COOLANT UNIT, VALVE DEVICE AND REFRIGERATION CIRCUIT SYSTEM

Abstract

Refrigerant device that forms a refrigeration circuit, suitable for circulating a refrigerant, comprising a device main body (11) and an aluminum coolant line (12, 13) that can be connected to the main body of the device (11), wherein at least the section of the main body of the device (11) to which the coolant line can be connected is made of stainless steel, and at this section the main body of the device (11) and the coolant line (12, 13) are joined by soldering to form a material bond, and at the connection surface (111e, 111h, 111h-1) of the main body of the device (11) a load-bearing section (111f, 111f-1) is provided that crosses the axial direction (D11, D13) of the coolant line (12, 13) and is suitable for absorbing a load in the axial direction (D11, D13), wherein the load can be absorbed by the load-bearing section (111f, 111f-1) being connected by a The connecting surface (111e, 111h, 111h-1) of the main body of the device (11) is formed by a recessed groove and the solder material is arranged on the inside.

Description

[Technical field]

[0001] The present invention relates to a coolant device and a valve device forming a refrigeration circuit system such as an air conditioning device, as well as a refrigeration circuit system. [Background technology]

[0002] Traditionally, a refrigerant unit is known as a component of an air conditioning unit (refrigeration system or cooling unit), etc., in which a connecting component, consisting of a discharge pipe and an intake pipe for a refrigerant (refrigerant lines), is connected to a main unit body (see, e.g., patent document 1). In many of these refrigerant units, the main unit body and the refrigerant lines are joined by soldering.

[0003] US 3 105 293 A concerns the production of a soldered joint between a first part made of aluminum and a second part made of stainless steel.

[0004] JP H08 - 267 228 A concerns a connection of a copper pipe to an aluminium pipe using a stainless steel intermediate piece.

[0005] DE 100 45 175 A1 discloses a heat exchanger with a first tube in which water flows and a second tube in which a refrigerant flows, wherein the first tube and the second tube are soldered together at a connecting surface.

[0006] CN 2 08 951 458 U discloses a pipe connection comprising an aluminium pipe, a steel pipe and a copper pipe.

[0007] DE 10 2011 008 119 A1 discloses a double tube comprising an outer tube and an inner tube arranged within the outer tube and coaxially to it. An outer tube wall has recesses that project into an annular gap between the outer tube and the inner tube.

[0008] Influenced by a sudden increase in material costs, etc., the material used for the main body of the device and the coolant lines has recently changed from copper to more affordable stainless steel and aluminum. In some cases, the main body housing, which requires a certain degree of stability, is made of stainless steel, while the coolant lines are made of aluminum due to its ease of machining. [Citation list][Patent documents]

[0009] [Patent Document 1] Patent Publication No. JP 2004-125238 A [Overview of the invention][Technical problem]

[0010] In general, soldering aluminum is highly difficult. Soldering stainless steel, in particular, presents significant challenges and can lead to unstable joint strength. At the interface between the aluminum coolant line and the stainless steel component, an intermetallic bond forms between the solder material and the stainless steel. While the interface between the aluminum solder and the coolant line is alloyed, resulting in a strong bond, the intermetallic bond formed at the interface with the stainless steel component is hard and brittle, resulting in poor adhesion. This characteristic of the intermetallic bond at the interface with the stainless steel component is a key factor contributing to the soldering difficulties and the instability of the joint strength.The current situation is therefore such that, with regard to the manufacture of a coolant device, in which, as above, a coolant line made of aluminum is soldered to a section of a housing etc. made of stainless steel on a device main body, high quality control is required to maintain the connection strength between the coolant line and the device main body.

[0011] The purpose of the present invention is to provide a cooling device, a valve device and a refrigeration circuit system in which the connection strength with respect to the soldered joint of the stainless steel section of the device main body and the aluminum refrigerant line can be increased. [Means of solving the problem]

[0012] The coolant device according to the invention is a coolant device that forms a refrigeration circuit through which a coolant circulates, comprising a device main body and a coolant line made of aluminum, which is connected to the device main body, characterized in that at least the section of the device main body to which the coolant line is connected is made of stainless steel, the device main body and the coolant line are connected at this section by soldering using a soldering material, and a load-bearing section is provided at the connection surface of the device main body, which crosses the axial direction of the coolant line, to absorb a load in the axial direction.

[0013] According to this coolant device, the load-bearing section provided at the connection surface of the device's main body can absorb a shear load (i.e., in the axial direction) that would otherwise tend to cause the intermetallic connection to detach from the connection surface. This absorption prevents the load from acting directly on the intermetallic connection, thus suppressing detachment and allowing it to withstand the forces in the axial direction of the coolant line. In other words, according to the aforementioned coolant device, the connection strength at the brazed joint between the stainless steel section of the device's main body and the aluminum coolant line can be increased.

[0014] According to the invention, the load is absorbed by forming the load-bearing section through a groove deepened starting from the connecting surface of the device main body, and by introducing the soldering material on the inside.

