Soldering iron attachment

Abstract

comprising soldering iron device (100) • a contact element (10), • a mounting element (20), and • a connecting screw (30), • wherein the contact element (10) has a contact tip (11) and is configured to release heat for a soldering process by means of the contact tip (11), • wherein the retaining element (20) has a receptacle (21) for the contact element (10) and the contact element (10) has a counter surface (12) corresponding to the receptacle (21), • wherein the receptacle (21) has a toothed section (22), • wherein at least the toothing (22) of the receptacle (21) of the retaining element (20) has a greater strength than the contact element (10), and • wherein the contact element (10) and the retaining element (20) are pressed together by means of the connecting screw (30), wherein the toothing (22) of the receptacle (21) is pressed into the counter surface (12).

Description

[0001] The invention relates to a soldering iron device.

[0002] Soldering irons have a contact element suitable for heating a soldering medium or the solder joint. This contact element can be heated in various ways. One method is to direct a gas jet generated by combustion onto the contact element. The gas transfers the heat it gains from combustion to the contact element upon contact. For the contact element to heat the soldering medium or the solder joint, precise positioning of the contact element relative to both the soldering medium and the gas source is crucial. To ensure this precise positioning, the contact element is attached to a holder. For example, German patent DE 16 01 907 U discloses a soldering iron device in which the contact element is attached to the gas nozzle via a rod-shaped holder.

[0003] The contact element and the holder are held together by a retaining pin. Despite the pin, the expansion of the contact element during heating and its contraction after use create play between the contact element and the holder. This play allows for relative movement between the contact element and the holder. Such play reduces the precision of the soldering iron, diminishes the quality of the work performed with it, and increases the maintenance required.

[0004] Document EP 2 653 255 A1 discloses a soldering iron with an interchangeable tip. The tip is rotatable, allowing retaining elements to rotate between a position holding the tip and a position releasing the tip. Document CN 1 07 598 320 A also discloses a soldering iron device with an interchangeable tip.

[0005] The purpose of the invention is to ensure the precision of a soldering iron device throughout its lifetime.

[0006] This problem is solved by a soldering iron device according to claim 1. The soldering iron device according to the invention minimizes the risk of the connection between a contact element and a mounting element loosening over the number of heating cycles of the contact element. This reduces the play between the contact element and the mounting element that increases with the number of heating cycles. This ensures that the precision of the soldering iron device is maintained throughout its service life and reduces the maintenance required for the soldering iron device.

[0007] The soldering iron device comprises a contact element, a mounting element, and a connecting screw. The contact element has a contact tip. The contact element is designed to transfer heat for soldering via the contact tip. To be heated, the contact element can be connected to a torch or other heat source via the mounting element, the mounting element preferably having a rod-shaped section. The rod-shaped section serves to attach and hold the contact element to the torch or heat source. In particular, an open design is provided in which the heat transfer path between the heat source and the contact element is not encapsulated.

[0008] The mounting element has a receptacle for the contact element. The contact element has a mating surface corresponding to the receptacle. The receptacle has serrations. At least the serrations of the mounting element's receptacle have greater strength than those of the contact element. The contact element and the mounting element are pressed together by means of the connecting screw. The serrations of the receptacle are pressed into the mating surface.

[0009] The contact surface is not solely a two-dimensional, flat surface, but also extends into the material of the contact element. At least, the mating surface of the contact element reaches into the contact element to the same depth as the toothing presses into it when the contact element is screwed in place. The toothing of the mounting element can have either tapered teeth or teeth with rounded tips resembling a sine wave.

[0010] When the contact element and the mounting element are screwed together, the teeth of the receptacle are pressed into the mating surface. In doing so, the teeth displace a portion of the contact element's material on the mating surface. This creates a mating tooth profile on the mating surface, which precisely matches the teeth of the receptacle. This precise engagement of the mating teeth and the teeth prevents any relative movement between the contact element and the mounting element.

[0011] The dependent claims describe preferred embodiments of the invention.

[0012] Preferably, the toothing of the receptacle is rotationally symmetrical and / or rotationally symmetrical. The toothing has a first axis of symmetry. A particularly preferred configuration is a frustoconical toothing. An advantage of this embodiment can be that, with a rotationally symmetrical and / or rotationally symmetrical toothing, a symmetrical engagement of the toothing in the mating surface is achieved, thus resulting in a uniform distribution of force transmission between the mounting element and the contact element. Furthermore, a frustoconical toothing facilitates the positioning of the contact element relative to the mounting element.An object is considered rotationally symmetric if it is mapped onto itself at any angle of rotation, and is considered rotationally symmetric if it is mapped back onto itself when rotated by a fixed angle of rotation less than 360°.

