Evaporation film, multilayer structure, packaging material, vacuum packaging bag and vacuum insulation material

Abstract

Provided are a vapor deposition film in which deterioration of gas barrier properties after bending treatment and after storage, as well as a multilayer structure, a packaging material, a vacuum packaging bag, and a vacuum insulation material using such a vapor deposition film. The vapor deposition film comprises a barrier layer (A) made of a resin and an aluminum vapor deposition layer (B) directly disposed on the barrier layer (A) and having an average thickness of 30 nm or more and 100 nm or less, wherein the aluminum vapor deposition layer (B) comprises an aluminum oxide layer (B1) and an aluminum layer (B2) sequentially disposed in this order from a surface in contact with the barrier layer (A).

Description

TECHNICAL FIELDThe present invention relates to an vapor deposition film, a multilayer structure, a packaging material, a vacuum packaging bag and a vacuum insulation.PRIOR ARTThere is known an evaporation film in which a metal evaporation layer is provided on a base film made of a resin. Such a vapor deposition film is used for various applications such as a vacuum packaging bag for a vacuum insulation material which is required to have gas barrier properties to maintain its heat insulation performance, a packaging material for protecting an article (e.g., a food) which is highly likely to be changed by oxygen, and the like. Patent Document 1 discloses an vapor deposition film comprising: a base film containing a polyvinyl alcohol polymer; and a metal vapor deposition layer disposed on the base film, characterized in that the average particle size of the metal vapor deposition layer measured by an electron microscope is 150 nm or less.PRIOR ART DOCUMENTSPatent DocumentsPatent Document 1: International PCT Application Publication No. 2013 / 125564SUMMARY OF THE INVENTIONPROBLEMS TO BE SOLVED BY THE INVENTIONIn a case where a packaging material or the like having a predetermined shape is made of an evaporation film, the packaging material is typically finished by a process including bending or the like. Further, the completed packaging material or the like may be bent during transportation, use, etc. However, the conventional vapor deposition film cannot maintain sufficient gas barrier properties after being subjected to a physical load, particularly a bending. Further, the gas barrier properties of the conventional vapor deposition film tend to deteriorate due to storage for a long period of time.The present invention has been made in view of the foregoing circumstances, and its object is to provide an evaporation film in which deterioration of gas barrier properties after a bending treatment and after storage is prevented, and a multilayer structure, a packaging material, a vacuum packaging bag, and a vacuum insulation cloth using such an evaporation film.MEANS FOR SOLVING THE PROBLEMSThe above object can be achieved by providing one of the following configurations:(1) a vapor deposition film comprising: a barrier layer (A) made of a resin; and an aluminum vapor deposition layer (B) disposed directly on the barrier layer (A) and having an average thickness of 30 nm or more and 100 nm or less, wherein the aluminum vapor deposition layer (B) comprises an aluminum oxide layer (B1) and an aluminum layer (B2) sequentially disposed in this order from a surface in contact with the barrier layer (A), in an elemental analysis in a depth direction of the aluminum oxide layer (B1), a maximum value (O / Al) MAX of a molar ratio of an oxygen element to an aluminum element is 0.5 or more and 2.0 or less, the molar ratio being measured with a scanning X-ray photoelectron spectrometer, and in depth direction analysis of the aluminum layer (B2), a minimum value (O / Al) MIN of a molar ratio of an oxygen element to an aluminum element is less than 0.5, the molar ratio being measured with a scanning X-ray photoelectron spectrometer;(2) the vapor deposition film according to (1), wherein the aluminum vapor deposition layer (B) comprises an aluminum oxide layer (B3) having an area (S) opposite to the area in contact with the barrier layer (A), and in elemental analysis of the area (S), a molar ratio (O / Al)s of an oxygen element to an aluminum element is 0.5 or more and 2.0 or less, the molar ratio being measured with a scanning X-ray photoelectron spectrometer;(3) the vapor deposition film according to (1) or (2), wherein the barrier layer (A) contains at least one selected from the group consisting of a vinyl alcohol polymer and a polyester resin as a main component;(4) the vapor deposition film according to any one of the configurations (1) to (3), wherein the barrier layer (A) is biaxially stretched;(5) the vapor deposition film according to any one of the configurations (1) to (4), wherein the average thickness of the barrier layer (A) is 0.1 μm or more and 20 μm or less;(6) the vapor deposition film according to any one of the configurations (1) to (5), wherein the average thickness of the aluminum vapor deposition layer (B) is 55 nm or more and 90 nm or less;(7) the vapor deposition film according to any one of the configurations (1) to (6), further comprising a polyolefin layer (D) disposed on an opposite surface of the barrier layer (A) to the aluminum vapor deposition layer (B) with an adhesive resin layer (C) therebetween;(8) the vapor deposition film according to (7), wherein the barrier layer (A), the adhesive resin layer (C) and the polyolefin layer (D) are at least uniaxially stretched;(9) a multilayer structure comprising: the vapor deposition film of (7) or (8); and a polyolefin layer (E) disposed on at least one surface of the vapor deposition film directly or via another intermediate layer;(10) the multilayer structure according to (9), wherein polyolefin layers (E) are respectively disposed on both surfaces of the vapor deposition film directly or via another intermediate layer, and the polyolefin layers (E) contain a same resin as a main component;(11) the multilayer structure according to (9) or (10), wherein the thickness ratio of the barrier layer (A) is 5% or less with respect to the total thickness of the multilayer structure;(12) a multilayer structure comprising: the vapor deposition film according to any one of the configurations (1) to (6); and a polyolefin layer (E) disposed on the vapor deposition film directly or via another intermediate layer;(13) the multilayer structure according to (12), further comprising another vapor deposition film disposed on the vapor deposition film directly or via another intermediate layer, wherein the other vapor deposition film comprises a barrier layer (a) made of a resin and an aluminum vapor deposition layer (b) disposed directly on the barrier layer (a) and having an average thickness of 30 nm or more and 100 nm or less;(14) the multilayer structure according to (13), wherein the aluminum vapor deposition layer (b) comprises an aluminum oxide layer (b1) and an aluminum layer (b2) sequentially arranged in this order from a surface in contact with the barrier layer (a), in an elemental analysis in the depth direction of the aluminum oxide layer (b1), a maximum value (O / Al) MAX of a molar ratio of an oxygen element to an aluminum element is 0.5 or more and 2.0 or less, the molar ratio being measured with a scanning X-ray photoelectron spectrometer, and in a depth direction analysis of the aluminum layer (b2), a minimum value (O / Al) MIN of a molar ratio of an oxygen element to an aluminum element is less than 0.5, wherein the molar ratio is measured with a scanning X-ray photoelectron spectrometer;(15) the multilayer structure according to any one of the configurations (12) to (14), further comprising a polyamide layer (F) disposed on the vapor deposition film directly or via another intermediate layer;(16) a packaging material comprising the vapor deposition film according to any one of the configurations (1) to (8) or the multilayer structure according to any one of the configurations (9) to (15);(17) a vacuum packaging bag comprising a packaging bag formed of the packaging material of (16), wherein the interior of the packaging bag has a reduced pressure; and(18) a vacuum insulation fabric comprising: the vacuum packaging bag according to (17); and a core material disposed inside the vacuum packaging bag.EFFECTS OF THE INVENTIONAccording to the present invention, there can be provided an evaporation film in which deterioration of gas barrier properties after a bending treatment and after storage is prevented, and a multilayer structure, a packaging material, a vacuum packaging bag, and a vacuum insulation cloth using such an evaporation film.BRIEF DESCRIPTION OF THE DRAWINGSFIG. 1 is a schematic cross-sectional view of a vapor deposition film according to an embodiment of the present invention.DESCRIPTION OF EMBODIMENTS

[0009] As referred to herein, the "gas barrier properties" are meant to mean mainly oxygen barrier properties. A property for preventing deterioration of gas barrier properties after a bending treatment can be expressed as "bending strength". Further, a property for preventing deterioration of gas barrier properties after storage may be expressed as "storage stability".A "main component" refers to a component having the highest content on a mass basis.An "average thickness" denotes an average value of thicknesses measured at five arbitrary points.In this specification, " / " in a term of a layer configuration also indicates that layers are arranged directly on each other, and " / / " indicates that layers are arranged on each other directly or via an adhesive layer therebetween.The term "top layer" is not used to distinguish the front side and the back side from each other, and is not limited to a layer on the front side. That is, a vapor deposition film or a multilayer structure consisting of two or more layers has two uppermost layers, namely, an uppermost layer on one side and an uppermost layer on the other side. Further, in the case of a structure in which the inside and the outside are distinguished from each other, such as a bag shape or a container shape, an inner top layer may be referred to as an innermost layer, and an outer top layer may be referred to as an outermost layer.Vapor Deposition FilmAn evaporation film of the present invention includes a barrier layer (A) made of a resin and an aluminum evaporation layer (B) disposed directly on the barrier layer (A) and having an average thickness of 30 nm or more and 100 nm or less, the aluminum evaporation layer (B) including an aluminum oxide layer (B1) and an aluminum layer (B2) sequentially disposed in this order from a surface in contact with the barrier layer (A), in depth-direction elemental analysis of the aluminum oxide layer (B1), a maximum value (O / Al) MAX of a molar ratio of an oxygen element to an aluminum element is 0.5 or more and 2.0 or less, the molar ratio being measured with a scanning X-ray photoelectron spectrometer, and in depth direction analysis of the aluminum layer (B2), a minimum value (O / Al) MIN of a molar ratio of an oxygen element to an aluminum element is less than 0.5, the molar ratio being measured with a scanning X-ray photoelectron spectrometer.The vapor deposition film of the present invention is characterized by bending strength and storage stability. Although the reasons for this are not clear, the following reasons may be present. In the vapor deposition film, since a portion which is in the aluminum vapor deposition layer (B) and is in contact with the barrier layer (A) is the aluminum oxide layer (B1), the adhesive strength between the barrier layer (A) and the aluminum vapor deposition layer (B) increases. Accordingly, for example, even in a case where bending treatment is performed or in a case where dimensional change occurs during storage, the state in which the aluminum vapor deposition layer (B) is held on the barrier layer (A) is maintained. Therefore, it is considered that the vapor deposition film is prevented from deteriorating the gas barrier properties after a bending treatment and after a storage. Further, in a case where a food or the like is packaged and stored using the vapor deposition film, a