the fungal connecting agent for structurally connecting the particles to form a green body. Inducing is an action or the omission of an action that causes or does not inhibit the growth of the fungal mycelium. For example, inducing can also be waiting. Inducing can be allowing growth. Allowing growth means that no active action is performed that causes growth and no action is performed that prevents or inhibits growth. Inducing can be providing moisture, nutrients, temperature, oxygen, light, and / or other environmental conditions that can positively influence the growth of a fungal mycelium. The step of inducing growth can also comprise aeration.

[0020] Growth indicates a proliferation of fungal mycelium cells. Growth indicates an enlargement of the fungal mycelium. Growth can indicate the penetration of the fungal mycelium into particles. Growth indicates the fungal mycelium connecting to one another to form a structure. Structural connecting is a mechanical connecting. Structural connecting forms a structure that can transmit mechanical forces. In particular, the structure can transmit tensile forces. A green compact is an intermediate product in the production of the three-dimensional body. A green compact corresponds geometrically to a three-dimensional body to be manufactured. A green compact is a body that must undergo further production steps. A green compact can contain living fungal mycelium. A green compact can have the same dimensions and geometric shape as the fully manufactured three-dimensional body. A green compact can contain fungal mycelium that continues to grow. A green compact can be rigid.A green compact can be mechanically stable. A green compact can also be easily mechanically deformable.

[0021] The method comprises a step of exposing the green body. Exposing is removing the green body from a surrounding material. In particular, exposing is removing the green body from the particle layers and the production facility. Exposing can be carried out using compressed air. Exposing can be carried out, in particular, using sterile air. Sterile air is ambient air that has been filtered and / or sterilized. The described method can be carried out, in particular, layer by layer. Carrying out layer by layer is a repetition of at least one production step with the effect that the produced body has multiple layers. The multiple layers can be connected to one another. In particular, a layer by layer process is the repetition of the steps of laying out a particle layer, applying a bonding agent, and depositing a print bed. The layer by layer process can comprise additive manufacturing.

[0022] A three-dimensional body manufactured using the described process exhibits several advantageous properties. The resulting body is particularly lightweight.

[0023] The resulting body can contain cavities. The material of the resulting body is also particularly lightweight. The resulting body can trap a particularly large amount of air. The cavities are created by the growth of the fungal mycelium. The resulting body can be created without the use of plastics. The production of the resulting body is particularly low in CO2 and therefore particularly environmentally friendly. The resulting body has excellent acoustic properties. Due to its structure and material, the resulting body absorbs sound and noise very well. The resulting body can provide a moisture buffer. Thus, the resulting body can reduce fluctuations in the humidity of a room. The resulting body has a particularly aesthetically pleasing shape.

[0024] The manufactured body can exhibit gradients of properties. This can be achieved by varying the materials used during production. The manufactured body can incorporate additional structures by embedding them during or after production. The manufacturing process offers particular freedom in the geometric design of a body, and overhangs and other geometric shapes are easy to create because the manufactured body is supported by a layer of particles during production. In contrast to a process such as extrusion, overhangs can be manufactured without any problem. The body produced in this way can contain living mycelium. This makes it possible to connect several bodies produced by this process by bringing them into contact to allow the mycelium to grow together.This allows for the production of particularly large structures, especially those larger than the dimensions of a production facility's build volume. Multiple components can be joined together without additional fastening elements such as screws or clamps. This also enables a particularly clean and elegant appearance of the final product. The resulting body has particularly high artistic value due to its particularly appealing aesthetics and connection with living biological material.

[0025] In one embodiment of the method, the fungal bonding agent comprises a nutrient for the fungus and / or an adhesive. The nutrient can comprise, for example, agar, glucose, fructose, carbohydrates, fatty acids, minerals, and / or salts. The bonding agent can comprise wood, lignin, and / or cellulose. The adhesive can be an organic adhesive, in particular alginate. The adhesive supports the bonding of the fungal mycelium to and within the particle layer. The support can be adhesion. By adhesion, the position of the bonding agent within a defined area can be supported or enabled. The adhesive can thus support a more precise determination of the geometry of the three-dimensional body to be produced. If the adhesive consists of an organic adhesive, it can be biodegradable. The adhesive can be degradable by the fungal mycelium. The adhesive can also be a nutrient.The nutrient supports the growth of the fungal mycelium. The fungal mycelium can use the nutrient to grow, multiply, expand, and / or degrade lignin and / or cellulose. If the adhesive is a nutrient, the production of the bonding agent can be simplified. If the adhesive is a nutrient, the bonding agent can be more environmentally friendly. If the adhesive is a nutrient, the bonding agent can be biodegradable and more environmentally friendly.