[0015] According to this design, a simple construction such as placing the solder material on the inside of the groove that forms the load-bearing section can efficiently absorb the load in the axial direction, thus better suppressing the delamination of the intermetallic connection.

[0016] It is preferred if several rows of the groove are provided next to each other in the axial direction, or if it is a section in which the groove is provided in a spiral shape around the axial line of the coolant line.

[0017] According to this design, the connection surface features a plurality of depressions arranged side by side in the axial direction at the intersection of the joint. By introducing solder material into these multiple depressions, the axial load is absorbed even more efficiently, and the failure of the intermetallic connection is further suppressed. If the grooves are arranged in multiple rows, the respective grooves preferably run along the circumference, ideally in a closed ring shape. If the grooves are ring-shaped, the area for absorbing the load can be increased, and the joint strength can be further enhanced.

[0018] Preferably, the load-bearing section has an inclined surface that is inclined to the axial direction.

[0019] According to this design, the inclined surface at the load-bearing section allows the load to be absorbed over a wide area in the axial direction and extensively suppresses the detachment of the intermetallic connection, thus further increasing the strength of the solder joint.

[0020] Furthermore, it is preferred if the dimension of the load-bearing section in the axial direction is larger than the layer thickness of the intermetallic compound formed between the joining surface and the soldering material.

[0021] According to this design, assuming the dimension of the load-bearing section in the axial direction is larger than the thickness of the intermetallic compound, the shear load (i.e., in the axial direction), which tends to cause the intermetallic compound to detach from the interface, can be absorbed over a sufficient length in the axial direction. This absorption efficiently prevents the load from acting directly on the intermetallic compound.

[0022] Furthermore, it is preferred if the dimension of the load-bearing section in an axial line crossing direction to the axial line direction is larger than the layer thickness of the intermetallic compound formed between the joining surface and the soldering material.

[0023] According to this design, the load in the shear direction (i.e., in the axial direction) can be absorbed over a sufficient length in the axial line crossing direction, and this absorption also efficiently suppresses the load from acting directly on the intermetallic joint.

[0024] Furthermore, the valve device of the present invention is a valve device such as the aforementioned coolant device, characterized in that the main body of the device is a valve body which forms a valve chamber inside.

[0025] This means that, according to this valve device, assuming that the valve device in question is the coolant device described above, the connection strength with respect to the soldered joint of the stainless steel section on the device main body and the aluminum coolant line can be increased.

[0026] Furthermore, the refrigeration circuit system of the present invention is characterized by encompassing the cooling device described above.

[0027] This means that, according to this refrigeration circuit system, assuming the refrigerant device described above is included, the connection strength regarding the soldered joint of the stainless steel section on the device main body and the aluminum refrigerant line can be increased. [Effects of the invention]

[0028] According to the coolant device, the valve device and the refrigeration circuit system of the present invention, the connection strength with respect to the soldered joint of the stainless steel section of the device main body and the aluminum coolant line can be increased. [Brief explanation of the characters] [ Fig. 1] Fig. Figure 1 is a partial cross-section showing an electric valve, which is a first embodiment of a coolant device and a valve assembly. [ Fig. 2] Fig. 2 is a schematic view showing a refrigeration cycle system, where the in Fig. The electric valve shown is included. [ Fig. 3] Fig. Figure 3 is an enlarged view of a first area A11 in Fig. 1. [ Fig. 4] Fig. Figure 4 is an enlarged view of a second area A12 in Fig. 1. [ Fig. 5] Fig. Figure 5 is a view showing a first load-bearing section in a first modification with the same enlarged cross-sectional area as in Fig. 3 shows. [ Fig. 6] Fig. Figure 6 is a view showing a second load-bearing section in the first variation with the same enlarged cross-sectional area as in Fig. 4 shows. [ Fig. 7] Fig. Figure 7 is a view showing a load-bearing section in a second embodiment with the same enlarged cross-sectional area as in Figure 7. Fig. 3 shows. [ Fig. 8] Fig. Figure 8 is a view showing a load-bearing section in a second modification with the same enlarged cross-sectional area as in Figure 8. Fig. 7 shows. [ Fig. 9] Fig. Figure 9 is a view showing a load-bearing section in a third embodiment with the same enlarged cross-sectional area as in Figure 9. Fig. 3 shows. [ Fig. 10] Fig. Figure 10 is a view showing a load-bearing section in a third variation with the same enlarged cross-sectional area as in Fig. 9 shows. [Forms for carrying out the invention]

[0029] The following describes a first embodiment of a coolant device, a valve device and a cooling circuit system based on Fig. 1, Fig. 2, Fig. 3 to Fig. 4 explained.

[0030] Fig. Figure 1 is a partial cross-section showing an electric valve, which is a first embodiment of a coolant device and a valve assembly, and Fig. 2 is a schematic view showing a refrigeration cycle system, where the in Fig. The electric valve shown in section 1 is included. Furthermore, it is Fig. 3 an enlarged view of a first area A11 in Fig. 1 and Fig. Figure 4 is an enlarged view of a second area A12 in Fig. 1.