decrease in adhesiveness between the barrier layer (A) and the aluminum vapor deposition layer (B) due to a constituent or the like of the content such as the food or the like is also prevented. A portion of the aluminum vapor deposition layer (B) peeled from the barrier layer (A) is bleached and causes deterioration of the appearance. Therefore, in a packaging material using the vapor deposition film, both deterioration of gas barrier properties after storage and deterioration of appearance are prevented. In addition, in the case where a food or the like is packaged and stored using the vapor deposition film, a phenomenon that the aluminum vapor deposition layer (B) is rapidly oxidized and thus bleached or becomes transparent due to a constituent or the like of the content such as the food or the like, and deterioration of the gas barrier properties due to corrosion of the aluminum oxide layer (B1) can be prevented. Thanks to the presence of the alumina layer (B1) oxidized to some percentage, the rapid oxidation of the alumina layer (B2) and the corrosion of the alumina layer (B1) can be prevented, therefore both deterioration of gas barrier properties after storage and deterioration of appearance are prevented.Barrier layer (A)The barrier layer (A) is a layer made of a resin. The barrier layer (A) may be a base layer for the aluminum vapor deposition layer (B) formed by vapor deposition. The barrier layer (A) may be a layer containing the resin as a main component. The resin constituting the barrier layer (A) is preferably a thermoplastic resin.As the resin which is the main component of the barrier layer (A), a resin having high gas barrier properties is suitably used. For example, when an unstretched film composed only of the resin is produced, it is preferable that the resin allows this film to have an oxygen permeability of 100 mL·20 μm / (m 2 ·day·atm) or less, more preferably 50 mL·20 μm / (m 2 ·day·atm) or less, and even more preferably 10 mL·20 μm / (m 2 ·day·atm) or less. As referred to herein, oxygen permeability denotes a value measured according to the method disclosed in ISO14663-2 Annex C (1999), under conditions including 20° C. and 65% RH. For example, an oxygen permeability of "50 mL·20 μm / (m 2 ·Tag·atm)"means that 1 m 2 of a film transmits 50 mL of oxygen per day at a pressure difference of an oxygen gas of 1 atmosphere when the film thickness is converted to an average thickness of 20 μm.Examples of the resin which is the main component of the barrier layer (A) include a vinyl alcohol polymer, a polyester resin, a polyamide, polyvinylidene chloride, an acrylonitrile copolymer, polyvinylidene fluoride, polychlorotrifluoroethylene, and the like; at least one selected from the group consisting of a vinyl alcohol polymer and a polyester resin is preferable, and a vinyl alcohol polymer is more preferable. By using such a resin as a main component of the barrier layer (A), the gas barrier properties can be improved, and further, deterioration of the gas barrier properties after a bending treatment and after storage can be further prevented. One kind or two or more kinds of resins may be used as the resin constituting the barrier layer (A).The polyester resin is a polymer having an ester bond. The polyester resin can be obtained by polycondensation or the like between a polyvalent carboxylic acid and a polyol. Examples of the polyester resin include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyglycolic acid (PGA), aromatic liquid crystal polyester, and the like, and PET is preferred.The vinyl alcohol polymer is a polymer containing a vinyl alcohol unit. The vinyl alcohol polymer is obtained by, for example, hydrolyzing a vinyl ester homopolymer or a copolymer of vinyl ester and another monomer by means of an alkali catalyst or the like. Examples of the vinyl ester include vinyl acetate, vinyl propionate, vinyl pivalate and the like, and vinyl acetate is preferred. Examples of the other monomer include ethylene; α-olefins such as propylene, butylene, isobutene, 4-methyl-1-pentene, 1-hexene and 1-octene; unsaturated carboxylic acids such as (meth)acrylic acid or esters thereof; vinylsilane compounds such as vinyltrimethoxysilane; unsaturated sulfonic acids or salts thereof; vinylpyrrolidone compounds such as N-vinylpyrrolidone; and the like. Among these, ethylene is preferred.The vinyl alcohol polymer can be produced by a known method. A chain transfer agent may be used in the preparation. Examples of the chain transfer agent include alkylthiols and the like.The saponification degree of the vinyl alcohol polymer (proportion (mol %) of the vinyl alcohol unit with respect to the sum of the vinyl alcohol unit and a vinyl ester unit) is preferably 90 mol % or more, more preferably 95 mol % or more, and even more preferably 99 mol % or more. When the saponification degree is at or above the upper limit, the gas barrier properties of the vapor deposition film at high humidity tend to improve. The upper limit of the saponification degree of the vinyl alcohol polymer may be 100 mol %. The saponification degree of the vinyl alcohol polymer can be determined by nuclear magnetic resonance (NMR) spectrometry.The content of the vinyl alcohol unit with respect to all the structural units in the vinyl alcohol polymer is preferably 30 mol % or more and 100 mol % or less, more preferably 35 mol % or more and 90 mol % or more, even more preferably 40 mol % or more and 80 mol % or less, and even more preferably 45 mol % or more and 75 mol % or less.The vinyl alcohol polymer is preferably an ethylene-vinyl alcohol copolymer (hereinafter also referred to as "EVOH"). The content of an ethylene unit with respect to all the structural units in the EVOH is preferably 10 mol % or more and 65 mol % or less, preferably 20 mol % or more and 60 mol %, and more preferably 25 mol % or more and 55 mol % or less.The EVOH may contain another structural unit other than the vinyl alcohol unit, the ethylene unit, and the vinyl ester unit. In the case where the EVOH contains the other structural unit, the content of the other structural unit with respect to all the structural units in the EVOH is preferably 30 mol % or less, more preferably 20 mol % or less, even more preferably 10 mol % or less, even more preferably 5 mol % or less, and may be particularly preferably 1 mol % or less. Further, in the case where the EVOH contains the other structural unit, the content thereof may be 0.05 mol % or more or 0.1 mol % or more.The MFR (190° C., load of 2.16 kg) of the EVOH is preferably 0.5 g / 10 min or more and 12 g / 10 min or less, and more preferably 1.0 g / 10 min or more and 8.0 g / min or less.From the viewpoint of gas barrier properties and the like, the lower limit of the content of the resin in the barrier layer (A) is preferably 70 mass %, more preferably 80 mass %, even more preferably 90 mass %, and may be 95 mass %, 99 mass %, or 99.9 mass %. The upper limit of the content of the resin in the barrier layer (A) may be 100 mass % or 99.99 mass %.The barrier layer (A) may contain inorganic oxide particles. An inorganic oxide constituting the inorganic oxide particles is not particularly limited, and examples thereof include silicon oxide, aluminum oxide, magnesium oxide, zirconium oxide, cerium oxide, tungsten oxide, molybdenum oxide, complexes thereof, and the like. Among these, silica or silica-magnesia is preferred, and silica is more preferred.The lower limit of the content of the inorganic oxide particles in the barrier layer (A) is preferably 0.001 mass %, more preferably 0.005 mass %, and even more preferably 0.01 mass %. Further, the upper limit of the content of the inorganic oxide particles is preferably 1 mass %, more preferably 0.7 mass %, and even more preferably 0.5 mass %. When the content of the inorganic oxide particles is in the above range, the gas barrier properties tend to further improve.The average particle size of the inorganic oxide particles is preferably 1 μm or more and 10 μm or less, and more preferably 2 μm or more and 5 μm or less. When the average particle size of the inorganic oxide particles is in the above range, the gas barrier properties tend to further improve. The average particle size of the inorganic oxide particles is a value measured by a laser diffraction scattering method.The barrier layer (A) may further contain a boron compound, a carboxylic acid, a phosphorus compound, a metal ion, an antioxidant, an ultraviolet absorbent, a plasticizer, an antistatic agent, a lubricant, a dye, a filler, a heat stabilizer, or the like. The barrier layer (A) may contain two or more kinds of these optional ingredients.The barrier layer (A) may be an unstretched layer or a stretched layer. The barrier layer (A) may be uniaxially stretched or biaxially stretched. In the case where the barrier layer (A) is a stretched layer, particularly a biaxially stretched layer, the barrier layer (A) which is relatively thin may also have favorable gas barrier properties.In the case where the barrier layer (A) is a stretched layer, the barrier layer (A) is preferably at least uniaxially stretched by, for example, twice or more and less than twelve times, and more preferably at least uniaxially stretched by three times or more and less than six times. Further, the barrier layer (A) is also preferably biaxially stretched twice or more and less than twelve times in each direction, and more preferably biaxially stretched three times or more and less than six times in each direction.The lower limit of the average thickness of the barrier layer (A) is preferably 0.1 μm, more preferably 0.5 μm, even more preferably 1 μm, and may be 2 μm, 4 μm, or 6 μm. When the average thickness of the barrier layer (A) is at or above the lower limit, for example, the gas barrier properties can be improved. The upper limit of the average thickness of the barrier layer (A) is preferably 20 μm, more preferably 15 μm, and may be 10 μm, 5 μm, 3 μm, or 2 μm. When the average thickness of the barrier layer (A) is at or below the upper limit, for example, the thickness and the weight of the vapor deposition film can be reduced.The oxygen permeability of the barrier layer (A) is preferably 50 mL·20 μm / (m 2 ·day·atm) or less, more preferably 10 mL·20 μm / (m 2 ·day·atm) or less, still more preferably 5 mL·20 μm / (m 2 ·day·atm) or less, and particularly preferably 1 mL·20 μm / (m 2 ·day·atm) or less. As referred to herein, oxygen permeability denotes a value measured according to the method disclosed in ISO14663-2 Annex C (1999), under conditions including 20° C. and 65% RH.The barrier layer (A) may be composed of a single layer or multiple layers.As the barrier layer (A), a resin film may be used. A method for manufacturing the resin film including the barrier layer (A) is not particularly limited; examples thereof include a melting method, a dissolving method, a calendering method, and the like, and among these, a melting method is preferred. Examples of the melting method include a casting method and an inflating method, and among these, a casting method is preferred. Further, a stretched film stretched by a known method may also be used.Aluminum Vapor Deposition Layer (B)The aluminum vapor deposition layer (B) is a layer directly deposited on a surface of the barrier layer (A) by vapor deposition. When the aluminum vapor deposition layer (B) is provided in the vapor deposition film, favorable gas barrier properties can be obtained.The aluminum vapor deposition layer (B) includes the aluminum oxide layer (B 1) and the aluminum layer (B 2) arranged sequentially in this order from the surface in contact with the barrier layer (A). The aluminum vapor deposition layer (B) preferably further comprises an aluminum oxide layer (B3) having an area (S) opposite to the area in contact with the barrier layer (A).Fig. 1 shows a vapor deposition film 10 according to an embodiment of the present invention. The vapor deposition film 10 includes the barrier layer (A) made of the resin and the aluminum vapor deposition layer (B) directly disposed on the barrier layer (A). The aluminum vapor deposition layer (B) has a three-layered structure including the aluminum oxide layer (B 1), the aluminum layer (B 2), and the aluminum oxide layer (B 3) in this order