[0026] In a further embodiment of the method, providing the fungus-containing bonding agent comprises providing a fungus-containing bonding agent with a wood-decaying fungus, in particular Trametes and / or Ganoderma. The wood-decaying fungus can decompose wood aerobically. The wood-decaying fungus can also decompose wood anaerobically. The wood-decaying fungus can decompose lignin and / or cellulose, in particular. The wood-decaying fungus can feed on wood, in particular lignin and / or cellulose. The wood-decaying fungus can grow into wood and wood particles and decompose interior parts of the wood. The wood-decaying fungus can also decompose the surface or exterior of a piece of wood. The wood-decaying fungus can, in particular, comprise a fungal mycelium. The fungal mycelium of the wood-decaying fungus can thus at least partially decompose wood particles.The fungal mycelium grows into the particles, forming a mechanical bond between them. Such a bond can be more stable than simply surrounding the particles with fungal mycelium.

[0027] In a further embodiment of the method, the laying out of the particles comprises laying out particles made of organic material, in particular wood, preferably beech. Organic material can be material of biological origin. The organic material can also comprise fungi, algae, plant material and / or animal material. If the organic material comprises wood, it can comprise beech, linden, oak, olive wood, apple wood, fir wood and / or bamboo. Organic material can also be material that has carbon atoms in its molecular structure. By forming the particles with organic material, it is made possible for the fungal mycelium to at least partially decompose the particles. In the process, the fungal mycelium grows into the particles and thus forms a mechanical bond between the particles. Such a bond can be more stable than exclusively surrounding the particles with fungal mycelium.

[0028] In a further embodiment of the method, the method comprises sterilizing the particles, preferably before laying out the particles. Sterilizing may comprise heating, irradiating, chemically treating, freezing, applying high pressure, and / or subjecting to a vacuum. Heating may comprise warming to a high temperature, in particular above 30°C, preferably above 50°C, particularly preferably above 100°C, and for example above 200°C. Heating may comprise controlling the temperature to keep the temperature below, for example, 500°C, 300°C, or 200°C. Irradiating may comprise irradiating with UV rays. Irradiating may also comprise irradiating with infrared rays. Irradiating may also comprise irradiating with radioactive radiation, in particular with alpha radiation, beta radiation, X-rays, gamma radiation, and / or neutron radiation.Chemical treatment can comprise treatment with chemical substances, in particular with an alcohol, isopropanol, acetone, an acid, a base and / or a salt. Freezing can comprise lowering the temperature. In particular, freezing can comprise lowering the temperature below 0°C, below -10°C, below -30°C, below -70°C, below -100°C, below -150°C or below -200°C. High pressurisation can comprise applying a pressure above atmospheric pressure, for example above 1.05 bar, above 1.5 bar, above 2 bar, above 10 bar, above 100 bar or above 200 bar. Exposure to a vacuum can comprise lowering the pressure below 0.5 bar, below 0.1 bar, below 0.01 bar or below 0.0001 bar.

[0029] By sterilizing the particles, unwanted organisms such as bacteria, animals, plants, viruses and / or fungi are removed or killed from the particles. This prevents unexpected, undesired and / or disruptive growth of organisms before, during or after the production of the three-dimensional body. Sterilization can prevent the fungal mycelium of the bonding agent from competing with other fungi. Sterilization can prevent the fungal mycelium from becoming infected with diseases. Sterilization can support the growth of the fungal mycelium. Sterilization can prevent unwanted death of the fungal mycelium. Sterilization can prevent the particles from rotting before, during and / or after production. Sterilization can prevent unpleasant odors.By keeping the particles below a predetermined temperature, carbonization, ignition and / or decomposition during sterilization can be avoided.

