Production process for a radar system for environmental detection with a waveguide antenna formed from several molded parts

Abstract

Method for producing a radar system for environmental detection, wherein the radar system includes a circuit board which carries at least one high-frequency component, and a plurality of molded parts which each have one or more individual antennas on their upper side for transmitting and / or receiving radar signals, characterized in that the molded parts are aligned in a defined position relative to one another and / or to the circuit board using a template and are connected to the circuit board in this position, in particular by soldering, by optionally conductive bonding and / or by caulking.

Description

[0001] The invention relates to a radar system for environmental detection in automotive applications. The radar system has a waveguide antenna formed from several molded parts. During production of the radar system, these parts are aligned with each other using a template while being connected to a circuit board. State of the art

[0002] Motor vehicles are increasingly being equipped with driver assistance systems that use sensor systems to monitor the surroundings and, based on the traffic situation detected, derive automatic vehicle reactions and / or instruct the driver, particularly by issuing warnings. A distinction is made between comfort and safety functions.

[0003] FSRA (Full Speed ​​Range Adaptive Cruise Control) plays an important role as a comfort feature in current development. The vehicle regulates its own speed to the desired speed set by the driver, provided the traffic situation permits; otherwise, the own speed is automatically adjusted to the traffic situation.

[0004] Safety functions now exist in a wide variety of forms. One group includes functions that reduce braking or stopping distances in emergency situations, all the way up to autonomous emergency braking. Another group is lane change functions: These warn the driver or intervene in the steering if the driver intends to make a dangerous lane change, i.e., if a vehicle in the adjacent lane is either in the blind spot (known as BSD - Blind Spot Detection) or rapidly approaching from behind (LCA - Lane Change Assist).

[0005] Nowadays, however, the driver is no longer only assisted, but the driver's task is increasingly carried out autonomously by the vehicle, i.e. the driver is increasingly replaced; this is referred to as autonomous driving.

[0006] Radar sensors are used for systems of the type described above, often in combination with sensors of other technologies, such as camera sensors. Radar sensors have the advantage, among other things, that they operate reliably even in poor weather conditions and can directly measure not only the distance of objects but also their radial relative velocity via the Doppler effect. 77 GHz and 79 GHz are typically used as transmission frequencies.

[0007] Due to the increasing functional scope of such systems, the requirements are constantly increasing, particularly with regard to detection range and resolution in azimuth and elevation – therefore, significantly larger antennas are necessary; radar systems with high resolution are often referred to as imaging radars.

[0008] The antenna is a central element of every radar sensor; it largely determines the sensor's performance and price. Currently, antennas are mostly implemented using planar technology on the high-frequency circuit board, e.g., as patch antennas. The disadvantages of this type of antenna implementation are, on the one hand, the losses in the feed lines and the antennas themselves (which limits the range), and, on the other hand, the high cost of such a circuit board (particularly because special high-frequency-capable substrates are required, which are expensive and require complex processing).

[0009] DE 10 2018 203 106 A1 discloses a basic design of a radar sensor of this type, which overcomes the disadvantages of planar technology by using a plastic waveguide antenna and a high-frequency component with at least one element for direct transmission or reception. The waveguide antenna and high-frequency component are located on opposite sides of the circuit board, and the coupling between the high-frequency component and the waveguide antenna is made through the circuit board, e.g., via a simple hole in the circuit board. DE 10 2020 211 254 A1 describes how the antenna can be realized cost-effectively using a single, single-layer molded part, which is connected to the circuit board, in particular by soldering.

[0010] Furthermore, DE 10 2020 216 362 A1 describes a method for producing a radar sensor, in which a printed circuit board is provided, one surface of the printed circuit board being populated with a radar transceiver. Furthermore, a plastic waveguide structure is provided, wherein waveguide channels are formed with at least one side wall coated with a metallically conductive coating in the waveguide structure and an open side. Finally, the waveguide structure is soldered to a surface of the printed circuit board, the open side facing the circuit board.