from the surface in contact with the barrier layer (A). The structure of the vapor deposition film of the present invention is not limited to the structure of the vapor deposition film 10 in FIG. 1. The vapor deposition film of the present invention may comprise an adhesive resin layer (C), a polyolefin layer (D) and other layer(s) described later. Further, the vapor deposition film may include another layer covering the surface (S) of the aluminum vapor deposition layer (B) opposite to the surface in contact with the barrier layer (A). As with the vapor deposition film 10 in FIG. 1, the surface (S) of the aluminum vapor deposition layer (B) may be uncovered, i.e., exposed.An example of the other layer covering the area (S) is a coating layer. The coating layer can be provided, for example, by coating a solution containing a solvent-soluble or water-soluble resin (a polyester resin, an acrylic resin, a vinyl alcohol resin, an ethylene-vinyl alcohol copolymer (EVOH) resin, a vinyl modified resin, an epoxy resin, an oxazoline group-containing resin, a modified styrene resin, a modified silicone resin, alkyl titanate, or the like). A filler may be added to the coating layer to improve barrier properties, abrasion resistance, smoothness and the like. Examples of the filler include a silica sol, an alumina sol, a particulate inorganic filler, a layered inorganic filler, and the like. The coating layer is preferably formed in the following manner: The filler is added to the above resin, and polymerization or condensation is carried out. The other layer covering the surface (S) may be a thermoplastic resin layer formed by a method different from coating with a solution, one of the layers used in a multilayer structure described later, or the like.No clear interface exists between the aluminum oxide layer (B1) and the aluminum layer (B2) or between the aluminum layer (B2) and the aluminum oxide layer (B3). Further, in each of the alumina layer (B 1), the aluminum layer (B 2), and the alumina layer (B 3), the elemental composition is typically not constant. The percentage content of an oxygen element gradually decreases from the alumina layer (B1) to the aluminum layer (B2). Further, the percentage content of an oxygen element gradually increases from the aluminum layer (B2) to the aluminum oxide layer (B3). In other words, in the aluminum vapor deposition layer (B), the percentage content of an oxygen element in an interlayer portion (aluminum layer (B 2)) is relatively low. Further, in the aluminum vapor deposition layer (B), a region having a predetermined thickness from the surface in contact with the barrier layer (A) (aluminum oxide layer (B1)) and a region having a predetermined thickness from the surface (S) opposite to the surface in contact with the barrier layer (A) (aluminum oxide layer (B3)) have high percentage contents of an oxygen element as compared with the interlayer portion (aluminum layer (B2)).In the depth-direction elemental analysis of the alumina layer (B1), the maximum value (O / Al) MAX of the molar ratio of an oxygen element to an aluminum element is 0.5 or more and 2.0 or less, preferably 0.8 or more and 1.8 or less, and more preferably 1.1 or more and 1.5 or less, the molar ratio being measured with a scanning X-ray photoelectron spectrometer. When the maximum value (O / Al) MAX of the molar ratio of an oxygen element to an aluminum element in the aluminum oxide layer (B1) is in the above range, the adhesion strength of the aluminum vapor deposition layer (B) with respect to the barrier layer (A) can be increased, and therefore, the bending strength and the storage stability of the vapor deposition film can be improved.In the depth direction elemental analysis of the aluminum oxide layer (B 1), a position where the maximum value (O / Al) MAX of the molar ratio of an oxygen element to an aluminum element is observed is preferably in a range of 0 nm or more and 20 nm or less, and more preferably in a range of 0 nm or more and 15 nm or less from the surface in contact with the barrier layer (A).In the depth direction analysis of the aluminum layer (B2), the minimum value (O / Al) MIN of the molar ratio of an oxygen element to an aluminum element is less than 0.5, preferably 0.001 or more and less than 0.5, more preferably 0.003 or more and less than 0.2, even more preferably 0.005 or more and less than 0.10, and even more preferably 0.01 or more and less than 0.06, the molar ratio being measured with a scanning X-ray photoelectron spectrometer. When the minimum value (O / Al) MIN of the molar ratio of an oxygen element (O) to an aluminum element (Al) in the aluminum layer (B2) is in the above range, the gas barrier properties, the bending strength, the storage stability, and the like of the vapor deposition film tend to improve.In elemental analysis of the surface (S) of the aluminum vapor deposition layer (B) opposite to the surface in contact with the barrier layer (A), a molar ratio (O / Al)s of an oxygen element to an aluminum element is preferably 0.5 or more and 2.0 or less, more preferably 0.8 or more and 1.8 or less, and even more preferably 1.1 or more and 1.7 or less, the molar ratio being measured with a scanning X-ray photoelectron spectrometer. When the molar ratio (O / Al)s of an oxygen element to an aluminum element in the area (S) of the aluminum vapor deposition layer (B) is in the above range, the bending strength, the storage stability, and the like tend to further improve.The maximum value (O / Al) MAX of the molar ratio of an oxygen element to an aluminum element in the aluminum oxide layer (B1) may be larger than the molar ratio (O / Al)s of an oxygen element to an aluminum element in the area (S) of the aluminum vapor deposition layer (B), and vice versa. That is, the maximum value (O / Al) MAX of the molar ratio of an oxygen element to an aluminum element in the aluminum oxide layer (B1) denotes the maximum value in the aluminum oxide layer (B1), and does not necessarily coincide with the maximum value in the aluminum vapor deposition layer (B). Further, apart from the area (S), the alumina layer (B3) may include a portion in which the molar ratio (O / Al) of an oxygen element to an aluminum element is higher than the value of (O / Al) MAX or (O / Al)s.The average thickness of the aluminum vapor deposition layer (B) is 30 nm or more and 100 nm or less. The lower limit of the average thickness of the aluminum vapor deposition layer (B) is preferably 35 nm, more preferably 45 nm, even more preferably 55 nm, and even more preferably 65 nm. When the average thickness of the aluminum vapor deposition layer (B) is at or above the lower limit, the gas barrier properties, the bending strength, the storage stability, and the like of the vapor deposition film can be further improved. The upper limit of the average thickness of the aluminum vapor deposition layer (B) is preferably 90 nm, and may be 80 nm, 70 nm, or 60 nm.The aluminum vapor deposition layer (B) can be effectively provided by, for example, a vacuum vapor deposition method. For example, when vacuum evaporation of aluminum is performed on a resin film becoming the barrier layer (A) during transportation of the resin film, the evaporation is performed while a small amount of oxygen gas is supplied to the resin film just before the evaporation. Accordingly, an aluminum element in the form of an aluminum oxide is disposed on a surface of the resin film (barrier layer (A)) to form the aluminum oxide layer (B1). The maximum value (O / Al) MAX of the molar ratio of an oxygen element (O) to an aluminum element (Al) in the aluminum oxide layer (B1) may be controlled by the supply amount of the oxygen gas blown onto the resin film or the like. The supply amount of the oxygen gas to the resin film may be, for example, 20 mL / min or more and 180 mL / min. By supplying the oxygen gas, the pressure during vacuum evaporation is reduced. The oxygen gas is preferably supplied such that the pressure during vacuum evaporation is 1.0×10 -4 Pa or more and 1.0×10 -3 Pa or less. Note that an appropriate supply amount of the oxygen gas and an appropriate pressure are appropriately set according to the deposition rate of the aluminum and the like.Note that, due to exposure to the air atmosphere or the like, an oxide film is typically formed on a surface of the vapor deposition film in which the aluminum vapor deposition layer (B) has been provided by the vacuum deposition method, and this oxide film may serve as the aluminum oxide layer (B3). Further, the aluminum vapor deposition layer (B) may be provided by a vapor deposition method different from the above-described method. The aluminum vapor deposition layer (B) may be provided by a sputtering method, an ion plating method, an ion beam mixing method, a plasma CVD method, a laser CVD method, an MO-CVD method, a thermal CVD method, or the like.Before vapor deposition, the surface of the barrier layer (A) on which the vapor deposition is performed may be subjected to plasma treatment. A known method can be used as the plasma treatment, and atmospheric pressure plasma treatment is preferred. Examples of a discharge gas in the atmospheric pressure plasma treatment include a nitrogen gas, helium, neon, argon, krypton, xenon, radon, and the like.Adhesive resin layer (C)The vapor deposition film of the present invention preferably further comprises the polyolefin layer (D) disposed on an opposite surface of the barrier layer (A) to the aluminum vapor deposition layer (B) with the adhesive resin layer (C) interposed therebetween.The adhesive resin layer (C) typically contains an adhesive resin as a main component. The adhesive resin is not particularly limited as long as it is a resin having adhesiveness, and examples thereof include acid-modified polyolefins (a carboxylic acid-modified polyolefin, a sulfonic acid-modified polyolefin, etc.), epoxy-modified polyolefins, and the like. The adhesive resin is preferably a thermoplastic resin. The adhesive resin is preferably an acid-modified polyolefin (acid-modified polyethylene, acid-modified polypropylene or the like), and more preferably acid-modified polyethylene. Further, the adhesive resin is also preferably a carboxylic acid-modified polyolefin, and more preferably carboxylic acid-modified polyethylene.The carboxylic acid-modified polyolefin may be a polyolefin having a carboxy group or an anhydride group thereof. The carboxylic acid-modified polyolefin (polyolefin having a carboxy group or an anhydride group thereof) can be obtained by, for example, chemically bonding an ethylenically unsaturated carboxylic acid or an anhydride thereof to an unmodified polyolefin by an addition reaction, a grafting reaction or the like.The unmodified polyolefin used in the preparation of the carboxylic acid-modified polyolefin is preferably polyethylene or polypropylene, and more preferably polyethylene.Examples of the ethylenically unsaturated carboxylic acid and the anhydride thereof include monocarboxylic acids, monocarboxylic acid esters, dicarboxylic acids, dicarboxylic acid monoesters, dicarboxylic acid diesters, dicarboxylic acid anhydrides and the like. Specific examples include maleic acid, fumaric acid, itaconic acid, maleic anhydride, itaconic anhydride, maleic monomethyl ester, maleic monoethyl ester, diethyl maleate, monomethyl fumarate and the like. Among these, dicarboxylic anhydrides such as maleic anhydride, itaconic anhydride and the like are preferred, and maleic anhydride is more preferred. That is, the adhesive resin is also preferably a maleic anhydride modified polyolefin, and more preferably maleic anhydride modified polyethylene.The carboxylic acid-modified polyolefin can be obtained by, for example, introducing the ethylenically unsaturated carboxylic acid or the anhydride thereof into the unmodified polyolefin by an addition reaction or a graft reaction in the presence of a solvent such as xylene and a catalyst such as a peroxide. Here, the lower limit of the addition amount or the grafting amount (modification degree) of the carboxylic acid or the anhydride thereof with respect to the unmodified polyolefin is preferably 0.01 mass %, and more preferably 0.02 mass % with respect to the unmodified polyolefin. On the other hand, the upper