[0030] In a further embodiment of the method, inducing growth comprises at least one of the steps of adjusting, in particular regulating, the temperature, adjusting, in particular regulating, the humidity, and adjusting, in particular regulating, the oxygen content. The adjustment, in particular the regulation, can take place in the separate space or chamber already described. Adjusting a temperature can be adjusting a temperature that particularly supports the growth of the fungal mycelium. The temperature can be kept constant throughout the entire growth of the fungal mycelium. However, the temperature can also be varied during the growth of the fungal mycelium. For example, a higher temperature can be set in an initial growth phase and a lower temperature can be set in a later growth phase.A lower temperature can also be set in the initial growth phase and a higher temperature in a later growth phase. The set temperature can be a temperature that occurs in the natural habitat of the mushroom mycelium. The set temperature can be a temperature comparable to the temperature in a forest. The temperature can also be regulated. For example, the temperature can be measured using a thermometer, and a heating device can be controlled based on the thermometer's measurement. The set or regulated temperature can be between 0°C and 40°C. In particular, this temperature can be between 10°C and 30°C, between 20°C and 30°C, or between 20°C and 25°C.

[0031] Setting the humidity can be a setting that particularly supports the growth of the fungal mycelium. The humidity can be kept constant throughout the entire growth of the fungal mycelium. However, the humidity can also be varied during the growth of the fungal mycelium. For example, a higher humidity can be set in the initial growth phase and a lower humidity in a later growth phase. It can also be a lower humidity in the initial growth phase and a higher humidity in a later growth phase. The set humidity can be a humidity that occurs in the natural habitat of the fungal mycelium. The set humidity can be a humidity comparable to the humidity in a forest. The humidity can also be regulated.For example, humidity can be measured using a hygrometer, and a humidity device can be controlled based on the hygrometer's measurement. The humidity can be the air humidity. The humidity can also be the humidity of the bonding agent, the particle layers, or the green body. The humidity can be between 0% and 30%. The humidity can also be between 30% and 70%. The humidity can also be between 70% and 100%. The humidity can also be 0% or 100%.

[0032] Adjusting the oxygen level can be an adjustment of the oxygen level that particularly supports the growth of the fungal mycelium. The oxygen level can be kept constant throughout the entire growth of the fungal mycelium. However, the oxygen level can also be varied during the growth of the fungal mycelium. For example, a higher oxygen level can be set in the initial phase of growth and a lower oxygen level in a later phase of growth. A lower oxygen level can also be set in the initial phase of growth and a higher oxygen level in a later phase of growth. The adjusted oxygen level can be an oxygen level that occurs in the natural habitat of the fungal mycelium. The adjusted oxygen level can be an oxygen level that is comparable to the oxygen level in a forest.The oxygen level can be 21%, for example. The oxygen level can also be above 21%, above 50%, or even 100%. The oxygen level can also be regulated.

[0033] By adjusting the temperature, humidity, and / or oxygen levels, the most favorable environmental conditions for the growth of the fungal mycelium are created. The fungal mycelium can then grow faster, penetrate deeper into the particles, and / or form stronger bonds. By adjusting the environmental conditions, the growth rate of the fungal mycelium can also be controlled. For example, the growth rate can also be slowed down. The growth rate can also be accelerated. The growth rates of organisms other than the fungal mycelium can also be influenced. For example, the growth of bacteria, algae, fungi, and / or plants can be slowed or accelerated. The growth of can also be prevented.

[0034] In a further embodiment of the method, the method comprises aerating the green compact, in particular aerating the green compact with sterile air, wherein the aerating of the green compact preferably comprises aerating by means of a device in the print bed of a production system. Aerating is providing air in at least one particle layer. The air is provided to a green compact through the particle layer, in particular to the fungal mycelium in the green compact. The aeration is carried out via a aeration device. The aeration device can comprise a compressor and, for example, aeration hoses. The compressor can compress air, which is supplied to the particle layers and the green compact via the aeration hoses. Alternatively or in addition to the compressor, the air can also be provided via a pressure bottle.Alternatively or in addition to the compressor, the air can also be provided by connecting it to the ambient air via an opening. Alternatively or additionally, air can also be provided via a chemical reaction. A device in the print bed can have ventilation holes in the print bed. Ventilation can also be carried out by a ventilation device in the edge areas of the production system. Ventilation can also be carried out by a ventilation device that is inserted into the particle layers. For example, ventilation tubes can be inserted into the particle layers and provide air. Ventilating a green compact can mean surrounding the green compact with air. The air can also penetrate the green compact. The air can also penetrate the green compact through pores. The air can also penetrate the green compact through diffusion processes.The air can be transported by the fungal mycelium from a surface of the green body into an internal volume of the green body. Sterile air is ambient air that has been filtered and / or sterilized. The ambient air can be sterilized by heating, for example, to over 100°C, over 200°C, or over 500°C. The ambient air can also be sterilized by irradiation, for example, by UV radiation. The supplied air can also be pure oxygen. The supplied air can also be oxygen-enriched ambient air, for example, with an oxygen content of more than or equal to 50%. The supplied air can have an oxygen content of 21%. The supplied air can be filtered before being supplied.