[0013] Preferably, the toothing of the receptacle is arranged on the inside of a recess in the mounting element. Thus, the root of the toothing is located further from the first axis of symmetry than the head of the toothing. An advantage of this embodiment can be that the toothing is better protected from environmental influences, such as contamination, than if the toothing were arranged on the outside of the mounting element.

[0014] Preferably, a second axis of symmetry of the connecting screw corresponds to the first axis of symmetry of the teeth of the receptacle. The connecting screw passes through the receptacle. The diameter of the tooth's tip circle is larger than the outer diameter of the screw's bolt. An advantage of this embodiment can be that a more compact design of the soldering iron device is achieved. Furthermore, an advantage of this embodiment can be that the teeth are subjected to symmetrical force when the contact element is screwed to the mounting element. This reduces asymmetrical distortion of the contact element and the mounting element.

[0015] Preferably, the mating surface is rotationally symmetric and / or rotationally symmetric. An advantage of this embodiment can be the reduced manufacturing effort required for a rotationally symmetric and / or rotationally symmetric mating surface.

[0016] Preferably, the contact element has a guide pin and the mounting element a corresponding guide bore. The guide bore is designed to guide the guide pin along a joining direction. An advantage of this embodiment can be that, by means of the guide pin and the guide bore, relative movement of the contact element to the mounting element is restricted or completely prevented even before initial contact between the toothing and the mating surface. This simplifies the joining of the contact element and the mounting element.

[0017] Preferably, the guide bore connects to the receptacle along the joining direction. The guide pin connects to the mating surface along the joining direction. An advantage of this embodiment can be that the soldering iron device is designed to be as compact as possible.

[0018] Preferably, the guide pin is rotationally symmetrical and / or torsionally symmetrical, in particular cylindrical. The guide pin has a first diameter. The mating surface is rotationally symmetrical and / or torsionally symmetrical, in particular cylindrical. The mating surface has a second diameter. The first diameter is equal to or smaller than a third diameter, which corresponds to the smallest diameter of the teeth of the receptacle. This allows for simple manufacturing of the guide pin and the mating surface.

[0019] Particularly preferred is a first partial surface of the mating surface oriented perpendicular to the joining direction. A second partial surface of the mating surface is oriented parallel to the joining direction. An advantage of this embodiment can be that this arrangement of the first and second partial surfaces of the mating surface allows for the press-fitting of different tooth profiles, since a section of either the first or second partial surface is always aligned with the tooth profile. Because the first diameter is smaller than the second diameter, the tooth profile can be brought into contact with the mating surface without damaging the guide pin.

[0020] Particularly preferred are the guide pin and / or the mating surface designed as cylindrical base bodies with flattened sections, especially rotationally symmetrical flattened sections of the base body. Here, the first diameter always represents the greatest distance between two points on the surface of the guide pin in a plane perpendicular to the third axis of symmetry. The second diameter always represents the greatest distance between two points on the mating surface in a plane perpendicular to the fourth axis of symmetry. An advantage of this embodiment can be that the flattened sections of the cylindrical base bodies of the guide pin and the mating surface allow for particularly easy insertion of the guide pin into the mounting element.

[0021] Preferably, the contact element has a better thermal conductivity than the mounting element. In particular, the contact element is made of copper or a copper alloy. An advantage of this embodiment can be that rapid heating and cooling of the contact element can be achieved without increasing the clearance between the mounting and the contact element. Furthermore, the mounting element can be selected from a material with properties that are better suited to the function of the mounting element, such as a material with higher strength or lower material costs.

[0022] Preferably, the contact element has a recess. The recess is designed to absorb heat from a gas stream. Preferably, the recess is configured as a blind hole and is designed to receive the gas stream. An advantage of this embodiment can be that the recess increases the surface area for contact and thus for heat transfer between the gas stream and the contact element. This allows for particularly efficient heat transfer between the heating gas and the contact element.

[0023] Preferably, the toothing of the receptacle has a plurality of equally pronounced teeth. An advantage of this embodiment can be that pressing the toothing of the receptacle into the mating surface results in a uniform force distribution in the retaining element and the contact element during the pressing-in process. Consequently, distortion of both the contact element and the retaining element is prevented.

[0024] Preferably, the toothing is arranged on an outer surface of the mounting element. An advantage of this embodiment can be the simple manufacturing of the toothing.

