LIQUID COOLING HEAT DISPENSING DEVICES

Abstract

An integrated liquid cooling heat dissipation device comprises a liquid cooling radiator (100) with a first and a second liquid reservoir (20) and a heat dissipation pipe assembly (30), a liquid cooling head (200), and a liquid pump (300). The first liquid reservoir (10) forms an upper reservoir body part (111) and a lower reservoir body part (112), which is combined with the heat dissipation pipe assembly (30) such that the liquid collection space in the first liquid reservoir (10) is modified below the first liquid reservoir (10), thereby reducing the height of the upper reservoir body part (111).The upper container body part (111) and the second liquid container (20) protrude from the front and rear of the heat dissipation tube set (30) and form a fan installation space (40) at the front and rear of the liquid cooling radiator (100), so that the fan (400) can supply air to the heat dissipation tube set (30) and the lower container body part (112) simultaneously to dissipate the heat.

Description

BACKGROUND OF THE INVENTION (a) Field of invention The present invention relates to the technology of liquid cooling heat dissipation devices and in particular to a liquid cooling heat dissipation device that can reduce the height and increase the internal working fluid capacity of the liquid cooling chiller. (b) Description of the state of the art The known liquid cooling heat dissipation devices used in computers and servers are typically separate liquid cooling heat dissipation systems, featuring separate liquid cooling radiators, liquid cooling heads, and liquid pumps, connected between the individual units by numerous liquid lines. The liquid cooler or radiators and the liquid cooling head of the separate liquid cooling heat dissipation device are isolated, resulting in a structure that is not sufficiently compact, installation that is inconvenient, and slow coolant flow. For these reasons, the inventor has already proposed an integrated liquid cooling heat dissipation device (Taiwan patent publication TW I765680 B) to address the shortcomings of the conventional separate liquid cooling heat dissipation device. However, when the integrated liquid cooling heat dissipation device is installed, the liquid cooling head must be attached to the underside of the liquid cooling radiator on the surface of the processor chip, causing the liquid cooling radiator to stand upright on the processor chip. This easily leads to the problem of insufficient space within the computer case. Therefore, the main problem of the present invention is how to reduce the height and volume of the integrated liquid cooling heat dissipation device while simultaneously increasing the capacity of the internal working fluid. Furthermore, the interior of the fluid reservoir at one end of the liquid cooling radiator in conventional integrated liquid cooling heat dissipation devices is divided into a chamber for cold fluid and a chamber for hot fluid.When the liquid flowing through the liquid cooling head absorbs heat and becomes hot, and flows into the hot liquid chamber, it conducts heat through the metal partition to the cold liquid in the adjacent cold liquid chamber, causing the cold liquid that is supposed to flow into the liquid cooling head to be abnormally heated first, thus impairing the cooling effect after it flows into the liquid cooling head. The other publications DE 10 2021 110 297 A1 , US 2018 / 0 195 804 A1 , US 2006 / 0 185 378 A1 , US 2019 / 0 090 384 A1 disclose cooling devices located in the territory of the application. The object of the invention is to provide an optimized separate cooling system that overcomes the aforementioned disadvantages of the prior art and reduces abnormal heating. OVERVIEW OF THE INVENTION A principal purpose of the present invention is to provide an integrated liquid cooling heat dissipation device comprising a liquid cooling chiller with a first liquid reservoir, a second liquid reservoir, and a heat dissipation pipe assembly connecting the first and second liquid reservoirs at both ends, a liquid cooling head assembly at the bottom of the second liquid reservoir, and a liquid pump in the first liquid reservoir. The first liquid reservoir forms an upper reservoir body part and a lower reservoir body part extending downwards from the lower end of the upper reservoir body part.The lower end of the lower container body part is combined with the upper end of the heat dissipation pipe set, so that the liquid collection space in the first liquid container below the first liquid container is changed, thereby reducing the height of the upper container body part, which makes it easier to install the integrated liquid cooling heat dissipation device in the computer case. A further objective of the present invention is to provide a liquid cooling heat dissipation device in which the front and rear ends of the upper container body and the second liquid container project from the front and rear of the heat dissipation pipe assembly, which can increase the capacity of the working fluid and form a concave fan installation space at the front and rear of the liquid cooling radiator, so that a fan can be installed in each fan installation space to supply air to the heat dissipation pipe assembly and the lower container body part while simultaneously dissipating heat. A further objective of the present invention is to provide a liquid cooling heat dissipation device in which the second liquid reservoir of the liquid cooling radiator is separated into a cold liquid chamber and a hot liquid chamber by an air-insulated space. Due to the low thermal conductivity of the air in the air-insulated space, the hot working fluid in the hot liquid chamber cannot transfer heat to the cold working fluid in the cold liquid chamber. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a three-dimensional schematic representation of the integrated liquid cooling heat dissipation device of the present invention. Fig. 2 is a schematic front view of the integrated liquid cooling heat dissipation device of the present invention. Fig. 3 is a schematic exploded view of the integrated liquid cooling heat dissipation device of the present invention. Fig. 4 is a schematic exploded view of the first liquid reservoir and the heat dissipation pipe assembly of the present invention. Fig. 5 is a schematic exploded view of the first liquid reservoirs of the present invention. Fig. 6 is a schematic exploded view of the second liquid reservoir and the heat dissipation pipe assembly of the present invention. Fig. 7 is a schematic exploded view of the second liquid reservoir of the present invention.Figure 8 is a schematic front view of the integrated liquid cooling heat dissipation device of the present invention. Figure 9 is a schematic cross-sectional side view of the integrated liquid cooling heat dissipation device of the present invention. Figure 10 is a schematic diagram of adding fans to the integrated liquid cooling heat dissipation device of the present invention. Figure 11 is an exploded view of the fans installed in the integrated liquid cooling heat dissipation device of the present invention. DETAILED DESCRIPTION OF PREFERRED EXECUTION FORMS According to Figures 1 and 2, the present invention relates to an integrated liquid cooling heat dissipation device, which in its preferred embodiment comprises a liquid cooling radiator 100, a liquid cooling head 200, and a liquid pump 300. The liquid cooling radiator 100 comprises a first liquid reservoir 10, a second liquid reservoir 20, and a heat dissipation pipe assembly 30. The first liquid reservoir 10 and the second liquid reservoir 20 are housings made of heat-dissipating metal (e.g., an aluminum alloy) and serve to introduce working fluid (water or other cooling fluids) into the first liquid reservoir 10 and the second liquid reservoir 20. The heat dissipation pipe assembly 30 consists of several first tubes 31 and several second tubes 32, which are arranged parallel at intervals, as well as several cooling fins 33.The first tubes 31 and the second tubes 32 are flat metal tubes, both ends of which are connected to and in contact with the first liquid reservoir 10 and the second liquid reservoir 20, respectively. The cooling fins 33 are located outside the first tubes 31 and the second tubes 32. One side of the liquid cooling head 200 is connected to the outside of the bottom wall of the second liquid reservoir 20, and the other side of the liquid cooling head 200 is used for attachment to a processor chip (not shown). The liquid pump 300 is inserted into the first liquid reservoir 10 to circulate the working fluid in the liquid cooler, so that it circulates sequentially between the first liquid reservoir 10, the first tubes 31, the second liquid reservoir 20, the liquid cooling head 200, the second tubes 32, and back to the first liquid reservoir 10. With reference to Figures 3, 4, and 5, the first liquid reservoir 10 above the liquid cooling radiator 100 is preferably configured with a first reservoir body 11, a first reservoir lid 12, and a first partition 13. The first reservoir body 11 is formed integrally from a rectangular upper reservoir body part 111 and a lower reservoir body part 112. The upper reservoir body part 111 has a thickness L1 and a width W1 that is greater than that of the lower reservoir body part 112. The upper end of the upper reservoir body part 111 is recessed to form a first upper chamber 113. The lower container body part 112 projects downwards from the lower end of the upper container body part 111, so that the upper container body part 111 and the lower container body part 112 of the first container body 11 form a T-shaped container body in the side view (as shown in Fig. 9).Simultaneously, the bottom surface of the first upper chamber 113 forms a first lower chamber 114, which is recessed into the lower part of the container body, so that the first upper chamber 113 and the first lower chamber 114 form a T-shaped chamber in the internal view (as shown in Fig. 9). The lower wall of the lower container body 112 is provided with a plurality of first pipe bushings 115, which are connected to the first lower chamber 114, so that the upper ends of the first pipes 31 and the second pipes 32 of the heat dissipation pipe assembly 30 are each inserted into the first pipe bushings 115 (as shown in Fig. 8). The first container