[0035] The growth of the fungal mycelium is supported by aeration. The growth of the fungal mycelium involves cross-linking of the mycelium and thus the formation of a green body. Aeration can accelerate the growth of the fungal mycelium, enable the growth of the fungal mycelium, enable denser cross-linking, and / or enable stronger cross-linking. Stronger cross-linking can be cross-linking through more hyphae, through thicker hyphae, and / or through more mechanically resistant hyphae, whereby the hyphae form the fungal mycelium. Aeration can support the growth of the fungal mycelium in a particular structure. For example, aeration can support growth in a particularly porous structure. Aeration can also support growth in a particularly dense structure. Aeration can promote growth in a particularly uniform structure, especially with small differences across the height of the manufactured body.

[0036] In a further embodiment of the method, the method comprises moving the at least one particle layer and the applied bonding agent from a production device to a growth device. A production device can be a manufacturing plant. The moving can also comprise moving adhesive, additives, and other agents or devices supplied during the manufacturing process. The moving is a moving with the smallest possible displacement of the particle layers and the bonding agent relative to one another. The moving is carried out by raising the print bed, whereby the material to be moved is lifted over the edge regions of the manufacturing plant and can be moved. The moving can be carried out by means of pluggable walls or plates, which are plugged together over the edge regions and around the print bed.The assembly can be performed before raising the print bed. After raising the print bed, another plate can be pushed between a particle layer and the print bed, thus placing the material to be moved in a container. The container thus formed can then be removed by hand, by crane, by rail, or by another device together with the material to be moved. The moving can also be performed using a device in a lower area of ​​the production facility. The moving can also take place without raising the print bed. The moving can also be done by lifting the material out of the production facility using a device.

[0037] A growth device is a device designed to enable and / or promote the growth of a fungal mycelium. The growth device can comprise a separate space or chamber as described above. The growth device can be a separate space or chamber as described above. The growth device can enable and / or perform the adjustment, in particular the regulation, of humidity, temperature, and / or oxygen content as described above.

[0038] By transferring material from a production device, the production device can be prepared for the production of another body before the growth of the fungal mycelium is complete. This can increase the throughput of the production device and its efficiency, as well as reduce material consumption, power consumption, gas usage, and / or costs. By transferring it to a growth device, the induction of growth can be simplified. The growth device can have more ergonomic, cheaper, and / or mechanically simpler connections or devices to enable ventilation, adjustment of temperature, humidity or oxygen content, or the adjustment of other environmental conditions. Furthermore, the transfer allows for transport for further processing steps and thus allows a more flexible design of the production process.

[0039] In a further embodiment of the method, the method comprises halting the growth of the fungal mycelium, in particular by heating, irradiating, and / or chemically treating the green body. Halting growth may comprise killing the fungal mycelium. Halting growth may also comprise killing parts of a fungal mycelium. Halting growth may also comprise putting the fungal mycelium into a non-growing state, in particular into a state in which the fungal mycelium has very low activity, such as oxygen consumption and nutrient consumption. Heating is warming up to a predetermined temperature. Heating may comprise holding at a predetermined temperature. For example, heating may comprise holding at a predetermined temperature for at least 10 minutes, more than 10 minutes, more than 30 minutes, more than 1 hour, more than 12 hours, and / or more than 24 hours.The predetermined temperature may be higher than room temperature. The predetermined temperature may be higher than 30°C, 50°C, 100°C, or 200°C. Heating may take place in an oven. Heating may also take place in an autoclave. Heating may also take place in the production facility and / or in a growth device. Irradiation may include irradiation with UV rays. Irradiation may also include irradiation with infrared rays. Irradiation may also include irradiation with radioactive radiation, in particular with alpha radiation, beta radiation, X-rays, gamma radiation, and / or neutron radiation. Chemical treatment may include treatment with chemical substances, in particular with an alcohol, isopropanol, acetone, an acid, a base, and / or a salt. Stopping growth may cause hardening, stiffening, and / or densification of the green body.Stopping growth can also involve sterilization.