[0011] EP 3 467 446 A1 discloses a radar level measuring device for detecting the topology of a product surface in a container, comprising at least two radar chips. One of the radar chips generates a local oscillator signal, which is transmitted to the two chips via a high-frequency line arrangement for synchronization. The high-frequency line arrangement is arranged on different layers of the circuit board substrate. Task, solution and advantages of the invention

[0012] The object of the invention is to propose, in contrast to the prior art, the robust production of a cost-effective antenna for imaging radars.

[0013] This object is fundamentally achieved by a production method according to claim 1. Advantageous embodiments of the invention are claimed in the subclaims.

[0014] The advantages of the invention arise from the fact that a large antenna for imaging radars can be realized and manufactured in a cost-effective and robust manner.

[0015] The method according to the invention for producing a radar system for environmental detection, which includes a circuit board with at least one high-frequency component and a plurality of molded parts, each of which has one or more individual antennas on its upper side for transmitting and / or receiving radar signals, is characterized in that the molded parts are aligned in a defined position relative to one another and / or to the circuit board using a template and are connected to the circuit board in this position, in particular by soldering, by optionally conductive bonding and / or by caulking.

[0016] A radar system in which the transmission of the radar signals between the at least one high-frequency component and the at least one individual antenna on the upper side of the molded parts is at least partially realized by internal waveguides, can further be characterized in that hollow-shaped waveguides are each formed by a recess in the side of the molded part facing the circuit board and a metallized surface of the circuit board, wherein due to this construction the molded parts can each consist of a single-layer at least partially metallized plastic part or a single-layer metal part, which is preferably produced by die casting, deep drawing or bending technology.

[0017] A rough positioning (or pre-fixing or pre-positioning) of the molded parts to the circuit board is expediently realized by structures, in particular tenons and / or pins, which protrude from the molded part into recesses or holes in the circuit board.

[0018] In an advantageous embodiment of the invention, the template can have resilient elements which press the individual molded parts against the circuit board during soldering or gluing to the circuit board in order to ensure a continuous soldering or adhesive connection next to the waveguides formed by the circuit board and molded parts, particularly in the case of unevenness in the circuit board and / or the molded parts.

[0019] A molded part can expediently have predetermined bending points, in particular in the form of grooves, openings and / or webs.

[0020] Advantageously, the positioning of the molded parts relative to the template is realized by structures, in particular tenons and / or pins, which protrude from the template into recesses or holes in the molded parts.

[0021] Furthermore, the positioning structures of the template can have a self-centering property, in particular through conical shape and / or resilient property.

[0022] According to the invention, the template has axially guided spring pins or template spring pins which serve to position the molded parts and / or to press the molded parts against the board.

[0023] Advantageously, the positioning of the template relative to the circuit board can be realized by structures, in particular tenons and / or pins, which protrude from the template into or through recesses or holes in the circuit board.

[0024] The template expediently has structures with a movable mechanism which, after triggering or applying this mechanism, press the circuit board from behind against reference surfaces on the template in order to fix the template to the circuit board during the connection process between the molded parts and the circuit board and / or to bring the circuit board into as flat a position as possible, wherein there are preferably press structures distributed over the entire circuit board, i.e. also in the central area, in particular in order to avoid bending of the circuit board due to the molded parts being pressed on from above, and these press structures may also act as positioning structures.

[0025] Furthermore, a stencil can cover several boards, in particular all boards located on a panel.

[0026] There may also be several high-frequency components that are connected via a common high-frequency signal, the so-called LO signal, wherein the LO signal is advantageously guided at least partially in at least one hollow waveguide, for which purpose there is at least one further molded part connected to the circuit board and the hollow waveguide is formed by a depression, recess or bulge in the side of the molded part facing the circuit board and a metallized surface of the circuit board, wherein this further at least one molded part is also fixed and / or positioned by the template device for production.