limit of the addition amount or the grafting amount (modification degree) is preferably 15 mass %, and more preferably 10 mass %, with respect to the unmodified polyolefin.The content of the adhesive resin in the adhesive resin layer (C) is preferably 80 mass % or more and 100 mass % or less, more preferably 90 mass % or more and 100 mass % or less, and more preferably 97 mass % or more and 100 mass % or less. The adhesive resin layer (C) may contain, as a component other than the adhesive resin, an antioxidant, an ultraviolet absorbent, a plasticizer, an antistatic agent, a lubricant, a dye, a filler, a heat stabilizer, a resin other than the adhesive resin, or the like.The adhesive resin layer (C) may be an unstretched layer or a stretched layer.The lower limit of the average thickness of the adhesive resin layer (C) is preferably 0.1 μm, more preferably 0.5 μm, even more preferably 1 μm, and may be 2 μm. When the average thickness of the adhesive resin layer (C) is at or above the lower limit, for example, sufficient adhesion strength can be obtained. The upper limit of the average thickness of the adhesive resin layer (C) is preferably 20 μm, more preferably 10 μm, even more preferably 5 μm, and may be 3 μm. When the average thickness of the adhesive resin layer (C) is at or below the upper limit, for example, the thickness of the vapor deposition film can be reduced.Polyolefin layer (D)In the case where the vapor deposition film comprises the polyolefin layer (D), the water vapor barrier properties, the bending strength, the storage stability, and the like can be improved. Further, in the case of an evaporation film in which the polyolefin layer (D) is an uppermost layer, for example, the evaporation film can be easily formed also in the form of a bag or the like by heat-sealing the polyolefin layer (D) as a thermally molten layer. In the case where the vapor deposition film of the present invention is formed in a bag shape, the innermost layer may be the polyolefin layer (D).The polyolefin layer (D) contains a polyolefin as a main component. Examples of the polyolefin include olefin homopolymers and copolymers such as polyethylene (linear low density polyethylene, low density polyethylene, medium density polyethylene, high density polyethylene, etc.), ethylene-propylene copolymers, polypropylene, propylene-α-olefin (α-olefin having 4 to 20 carbon atoms) copolymers, polybutene, polypentene, and the like. Among these, polyethylene or polypropylene is preferred, and polypropylene is more preferred. One kind or two or more kinds of polyolefins may be used.The content of the polyolefin in the polyolefin layer (D) is preferably 80 mass % or more and 100 mass % or less, more preferably 90 mass % or more and 100 mass % or less, and more preferably 97 mass % or more and 100 mass % or less. The polyolefin layer (D) may contain, as a component other than the polyolefin, an antioxidant, an ultraviolet absorbent, a plasticizer, an antistatic agent, a lubricant, a dye, a filler, a heat stabilizer, a resin other than the polyolefin, or the like.The polyolefin layer (D) may be an unstretched layer or a stretched layer.The lower limit of the average thickness of the polyolefin layer (D) is preferably 1 μm, more preferably 5 μm, and even more preferably 10 μm. When the average thickness of the polyolefin layer (D) is at or above the lower limit, sufficient moisture barrier properties and the like can be obtained. The upper limit of the average thickness of the polyolefin layer (D) is preferably 100 μm, more preferably 50 μm, and even more preferably 30 μm. When the average thickness of the polyolefin layer (D) is at or below the upper limit, for example, the thickness of the vapor deposition film can be reduced.The polyolefin layer (D) may be composed of a single layer or multiple layers.The barrier layer (A), the adhesive resin layer (C) and the polyolefin layer (D) are preferably at least uniaxially stretched, and more preferably biaxially stretched. In such a case, the gas barrier properties, the bending strength, the storage stability and the like of the vapor deposition film can be further improved. For example, the barrier layer (A), the adhesive resin layer (C) and the polyolefin layer (D) are preferably at least uniaxially stretched twice or more and less than twelve times, and more preferably at least uniaxially stretched three times or more and less than six times. Further, the barrier layer (A), the adhesive resin layer (C) and the polyolefin layer (D) are also preferably biaxially stretched twice or more and less than twelve times in each direction, and more preferably biaxially stretched three times or more and less than six times in each direction.The barrier layer (A), the adhesive resin layer (C) and the polyolefin layer (D) are preferably integrally stretched. For example, the barrier layer (A), the adhesive resin layer (C) and the polyolefin layer (D) may be a stretched multilayer film in which these layers are stacked in this order. Further, the vapor deposition film can be obtained by providing the aluminum vapor deposition layer (B) by vapor deposition on a surface of a multilayer film in which the barrier layer (A), the adhesive resin layer (C) and the polyolefin layer (D) are stacked in this order, this surface being on the barrier layer (A) side.A method for producing the multilayer film comprising the barrier layer (A), the adhesive resin layer (C) and the polyolefin layer (D) is not particularly limited, and a coextrusion method is preferred. By employing the coextrusion method, the film properties such as gas barrier properties and flexibility, process passability (reduction of film thickness variations), and economic efficiency (a targeted feature (for example, reduction of the thickness of the barrier layer (A)) can be easily obtained in a small number of steps) can be well balanced at a high level. That is, the barrier layer (A), the adhesive resin layer (C) and the polyolefin layer (D) are preferably a coextruded film. Examples of the coextrusion process include coextrusion casting molds, coextrusion inflation molds, coextrusion coating molds, and the like.The vapor deposition film of the present invention may comprise other layer(s) besides the barrier layer (A), the aluminum vapor deposition layer (B), the adhesive resin layer (C) and the polyolefin layer (D). Examples of the other layer(s) include the above-mentioned coating layer, another thermoplastic resin layer, another vapor deposition layer, a paper layer, a metal foil layer, and the like. One kind or two or more kinds of layers may be used as the other layer(s).Layer configuration, etc.Examples of a layer configuration of the vapor deposition film of the present invention include:(1) A / B;(2) D / C / A / B;(3) X / / D / C / A / B;(4) A / B / / X;(5) D / C / A / B / / X; and(6) X / / D / C / A / B / / X.Note that A denotes the barrier layer, B denotes the aluminum vapor deposition layer, C denotes the adhesive resin layer, D denotes the polyolefin layer, and X denotes the other layer(s).The average thickness of the vapor deposition film of the present invention is not particularly limited, and the lower limit may be, for example, 5 μm, 10 μm, or 15 μm. On the other hand, the upper limit of the average thickness may be, for example, 200 μm, 100 μm, 50 μm, 30 μm, or 20 μm. The shape of the vapor deposition film is not particularly limited as long as it has a layered structure.The oxygen permeability of the vapor deposition film of the present invention is preferably less than 1.0 mL / (m 2 ·day·atm), more preferably less than 0.10 mL / (m 2 ·day·atm), still more preferably less than 0.05 mL / (m 2 ·day·atm), and particularly preferably less than 0.01 mL / (m 2 ·day·atm). When the oxygen permeability is below the upper limit, the vapor deposition film can be particularly suitably used as various packaging materials and the like. On the other hand, the lower limit of the oxygen permeability may be 0 mL / (m 2 ·day·atm) or 0.001 mL / (m 2 ·day·atm). The oxygen permeability of the vapor deposition film is a value measured according to the method disclosed in ISO14663-2 Annex C (1999), under conditions including 20° C. and 65% RH.The vapor deposition film of the present invention is characterized by bending strength and storage stability. Further, the vapor deposition film also has favorable gas barrier properties. Therefore, the vapor deposition film can be used for various applications. Examples of the application of the vapor deposition film include various packaging materials for food packaging, medical packaging, industrial chemical packaging, agricultural chemical packaging, etc., a vacuum insulated bag, and the like.Multilayer StructureThe vapor deposition film of the present invention is also suitably used as a multilayer structure in which another layer is disposed on the vapor deposition film.Polyolefin layer (E)A multilayer structure according to an embodiment of the present invention comprises the vapor deposition film of the present invention and a polyolefin layer (E) disposed on at least one surface of the vapor deposition film directly or via another intermediate layer. In the case where the multilayer structure includes both the vapor deposition film and the polyolefin layer (E), in addition to the gas barrier properties, the water vapor barrier properties and the like can be improved. Further, in the case of a multilayer structure in which the polyolefin layer (E) is an uppermost layer, for example, the multilayer structure can be easily formed also in the form of a bag or the like by heat-sealing the polyolefin layer (E) as a thermally molten layer. In the case where the multilayer structure of the present invention is formed in a bag shape, the innermost layer may be the polyolefin layer (E).In the case where the vapor deposition film included in the multilayer structure of the present invention comprises the polyolefin layer (D), the polyolefin layer (D) is a layer of the coextruded film, while the polyolefin layer (E) is, for example, a layer provided separately by extrusion lamination or the like; therefore, these polyolefin layers can be distinguished from each other. Note that a method of disposing the polyolefin layer (E) is not particularly limited.The polyolefin layer (E) may be directly disposed on the vapor deposition film of the present invention or may be disposed with another layer interposed therebetween.Examples of the other layer include an adhesive layer and the like. Examples of the adhesive layer include a layer using an adhesive resin similar to that in the above-described adhesive resin layer (C), a layer of a curable adhesive (e.g., a two-component polyurethane adhesive), and the like.A concrete mode of the composition of the polyolefin layer (E) is similar to that of the polyolefin layer (D). A polyolefin which is a main component of the polyolefin layer (E) is preferably polyethylene or polypropylene.The polyolefin layer (E) may be an unstretched layer or a stretched layer. In the case where the multilayer structure of the present invention is formed in a bag shape and the innermost layer is the polyolefin layer (E), from the viewpoint that the heat sealing properties are advantageous, the polyolefin layer (E) serving as the innermost layer is preferably an unstretched layer. In the case where the multilayer structure of the present invention is formed in a bag shape and the outermost layer is the polyolefin layer (E), from the viewpoint that the mechanical strength is advantageous, the polyolefin (E) serving as the outermost layer is preferably stretched and more preferably biaxially stretched.The lower limit of the average thickness of the polyolefin layer (E) is preferably 5 μm, more preferably 10 μm, even more preferably 15 μm, and may be 20 μm, 30 μm, or 40 μm. When the average thickness of the polyolefin layer (E) is at or above the lower limit, for example, sufficient moisture barrier properties can be obtained. Further, in a case where the polyolefin layer (E) is an uppermost layer, when the average thickness of the polyolefin layer (E) is at or above the lower limit, sufficient heat sealing properties can also be obtained. The upper limit of the average thickness of the polyolefin layer (E) is