[0040] By halting growth, unwanted further growth of the fungal mycelium is prevented. Further growth can, for example, decompose particles to such an extent that the mechanical properties of the green body are impaired. By halting growth, the fungal mycelium can be prevented from growing into undesired areas of a particle layer. By halting growth, the fungal mycelium can be prevented from forming fruiting bodies. By halting growth, the fungal mycelium can be prevented from rotting. By halting growth, the useful life of the produced body can be extended.

[0041] In a further embodiment of the method, the method comprises applying an adhesive, in particular an adhesive comprising alginate, in a defined region of the particle layer, wherein the application of the connecting agent preferably takes place via a first nozzle and the application of the adhesive via a second nozzle. The first nozzle can be arranged next to the second nozzle. The first nozzle and the second nozzle can be arranged on the same effector. The first nozzle and the second nozzle can be arranged on different effectors. The first nozzle and the second nozzle can be arranged on the same robot. The first nozzle and the second nozzle can be arranged on different robots. During application, the first nozzle and the second nozzle can be operated simultaneously. Operating means conveying connecting agent and / or adhesive.During application, the first nozzle can first perform an application step on a particle layer, and then the second nozzle can perform an application step on a particle layer. The nozzles can be guided along the same movement paths during application. The nozzles can also be guided along different paths. The nozzles can have the same diameter. The nozzles can also have different diameters. The nozzles can be designed to convey solids, liquids, and / or suspensions.

[0042] The adhesive supports the bonding of the fungal mycelium to the particles. This support can be achieved by gluing. Gluing can support or enable the position of the connecting element within a defined area.

[0043] The adhesive can thus support a more precise determination of the geometry of the three-dimensional body to be produced. By applying the adhesive through a second nozzle, a more precise and flexible application is possible. For example, the adhesive can be applied only in areas that are subject to particular mechanical stress, thus supporting the mechanical strength in these areas. By using a second nozzle, the shelf life of a bonding agent can be increased because the fungal mycelium cannot prematurely degrade or decompose an adhesive. By using a second nozzle, the nozzle can be adapted to the properties of the adhesive more easily and flexibly. By using a second nozzle, the use of adhesives and bonding agents that are difficult to mix or otherwise incompatible with each other can be enabled.By using a second nozzle, it is possible to use adhesives and bonding agents that have different phases, such as a solid and a liquid phase. Short description of the characters Fig. 1 schematically illustrates a manufacturing plant according to an embodiment of the present invention. Fig. 2 schematically illustrates a cross-section of the production plant from Fig. 1. Fig. 3 schematically illustrates another cross-section of the production plant from Fig. 1. Fig. 4 schematically illustrates a cross-section of the production plant from Fig. 1 with multiple particle layers, a green body, and a ventilation device. Fig. Figure 5 schematically illustrates a method for producing a three-dimensional body using the production plant from Fig. 1 to 4. Fig. 6 schematically illustrates a cross-section of several particle layers with an applied bonding agent. Fig. Figure 7 schematically illustrates a cross-section of several particle layers with an applied bonding agent and coalesced fungal mycelium. Detailed description of embodiments

[0044] Fig. 1 schematically illustrates a manufacturing system 10 for the layer-by-layer production of a three-dimensional body according to an embodiment of the present invention. On the manufacturing system 10, Fig. 1, a particle layer 14 and a bonding agent 26 are arranged. The production system 10 comprises a coater 12, a control device 16, a robot 18, a print bed 22, and edge regions 36. Additionally, the production system can comprise a ventilation device 52.

[0045] As in Fig. As shown in Figures 2 to 4, the print bed 22 has a threaded spindle 48, ventilation holes 30, and a print bed plate 50. The print bed 22 is arranged between the edge regions 36. The print bed 22 is designed to receive at least one particle layer 14, which can be applied using the coater 12 described below. Receiving can be a superimposed arrangement of the particle layer 14 over the print bed sheet 50. The print bed plate 50 is rectangular, but can also be square. The edge regions 36 of the production system 10 are arranged around a print bed 22. The edge regions 36 are designed to prevent the particle layers 14 from escaping from the production system 10. The edge regions 36 enclose a rectangular region. However, the edge regions 36 can also enclose a square region.