[0027] If the at least one molded part for the hollow LO waveguide is located on the other side of the board than the molded parts with the antennas, the template device preferably has at least one structure with a movable mechanism which, after triggering or applying this mechanism, presses the molded part for the hollow LO waveguide or the molded parts with the antennas against the board from behind. Brief description of the drawings Fig. 1 shows a prior art radar sensor design with a soldered single-layer molded part to form an antenna with internal waveguides and a high-frequency component that is directly connected to these waveguides via holes in the circuit board. Fig. Figure 2 shows a circuit board with four single-layer molded parts for forming a large antenna for an imaging radar. In Fig. Figure 3 shows a template used to align and fix the four preforms during their soldering onto the circuit board. Fig. 4 shows the back of the board with four high-frequency chips connected via a branched LO line. Fig. 5 shows a molded part soldered onto the circuit board, the inner recess of which, together with the metallized surface there, forms an internal LO waveguide. Examples of implementation

[0028] Until now, antennas for radar systems for environmental detection have mostly been implemented as planar antennas on a high-frequency circuit board. The antennas and their connecting lines to the feeding or receiving high-frequency component on the top layer of the high-frequency circuit board require a special substrate with material properties suitable for high frequencies (e.g., defined thickness, defined dielectric constant, very low loss angle). In particular, the material costs of this special substrate and its processing (also due to the required high structural accuracy) result in costs that are several times higher than for a purely low-frequency circuit board of the same size and with the same number of layers. In addition to the costs, the signal losses in the antennas and their feed lines are also disadvantageous. For a transmitting and receiving antenna, including feed lines, the combined power losses are typically around 6 dB.Such reduced sensor sensitivity results in a 30% reduced maximum sensor range.

[0029] Due to the aforementioned disadvantages of board-based antennas, so-called waveguide antennas are now being increasingly considered. Here, antennas and their feed lines are realized using waveguides, which in the simplest case represent rectangular cavities with metallic or metallized walls; therefore, the term waveguide antenna is often used. Such an antenna can be designed as a plastic part with metallized surfaces. DE 10 2018 203 106 A1 describes a structure with a plastic antenna consisting of several layers, wherein feed lines to the antennas are realized by internal waveguides, which are created by slot-shaped depressions in joined layers. Alternatively, DE 10 2020 211 254 A1 shows a Fig. 1 illustrates the implementation of an antenna by a single-layer molded part 21 made of plastic, which is soldered to the circuit board 22, with three walls of the waveguides 23 required for the supply lines being formed by slot-shaped recesses in the underside of the molded part, and the fourth wall being formed by a metallized surface 24 of the circuit board. In both designs, the radio-frequency chip 25 is located on the back of the circuit board (i.e., the side opposite the antenna) and has radiating and receiving elements 26 on its underside, which are connected through a hole 27 in the circuit board with metallized side walls 28 to the waveguides 23 in the plastic antenna or between the latter and the circuit board. Since in these designs no lines carrying radio-frequency signals run within the circuit board, a cost-effective low-frequency circuit board can be used.A further advantage is that the high-frequency signals run entirely in waveguides, which generate only very low power losses, so that a high sensor sensitivity can be achieved.

[0030] Particularly for partially or fully automated driving, radar sensors are required which have high angular accuracy and separation capability in both azimuth and elevation – they are referred to as imaging radars. For high angular separation capability, a large antenna aperture is required – the required width and height of the antennas are in the range of 10-20 cm or even higher. The production of such large antennas is associated with tolerance problems, particularly with regard to flatness; sufficient flatness of large circuit boards is also difficult to achieve. In addition, a structure with a single-layer soldered molded part is problematic because very high stresses can arise between the molded part and the circuit board due to different thermal expansion coefficients and different thermal expansion during the cooling process after the soldering process.Over its lifetime, this can lead to cracks in a plastic molded part or to local detachment (because, for example, the metallization of the molded part or circuit board detaches).