preferably 200 μm, more preferably 100 μm, and may be 60 μm or 40 μm. When the average thickness of the polyolefin layer (E) is at or below the upper limit, for example, the thickness of the multilayer structure may be reduced.In a case where the polyolefin layer (E) is disposed on the polyolefin layer (D), from the viewpoint of preventing deterioration of gas barrier properties after storage, the total thickness of the polyolefin layer (D) and the polyolefin layer (E) is preferably 40 μm or more, more preferably 50 μm or more, even more preferably 55 μm or more, and particularly preferably 60 μm or more. The total thickness of the polyolefin layer (D) and the polyolefin layer (E) may be, for example, 200 μm or less.The polyolefin layer (E) may consist of a single layer or multiple layers.In the multilayer structure of the present invention, polyolefin layers (E) may be respectively disposed on both surfaces of the vapor deposition film of the present invention directly or via another intermediate layer. In the multilayer structure in such a mode, the two polyolefin layers (E) may preferably be the uppermost layers.In the case where the polyolefin layers (E) are respectively disposed on the both surfaces of the vapor deposition film of the present invention directly or via another intermediate layer, the polyolefin layers (E) preferably contain a similar resin as a main component. The same resin means that, for example, the two resins are polyethylene or that the two resins are polypropylene. In the sense of the similar resin, the resins may differ from each other in density, melting point, whether stretched or unstretched, etc. For example, two polyolefin layers (E) may be arranged one on top of the other using the same material. In the case where the two polyolefin layers (E) contain a similar resin as a main component, advantages such as an improvement in recycleability and the like can be obtained. For example, excellent compatibility in recovery and melt molding can be obtained, and therefore a recycled product having good appearance can be formed.Other Vapor Deposition FilmThe multilayer structure of the present invention may further comprise another vapor deposition film (second vapor deposition film) disposed on the vapor deposition film of the present invention (first vapor deposition film) directly or via another intermediate layer. In other words, the multilayer structure of the present invention may comprise a plurality of vapor deposition films, at least one of the plurality of vapor deposition films being the vapor deposition film of the present invention. The multilayer structure including the plurality of vapor deposition films is further characterized by gas barrier properties, bending strength, storage stability, and the like.The plurality of vapor deposition films may be directly stacked or may be stacked with another layer interposed therebetween. Examples of the other layer include an adhesive layer, the polyolefin layer (E), a polyamide layer (F) described later, and the like, and an adhesive layer is preferable. A plurality of layers may be present between the plurality of vapor deposition films.The other vapor deposition film (second vapor deposition film) includes, for example, a barrier layer (a) made of a resin and an aluminum vapor deposition layer (b) directly disposed on the barrier layer (a) and having an average thickness of 30 nm or more and 100 nm or less. Concrete modes and suitable modes of the barrier layer (a) and the aluminum vapor deposition layer (b) are similar to the concrete modes and suitable modes of the barrier layer (A) and the aluminum vapor deposition layer (B) of the vapor deposition film of the present invention.It is preferable that the aluminum vapor deposition layer (b) includes an aluminum oxide layer (b1) and an aluminum layer (b2) sequentially arranged in this order from a surface in contact with the barrier layer (a), that in an elemental analysis in the depth direction of the aluminum oxide layer (b1), a maximum value (O / Al) MAX of a molar ratio of an oxygen element to an aluminum element is 0.5 or more and 2.0 or less, the molar ratio being measured with a scanning X-ray photoelectron spectrometer, and that in a depth direction analysis of the aluminum layer (b2), a minimum value (O / Al) MIN of a molar ratio of an oxygen element to an aluminum element is less than 0.5, wherein the molar ratio is measured with a scanning X-ray photoelectron spectrometer. It is more preferable that the aluminum vapor deposition layer (b) comprises an aluminum oxide layer (b3) having an area (s) opposite to the area in contact with the barrier layer (a), and that in elemental analysis of the area (s), a molar ratio (O / Al)s of an oxygen element to an aluminum element is 0.5 or more and 2.0 or less, the molar ratio being measured with a scanning X-ray photoelectron spectrometer. Concrete modes and suitable modes of the alumina layer (b1), the aluminum layer (b2) and the alumina layer (b3) are similar to the concrete modes and suitable modes of the alumina layer (B1), the aluminum layer (B2) and the alumina layer (B3) in the aluminum vapor deposition layer (B) of the vapor deposition film of the present invention.The multilayer structure of the present invention may comprise two vapor deposition films of the present invention. The multilayer structure of the present invention may comprise three or more vapor deposition films of the present invention. In the case where the multilayer structure of the present invention comprises two or more vapor deposition films of the present invention, these vapor deposition films may be the same or different from each other.Polyamide layer (F)The multilayer structure of the present invention may further comprise the polyamide layer (F) disposed on the vapor deposition film directly or via another intermediate layer. When the multilayer structure includes the polyamide layer (F), the gas barrier properties and the like can be further improved.The vapor deposition film and the polyamide layer (F) may be directly stacked or may be stacked with another layer interposed therebetween. Examples of the other layer include an adhesive layer, the polyolefin layer (E), and the like. A plurality of layers may be present between the plurality of vapor deposition films.The polyamide layer (F) is preferably at least one of the uppermost layers of the multilayer structure. In the case where the multilayer structure of the present invention is formed in a bag shape, the outermost layer may be the polyamide layer (F). In one embodiment of the multilayer structure of the present invention, one uppermost layer may be the polyolefin layer (E) and the other uppermost layer may be the polyamide layer (F).The polyamide layer (F) typically contains a polyamide as a main component. The polyamide is a resin containing an amide bond. The polyamide can be obtained, for example, by ring-opening polymerization of a lactam having a three- or more membered ring, polycondensation of polymerizable ω-amino acids, polycondensation between a dibasic acid and a diamine, or the like. Examples of the polyamide include polycapramide (nylon 6), poly-ω-aminoheptanoic acid (nylon 7), poly-ω-aminononanoic acid (nylon 9), polyundecaneamide (nylon 11), polylauryllactam (nylon 12), polyethylenediamine adipamide (nylon 26), polytetramethylene adipamide (nylon 46), polyhexamethylene adipamide (nylon 66), polyhexamethylene sebacamide (nylon 610), polyhexamethylene dodecanamide (nylon 612), polyoctamethylene adipamide (nylon 86), polydecamethylene adipamide (nylon 108), a caprolactam / lauryl lactam copolymer (nylon 6 / 12), a caprolactam / ω-aminononanoic acid copolymer (nylon 6 / 9), a caprolactam / hexamethylenediamine adipate copolymer (nylon 6 / 66), a lauryllactam / hexamethylenediamine adipate copolymer (nylon 12 / 66), a hexamethylenediamine adipate / hexamethylenediamine sebacate copolymer (nylon 66 / 610), an ethylenediammonium adipate / hexamethylenediamine adipate copolymer (nylon 26 / 66), a caprolactam / hexamethylenediamine adipate / hexamethylenediamine sebacate copolymer (nylon 6 / 66 / 610), polyhexamethylene isophthalamide (nylon 6L), polyhexamethylene terephthalamide (nylon 6T), a hexamethylene isophthalamide / terephthalamide copolymer (nylon 6L / 6T), and the like.The content of the polyamide in the polyamide layer (F) is preferably 80 mass % or more and 100 mass % or less, more preferably 90 mass % or more and 100 mass % or less, and more preferably 97 mass % or more and 100 mass % or less. The polyamide layer (F) may contain, as a component other than the polyamide, an antioxidant, an ultraviolet absorbent, a plasticizer, an antistatic agent, a lubricant, a dye, a filler, a heat stabilizer, a resin other than the polyamide, or the like.The polyamide layer (F) may be an unstretched layer or a stretched layer.The lower limit of the average thickness of the polyamide layer (F) is preferably 1 μm, more preferably 3 μm, even more preferably 5 μm, and even more preferably 10 μm. When the average thickness of the polyamide layer (F) is at or above the lower limit, the gas barrier properties, the bending strength, the storage stability, and the like can be improved. The upper limit of the average thickness of the polyamide layer (F) is preferably 100 μm, more preferably 50 μm, and may be 30 μm. When the average thickness of the polyamide layer (F) is at or below the upper limit, for example, the thickness of the multilayer structure may be reduced.The polyamide layer (F) may be composed of a single layer or multiple layers.Other layer(s)The multilayer structure of the present invention may comprise other layer(s) besides the vapor deposition film, the polyolefin layer (E) and the polyamide layer (F) described above. Examples of the other layer(s) include an adhesive layer, another thermoplastic resin layer, a paper layer, a metal foil layer, and the like.In the case where the multilayer structure of the present invention comprises an adhesive layer, the average thickness of the adhesive layer is preferably, for example, 0.1 μm or more and 10 μm or less, more preferably 0.3 μm or more and 5 μm or less, and even more preferably 0.5 μm or more and 3 μm or less. When the average thickness of the adhesive layer is in the above range, for example, the weight of the multilayer structure can be reduced while obtaining sufficient adhesiveness.Layer configuration, etc.Examples of a layer configuration of the multilayer structure of the present invention include:(1) / E vapor deposition film;(2) vapor deposition film / / F / E;(3) E / / FLASH FILM / / E;(4) E / / FLASH FILM / / E / / E;(5) F / / FLASH FILM / / E;(6) E / / FLASH FILM / / F / / E;(7) F / / FLASH FILM / / F / / E;(8) E / / FLASH FILM / / FLASH FILM / / E;(9) F / / FLASH FILM / / FLASH FILM / / E;(10) Vapor deposition film / / vapor deposition film / / E; and(11) F / Vapor Deposition Film / / Vapor Deposition Film / / E.It should be noted that E denotes the polyolefin layer and F denotes the polyamide layer. Among the above-mentioned layer configurations, the one in which another layer is disposed at an arbitrary position is also an example of the multilayer structure of the present invention. The layer configuration of the vapor deposition film in each of the above-mentioned layer configurations is as described above. Further, the orientation of the vapor deposition film is not particularly limited. For example, in the case where the multilayer structure having the layer configuration (1) "vapor deposition film / / E" includes a vapor deposition film having a layer configuration "A / B", the layer configuration may be either "A / B / / E" or "B / A / / E".In the multilayer structure of the present invention, the thickness ratio of the barrier layer (A) with respect to the total thickness of the multilayer structure (the average thickness of the barrier layer (A) with respect to the average thickness of the entire multilayer structure) may be, for example, 10% or less, is preferably 5% or less, and may be more preferably 4% or less, 3% or less, or 2% or less. When the thickness ratio of the barrier layer (A) is at or below the upper limit, advantages such as improvement in recycleability and the like can be obtained. For