[0046] The coater 12 is designed to apply particles from a particle reservoir 38 onto the print bed 22 and onto a particle layer. The coater 12 is moved from an outer edge 36 of the production system 10 to an opposite outer edge 36 of the production system 10. The robot 18 has an effector 34, a nozzle 20, and a bonding agent reservoir 40. The robot 18 is designed to apply the bonding agent 26 via the effector 34 and the nozzle 20 from the bonding agent reservoir 40 in a defined area of ​​the particle layer 14. The robot 18 is designed to move the effector 34 over the particle layer. The robot 18 is arranged next to the edge areas 36 and thus outside the print bed 22. The effector 34 is arranged at one end of the robot 18. The effector 34 is designed to apply the bonding agent 26 from the bonding agent reservoir 40 to a particle layer 14.Effector 34 is a peristaltic effector.

[0047] The control device 16 is designed to control the coater 12, the robot 18, and the print bed 22. In addition, the control device 16 can control a ventilation device 52. The control device 16 shown has a computer and is connected to the controlled devices via a bus system. The production system 10, in particular the print bed 22, the coater 12, and the control device 16, are designed to arrange a particle layer 14 above the print bed 22, as described below. The edge regions 36 enclose a rectangular region. The particle layer 14 and the print bed 22 are arranged between the edge regions 36 in this rectangular region. A particle layer 14 consists of particles 28, which form a layer covering a surface spanned between the edge regions 36. The particles 28 can be made of wood, in particular beech.

[0048] The connecting agent 26 used by the manufacturing system 10 of the present invention is a fungal connecting agent. The connecting agent 26 comprises a fungal mycelium. Alternatively or additionally, the connecting agent 26 can also comprise fungal spores and / or the fruiting body of a fungus. The fungal mycelium 24 is a part of a fungus, in particular Trametes and / or Ganoderma. The fungal mycelium is living.

[0049] Fig. 2 schematically illustrates a cross-section of the production system 10, in particular the coater 12 and the print bed 22. The cross-section also illustrates a cross-section of the particle layers 14 laid down by the production system 10 of the present invention. The respective particle layer 14 is delimited by edge regions 36 of the production system 10. The coater 12 has a particle reservoir 38, which stores particles 28, and a coating opening 46. The print bed 22 has a print bed plate 50, which can be a rectangular or square plate. The print bed plate 50 can be made of metal, plastic, or ceramic. The print bed plate 50 is connected to the threaded spindle 48. The threaded spindle 48 can be made of metal, plastic, or ceramic. The print bed plate 50 can be guided on rails.A plurality of particle layers 14 can be arranged vertically one above the print bed 22 using the coater 12. The particle layers are defined by the print bed and the edge regions. The coater 12 can apply a first particle layer and then a further particle layer onto this first particle layer.

[0050] Fig. 3 schematically illustrates a cross-section of the production system, in particular the effector 34, the nozzle 20, the bonding agent reservoir 40, and the print bed 22. The cross-section also illustrates a cross-section of the particle layers 14 laid down by the coater 12 and the bonding agent 26 applied through the nozzle 20. The particle layer 14 is delimited by edge regions 36 of the production system 10. The bonding agent reservoir 40 is arranged above the effector 36.

[0051] Fig. 4 schematically illustrates a cross-section of the production system 10 with several particle layers 14, a green compact 32, and a ventilation device 52. The green compact 32 forms an arched structure. The particle layers 14 and the green compact 32 are arranged above a print bed 22. The print bed 22 has ventilation holes 30 which are connected to a ventilation device 52. The green compact 32 has a fungal mycelium 24 and particles 28, more precisely particles of the particle layer 14, which was laid out by the coater 12. The particles 28 are connected via the fungal mycelium. The fungal mycelium is intergrown with the particles 28 and with itself. The green compact 32 forms a rigid structure. The green compact 32 can have free spaces, in particular pores. The green compact 32 can have a high humidity, in particular a higher humidity than the particle layers 14. The green compact 32 can contain foodstuffs.