[0025] Preferably, the first diameter of the guide pin is smaller than the diameter of the tip circle of the toothing if the toothing is arranged on the inside of the recess of the retaining element.

[0026] Further details, advantages and features of the present invention will become apparent from the following description of exemplary embodiments with reference to the drawing. It shows: Fig. 1 a schematic representation of a cross-section of a non-assembled soldering iron device according to an embodiment of the invention, and Fig. 2 A schematic representation of the assembled soldering iron device according to the embodiment of the invention.

[0027] Fig. Figure 1 shows a schematic representation of a cross-section of a non-assembled soldering iron device 100 according to an embodiment of the invention.

[0028] The soldering iron device 100 comprises a contact element 10, a mounting element 20, and a connecting screw 30. The contact element 10 has a contact tip 11. The contact element 10 is configured to transfer heat for a soldering operation via the contact tip 11. The mounting element 20 has a receptacle 21 for the contact element 10. The contact element 10 has a mating surface 12 corresponding to the receptacle 21. The receptacle 21 has a toothed section 22. At least the toothed section 22 of the receptacle 21 of the mounting element 20 has a greater strength than the contact element 10. The contact element 10 and the mounting element 20 are pressed together by means of the connecting screw 30. The toothed section 22 of the receptacle 21 is pressed into the mating surface 12.

[0029] The toothing 22 of the receptacle 21 is arranged on an inner surface 23a of a recess 23 of the mounting element 20. The toothing 22 of the receptacle 21 is frustoconical. The toothing 22 has a first axis of symmetry 22a. A second axis of symmetry 30a of the connecting screw 30 corresponds to the first axis of symmetry of the toothing 22 of the receptacle 21. The connecting screw 30 passes through the receptacle 21. For this purpose, a through-hole 25 is provided in the mounting element 20, which is wider than the bolt of the connecting screw 30 and narrower than the head of the connecting screw 30. This prevents the screw from slipping through the through-hole 25.

[0030] The contact element 10 has a guide pin 13, and the mounting element 20 has a corresponding guide bore 24. The guide bore 24 is configured to guide the guide pin 13 along a joining direction 40. The guide bore 24 connects to the receptacle 21 along the joining direction 40. The guide pin 13 connects to the mating surface 12 along the joining direction 40. The through-hole 25 connects to the guide bore 24 along the joining direction 40.

[0031] The guide pin 13 is designed as a rotationally symmetric cylindrical body with flattened sections. The guide pin 13 has a first diameter 13a. The guide pin 13 has an internal thread 15 for receiving the connecting screw 30 21. The mating surface 12 is designed as a rotationally symmetric cylindrical body with flattened sections. The mating surface 12 has a second diameter 12c. The first diameter corresponds to a third diameter (22b), which corresponds to the smallest diameter of the toothing 22 of the receptacle 21. A first partial surface 12a of the mating surface 12 is oriented perpendicular to the joining direction 40. A second partial surface 12b of the mating surface 12 is oriented parallel to the joining direction 40. Here, the first diameter 13a always represents the greatest distance between two points on the surface of the guide pin 13 in a plane that is oriented perpendicular to the third axis of symmetry 13b.The second diameter 12c always represents the greatest distance between two points on the opposite surface 13d in a plane that is normal to the fourth axis of symmetry 12d.

[0032] A contact surface 14 adjoins the counter surface 12 and is oriented perpendicular to the joining direction 40. The retaining element 20 can be positioned on the contact element 10 until an end face 26 of the retaining element 20, on which the recess 23 is located, rests on the contact surface 14.

[0033] The contact element 10 has a better thermal conductivity than the mounting element 20. The contact element 10 has a recess 16. The recess 16 is designed to absorb heat. The recess 16 is configured as three bores. The mounting element 20 has a mounting rod 27, which can be attached to a gas soldering iron or burner (not shown) to generate heat.

[0034] If the contact element 10 and the mounting element 20 are not yet screwed together, the mating surface 12 has a smooth shape. For proper assembly of the soldering iron device 100, the contact element 10 is first guided in the joining direction 40 towards the mounting element 20 until the guide pin 13 tapers to a point at the guide bore 24. This process is aided by the frustoconical shape of the teeth 22 of the receptacle 21. The connecting screw 30 is then inserted through the through-hole 25 of the contact element 10, through the guide bore 24, and into the internal thread 15. Screwing the connecting screw 30 into the internal thread 15 joins the contact element 10 and the mounting element 20 together. In this process, the toothing 22 presses into the counter surface 12 and deforms the contact element 10 on the counter surface 12, so that a counter toothing corresponding to the toothing 22 is formed on the counter surface 12.This results in a precisely fitting interlocking shape of the contact element 10 and the mating surface, thus preventing rotation of the contact element 10 relative to the mounting element 20 about the first axis of symmetry 22a when the contact element 10 is unheated. When the contact element 10 is heated, its material expands more than that of the mounting element 20. In conjunction with the screw connection of the contact element 10 to the mounting element 20 by means of the connecting screw 30, the interlocking interlocking further prevents rotation of the contact element 10 relative to the mounting element 20 about the first axis of symmetry 22a.