example, excellent compatibility in recovery and melt molding can be obtained, and therefore a recycled product having good appearance can be formed. The lower limit of the thickness proportion of the barrier layer (A) is preferably 0.1%, and may more preferably be 0.2%, 0.5%, or 1%. When the thickness ratio of the barrier layer (A) is at or above the lower limit, for example, the gas barrier properties can be improved.The lower limit of the average thickness of the multilayer structure of the present invention (the average thickness of the entire multilayer structure) is preferably 10 μm, and may be 20 μm, 30 μm, or 50 μm. When the average thickness of the multilayer structure is at or above the lower limit, the gas barrier properties, the bending strength, the storage stability, and the like can be further improved. The upper limit of the average thickness of the multilayer structure is preferably 1000 μm, and may be 500 μm, 300 μm, 200 μm, or 100 μm. When the average thickness of the multilayer structure is at or below the upper limit, weight reduction, improvement in moldability, and the like can be achieved.The multilayer structure of the present invention can also be crushed for the purpose of reuse to be used as a melt molding material. The multilayer structure may be mixed and used with another melt molding material (another recycled resin, an unused resin or the like). The entire multilayer structure may be reused as a melt-molding material, or only a part of the multilayer structure may be separated and then reused as a melt-molding material.A method for producing the multilayer structure of the present invention is not particularly limited. For example, the multilayer structure can be obtained in the following manner: a film of the polyolefin layer (E), a film of the polyamide layer (F), another vapor deposition film and / or the like are / is disposed on the vapor deposition film by a known means such as dry lamination or the like. Alternatively, the multilayer structure can be obtained in the following manner: the polyolefin layer (E), the polyamide layer (F) and / or the like are / is disposed on the vapor deposition film by melt extrusion, for example.Examples of application of the multilayer structure of the present invention include various packaging materials for food packaging, medical packaging, industrial chemical packaging, agricultural chemical packaging, etc., a vacuum insulated bag, and the like.Packaging MaterialA packaging material of the present invention comprises the vapor deposition film of the present invention or the multilayer structure of the present invention. The packaging material is used for packaging, and the shape thereof is not limited. The packaging material may be plate-shaped or may be formed in a predetermined shape such as a bag shape or the like. From the viewpoint of heat-sealing properties and the like, an uppermost layer is preferably the polyolefin layer (D) or the polyolefin layer (E) serving as a thermally molten layer. Further, from the viewpoint of heat-sealing properties and the like, the polyolefin layer (D) or the polyolefin layer (E) which is the uppermost layer is preferably unstretched. In the case of a packaging material formed in a mold having the inside and the outside, such as a bag mold or the like, at least the innermost layer is preferably the polyolefin layer (D) or the polyolefin layer (E). From the viewpoint of further preventing deterioration of gas barrier properties after storage of the packaging material, the aluminum vapor deposition layer (B) is preferably disposed more outward than the barrier layer (A). Concretely, examples of a preferable layer configuration of the packaging material include {outer layer side (E) / / (B) / (A) / (C) / (D) / / (E) inner layer side} and the like. In particular, it is preferable that (A) / (C) / (D) are stretched and (E) is unstretched, because this configuration enables both the mechanical strength and the heat-sealing properties of the packaging material to be apt to be obtained. Further, when the total thickness of the inner layers (D) / / (E) is 55 μm or more, deterioration of gas barrier properties after storage can be prevented even when specific contents (contents having a water activity of 0.9 or more or a salinity of 0.5 g / g or more or containing oil) are packaged.The packaging material of the present invention is used, for example, for packaging foods, drinks, chemicals, medical devices, machine parts, garments and the like. In particular, the packaging material is preferably used for applications requiring barrier properties against oxygen and applications in which the inside of the packaging material is replaced with various function gases. Since the packaging material comprises the vapor deposition film of the present invention, deterioration of gas barrier properties after a bending treatment and after storage is prevented, and therefore excellent gas barrier properties can be maintained over a long period of time. Further, in the packaging material of the present invention, the aluminum vapor deposition layer (B) is less likely to be peeled from the barrier layer (A), and therefore deterioration in appearance after storage is also prevented.The packaging material is formed into a vertical filling and sealing bag, a spout bag, a laminated tube container, a container lid material, a vacuum packaging bag and the like according to the application in various modes.The vertical filling and sealing bag is used, for example, for packaging foods, beverages and the like in the form of a liquid, a viscous part, a powder, loose solids or a combination thereof. The vertical bag for filling and sealing is formed by heat-sealing the vapor deposition film or the multilayer structure. In the case where the heat sealing is carried out, it is typically necessary to provide, in the vapor deposition film or the multilayer structure, a heat sealable layer (for example, the polyolefin layer (D) or the polyolefin layer (E)) as an inner layer of the vertical filling and sealing bag or as both an inner layer and an outer layer of the vertical filling and sealing bag. In the case where the heat sealable layer is only on the inside of the vertical fill and seal bag, a body portion is typically sealed by means of pad sealing (pillow sealing). In the case where the heat sealable layer is on both the inside and outside of the vertical fill and seal bag, the body portion is typically sealed by envelope sealing (envelope sealing).The spout bag is used for packaging liquid substances, for example liquid beverages such as soft drinks, jellies, joratch, fruit fruits, spices, functional water, liquid diets and the like. The laminated tube container is used for, for example, packaging cosmetics, chemicals, medicines, foods, dentifrices and the like. The container lid material is a lid material for a container in which foods such as processed meat, processed vegetables, processed seafood or fruit, or the like are packaged.Vacuum Packaging BagA vacuum packaging bag of the present invention comprises a packaging bag formed from the packaging material of the present invention, and the inside of the packaging bag has a reduced pressure. The vacuum bag is used for applications where the contents are to be packaged in a vacuum state, for example, for storing foods, beverages, etc., as a coating material for a vacuum insulation, and the like. Since such a vacuum packaging bag comprises the vapor deposition film of the present invention, deterioration of gas barrier properties after a bending treatment and after a storage is prevented, and therefore a high vacuum state can be maintained for a long period of time. A multilayer structure suitably used in the vacuum packaging bag preferably comprises a plurality of vapor deposition films. Further, in a case where high mechanical strength is required, the polyamide layer (F) is preferably provided. Examples of a layer configuration of the multilayer structure suitably used in the vacuum packaging bag include {outer side (F) / / (A) / (B) / / (A) / (B) / / (E) inner side}, {outer side (F) / / (A) / (B) / / (B) / (A) / / (E) inner side} and the like, wherein it is more preferable that one of the barrier layers (A) is an EVOH and the other is PET.Vacuum Insulation MaterialA vacuum insulation fabric of the present invention comprises the vacuum packaging bag of the present invention and a core material disposed within the vacuum packaging bag. In the case of the vacuum insulation material, the vacuum packaging bag is also referred to as outer packaging material. The vacuum insulation material is used for applications where cold, heat, etc. are to be maintained. Examples of the core material include fiberglass, polyurethane foam, and the like. In the vacuum insulation fabric, the core material in the vacuum packaging bag (outer packaging material) is vacuum-sealed. The vacuum packaging bag (the outer packaging material) is formed by, for example, heat-sealing the vapor deposition film or the multilayer structure.In the vacuum insulation material of the present invention, the vacuum packaging bag (the outer packaging material) comprises the vapor deposition film; therefore, deterioration of the gas barrier properties after a bending treatment and after storage is prevented, and therefore, a high heat insulation effect can be maintained over a long period of time. The vacuum insulation material can be used as heat insulating materials for home electronics such as refrigerators, hot water feeders, rice cookers, etc., heat insulating materials for residential buildings used in wall portions, ceiling portions, roof floor portions, floor portions, etc., car roof materials, automatic machine heat insulating panels, etc., and the like.EXAMPLESHereinafter, the present invention will be described in detail by way of Examples, and the present invention is not limited to these Examples.Note that, hereinafter, an aluminum vapor deposition layer may be abbreviated as "Al vapor deposition layer", a polyolefin may be abbreviated as "PO", and a polyamide may be abbreviated as "PA".Materials 1 UsedBarrier layer (A)EVOH-1: an EVOH having an ethylene unit content of 32 mol%, a saponification degree of 99.9 mol%, and an MFR (190°C, load of 2.16 kg) of 1.6 g / 10 minOPET: "Lumirror (registered trademark) P60" (manufactured by Toray Industries, Inc., biaxially stretched PET film; average thickness: 12 μm)Evaluation Method 1(1) Molar ratio (O / Al) of an oxygen element to an aluminum element in the aluminum vapor deposition layer (B)With respect to the aluminum vapor deposition layer (B) of each of the vapor deposition films obtained in Examples and Comparative Examples, a molar ratio (O / Al) of an oxygen element to an aluminum element was measured using a scanning X-ray photoelectron spectrometer "PHIQuba SXM," manufactured by ULVAC-PHI, Inc., while sputtering in argon was performed in the thickness (depth) direction. Note that the measurement was performed under conditions in which AlKα (1486.6 eV) was used as an X-ray source, the X-ray diameter was 100 μmφ (25 W, 15 kV), the measurement range was 300 μm (horizontal)×300 μm (vertical), the signal receiving angle was 45°, and the pressure was 1×10 -6 Pa.A molar ratio of an oxygen element to an aluminum element at a measurement point at which the molar ratio of an oxygen element observed on the barrier layer (A) side (i.e., in the aluminum oxide layer (B1)) was the maximum value was defined as (O / Al) MAX and a molar ratio of an oxygen element to an aluminum element at a measurement point at which the molar ratio of an oxygen element was the minimum value (i.e., in the aluminum layer (B2)) was defined as (O / Al) MIN. Further, the molar ratio (O / Al)s of an oxygen element to an aluminum element in the area (S) of the aluminum vapor deposition layer (B) opposite to the area in contact with the barrier layer (A) was also measured.