[0031] An electric valve 10 of the present embodiment is used in a Fig. The refrigeration circuit system 1 shown in Figure 2 uses an expansion valve 100, which is described below. This electric valve 10 comprises a device body 11, a first coolant line 12, and a second coolant line 13. The electric valve 10 is a valve device in which a valve body 11b is moved forward and backward in a valve chamber 11a by a motor drive with respect to a valve seat component 11c, so that the flow rate of a coolant flowing between the first coolant line 12 and the second coolant line 13 is adjusted by means of the valve chamber 11a. The device body 11 comprises a valve body 111-1, inside of which the valve chamber 11a is formed, and a housing 111-2, in which a forward / reverse mechanism of the valve body 11b is installed.The housing 111-2 is welded to the valve main body 111-1, forming a cylindrical housing 111 of the device main body 11, closed at both ends. The first coolant line 12 is a cylindrical line, one end of which is brazed to a bottom wall section 111a of the valve chamber 11a of the valve main body 111-1 of the device main body 11 along an axial line X. The second coolant line 13 is also a cylindrical line, one end of which is brazed to an ambient wall section 111b of the valve chamber 11a of the valve main body 111-1 perpendicular to the axial line X. In the present embodiment, the valve main body 111-1, through which the first coolant line 12 and the second coolant line 13 are connected in the device main body 11, is a section made of stainless steel.On the other hand, the first coolant line 12 and the second coolant line 13 are made of aluminum. A solder material specifically designed for aluminum is used. The soldering structure using this solder material is described below based on... Fig. 3 and Fig. 4 explained in detail.

[0032] Prior to the explanation of the soldered structure of the electric valve 10, an overview of the refrigeration circuit system 1 for circulating coolant, which includes the electric valve 10 as expansion valve 100, is given, based on Fig. 2 explained. The refrigeration circuit system 1 of the present embodiment comprises the expansion valve 100, a heat exchanger outdoor unit 200, a heat exchanger indoor unit 300, a flow path diverter valve 400, and a compressor 500, which are each connected by pipes as shown and form a heat pump refrigeration circuit. The illustration of an accumulator, pressure sensor, temperature sensor, etc., has been omitted.

[0033] The flow path of the refrigeration circuit can be switched between two flow paths by the flow path changeover valve 400: one for cooling operation and one for heating operation. In cooling operation, the flow is as described in... Fig. Figure 2, indicated by a solid arrow, shows a refrigerant compressed by the compressor 500 flowing from the flow path switching valve 400 into the heat exchanger outdoor unit 200. The heat exchanger outdoor unit 200 acts as a condenser, and liquid refrigerant flowing out of the heat exchanger outdoor unit 200 flows through the expansion valve 100 into the heat exchanger indoor unit 300, which acts as an evaporator.

[0034] During heating operation, on the other hand, the system circulates as in Fig. Figure 2, indicated by a dashed arrow, shows a refrigerant compressed by the compressor 500 from the flow path diverter valve 400 through the heat exchanger indoor unit 300, the expansion valve 100, the heat exchanger outdoor unit 200, the flow path diverter valve 400, and the compressor 500. The heat exchanger indoor unit 300 acts as a condenser, and the heat exchanger outdoor unit 200 acts as an evaporator. The expansion valve 100 decompresses and expands either the liquid refrigerant flowing in from the heat exchanger outdoor unit 200 during cooling operation, or the liquid refrigerant flowing in from the heat exchanger indoor unit 300 during heating operation, and also controls the flow rate of this refrigerant. Fig. 2. The expansion valve 100 is configured such that, during cooling operation, liquid refrigerant flows from the heat exchanger outdoor unit 200 into a second connecting line 102 (second refrigerant line 13), and during heating operation, liquid refrigerant flows from the heat exchanger indoor unit 300 into a first connecting line (first refrigerant line 12). However, there is no restriction on this configuration, so the expansion valve 100 can also be configured such that, during cooling operation, liquid refrigerant flows from the heat exchanger outdoor unit 200 into the first connecting line 101, and during heating operation, liquid refrigerant flows from the heat exchanger indoor unit 300 into the second connecting line 102.

[0035] Next, also based on Fig. 3 and Fig. 4 at the in Fig. Figure 1 shows the soldered structure of the housing 111 made of stainless steel, the main body of the device 11, and the first coolant line 12 and the second coolant line 13 made of aluminum. First, based on... Fig. 1 and Fig. 3 explains the soldered structure of the housing 111 and the first coolant line 12. Fig. Figure 3 shows this solder structure as an enlarged view of a first area A11 in Fig. 1.