lid 12 covers the upper end of the upper part of the container body 111 to close the first upper chamber 113.The first partition 13 is arranged transversely in the first upper chamber 113 and the first lower chamber 114 to divide the first upper chamber 113 and the first lower chamber 114 into a liquid inlet chamber 116 and a liquid outlet chamber 117, such that the upper ends of the first pipes 31 are connected to the liquid outlet chamber 117, and the upper ends of the second pipes 32 are connected to the liquid inlet chamber 116. The aforementioned liquid pump 300 is combined with the first container lid 12 and arranged in the liquid inlet chamber 116. The preferred embodiment of the second liquid reservoir 20 below the liquid cooler 100 has a second reservoir body 21 and a second reservoir lid 22 (see Fig. 6, Fig. 7 and Fig. 8). The upper end of the second reservoir body 21 is recessed to form a second chamber 23. The second chamber 23 is divided into a chamber for cold liquid 24 and a chamber for hot liquid 25. The bottom wall of the second reservoir body 21 is connected to the aforementioned liquid cooling head 200. The chamber for cold liquid 24 and the chamber for hot liquid 25 are each connected to the liquid cooling head 200. The second reservoir lid 22 covers the upper end of the second reservoir body 21 to close the second chamber 23. The upper wall of the second container lid 22 is provided with a plurality of second pipe nozzles 26 which are connected to the cold liquid chamber 24 and the hot liquid chamber 25.The lower ends of the aforementioned first tubes 31 and second tubes 32 are each inserted into the second tube nozzles 26 (as shown in Fig. 8), so that the lower ends of the first tubes 31 are connected to the cold liquid chamber 24 and the lower ends of the second tubes 32 are connected to the hot liquid chamber 25. By structurally designing the upper container body part 111 and the lower container body part 112 of the first liquid container 10, the present invention enables the implementation of the first liquid container 10 with a structure in which the upper container body part 111 has a lower height and the lower container body part 112 projects downwards from the bottom of the upper container body part 111, so that only the upper container body part 111, with its lower height, remains on the heat dissipation tube assembly 30 (and the fans described below) in the space in which the lower container body part 112 extends downwards towards the heat dissipation tube assembly 30. Therefore, the height volume of the liquid cooling radiator 100 can be reduced, allowing it to be installed and used in a smaller computer case. As shown in Fig.As shown in Fig. 9, the front and rear ends of the upper container body part 111 of the first liquid container 10 and the front and rear ends of the second liquid container 20 project from the front and rear of the heat dissipation tube set 30, respectively, so that the liquid cooling radiator 100 can hold more working fluid (water, etc.) without increasing the height of the liquid cooling radiator 100, and a concave fan installation space 40 can be formed at the front and rear of the liquid cooling radiator 100 to accommodate a fan 400 (as shown in Fig. 10 and Fig. 11). Referring again to Figs. 4, 5, and 8, the inner surface of the first container lid 12 of the aforementioned first liquid container 10 has a liquid pump seat 121 that projects into the first container body 11. The liquid pump seat 121 is cylindrical. On the outside of the first container lid 12, there is a recess with a liquid pump cavity 122 that extends to the liquid pump seat 121. In this way, the liquid pump 300 is loaded from the outside of the first container lid 12 into the liquid pump cavity 122. The end face of the liquid pump seat 121 is provided with a liquid inlet opening 123, which is connected to the liquid pump cavity 122 and the liquid inlet chamber 116.One side of the liquid pump seat 121 is provided with a projection 124, and the projection 124 is also provided with a liquid outlet opening 125, which connects the liquid pump cavity 122 and the liquid outlet chamber 117. The aforementioned first partition 13 is designed as a T-shaped plate, and its upper edge is provided with a slot 131 that corresponds to the contour of the projection 124. The slot 131 is in close contact with the circumferential surface of the projection 124, and the other edges of the first partition 13 are in close contact with the inner walls of the first upper chamber 113 and the first lower chamber 114.When the liquid pump 300 is in operation, the working fluid of the liquid inlet chamber 116 can be drawn in from the liquid inlet port 123 and then transported from the liquid outlet port 125 to the liquid outlet chamber 117, so that the working fluid circulates continuously in the liquid cooling radiator 100 and the circulating working fluid flow passes through the liquid cooling head 200 to cool the processor chip, and then dissipates the heat through the heat dissipation tube set 30. Referring again to Figs. 4, 5, and 8, to increase the structural strength of the first liquid container 10, the bottom wall of the upper container body part 111 of the