[0031] To avoid these problems, instead of one large molded part, several smaller molded parts can be used, which are soldered onto the board. Fig. Figure 2 shows an example with four preforms 1-4 (view from above). Each preform carries six transmitting antennas (TX1.1-6, TX2.1-6, TX3.1-6, TX4.1-6) and six receiving antennas (RX1.1-6, RX2.1-6, RX3.1-6, RX4.1-6), the structure of which is not shown in detail. Before being soldered to the circuit board 5, they are positioned using small pins on their backside, which protrude into holes in the circuit board. These small pins, also called pins, must have a significantly smaller diameter than the holes in the circuit board to be robust against tolerances. Tolerances that occur include, in particular, positioning inaccuracies of the holes created by drilling in the circuit board, diameter inaccuracies of the holes (for example, due to drill bit wear), and positioning inaccuracies and diameter inaccuracies of the pins (due to the limited accuracy of the tool used to produce the preform).This play of the pins in the board holes leads to positioning errors of the molded parts in the x- and y-direction (due to lateral offset of the molded parts and twisting). Furthermore, there are other tolerance-related causes for relative positioning errors between the molded parts, so that the actual arrangement of the RX antennas can deviate from the nominally equidistant and uniform arrangement in two parallel horizontal rows, and the actual arrangement of the TX antennas can deviate from the nominally equidistant and uniform arrangement in two parallel vertical columns – for example, the gap between antennas RX1.6 and RX2.6 can be larger than the nominal pitch of the other RX antennas.

[0032] Such position errors of the individual antennas lead to phase errors in their received signals, which in turn lead to errors in angle estimation and reduced or faulty angular separation. The phase errors are proportional to sin(α), where α represents the angle relative to the normal on the antenna and an antenna calibration to an angle of α = 0 is assumed. High angular accuracy and separation are most important in the range around 0° (e.g., in the range -10° to +10°); in this range, the sine function changes significantly (its derivative cos(α) has a maximum value there), so quite large phase errors can occur.Compared to an unevenness of the antenna arrangement (i.e. the surfaces of the individual antennas are not exactly in one plane, particularly due to uneven molded parts and / or an uneven circuit board, which leads to position errors in the z-direction perpendicular to the antenna), the position errors in the x- and y-direction are much more critical, since errors in the z-direction have a proportional effect to 1-cos (α) and are therefore approximately 0 around α = 0 (since the derivative of cos (α) vanishes at α = 0, i.e. is 0).

[0033] To avoid such positioning errors in the x- and y-direction, the preforms must be brought into the nominal position before or during soldering to the board. A template can be used for this purpose, which is Fig. 3; in the upper image, the arrangement of preforms 1-4, blank 5, and template 6 is shown from above, the lower image shows a section through part of this arrangement (along section line A). The template 6 has pins 6.1, which engage in round holes 1.1 of the preforms 1-4. The pins 6.1 have a conical shape at their front, which realizes an inherent centering with the holes 1.1 of the preforms 1-4 (the holes can also have a chamfer at the top, which in Fig. 3 is not shown). Furthermore, the pins 6.1 are movable in the axial direction and are each pressed against the molded part 1 by a spring 6.2, ensuring that the holes 1.1 are centered relative to the pins 6.1, even if the molded parts 1-4 and / or the circuit board 5 are uneven. Furthermore, the spring force helps ensure continuous soldering on the sides of the internal waveguides 7, i.e., at the connections between the molded parts 1-4 and the circuit board 5 next to the waveguides (connections are marked with 8): - firstly, in places where there is little distance between the preform and the circuit board (e.g. because the circuit board has a local upward bulge), the preform is pressed into the solder layer (and thus the solder to the side), whereby in places where there is a greater distance between the preform and the circuit board, the thickness of the solder paste, possibly in conjunction with the adhesive behavior of the solder, is sufficient to close the gap between the preform and the circuit board; - and secondly by bending the molded part towards the board via the spring force, whereby for this purpose the molded part preferably has predetermined bending points, in particular in the form of grooves, openings and / or webs.

[0034] Fig. 3 also shows in the sectional view pins 1.4 on the underside of the molded parts, which protrude into larger holes 5.1 of the board 5, which serves for the rough positioning or pre-positioning of the molded parts.