[0036] As in Fig. As shown in Figure 1, a bottom wall through-hole 111c is formed in the bottom wall section 111a of the valve chamber 11a at the housing 111 of the main body of the device 11. This through-hole is connected to the first coolant line 12. A pipe receiving tube 111d projects from the outer circumference of the bottom wall through-hole 111c towards the outside of the valve chamber 11a. This pipe receiving tube receives one end of the first coolant line 12. The valve seat component 11c of the electric valve 10 is attached to the bottom wall through-hole 111c by means of soldering, etc. One end of the first coolant line 12 is inserted into this pipe receiving tube 111d and soldered to it via the bottom wall through-hole 111c in a state that allows it to be connected to the valve chamber 11a. As shown in Figure 111c, the first end of the coolant line 12 is inserted into this pipe receiving tube 111d and soldered to it via the bottom wall through-hole 111c in a state that allows it to be connected to the valve chamber 11a. Fig. As shown in Figure 3, a first load-bearing section 111f is provided on a connection surface 111e with the first coolant line 12 at the housing 111, i.e., the inner circumferential surface of the line receiving tube 111d. The first load-bearing section 111f is a section that absorbs a load F11 acting on the soldered joint via the first coolant line 12, etc., in an axial direction D11 of the first coolant line 12. The load F11 in the axial direction D11 becomes a shear load with respect to the soldered joint. The first load-bearing section 111f, which absorbs this load F11, is a location that runs in an axial direction D12 that intersects the axial direction D11 of the first coolant line 12.Specifically, the load F11 is absorbed by forming a rectangular groove starting from the connecting surface 111e in the axial line intersection direction D12 and filling it with solder material 14 on the inside.

[0037] A groove width dimension W11 of the first load-bearing section 111f in the axial direction D11 is greater than a layer thickness t11 of an intermetallic compound 15 formed between the connection surface 111e with the first coolant line 12 and the solder material 14 for aluminum. More precisely, the groove width dimension W11 is greater than twice the layer thickness t11 of the intermetallic compound 15.

[0038] The layer thickness t11 of the intermetallic compound 15 is influenced by the temperature or heating time of the soldering process, resulting in different specific numerical values, generally ranging from a few µm to 10 µm. This value generally corresponds to a clearance t12 between the joint surface 111e and the first coolant line 12 when no solder material 14 is present, i.e., a thickness of approximately 3 to 25% of the thickness of the solder material 14 between a section at the joint surface 111e, where no first load-bearing section 111f is formed, and the first coolant line 12.

[0039] Furthermore, the groove depth dimension W12 of the first load-bearing section 111f in the axial line intersection direction D12 is greater than the layer thickness t11 of the intermetallic compound 15. More precisely, with regard to the groove depth dimension W12, the groove depth dimension W12 is greater than the single layer thickness t11 of the intermetallic compound 15. Furthermore, the groove depth dimension W12 is greater than the clearance t12 between the connection surface 111e and the first coolant line 12.

[0040] Next, based on Fig. 1 and Fig. 4 explains the solder joint between the second coolant line 13 and the surrounding wall section 111b of the valve chamber 11a at the housing 111.

[0041] As in Fig. As shown in Figure 1, a through-hole 111g is formed in the stainless steel surrounding wall section 111b of the valve chamber 11a, through which an end section of the second coolant line 13 passes. The second coolant line 13 is soldered in a state in which one end is inserted into this through-hole 111g. As shown in Figure 1, Fig. As shown in Figure 4, a second load-bearing section 111j is provided at the connection surface 111h with the second coolant line 13 at the housing 111, i.e., the inner circumferential surface of the through-hole 111g in the surrounding wall. The second load-bearing section 111j is a section that absorbs a load F12 acting on the solder joint via the second coolant line 13, etc., in an axial direction D13 of the second coolant line 13. The load F12 in the axial direction D13 also becomes a shear load with respect to the solder joint. The second load-bearing section 111j is a point which runs in an axial line crossing direction D14 which crosses the axial line direction D13 of the second coolant line 13, wherein more specifically with regard to the respective corners inside and outside on the inner circumference of the ambient wall through-hole 111g it is a C-chamfered point which is formed over the entire circumference.Here too, the load F12 is absorbed by the fact that the C-chamfered second load-bearing section 111j is formed descending from the connection surface 111h and the soldering material 14 is introduced into the lowered section.

[0042] A chamfer dimension W13 of the second load-bearing section 111j in the axial direction D13 is larger than a layer thickness t13 of the intermetallic compound 15, which is formed between the connection surface 111h with the second coolant line 13 and the solder material 14 for aluminum. More precisely, the chamfer dimension W13 in the axial direction D13 is larger than the simple layer thickness t13 of the intermetallic compound 15.

[0043] Furthermore, the chamfer dimension W14 of the second coolant line 13 in the axial line crossing direction D14 at the second load-bearing section 111j is also larger than the layer thickness t11 of the intermetallic compound 15. Furthermore, the chamfer dimension W14 in the axial line crossing direction D14 is larger than a clearance t14 between the connection surface 111h and the second coolant line 13 when the brazing material 14 is not present.