[0052] The aeration device 52 has aeration hoses 42 and a compressor 44. The compressor 44 is designed to compress air and supply it through the aeration hoses 42 via the aeration holes 30 to the particle layers 14 and the green body 32. The air thus supplied is ambient air. The supplied air can also be sterile air. The supply of air is aeration. The fungal mycelium 24 is designed to use the oxygen of the supplied air for the growth and / or decomposition of wood. The fungal mycelium 24 is designed to mechanically bond the particles of the particle layer 14 to one another. In particular, the fungal mycelium is designed to grow in and / or around the particles 28. The fungal mycelium can be designed to decompose the particles 28.

[0053] Fig. Figure 5 schematically illustrates a method for producing a three-dimensional body by means of the above-described production plant 10. The above-described control device 16 is designed and configured to carry out the process described below with reference to Fig. 5, in particular to control the various components of the production plant 10 accordingly to carry out the method. The method comprises a step of providing I the above-described fungus-containing connecting agent 26, a step of laying out II the above-described particles 28 in the above-described particle layer 14 above the print bed 22, a step of applying III the above-described fungus-containing connecting agent 26 in a defined region of the particle layer 14, a step of inducing IV growth of a fungal mycelium 24 from the above-described fungus-containing connecting agent 26 for structurally connecting particles 28 of the particle layers 14 to form a green compact 32, and a step of exposing V the above-described green compact 32.

[0054] Providing I comprises filling the connecting agent reservoir 40 with connecting agent 26. Providing I can also comprise producing the connecting agent 26. In laying out II, the coater 12 applies particles 28 in a particle layer 14 to the print bed 22. For this purpose, the coater 12 is moved from a starting position across an extension direction of the production system 10 and, in doing so, lays out the particle layer 14 of uniform thickness via the coating opening 46 along the movement path of the coater 12. When returning to the starting position, the coater 12 can flatten the particle layer 14 and / or scrape off excess particles 28. Excess particles 28 can be particles that lie above an extension height of the edge regions 36 or above a predetermined height.The excess particles 28 can fall into a collecting opening and be collected for reuse. Laying II can be performed layer by layer. Layer-by-layer laying II means that a step of laying II is performed repeatedly, and the print bed 22 is lowered between each repetition. Further processing steps can be performed between each repetition; in particular, an application III can be performed between each repetition.

[0055] In application III, a bonding agent 26 is applied to a defined area of ​​the laid-out particle layer 14 via the effector 34 and the nozzle 20. The defined area can be calculated by a computer or specified by a user. Application III comprises placing the bonding agent 26 onto the particle layer 14. Application III can also comprise pressing it into the particle layer 14, displacing the particles 28, seeping between the particles 28, wetting the particles 28, and / or sticking the particles 28 of the particle layer 14 together. Application III of the bonding agent 26 can be carried out layer by layer. Layer-by-layer application III means that a step of application III is carried out repeatedly, and the print bed 22 is lowered between each repetition.Between each repetition, further processing steps can be carried out; in particular, a laying out II can be carried out between each repetition.

[0056] During the induction of growth IV, the fungal mycelium 24 grows. In doing so, it connects particles 28 from the particle layer 14 to one another. In doing so, it connects different regions of the fungal mycelium 24 to one another. The fungal mycelium 24 can also grow from fungal spores. During the exposure V, the green compact 32 is removed from the particle layers 14, or the particle layers 14 are removed from the green compact 32, or the green compact 32 is removed from the production facility 10. The exposure also includes lifting the green compact 32 out of the particle layers 14. The exposure can be carried out during the step of inducing growth IV. In doing so, the fungal mycelium 24 grows before exposure, while the green compact 32 is embedded in particle layers 14, as well as after exposure. After exposure, the green compact can be sprayed. The spraying can provide moisture, food, antibiotics, and / or adhesive.Spraying can be a step in inducing IV growth.

[0057] Fig. Figure 6 schematically illustrates a cross-section of several particle layers 14 with an applied bonding agent 26. The cross-section is a vertical cross-section through several particle layers 14, meaning that the cross-section is parallel to a direction of gravity. The cross-section schematically shows the state of the bonding agent 26 shortly after the application step III, for example, one hour after the application III. Fig. 6, like the other figures, is not to scale. The representation is for illustrative purposes only. The connecting agent 26 is arranged between the particles 28 of the particle layers 14 and is located in defined areas. The connecting agent 26 comprises a fungal mycelium 24. The fungal mycelium 24 consists of individual hyphae. The hyphae or fungal mycelium 24 are largely not interconnected and are located within the area in which they were applied. The particles 28 of the particle layer 14 have not been decomposed or have only been decomposed slightly.