[0035] Fig.Figure 2 shows a schematic representation of the assembled soldering iron device 100 according to the embodiment of the invention. The recesses 16 of the contact element 10 are designed as blind holes and are configured to receive a heat flow from a gas stream. The recesses increase the surface area that absorbs the heat energy of the gas stream. This improves heat transfer from the gas to the contact element 10. The mounting element 20 is screwed firmly onto the contact element 10, so that the end face 26 of the mounting element 20 rests on the support surface 14. The contact element 10 has a grip structure 17 for improved handling.

[0036] In addition to the above written description of the invention, explicit reference is hereby made to the graphic representation of the invention in the figures for its supplementary disclosure. Reference symbol list 10 contact elements 11 Contact tip 12 Opposite surface 12a first sub-area 12b second sub-area 12c second diameter 12d fourth axis of symmetry 13 guide pins 13a first diameter 13b third axis of symmetry 14 contact surfaces 15 internal threads 16 Exclusion 16a Receiving borehole 17 Handle structure 20 mounting elements 21 recording 22 gearing 22a first axis of symmetry 22b third diameter 23 recess 23a Inside 24 guide holes 25 Through opening 26 Front side of the mounting element 27 Mounting rod 30 Connecting screw 30a second axis of symmetry 40 Leading direction 100 soldering iron devices

Claims

[1] comprising a soldering iron device (100) • a contact element (10), • a mounting element (20), and • a connecting screw (30), • wherein the contact element (10) has a contact tip (11) and is configured to release heat for a soldering process by means of the contact tip (11), • wherein the retaining element (20) has a receptacle (21) for the contact element (10) and the contact element (10) has a counter surface (12) corresponding to the receptacle (21), • wherein the receptacle (21) has a toothed section (22), • wherein at least the toothing (22) of the receptacle (21) of the retaining element (20) has a greater strength than the contact element (10), and • wherein the contact element (10) and the retaining element (20) are pressed together by means of the connecting screw (30), wherein the toothing (22) of the receptacle (21) is pressed into the counter surface (12). [2] Soldering iron device (100) according to claim 1, characterized by , that the toothing (22) of the receptacle (21) is rotationally symmetric and / or rotationally symmetric, in particular frustoconical in shape, and that the toothing (22) has a first axis of symmetry (22a). [3] Soldering iron device (100) according to one of the preceding claims, characterized by , that the toothing (22) of the receptacle (21) is arranged on an inner side (23a) of a recess (23) of the retaining element (20). [4] Soldering iron device (100) according to one of the preceding claims 2 or 3, characterized by , that a second axis of symmetry (30a) of the connecting screw (30) corresponds to the first axis of symmetry (22a) of the toothing (22) of the receptacle (21) and the connecting screw (30) passes through the receptacle (21). [5] Soldering iron device (100) according to any one of the preceding claims, characterized by, that the opposite surface (12) is rotationally symmetric and / or rotationally symmetric. [6] Soldering iron device (100) according to any one of the preceding claims, characterized by , that the contact element (10) has a guide pin (13) and the retaining element (20) has a corresponding guide bore (24), wherein the guide bore (24) is configured to guide the guide pin (13) along a joining direction (40). [7] Soldering iron device (100) according to claim 6, characterized by , that the guide bore (24) connects to the receptacle (21) along the joining direction (40) and that the guide pin (13) connects to the opposite surface (12) along the joining direction (40). [8] Soldering iron device (100) according to claim 7, characterized by , that • the guide pin (13) is designed to be rotationally symmetric and / or rotationally symmetric, in particular cylindrical, and has a first diameter (13a), and • the opposite surface (12) is rotationally symmetric and / or rotationally symmetric, in particular cylindrical, and has a second diameter (12c), [9] Soldering iron device (100) according to any one of the preceding claims, characterized by , that the contact element (10) has a better thermal conductivity than the retaining element (20). [10] Soldering iron device (100) according to any one of the preceding claims, characterized by , that the contact element (10) has a recess (16) wherein the recess (16) is designed to absorb heat.

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