[0044] In the first embodiment described above, the following effects can be achieved by the electric valve 10, as an example of a refrigerant device and a valve assembly, and the refrigeration circuit system 1 comprising the electric valve 10 as an expansion valve 100. That is, according to the present embodiment, the load loads F11, F12 in the axial directions D11, D13 of the respective lines can be absorbed by the first load-bearing section 111f and the second load-bearing section 111j of the main body of the device 11. The interface between the solder material 14 for the aluminum and the first refrigerant line 12 and the second refrigerant line 13 made of aluminum is alloyed, resulting in a high bond strength. On the other hand, the intermetallic compound 15 formed at the connecting surfaces 111e, 111h of the stainless steel housing 111 is hard and brittle, so that the adhesion to the stainless steel is not very high.The properties of the intermetallic compound 15 at the connection surfaces 111e, 111h are a factor that contributes to the difficulty of soldering and the instability of the joint strength. In the present embodiment, the first load-bearing section 111f and the second load-bearing section 111j can absorb the shear loads F11, F12 (i.e., the axial directions D11, D13), which tend to cause the intermetallic compound 15 to detach from the connection surfaces 111e, 111h. This absorption prevents the loads F11, F12 from acting directly on the intermetallic compound 15, thus suppressing detachment and enabling the bond to withstand these loads.This means that, according to the present embodiment, the connection strength with respect to the solder joint of the housing 111 made of stainless steel at the main body of the device 11 as well as the first coolant line 12 and the second coolant line 13 made of aluminum can be increased.

[0045] In the present embodiment, the load load F11 is absorbed by forming the first load-bearing section 111f as a recessed groove extending from the connection surface 111e with the first coolant line 12, and by inserting the soldering material 14 on the inside. According to this design, the load load F11 can be efficiently absorbed by a simple structure such as inserting the soldering material 14 on the inside of a groove, thus better suppressing the delamination of the intermetallic connection 15.

[0046] Furthermore, in the present embodiment, the dimensions of the first load-bearing section 111f and the second load-bearing section 111j in the axial directions D11, D13 of the respective conductors (groove width dimension W11 and chamfer dimension W13) are larger than the layer thicknesses t11, t13 of the intermetallic compound 15. According to this design, the shear loads F11, F12 (i.e., in the respective axial directions D11, D13), which tend to cause the intermetallic compound 15 to detach from the connecting surfaces 111e, 111h, can be absorbed over a sufficient length in the respective axial direction D11, D13. This absorption effectively prevents the loads F11, F12 from acting directly on the intermetallic compound 15.

[0047] Furthermore, in the present embodiment, the dimensions of the first load-bearing section 111f and the second load-bearing section 111j in the respective axial line intersection directions D12, D14 (groove depth dimension W12 and chamfer dimension W14) are also larger than the layer thicknesses t11, t13 of the intermetallic compound 15. According to this design, the load loads F11, F12 in the shear direction (i.e., in the respective axial line directions D11, D13) can be absorbed over a sufficient length in the axial line intersection directions D12, D14. This absorption also efficiently prevents the load loads F11, F12 from acting directly on the intermetallic compound 15.

[0048] This concludes the explanation of the first embodiment, and next, a first modification of the first embodiment will be explained. In the first modification, the direction of the irregularities recessed in the first load-bearing section 111f and the second load-bearing section 111j, originating from the connecting surfaces 111e and 111h, was changed to a projecting form in the opposite direction to that of the first embodiment. The following section primarily explains these changes.

[0049] Fig. 5 is a view showing a first load-bearing section in the first modification with the same enlarged cross-sectional area as in Fig. 3 shows, and Fig. Figure 6 is a view showing a second load-bearing section in the first variation with the same enlarged cross-sectional area as in Fig. 4 shows. At Fig. 5 and Fig. 6 are from the in Fig. 3 and Fig. The four components shown are identical components necessary for explanation, with the same reference symbols as in Fig. 3 and Fig. 4, whereby a double explanation of these identical components is omitted in the following.

[0050] Initially, in the first modification, a first load-bearing section 111f-1 has a rectangular rib shape projecting from the connection surface 111e with the first coolant line 12 at the housing 111 of the main device body 11. A rib width dimension W11-1 of the first load-bearing section 111f-1 in the axial direction D11 is greater than the layer thickness t11 of the intermetallic compound 15. Furthermore, a rib height dimension W12-1 in the axial line intersection direction D12 is greater than the layer thickness t11 of the intermetallic compound 15, but less than the clearance t12 between the connection surface 111e and the first coolant line 12.

[0051] Next, in the first modification, a second load-bearing section 111j-1 is given a triangular rib shape projecting from a connecting surface 111h-1 with the second coolant line 13 at the housing 111 of the device main body 11 (i.e., the inner circumferential surface of the ambient wall through-hole 111g). The triangular rib is formed projecting from the respective end edges on the inside and outside of the inner circumferential surface of the ambient wall through-hole 111g. A rib width dimension W13-1 of the respective triangular rib, which forms the second load-bearing section 111j-1, in the axial direction D13 is larger than the layer thickness t13 of the intermetallic compound 15. Furthermore, a rib height dimension W14-1 in the axial line intersection direction D14 is indeed larger than the layer thickness t13 of the intermetallic compound 15, but smaller than a clearance t14-1 between the connection surface 111h-1 and the second coolant line 13.