[0035] The template 6 is positioned relative to the circuit board 5 via pins 6.3, which protrude into holes 5.2 of the circuit board 5. Furthermore, it may be advantageous for the template 6 not only to be placed on top, but also to be firmly fixed to the circuit board 5. For this purpose, there are holders 6.4, which press the circuit board 5 from behind against reference surfaces 6.5 on the template; this is not explicitly stated in Fig. 3 shows that the holders 6.4 have a springy / elastic or clamping property for pressing on and there is a mechanism by which, after the stencil 6 has been placed on the circuit board 5, the parts of the holder 6.4 pressing on the circuit board 5 from behind are guided there. Via the reference surfaces 6.5 on the stencil 6, against which the circuit board 5 is pressed from behind, a flat course of the antenna can be achieved during the soldering process. Since the circuit board 5 is large (due to the large size of the imaging radar considered here) and also because of the force exerted by the stencil spring pins 6.1 on the preforms 1-4 and thus on the circuit board 5 (which can bend the circuit board), it is advantageous to provide at least one holder in the central region of the circuit board. In principle, the holders 6.4 and the pins 6.3 can be used for fixing orPositioning of template and board can be realized in a common element; this element can also include the reference surfaces 6.5.

[0036] The soldering process takes place with the stencil in place. It should be noted that the high temperatures during the soldering process lead to thermal expansion of both the preforms and the circuit board, as well as the stencil. Therefore, it is advisable to select a material for the stencil (especially a metal or alloy) that has a similar thermal expansion coefficient to that of the preforms and PCB (which in turn have similar expansion coefficients, roughly in the range of 13-15 ppm / K). Since the stencil and circuit board, plus the soldered preforms, can cool at different rates during the cooling process, which could lead to high stresses, it can be advantageous to remove the stencil as soon as the solder has solidified sufficiently to prevent any further displacement of the preforms.

[0037] During the assembly and soldering process, several boards are typically connected together in a larger panel (e.g., four boards). In this case, a common stencil can be used for several or all boards in the panel.

[0038] Due to tolerances in the injection mold used to manufacture the plastic molded parts 1-4, the position of their positioning holes 1.1 relative to the individual TX and RX antennas may deviate from the nominal value. Such errors can be corrected using the position of the positioning pins or template spring pins 6.1 of template 6.

[0039] In addition to injection molding, 3D printing is also increasingly being considered for the production of plastic molded parts.

[0040] Soldering has so far been considered as the connection technique between molded parts and the circuit board. Other connection techniques such as gluing (especially with conductive adhesive) or caulking are also conceivable – for a plastic molded part, hot caulking is a suitable option. Caulking can be particularly useful when the internal waveguides (between the molded part and the circuit board) do not require a conductive and closed connection on their right and left side walls because of the so-called bandgap structures (e.g., rows of small metallized plastic posts) located there.

[0041] Instead of the previously considered plastic molded parts with a metallized surface, these can also be realized directly as a metal part, which is preferably manufactured by die casting, deep drawing or bending technology.

[0042] Due to the high number of TX and RX antennas in imaging radars, several high-frequency components are usually used; in the example of 24 TX and 24 RX antennas considered so far, for example, four high-frequency chips are used for six TX and six RX antennas each - Fig. Figure 4 shows the back of circuit board 5 with the high-frequency chips 9-12. Only one of the chips (here, chip 9) is responsible for the actual generation of the high-frequency signal, which is distributed to the other three chips 10-12, but also back to the generating chip 9 via lines 13 (feedback to the generating chip so that all four chips see the shared high-frequency signal with the same propagation delay). The shared high-frequency signal is commonly referred to as the LO signal—it is often not at the frequency used for the transmitted / received radar waves of approximately 77 GHz, but a factor of 2-4 lower.The LO lines 13 are quite long, but must not have excessive losses (otherwise the LO power fed into the chips is too low); therefore, the implementation of the LO lines directly on the PCB (especially as so-called microstrip lines) requires a special low-loss substrate, which, due to its relatively high cost, is precisely what the design presented above is intended to avoid.

[0043] Therefore, hollow waveguides should also be used here. Fig. 5 shows the circuit board 5 from the rear with the four chips 9-12 and a molded part 14 made of surface-metallized plastic; in Fig. Figure 5 below shows a section through this molded part (along section line B). The hollow waveguide 15 is generated by a longitudinal rectangular recess in the molded part 14, which creates three side walls, and a metallized surface 5.3 of the circuit board 5, which forms the fourth side wall. The molded part is soldered to the circuit board next to the formed waveguide.