(2) Oxygen Permeability (OTR)A part was cut out from each of the vapor deposition films obtained in Examples and Comparative Examples, and its OTR was subjected to the method disclosed in ISO14663-2 Annex C (1999) under conditions including 20° C. and 65% RH by means of an oxygen permeability meter OX-TRAN 2 / 21 manufactured by MOCON INC. (Detection limit: 0.01 mL / (m 2 ·day·atm)) measured and evaluated according to the following criteria.Determination CriteriaA: Less than 0.01 mL / (m 2 ·day·atm) (below the detection limit) B: 0.01 mL / (m 2 ·day·atm) or more and less than 0.05 mL / (m 2 ·day·atm) C: 0.05 mL / (m 2 ·day·atm) or more and less than 0.10 mL / (m 2 ·day·atm) D: 0.10 mL / (m 2 ·day·atm) or more and less than 1.0 mL / (m 2 ·day·atm) E: 1.0 mL / (m 2 ·day·atm) or more(3) OTR Difference between before and after Bending TestA sample having a size of 21 cm × 30 cm was cut out from each of the vapor deposition films obtained in Examples and Comparative Examples, and subjected to Gelblo Flex Test (Bending Test) according to ASTM F 392 by means of Gelblo Flex Tester (BE-1005) manufactured by Tester Sangyo Co., Ltd. Specifically, in an atmosphere of 23° C. / 50% RH, the cut-out vapor deposition film was deformed into a cylindrical shape having a diameter of 3.5 inches, the both ends were attached to the Geldo Flex Tester, the initial pitch and the pitch at the maximum bending were set to 7 inches and 1 inch, respectively, the sample was twisted at an angle of 440° at the first 3.5 inches of stroke and then moved straight and horizontally by the remaining 2.5 inches, and this repeated mutual movement was performed three times. After the bending test, a part of the bent portion of the vapor deposition film after the bending test was cut out, and its OTR was measured according to the method disclosed in ISO14663-2 Annex C (1999), under conditions including 20° C. and 65% RH, by means of an oxygen permeability meter OX-TRAN 2 / 21 manufactured by MOCON INC. (Detection limit: 0.01 mL / (m 2 ·day·atm)). The OTR difference between before and after the Flex Test (OTR after Test - OTR before Test) was calculated and this OTR difference was evaluated according to the following criteria. When the evaluation was A to D, it was determined that the bending strength was advantageous.Determination CriteriaA: Less than 0.05 mL / (m 2 ·day·atm) B: 0.05 mL / (m 2 ·day·atm) or more and less than 0.10 mL / (m 2 ·day·atm) C: 0.10 mL / (m 2 ·day·atm) or more and less than 0.15 mL / (m 2 ·day·atm) D: 0.15 mL / (m 2 ·day·atm) or more and less than 0.20 mL / (m 2 ·day·atm) E: 0.20 mL / (m 2 ·day·atm) or more(4) OTR Difference between before and after Storage TestUsing a sample obtained by cutting a part from each of the vapor deposition films obtained in Examples and Comparative Examples, a storage test was performed in an atmosphere of 20° C. / 65% RH for 20 days, and the oxygen permeability of the sample after the storage test was determined according to the method disclosed in ISO14663-2 Annex C (1999) under conditions including 20° C. and 65% RH by means of an oxygen permeability meter OX-TRAN 2 / 21 manufactured by MOCON INC. (Detection limit: 0.01 mL / (m 2 ·day·atm)). The OTR difference between before and after the storage test (OTR after the test - OTR before the test) was calculated and evaluated according to the following criteria. When the evaluation was A to D, it was determined that the storage stability was advantageous.Determination CriteriaA: Less than 0.05 mL / (m 2 ·day·atm) B: 0.05 mL / (m 2 ·day·atm) or more and less than 0.10 mL / (m 2 ·day·atm) C: 0.10 mL / (m 2 ·day·atm) or more and less than 0.15 mL / (m 2 ·day·atm) D: 0.15 mL / (m 2 ·day·atm) or more and less than 0.20 mL / (m 2 ·day·atm) E: 0.20 mL / (m 2 ·day·atm) or moreExample 1An unstretched film having an average thickness of 170 μm was obtained in the following manner: By means of a single screw extruder, the EVOH-1 was melted at 240°C and extruded from a die onto a casting roll while blowing the air by means of an air doctor at a wind speed of 30 m / s. The obtained unstretched film was brought into contact with warm water at 80°C for 10 seconds, stretched 3.2 times in the longitudinal direction and 3.0 times in the transverse direction using a simultaneous tenter type biaxial stretcher at 90°C, and further subjected to heat treatment in a tenter set at 170°C for 5 seconds, thus obtaining a biaxially stretched EVOH film (barrier layer (A)) having an average thickness of 12 μm and a total width of 3.6 m. While the obtained biaxially stretched EVOH film was wound up, a slit having a width of 80 cm was cut with respect to the central position of the total film width, whereby a biaxially stretched EVOH film having a length of 4000 m was obtained.Using a roll type vacuum deposition apparatus "EWA-105," manufactured by Japan Vacuum Engineering Co., Ltd., which has a transport chamber and a deposition chamber, the aluminum layer (B) was formed on the obtained biaxially stretched EVOH film (deposition base) by the following method. "EWA-1 05" was equipped with a winder and a winder on the side of the transport chamber, a crucible for heating aluminum, and a cooling can for cooling the film during its transport were provided in the evaporation chamber, and the film was transported along the cooling can. The obtained biaxially stretched EVOH film was transported by means of the cooling can cooled to -30°C at a transport speed of 150 m / min. In addition, a nozzle for directly blowing oxygen onto the biaxially stretched EVOH film before evaporation (nozzle gap: 2 mm; nozzle width: 21 cm; film-nozzle distance: 2 cm; angle with respect to the film: 30°) was installed in the evaporation chamber, and aluminum was evaporated in vacuum while blowing oxygen at 80 mL / min; thus, an evaporation film was produced in which the aluminum evaporation layer (B) having an average thickness of 40 nm was formed on the biaxially stretched EVOH film. Note that the pressure in the deposition chamber was 5×10 -4 Pa to 9×10 -4 Pa. The average thickness of the aluminum vapor deposition layer (B) was adjusted by appropriately controlling the voltage applied to the crucible.The obtained vapor deposition film was subjected to each evaluation according to the methods described above in the Paragraphs. (1) to (4) of Evaluation Method 1. The results are shown in Table 1.Examples 2 to 7 and Comparative Examples 1 to 3Vapor deposition films were produced and evaluated by the same method as in Example 1 except that the supply amount of oxygen blown during vapor deposition was changed as in Table 1. The results are shown in Table 1.Example 8An evaporation film was produced and evaluated by the same method as in Example 1 except that the transport speed of the biaxially stretched EVOH film during evaporation was changed to 75 m / min and that evaporation was performed such that the average thickness of the aluminum evaporation layer was 80 nm. The results are shown in Table 1.Example 9An unstretched film was obtained by the same method as in Example 1 except that the average thickness was 12 μm. A vapor deposition film was produced and evaluated by the same method as in Example 1 except that the obtained unstretched film was directly used as a vapor deposition base. The results are shown in Table 1.Example 10An evaporation film was produced and evaluated by the same method as in Example 1 except that the OPET was used instead of the biaxially stretched EVOH film. The results are shown in Table 1.Comparative Example 4An evaporation film was produced and evaluated by the same method as in Comparative Example 3 except that the OPET was used instead of the biaxially stretched EVOH film. The results are shown in Table 1.Comparative Example 5An evaporation film was produced and evaluated by the same method as in Comparative Example 3 except that a nozzle for directly blowing oxygen onto the evaporation layer of the biaxially stretched EVOH film after evaporation was installed in the evaporation chamber (nozzle gap: 2 mm; nozzle width: 21 cm; film-nozzle distance: 2 cm; angle with respect to the film: 90°), that an oxygen gas was introduced under conditions including 5000 mL / min or more from the nozzle for directly blowing oxygen onto the evaporation layer, and that the oxygen gas was introduced such that the pressure in the evaporation chamber was 1.0×10 -2 Pa to 5.0×10 -2 Pa. The results are shown in Table 1.Comparative Example 6A vapor deposition film was produced and evaluated by the same method as in Example 1, except that the supply amount of oxygen blown during vapor deposition was 5000 mL / min or more and an oxygen gas was introduced such that the pressure in the vapor deposition chamber was 1.0×10 2 Pa to 5.0×10 2 Pa. The results are shown in Table 1.Comparative Example 7An evaporation film was produced and evaluated by the same method as in Comparative Example 3 except that a nozzle for blowing oxygen was installed (nozzle gap: 2 mm; nozzle width: 21 cm), that oxygen could be blown between the crucible for heating aluminum in the evaporation chamber and the biaxially stretched EVOH film during transportation, and that alumina was evaporated in vacuo while blowing oxygen at 3000 to 5000 mL / min. The results are shown in Table 1. Table 1 Table 1Unit-μm-nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nmmL / min------Example 1EVOH-112Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretched40801,360,021,58A. AB. BB. BExample 2EVOH-112Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretched401001,480,021,53A. AB. BB. BExample 3EVOH-112Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretched401301,770,031,72A. AC. CB. BExample 4EVOH-112Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretched401601,930,031,82B. BD. DC. CExample 5EVOH-112Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretched40701,120,021,67A. AB. BB. BExample 6EVOH-112Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretched40500,870,031,48B. BB. BC. CExample 7EVOH-112Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretched40300,530,041,41B. BB. BD. DExample 8EVOH-112Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretched80801,250,031,33A. AA. AA. AExample 9EVOH-112The unextended portion is not stretched40801,310,041,52B. BC. CD. DExample 10OPET12Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretched40801,360,021,64D. DD. DC. CComparative Example 1EVOH-112Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretched402002,320,031,24C. CE. EC. CComparative Example 2EVOH-112Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretched40100,270,031,32B. BB. BE. EUnit-μm-nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nmmL / min------Comparative Example 3EVOH-112Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretched4000,130,011,32B. BB. BE. EComparative Example 4OPET12Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretched4000,080,031,59D. DE. EE. EComparative Example 5EVOH-112Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretched40> 5000* 10,090,063,12C. CE. ED. DComparative Example 6EVOH-112Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretched40> 50003,420,061,31C. CE. ED. DComparative Example 7EVOH-112Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretched403000 up to 50001,731,721,68C. CC. CE. E*1: Oxygen gas was blown onto the vapor deposition layer after vapor deposition.Materials 2 UsedBarrier layer (A) and Barrier layer (a)EVOH-1: an EVOH having an ethylene unit content of 32 mol%, a saponification degree of 99.9 mol%, and an MFR (190°C, under the load of 2.16 kg) of 1.6 g / 10 minOPET: "Lumirror (registered trademark) P60" (manufactured by Toray Industries, Inc., biaxially stretched PET film; average thickness: 12 μm)PO layer (E)LLDPE: "Unilux (registered trademark) LS760C" (manufactured by Idemitsu Unitech Co., Ltd., LLDPE film; average thickness: 50 μm) PA layer (F)OPA: "EMBLEM (registered trademark) ONM15," biaxially stretched polyamide film; average thickness: 15 μmEvaluation Method 2(5) Thermal conductivityAfter each of the vacuum insulation materials obtained in Examples and Comparative Examples was stored at 23° C. and 50% RH for 1 week, the thermal conductivity (mW / (m·k)) of the vacuum insulation material was measured with a thermal conductivity meter (FOX314 manufactured by EKO Instruments Co., Ltd.), the temperature on one side of the vacuum insulation material was set to 38° C. and the temperature on the other side was set to 12° C. The evaluation was performed twice, an average value of the two evaluation results was defined as thermal conductivity before the test, and