[0058] Fig. Figure 7 schematically illustrates the cross-section of the Fig. 6 several days after the application step III, for example five days after application. Fig.7 is also not to scale. The fungal mycelium 24 forms a grown-together and interconnected network. The fungal mycelium 24 has penetrated the particles 28 and connects them to one another. The fungal mycelium 24 can transmit forces. The fungal mycelium 24 thus forms, together with the enclosed particles 28, a green compact 32. The particles 28 enclosed by the fungal mycelium 24 have been partially decomposed. The fungal mycelium 24 has grown together within the defined areas, but has only grown slightly beyond this area. The fungal mycelium 24 has grown in the defined area due to the moisture of the connecting agent 26. The fungal mycelium 24 has only grown slightly outside the defined area due to the conditions in the particle layer 14. The conditions can be, for example, moisture.By applying the connecting agent 26, targeted growth conditions for the fungal mycelium 24 were achieved in the defined area. Thus, the growth of the fungal mycelium 24 was specifically controlled to obtain a desired shape of a green compact 32. Reference symbol 10 Production plant 12 coaters 14 Particle layer 16 Control device 18 robots 20 nozzle 22 print bed 24 fungal mycelium 26 connecting devices 28 particles 30 ventilation holes 32 Greenfinch 34 Effector 36 Marginal area 38 Particle reservoir 40 lanyard reservoir 42 ventilation hoses 44 Compressor 46 Coating opening 48 threaded spindle 50 print bed plate 52 Ventilation device I Provide lanyards II Laying out particles III Applying connecting devices IV Bringing about growth V Exposing Greenfinch

Claims

[1] Method for the production of a three-dimensional body, in particular layer by layer, wherein the method comprises at least the following steps: - Providing (I) a fungus-containing connecting agent (26); - laying out (II) particles (28) in at least one particle layer (14) over a printing bed (22); - applying (III) the fungus-containing connecting agent (26) in a defined area of ​​the particle layer (14); - causing (IV) growth of a fungal mycelium (24) from the fungus-containing bonding agent (26) for structurally bonding particles (28) of the particle layer (14) to form a green body (32); and - Expose (V) the greenling (32). [2] The method of claim 1, wherein providing (I) the fungus-containing connecting agent (26) comprises providing (I) a fungus-containing connecting agent (26) with a nutrient for the fungus and / or an adhesive. [3] Method according to claim 1 or 2, wherein the providing (I) of the fungus-containing connecting agent (26) comprises providing (I) a fungus-containing connecting agent (26) with a wood-decomposing fungus, in particular Trametes and / or Ganoderma. [4] Method according to one of the preceding claims, wherein the laying out (II) of the particles (28) comprises a laying out (II) of particles (28) made of organic material, in particular wood, preferably beech or oak. [5] Method according to one of the preceding claims, wherein the method comprises sterilizing the particles (28), preferably before laying out (II) the particles (28), in particular by high temperature and / or pressure, preferably by a temperature greater than 30°C and / or a pressure above 1.05 bar. [6] A method according to any one of the preceding claims, wherein said inducing (IV) growth comprises at least one of the following steps: - adjusting, in particular regulating, the temperature, - adjusting, in particular regulating, the humidity, and - adjusting, in particular regulating, the oxygen content. [7] Method according to one of the preceding claims, wherein the method comprises ventilating the green body (32), in particular ventilating the green body (32) with sterile air, wherein the ventilating of the green body (32) preferably comprises ventilating by means of a device in the printing bed (22). [8] Method according to one of the preceding claims, wherein the method comprises displacing the at least one particle layer (14) and the applied bonding agent (26) from a manufacturing device into a growth device. [9] Method according to one of the preceding claims, wherein the method comprises stopping the growth of the fungal mycelium (24), in particular by heating, irradiating and / or chemically treating the green body (32). [10] Method according to one of the preceding claims, wherein the method comprises applying (III) an adhesive, in particular an adhesive comprising alginate, in a defined region of the particle layer (14), wherein the application (III) of the connecting agent preferably takes place via a first nozzle and the application of the adhesive takes place via a second nozzle.

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