[0052] According to the first modification described above, the first load-bearing section 111f-1 and the second load-bearing section 111j-1, which project in a rib-like manner, can absorb the loads F11 and F12 in the axial directions D11 and D13 of the respective lines, thus enabling the respective loads F11 and F12 to be withstood. This means that the connection strength of the solder joint between the stainless steel housing 111 and the main body of the device 11, as well as between the first coolant line 12 and the second coolant line 13 made of aluminum, can also be increased by this modification.

[0053] Next, a second embodiment is described. In the second embodiment, the shape of the load-bearing sections differs from that of the first embodiment. The following section describes the second embodiment, focusing on the differences from the first embodiment, while omitting a description and explanation of the identical construction of the electric valve and the refrigeration circuit system as in the first embodiment. Furthermore, in the second embodiment with two lines, a first coolant line, connected to the bottom wall of the valve chamber, is described and explained as an example. In the subsequent explanation, these are referred to as coolant line and load-bearing section without differentiating between first and second.

[0054] Fig. Figure 7 is a view showing a load-bearing section in a second embodiment with the same enlarged cross-sectional area as in Figure 7. Fig. 3 shows. At Fig. 7 are from the in Fig. The three components shown are identical components necessary for explanation, with the same reference symbols as in Fig. 3 provided, whereby a double explanation of these identical components is omitted in the following.

[0055] In the second embodiment, triangular grooves are provided along the axial direction as the load-bearing section 211f. These triangular grooves can be arranged in several rows side by side on the connecting surface 111e in the axial direction D11 of a coolant line 22, or a single triangular groove can be arranged in a spiral shape. In both cases, the cross-sectional shape of the load-bearing section 211f along the axial direction D11 is as shown in Fig. Figure 7 shows a jagged shape. With respect to one of these grooves forming this jagged shape, a groove width dimension W21 in the axial direction D11 is larger than the layer thickness t11 of the intermetallic compound 15. The groove width dimension W21 is preferably larger than twice the layer thickness t11 of the intermetallic compound 15. Furthermore, a groove depth dimension W22 in the axial direction intersection D12 is larger than the layer thickness t11 of the intermetallic compound 15, and also larger than the clearance t12 between the connecting surface 111e and the coolant line 22.

[0056] Next, a second modification is explained, in which the second embodiment has been modified. In the second modification, the direction of the irregularities of the load-bearing section 211f at the connecting surface 111e was changed in the opposite direction to that of the second embodiment. The following section mainly explains these changes.

[0057] Fig. Figure 8 is a view showing a load-bearing section in the second variation with the same enlarged cross-sectional area as in Fig. 7 shows. At Fig. 8 are from the in Fig. The components shown in section 7 are identical components necessary for explanation, with the same reference symbols as in [reference number]. Fig. 7, whereby a double explanation of these identical components is omitted in the following.

[0058] In the second modification, triangular ribs are provided along the axial direction as load-bearing section 211f-1. These triangular ribs can be arranged in several rows side by side on the connecting surface 111e in the axial direction D11 of the coolant line 22, or a single triangular rib can be arranged in a spiral shape. In both cases, the cross-sectional shape of the load-bearing section 211f-1 along the axial direction D11 is as shown in Fig. Figure 8 shows a jagged shape. With respect to one of these dirt ribs forming this jagged shape, a rib width dimension W21-1 in the axial direction D11 is larger than the layer thickness t11 of the intermetallic compound 15. The rib width dimension W21-1 is preferably larger than twice the layer thickness t11 of the intermetallic compound 15. Furthermore, a rib height dimension W22-1 in the axial line intersection direction D12 is larger than the layer thickness t11 of the intermetallic compound 15, but smaller than the clearance t12 between the connecting surface 111e and the coolant line 22.

[0059] Naturally, the second embodiment and the second modification described above can produce the same effects as the first embodiment and the first modification described above. That is, the second embodiment and the second modification can also increase the connection strength of the solder joint between the stainless steel housing 111 and the main body 11 of the device, as well as the aluminum coolant line 22.

[0060] In the second embodiment and the second modification, a plurality of triangular grooves and triangular ribs are arranged side by side in the axial direction D11 of a cross-sectional surface at the connection surface 111e. By introducing the soldering material 14 into these plurality of triangular grooves and triangular ribs, the load F11 in the axial direction D11 can be absorbed even more efficiently, and the delamination of the intermetallic connection 15 can be suppressed even more effectively.

[0061] Next, a third embodiment is described. In this third embodiment, the shape of the load-bearing section also differs from that of the first embodiment. The following explanation of the third embodiment focuses on the differences from the first embodiment, omitting a description and explanation of the construction of the electric valve and the refrigeration circuit system. Furthermore, the third embodiment is also described using the first coolant line as a representative example, simply referred to as the coolant line or load-bearing section.