[0044] The LO signals are routed from the chip to the board via electrical connections, in particular so-called balls (in Fig. 5 not explicitly shown) and from there, if necessary, guided along a short microstrip line in a waveguide 5.4 formed in the circuit board substrate (FR4), which also extends beneath the soldered sidewall 14.1 of the molded part. The LO signal is then coupled from the waveguide 5.4 formed in the circuit board substrate into the waveguide 15, which is formed from the recess in the molded part and the metallized circuit board surface. This completely closes the LO waveguides and prevents them from radiating, which is particularly important when the LO operates at a split radar frequency, since the radiation permitted by the international frequency approval is extremely low there.

[0045] If during the soldering process the arrangement of the board and the molded parts for antennas and the LO waveguides is such that the molded part for LO waveguides is at the bottom, it may be necessary to press it against the board from behind during the soldering process; for this purpose, additional stencil holders analogous to the holders 6.4 in Fig. 3, which now do not press against the board from behind, but against the molded part for the LO waveguides.

[0046] The positioning of the preform for the LO waveguides relative to the board can be achieved by structures, particularly pegs and / or pins, that protrude from the preform into or through recesses or holes in the board. If the preform is located on the underside of the board during the soldering process, these structures can also serve to pre-fix the preform, e.g., in the form of clips that have a certain amount of play to allow the preform to be pressed into the solder paste (via the force of the stencil holders acting from behind).

[0047] So far, it has been assumed that the molded part for forming the LO waveguides is located on the same side as the radio-frequency chips - although they can also be located on opposite sides. To feed the waveguide, an electrical line can then be led from a ball of the chip through the circuit board to an element that couples out into the waveguide. Alternatively, radiating elements can be located on the underside of the chip, which radiate the LO signal directly into the waveguides through areas in the board that are transparent to radar waves, or receive it from them. The areas in the board that are transparent to radar waves can be realized by holes with metallized sidewalls, or by having no metallization on and between the carrier material layers of the board and surrounding the areas with vias.

[0048] Until now, it was assumed that the molded part for the LO waveguides would be made of surface-metallized plastic. However, it can also be realized directly as a metal part, preferably produced by die casting, deep drawing, or bending. Generally, it is advantageous if the material used for the molded part has a similar coefficient of thermal expansion to that of the circuit board in order to avoid or reduce stresses that occur after the soldering process. A two-part molded part consisting of a frame soldered to the circuit board and a cover, as is often used for shielding, is also conceivable.

[0049] Soldering has so far been considered as the connection technique between the LO waveguide molded part and the circuit board. Other connection techniques such as gluing (especially with conductive adhesive) or caulking are also conceivable – for a plastic molded part, hot caulking is a suitable option. Caulking can be particularly useful when the internal waveguides (between the molded part and the circuit board) do not require a conductive and closed connection on their right and left side walls because of the so-called bandgap structures (e.g., rows of small metallized plastic posts) located there.

[0050] Until now, the cross-section of the hollow LO waveguide was assumed to be rectangular. If the LO signal is divided down from the frequency used for the transmitted / received radar waves (in the range of 77 GHz), the cross-section of a rectangular waveguide becomes quite large; a reduction in the cross-section can be achieved by using one or more longitudinal ridges (also called "ridged waveguides").

[0051] Finally, the following should be noted: A radar system both transmits and receives. For the sake of simplicity, the above description often does not explicitly describe or distinguish between the two. For example, when referring to the antenna or the elements on the chip, we speak of "radiating"—for receiving antennas, this naturally means "receiving"; and when we speak of "feeding" a waveguide, we mean "coupling" for a waveguide that, in turn, feeds another component.