first container body 11 is provided with a plurality of first ribs 118 projecting into the first upper chamber 113, and the upper wall of the first container lid 12 is provided with a plurality of second ribs 126 projecting into the first upper chamber 113. Furthermore, the upper wall of the first container lid 12 is provided with a liquid injection port 127 connected to the first upper chamber 113, and a removable sealing element 128 (e.g., a sealing screw, etc.) is combined with the liquid injection port 127. Referring to Figures 7 and 8, the present invention provides an air-insulating chamber 27 in the second chamber 23 of the second vessel body 21 to prevent heat transfer from the hot working fluid, which flows into the hot liquid chamber 25 of the second vessel body 21 through the liquid cooling head 200 into the adjacent cold liquid chamber 24. The air-insulating chamber 27 consists of a partition 271 for hot fluid and a partition 272 for cold fluid, which are arranged in the second chamber 23 and separated by a gap. The second chamber 23 is divided by the air-insulating chamber 27 into the cold liquid chamber 24 and the hot liquid chamber 25. The lower housing wall of the cold liquid chamber 24 is provided with a cold liquid inlet 241, through which the cold working medium flows from the cold liquid chamber 24 to the liquid cooling head 200.The lower housing wall of the hot liquid chamber 25 is provided with a hot liquid outlet 251 to return the hot working fluid from the liquid cooling head 200 to the hot liquid chamber 25. The second vessel body 21 is preferably designed as a square pyramid with a wider upper end and a narrower lower end, and the second chamber 23 is a conical chamber corresponding to the square pyramid. Referring again to Figures 10 and 11, the preferred embodiment of the liquid cooling radiator 100 of the present invention further comprises two fan mounts 50. The two fan mounts 50 are combined on both sides of the heat dissipation tube assembly 30, so that one or two fans 400 can be placed in the fan mounting space 40 at the front and rear of the liquid cooling radiator 100, and the fans 400 can each be secured in the two fan mounts 50. When the fans 400 are running to expel air, they can blow not only towards the heat dissipation tube assembly 30, but also towards the lower part of the reservoir body 112, which projects downwards towards the heat dissipation tube assembly 30, in order to improve the heat dissipation efficiency of the present invention. Although a particular embodiment of the invention has been described in detail for illustrative purposes, various modifications and improvements can be made without departing from the spirit and scope of the invention. Accordingly, the invention is not intended to be limited, except by the attached claims.

Claims

Integrated liquid cooling heat dissipation device comprising a liquid cooling radiator (100), a liquid cooling head (200), and a liquid pump (300), wherein the liquid cooling radiator (100) comprises a first liquid reservoir (10), a second liquid reservoir (20), and a heat dissipation tube assembly (30), wherein the heat dissipation tube assembly (30) comprises a plurality of first tubes (31), a plurality of second tubes (32), and a plurality of cooling fins (33), wherein the first tubes (31) and the second tubes (32) are flat metal tubes, the respective two opposite ends of which are connected to the first liquid reservoir (10) and the second liquid reservoir (20), respectively, wherein the cooling fins (33) are arranged outside the first tubes (31) and the second tubes (32), and wherein the liquid cooling head (200) has one side outside is connected to a bottom wall of the second liquid container (20),wherein the liquid pump (300) is arranged in the first liquid container (10), wherein: the first liquid container (10) comprises a first container body (11), a first container lid (12) and a first partition (13), wherein the first container body (11) is formed integrally into an upper container body part (111) and a lower container body part (112), wherein the upper container body part (111) has a thickness (L1) and a width (W1) that are greater than those of the lower container body part (112), wherein an upper end of the upper container body part (111) is recessed into a first upper chamber (113), wherein the lower container body part (112) projects downwards beyond a lower end of the upper container body part (111), wherein the first upper chamber (113) has a bottom surface that forms a first lower chamber (114) and is recessed into the lower container body part (112). is, wherein the lower container body part (112) has a bottom wall,the first container (114) is provided with a plurality of first pipe connections (115) connected to the first lower chamber (114), the first container lid (12) covering the upper end of the upper container body part (111), the first partition (13) being inserted into the first upper chamber (113) and the first lower chamber (114) to divide the first upper chamber (113) and the first lower chamber (114) into a liquid inlet chamber (116) and a liquid outlet chamber (117); the second liquid container (20) comprising a second container body (21) and a second container lid (22), the upper end of the second container body (21) being recessed into a second chamber (23), the second chamber (23) being divided into a cold liquid chamber (24) and a hot liquid chamber (25), the cold liquid chamber (24) and the hot liquid chamber (25) each being connected with are connected to the liquid cooling head (200),wherein the second container lid (22) covers the upper end of the second container body (21), wherein an upper wall of the second container lid (22) is provided with a plurality of second pipe connections (26) which are connected to the cold liquid chamber (24) and the hot liquid chamber (25), the first pipes (31) and the second pipes (32) are inserted with their respective upper ends into the first pipe receptacles (115) and with their respective opposite lower ends into the second pipe receptacles (26); the upper container body part (111) of the first liquid container (10) and the second liquid container (20) each have a front and a rear end which project from the opposite front and rear of the heat dissipation pipe assembly (30), respectively, so that a concave fan installation space (40) is formed at the front and rear of the liquid cooling radiator (100), respectively. The integrated liquid cooling heat dissipation device according to claim 1, wherein the upper container body part (111) and the lower container body part (112) of the first container body (11) form a T-shaped container body in the side view; the first upper chamber (113) and the first lower chamber (114) form a T-shaped chamber in the side view part. The integrated liquid cooling heat dissipation device according to claim 2, wherein the first container lid (12) has a liquid pump seat (121) located on an inner surface of the same and projecting into the first container body (11); wherein an outer wall of the first container lid (12) is recessed with a liquid pump cavity (122) extending to the liquid pump seat (121), and wherein the liquid pump (300) is loaded into the liquid pump cavity (122) from the outside of the first container lid (12). The integrated liquid cooling heat dissipation device according to claim 3, wherein the liquid pump seat (121) comprises a liquid inlet hole (123) located on one of its end faces and connected to the liquid pump cavity (122) and the liquid inlet chamber (116), and a projection (124) located on one of its side walls and connected to the liquid pump cavity (122) and the liquid outlet chamber (117), wherein the projection (124) is provided with a liquid outlet hole (125) connecting the liquid pump cavity (122) and the liquid outlet chamber (117); the first partition (13) is provided with a gap (131) that corresponds to the contour of the projection (124) and is closely connected to the surrounding surface of the projection (124). The integrated liquid cooling heat dissipation device according to claim 4, wherein the upper container body part (111) comprises at least one first rib (118) located on a bottom wall of the same and projecting into the first upper chamber (113); the first housing cover (12) comprises at least one second rib (126) located on an upper wall of the same and projecting into the first upper chamber (113). The integrated liquid cooling heat dissipation device according to one of claims 1 to 5, wherein the first container lid (12) comprises a liquid injection hole (127) located on an upper wall thereof and connected to the first upper chamber (113), and a sealing element (128) removablely inserted into the liquid injection hole (127). The integrated liquid cooling heat dissipation device according to any one of claims 1 to 6, wherein the second container body (21) has an air-insulated space (27) arranged in the second chamber (23), wherein the air-insulated space (27) consists of a partition (271) for hot liquid and a partition (272) for cold liquid, which are arranged in the second chamber (23) and separated by a gap, wherein the air-insulated space (27) divides the second chamber (23) into the chamber (24) for cold liquid and the chamber (25) for hot liquid, wherein the cold liquid chamber (24) has a lower housing wall provided with a cold liquid inlet (241) so that a working liquid can flow from the cold liquid chamber (24) to the liquid cooling head (200), wherein the hot liquid chamber (25) has a lower housing wall provided with a is equipped with a hot liquid outlet (251),so that the working fluid can flow from the liquid cooling head (200) back to the hot liquid chamber (25). The integrated liquid cooling heat dissipation device according to claim 7, wherein the second container body (21) is a square pyramid with a wider upper end and a narrower lower end in a front face thereof; the second chamber (23) is a conical chamber corresponding to the square pyramid. The integrated liquid cooling heat dissipation device according to one of claims 1 to 8, which further comprises two fan mounts (50) each combined on two opposite sides of the heat dissipation tube sets (30). The integrated liquid cooling heat dissipation device according to claim 9, which further comprises at least one fan (400) arranged in the fan installation space (40) and attached to the two fan mounts (50).

Images