[0062] Fig. Figure 9 is a view showing a load-bearing section in the third embodiment with the same enlarged cross-sectional area as in Figure 9. Fig. 3 shows. At Fig. 9 are from the in Fig. The three components shown are identical components necessary for explanation, with the same reference symbols as in Fig. 3 provided, whereby a double explanation of these identical components is omitted in the following.

[0063] In the third embodiment, a load-bearing section 311f takes the form of an extra-long triangular groove with an inclined surface 311k, which is inclined (i.e. inclined to the axial line direction) towards the connecting surface 111e with a coolant line 32 at the housing 111 of the device main body 11. With regard to the load-bearing section 311f in the form of an extra-long triangular groove, the groove width dimension W31 in the axial direction D11 is greater than the layer thickness t11 of the intermetallic compound 15. The groove width dimension W31 in the axial direction D11 is preferably greater than twice the layer thickness t11 of the intermetallic compound 15. Furthermore, the groove depth dimension W32 in the axial direction intersection D12 is greater than the layer thickness t11 of the intermetallic compound 15, and also greater than the clearance t12 between the connecting surface 111e and the coolant line 32.

[0064] Next, a third modification is explained, in which the third embodiment has been modified. In the third modification, the direction of the irregularities of the load-bearing section 311f at the connecting surface 111e was changed in the opposite direction to that of the third embodiment. The following section mainly explains these changes.

[0065] Fig. Figure 10 is a view showing a load-bearing section in the third variation with the same enlarged cross-sectional area as in Fig. 9 shows. At Fig. 10 are from the in Fig. The components shown in section 9 are the same components required for explanation, with the same reference symbols as in [reference number]. Fig. 9, whereby a double explanation of these identical components is omitted in the following.

[0066] In the third modification, a load-bearing section 311f-1 projects from the connection surface 111e with the coolant line 32 as an extra-long triangular rib. With respect to the load-bearing section 311f-1 in the form of an extra-long triangular rib, a groove width dimension W31-1 in the axial direction D11 is greater than the layer thickness t11 of the intermetallic compound 15. Furthermore, a rib height dimension W32-1 in the axial line intersection direction D12 is indeed greater than the layer thickness t11 of the intermetallic compound 15, but less than the clearance t12 between the connection surface 111e and the coolant line 22.

[0067] Naturally, the third embodiment and the third modification described above can produce the same effects as the first embodiment and the first modification described above. That is, the third embodiment and the third modification can also increase the connection strength of the solder joint between the stainless steel housing 111 and the main body 11 of the device, as well as the aluminum coolant line 32.

[0068] Furthermore, according to the third embodiment and the third modification, the inclined surfaces 311k, 311k-1 in the load-bearing section 311f in the form of an extra-long triangular groove and in the load-bearing section 311f-1 in the form of an extra-long triangular rib can absorb the load F11 over a wide area in the axial direction D11. This significantly suppresses the delamination of the intermetallic connection 15, thus further increasing the strength of the solder joint.

[0069] The first to third embodiments and first to third modifications described above merely represent representative forms of the present invention, without any limitation. That is to say, an embodiment with various modifications is possible in an area that does not deviate from the essential nature of the present invention. As long as these modifications also encompass the design of the refrigerant device, the valve assembly, and the refrigeration circuit system of the present invention, they are naturally included within the scope of the present invention.

[0070] For example, in the first to third embodiments and first to third modifications described above, the electric valve 10, which is used as an expansion valve 100 in the refrigeration circuit system 1, was cited as an example of a refrigerant device and a valve device. However, the refrigerant device and the valve device are not limited to this. Regarding the valve device, there is no restriction to an electric valve as an expansion valve; it can also be various types of valve devices other than an electric valve, such as a solenoid valve or a manual valve, or various types of valve devices other than an expansion valve, such as a flow path reversing valve, a check valve, or a shut-off valve.Furthermore, there is no restriction regarding the coolant device to a valve device, but it can be various types of devices such as an accumulator, oil separator or compressor.

[0071] Furthermore, in the first to third embodiments and first to third modifications described above, the electric valve 10 was cited as an example of a coolant device and a valve assembly. This valve comprises two connecting pipes in the form of the first coolant line 12 (coolant line 22, 32) and the second coolant line 13. In the electric valve 10, first load-bearing sections 111f, 111f-1 (load-bearing sections 211f, ..., 311f-1) are formed at the connection surface 111e with the first coolant line 12 (coolant line 22, 32). Second load-bearing sections 111j, 111j-1 are also formed at the connection surfaces 111h, 111h-1 with the second coolant line 13. However, the coolant device and the valve assembly are not limited to these configurations. The number of coolant lines, such as...The connecting pipes can be adjusted as desired; furthermore, the load-bearing section described above can also be formed on only a part of the connecting surface with the coolant line, as required according to the environment in which it is used.