Claims

[1] Method for producing a radar system for environmental detection, wherein the radar system comprises a circuit board (5) which carries at least one high-frequency component, and a plurality of molded parts (1, 2, 3, 4) which each have one or more individual antennas for transmitting and / or receiving radar signals on their upper side, characterized by that the molded parts (1, 2, 3, 4) are aligned in a defined position relative to one another and / or to the circuit board (5) via a template (6) and are connected to the circuit board (5) in this position, in particular by soldering, by optionally conductive bonding and / or by caulking, wherein the positioning of the molded parts (1, 2, 3, 4) relative to the template (6) is realized by positioning structures, in particular pins and / or pins (6.1), which protrude from the template (6) into recesses or holes (1.1) of the molded parts (1, 2, 3, 4), and wherein the template (6) has axially guided resilient pins (6.1) which serve to position the molded parts (1, 2, 3, 4) and / or to press the molded parts (1, 2, 3, 4) against the board (5). [2] Method for producing a radar system according to claim 1, wherein in the radar system the transmission of the radar signals between the at least one high-frequency component and the at least one individual antenna on the upper side of the molded parts is realized at least partially by internal waveguides (7), characterized bythat hollow waveguides (7) are each formed by a recess in the side of the molded part (1, 2, 3, 4) facing the circuit board (5) and a metallized surface of the circuit board (5), wherein, as a result of this construction, the molded parts (1, 2, 3, 4) can each consist of a single-layer, at least partially metallized plastic part or a single-layer metal part, which is preferably produced by die-casting, deep-drawing or bending technology. [3] Method for producing a radar system according to one of the above claims, wherein a rough positioning of the molded parts (1, 2, 3, 4) to the circuit board (5) is realized by structures, in particular pins and / or pins (1.4), which protrude from the molded part (1, 2, 3, 4) into recesses or holes (5.1) of the circuit board (5). [4] Method for producing a radar system according to one of the above claims, wherein the template (6) has resilient elements (6.1) which press the individual molded parts (1, 2, 3, 4) against the circuit board (5) during soldering or gluing thereof, in order to ensure a continuous soldered or glued connection next to the waveguides formed by the circuit board (5) and the molded parts (1, 2, 3, 4), particularly in the case of unevenness in the circuit board (5) and / or the molded parts (1, 2, 3, 4). [5] Method for producing a radar system according to claim 4, wherein at least one molded part (1, 2, 3, 4) has predetermined bending points, in particular in the form of grooves, openings and / or webs. [6] Method for producing a radar system according to one of the above claims, in which the positioning structures of the template (6) have a self-centering property, in particular by conical shape and / or resilient property. [7] Method for producing a radar system according to one of the above claims, wherein the positioning of the template (6) relative to the circuit board (5) is realized by structures, in particular pins and / or pins (6.3), which protrude from the template (6) into or through recesses or holes (5.2) of the circuit board (5). [8] Method for producing a radar system according to one of the above claims, wherein the template (6) has structures with a movable mechanism which, after triggering or applying this mechanism, press the circuit board (5) from behind against reference surfaces (6.5) on the template (6) in order to fix the template (6) to the circuit board (5) during the connection process between the molded parts (1, 2, 3, 4) and the circuit board (5) and / or to bring the circuit board (5) into a position that is as flat as possible, wherein there are preferably press structures distributed over the entire circuit board (5), i.e. also in the central region, in particular to avoid bending of the circuit board (5) due to the molded parts (1, 2, 3, 4) being pressed on from above, and these press structures optionally also act as positioning structures. [9] Method for producing a radar system according to one of the above claims, wherein a template (6) covers several circuit boards (5), in particular all circuit boards (5) located on a panel. [10] Method for producing a radar system according to one of the above claims, in which there are several high-frequency components which are connected via a common high-frequency signal, the so-called LO signal, wherein the LO signal is guided at least partially in at least one hollow waveguide (15), for which purpose there is at least one further molded part (14) connected to the circuit board (5) and the hollow waveguide (15) is formed by a depression, recess or bulge in the side of the molded part (14) facing the circuit board and a metallized surface (5.3) of the circuit board (5), wherein this further at least one molded part (14) is also fixed and / or positioned by the template device for production. [11] A method for producing a radar system according to claim 10, wherein the at least one mold part (14) for the hollow LO waveguide is located on the other side of the board than the mold parts (1, 2, 3, 4) with the antennas and the template device has at least one structure with a movable mechanism which, after triggering or applying this mechanism, presses the mold part (14) for the hollow LO waveguide or the mold parts (1, 2, 3, 4) with the antennas from behind against the board (5).

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