[0072] In the first to third embodiments and first to third modifications described above, the following load-bearing sections are given as examples. These include the first load-bearing section 111f and the load-bearing section 311f, which consist of a single groove; the serrated load-bearing section 211f, consisting of a plurality of grooves; and the second load-bearing section 111j, consisting of a C-chamfer. Furthermore, the first load-bearing section 111f-1, consisting of a single rectangular rib, and the load-bearing section 311f-1, consisting of a single triangular rib, are given as examples. Additionally, the second load-bearing section 111j-1, consisting of two triangular ribs, and the load-bearing section 211f-1, which is serrated from a plurality of triangular ribs, are given as examples.The load-bearing section is not limited to this, however, and its specific shape, etc., can be arbitrary as long as it absorbs a load in the axial direction of the coolant line. As mentioned above, a load-bearing section consisting of a groove or rib can efficiently absorb the load through a simple design.

[0073] Furthermore, in the first to third embodiments and first to third modifications described above, the first load-bearing sections 111f, 111f-1 and the second load-bearing sections 111j, 111j-1, in which the dimension in the axial direction is greater than the layer thicknesses t11, t13 of the intermetallic compound 15, were cited as examples of load-bearing sections. Other load-bearing sections 211f, 211f-1, 311f, 311f-1, in which the dimension in the axial direction is greater than the layer thicknesses t11, t13 of the intermetallic compound 15, were also cited as examples. In these load-bearing sections, the dimension in the axial line intersection direction is also greater than the layer thicknesses t11, t13 of the intermetallic compound 15.However, the load-bearing section is not limited to this, and its dimensions in the axial direction and axial line crossing direction can also be equal to or smaller than the layer thickness of the intermetallic compound. As already explained above, however, the direct action of the load loads F11, F12 on the intermetallic compound 15 can be efficiently suppressed if the dimensions in the axial direction and axial line crossing direction are larger than the layer thicknesses t11, t13 of the intermetallic compound 15. [List of reference symbols] 1 refrigeration circuit system 10 Electric Valve 11 Device main body 11a Valve chamber 11b Valve body 11c Valve seat component 12 first coolant line 13 second coolant line 14 Soldering material 15 intermetallic compound 22 Coolant line 100 Expansion valve 101 first connecting pipe 102 second connecting pipe 111 Housings 111-1 Valve main body 111-2 Housing 111a Floor wall section 111b Surrounding wall section 111c Floor wall through hole 111d Conduit intake tube 111e, 111h, 111h-1 Connecting surface 111f, 111f-1 first load-bearing section 111g ambient wall through hole 111j, 111j-1 second load-bearing section 200 Heat exchanger outdoor unit 211f, 211f-1, 311f, 311f-1 load bearing section 300 Heat exchanger indoor unit 311k, 311k-1 inclined surface 400 Flow path switching valve 500 compressor t11, t13 layer thickness t12, t14, t14-1 game D11, D13 Axial line direction D12, D14 Axial line intersection direction F11, F12 load load W11, W21, W31 groove width dimension W11-1, W13-1, W21-1, W31-1 Rib width dimension W12, W22, W32 Groove depth dimension W12-1, W14-1, W22-1, W32-1 Rib height dimension W13, W14 chamfer dimension X Axial line

Claims

A refrigerant device forming a refrigeration circuit suitable for circulating a refrigerant, comprising a device body (11) and an aluminum refrigerant line (12, 13) connectable to the device body (11), wherein at least the section of the device body (11) to which the refrigerant line can be connected is made of stainless steel, and at this section the device body (11) and the refrigerant line (12, 13) are joined by soldering to form a material bond, and at the connection surface (111e, 111h, 111h-1) of the device body (11) a load-bearing section (111f, 111f-1) is provided, intersecting the axial direction (D11, D13) of the refrigerant line (12, 13) and suitable for absorbing a load in the axial direction (D11, D13), wherein the load is thereby It is possible to capture the load-bearing section (111f, 111f-1) by means of a starting from the connecting surface (111e, 111h,111h-1) of the main body of the device (11) a recessed groove is formed and the solder material is arranged on the inside. Coolant device according to claim 1, characterized in that several grooves are provided next to each other in the axial direction (D11, D13), or it is a section in which the groove is provided in a spiral shape. Coolant device according to claim 1 or 2, characterized in that the load-bearing section (111f, 111f-1) has an inclined surface (311k, 311k-1) inclined to the axial line direction (D11, D13). Coolant device according to one of claims 1 to 3, characterized in that the dimension of the load-bearing section (111f, 111f-1) in the axial line direction (D11, D13) is larger than the layer thickness (t11, t13) of the intermetallic connection between the connection surface and the soldering material. Coolant device according to one of claims 1 to 4, characterized in that the dimension of the load-bearing section (111f, 111f-1) in an axial line crossing direction (D12, D14) crossing the axial line direction is larger than the layer thickness (t11, t13) of the intermetallic connection between the connection surface and the solder material. Valve device, which is a coolant device according to one of claims 1 to 5, characterized in that the device main body (11) is a valve body (11b) which forms a valve chamber (11a) inside. Refrigeration circuit system (1), characterized in that it comprises a refrigerant device according to one of claims 1 to 5.

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