the results were evaluated according to the following criteria. When the evaluation results were A or B, it was determined that the heat insulation performance was advantageous.Thermal conductivity before testing (determination criteria)A: 2.5 mW / m·K or less B: greater than 2.5 mW / m·K and 2.8 mW / m·K or less C: greater than 2.8 mW / m·KEach of the vacuum insulation fabrics obtained in Examples and Comparative Examples was bent along a semicircular arc of R=115 mm. After storage at 23° C. and 50% RH for 1 week, the bent vacuum insulation cloth was pressed against a horizontal plate to restore the flat plate shape, and then the thermal conductivity of the vacuum insulation cloth was measured in the same manner as above. The evaluation was performed twice, an average value of the two evaluation results was defined as thermal conductivity after the bending test, the thermal conductivity difference between before and after the bending test (after the bending test - before the bending test) was calculated, and the results were evaluated according to the following criteria. When the evaluation results were A to C, it was determined that the bending strength was advantageous. That is, it is considered that deterioration of the gas barrier properties after the bending treatment is prevented, and accordingly, decrease of the thermal conductivity due to the bending is prevented.Difference in thermal conductivity between before and after the bending test(Determination Criteria)A: 0.1 mW / m·K or less B: greater than 0.1 mW / m·K and 0.3 mW / m·K or less C: greater than 0.3 mW / m·K and 0.5 mW / m·K or less D: greater than 0.5 mW / m·KEach of the vacuum insulation fabrics obtained in Examples and Comparative Examples was bent along a semicircular arc of R=115 mm. After storage at 23° C. and 50% RH for 1 week, the bent vacuum insulation material was stored in a dryer at 80° C. for 60 days, pressed against a horizontal plate to restore the flat plate shape, and then stored at 23° C. and 50% RH for 1 week, and the thermal conductivity was measured with a thermal conductivity meter in the same manner as above. The evaluation was performed twice, an average value of the two evaluation results was defined as thermal conductivity after the storage test, the difference between before and after the storage test (after the storage test - after the bending test) was calculated, and the results were evaluated according to the following criteria. When the evaluation results were A to C, it was determined that the storage stability was advantageous. That is, it is considered that deterioration of the gas barrier properties after storage is prevented, and accordingly, decrease of the thermal conductivity after storage is prevented.Difference in thermal conductivity between before and after the storage test (determination criteria)A: 7.0 mW / m·K or less B: greater than 7.0 mW / m·K and 11.0 mW / m·K or less C: greater than 11.0 mW / m·K and 15.0 mW / m·K or less D: greater than 15.0 mW / m·K and 15.0 mW / m·K or lessExample 11The vapor deposition film obtained in Example 8 was prepared as a first vapor deposition film.A second vapor deposition film (OPET / Al=12 μm / 50 nm) was prepared by the same procedure as in Example 10, except that the transport speed of the PET during vapor deposition was changed to 94 m / min and that vapor deposition was performed such that the average thickness of the aluminum vapor deposition layer was 50 nm. With respect to the obtained second vapor deposition film, the molar ratio (O / Al) of an oxygen element to an aluminum element in the aluminum vapor deposition layer was measured according to the method described above in Section. (1) of Evaluation Method 1. The results are shown in Table 3. Further, the results of measuring the molar ratio of the vapor deposition film (the first vapor deposition film) obtained in Example 8 are also shown again in Table 3. Note that the aluminum vapor deposition layer of the vapor deposition film of Example 8 (the first vapor deposition film) is referred to as an aluminum vapor deposition layer (B), and the aluminum vapor deposition layer of the second vapor deposition film is referred to as an aluminum vapor deposition layer (b).A surface of the aluminum vapor deposition layer of the second vapor deposition film, a surface of the OPA, and a surface of the LLDPE were coated with a two-component urethane adhesive ("TAKELAC (trade mark) A-520" and "TAKENATE (trade mark) A-50" manufactured by Mitsui Chemicals, Inc.), respectively, so that the average thickness of the dried adhesive was 1.0 μm, and drying was performed. A multilayer structure was prepared in the following manner: Lamination was carried out using also the first vapor deposition film to obtain a configuration of OPA / tie / PET / Al / tie / Al / EVOH-1 / tie / LLDPE ("tie" means the adhesive layer, and "Al" means the aluminum vapor deposition layer).A vacuum insulation material was prepared using the obtained multilayer structure. Specifically, the multilayer structure was cut to a size of 20 cm×40 cm to produce two cover materials, the two cover materials were superposed on each other such that the LLDPE layers corresponded to the inner surfaces, and three sides were heat-sealed to a width of 10 mm to produce a three-sided bag as a packaging bag. Through an opening of the obtained packaging bag, fiberglass dried in an atmosphere at 160° C. for 4 hours and a calcium oxide bag as a core material having low thermal conductivity and an adsorbent, respectively, were put, and the packaging bag in a state of having an internal pressure of 1.0 Pa was sealed by a vacuum insulation plate production apparatus (KT-500RD manufactured by NPC Incorporated) at a temperature of 20° C. to produce the vacuum insulation material. The thermal conductivity of the obtained vacuum insulation was evaluated according to the method described above in Schn. (5) of Evaluation Method 2. The results are shown in Table 3.Examples 12 and 13Vapor deposition films were each produced by the same method as in Example 8, except that the supply amount of oxygen blown during vapor deposition was changed as in Table 2. Vapor deposition films, multilayer structures and vacuum insulation materials were prepared and evaluated by the same method as in Example 11 except that the obtained vapor deposition films were each used as the first vapor deposition film. The results are shown in Table 3.Example 14An unstretched film was obtained by the same method as in Example 8 except that the average thickness was 12 μm. An evaporation film was prepared by the same method as in Example 8, except that the obtained unstretched film was directly used as an evaporation base. An evaporation film, a multilayer structure and a vacuum insulation were prepared and evaluated by the same method as in Example 11 except that the obtained evaporation film was used as the first evaporation film. The results are shown in Table 3.Example 15An evaporation film, a multilayer structure and a vacuum insulation were produced and evaluated by the same method as in Example 11 except that the evaporation film obtained in Example 1 was used as the first evaporation film. The results are shown in Table 3.Comparative Example 8An evaporation film, a multilayer structure and a vacuum insulation were produced and evaluated by the same method as in Example 11 except that the evaporation film obtained in Comparative Example 1 was used as the first evaporation film and that oxygen was not blown during the formation of the second evaporation film. The results are shown in Table 3.Comparative Example 9An evaporation film, a multilayer structure and a vacuum insulation were produced and evaluated by the same method as in Comparative Example 8, except that the evaporation film obtained in Comparative Example 2 was used as the first evaporation film. The results are shown in Table 3.Comparative Example 10An evaporation film, a multilayer structure and a vacuum insulation were produced and evaluated by the same method as in Comparative Example 8, except that the evaporation film obtained in Comparative Example 3 was used as the first evaporation film. The results are shown in Table 3. Table 2 Table 2Unit-μm-nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nmmL / min-μmnm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nmmL / min-μm-μmExample 11EVOH-112Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretched8080OPET125080LLDPE50OPA15Example 12EVOH-112Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretched80160OPET125080LLDPE50OPA15Example 13EVOH-112Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretched8030OPET125080LLDPE50OPA15Example 14EVOH-112The unextended portion is not stretched8080OPET125080LLDPE50OPA15Example 15EVOH-112Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretched4080OPET125080LLDPE50OPA15Comparative Example 8EVOH-112Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretched40200OPET12500LLDPE50OPA15Comparative Example 9EVOH-112Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretched4010OPET12500LLDPE50OPA15Comparative Example 10EVOH-112Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretched400OPET12500LLDPE50OPA15Table 3Table 3Unit---------Example 111,250,031,331,250,031,31A. AA. AA. AExample 121,950,041,621,250,031,31A. AB. BB. BExample 130,580,011,221,250,031,31A. AB. BB. BExample 141,330,031,421,250,031,31B. BC. CC. CExample 151,360,021,581,250,031,31A. AC. CC. CComparative Example 82,320,031,240,150,011,24C. CD. DD. DComparative Example 90,270,031,320,150,011,24B. BB. BD. DComparative Example 100,130,011,320,150,011,24B. BB. BD. DMaterials 3 UsedBarrier layer (A)EVOH-2: an EVOH having an ethylene unit content of 48 mol%, a saponification degree of 99.9 mol%, and an MFR (190°C, load of 2.16 kg) of 6.4 g / 10 minEVOH-3: an EVOH having an ethylene unit content of 32 mol%, a saponification degree of 99.9 mol%, and an MFR (190°C, load of 2.16 kg) of 1.6 g / 10 minOPET: "Lumirror (registered trademark) P60" (manufactured by Toray Industries, Inc., biaxially stretched PET film; average thickness: 12 μm) adhesive resin layer (C)Ad: "ADMER (registered trademark) NF528" (manufactured by Mitsui Chemicals, Inc., maleic anhydride-modified polyethylene) PO layer (D)PP: "Novatec (registered trademark) FL203D" (manufactured by Japan Polypropylene Corporation, polypropylene)PO layer (E)OPP: "FOR" (manufactured by Futamura Chemical Co., Ltd., biaxially stretched polypropylene film; average thickness: 20 μm)CPP30: "GLC" (Mitsui Chemicals Tohcello Inc., unstretched polypropylene film; average thickness: 30 μm)CPP50: "GLC" (Mitsui Chemicals Tohcello Inc., unstretched polypropylene film; average thickness: 50 μm)Evaluation Method 3(6) OTR Prior to Storage TestA measurement sample having a size of 11 cm×11 cm was cut out from each of the multilayer structures obtained in Examples and Comparative Examples, the cut-out measurement sample was allowed to stand at 20° C. and 65% RH for 1 week, and then its oxygen permeability was determined according to the method disclosed in ISO14663-2 Annex C (1999) under conditions including 20° C. and 65% RH using an oxygen permeability meter OX-TRAN 2 / 21 manufactured by MOCON INC. (Detection limit: 0.01 mL / (m 2 · Tag·atm)) was measured, and the results were evaluated according to the following criteria.Determination CriteriaA: Less than 0.01 mL / (m 2 ·day·atm) B: 0.01 mL / (m 2 ·day·atm) or more and less than 0.05 mL / (m 2 ·day·atm) C: 0.05 mL / (m 2 ·day·atm) or more and less than 0.10 mL / (m 2 ·day·atm) D: 0.10 mL / (m 2 ·day·atm) or more and less than 0.2 mL / (m 2 ·day·atm) E: 0.2 mL / (m 2 ·day·atm) or more(7) OTR and Appearance after Storage TestThe following storage test was carried out: Ketchup bags obtained in Examples and Comparative Examples were each stored in a thermo hygrostat set at 43°C and 50% RH for 150 days. After the storage test, an upper portion of the bag was cut, the ketchup was squeezed out, an adherent substance was washed away with pure water, the remaining pure water was wiped off with a paper towel, and then a square of 11 cm×11 cm was cut out from a central portion of the bag (excluding the sealed portion), the cut measurement sample was conditioned at 20° C. and 65% RH for 1 week, the oxygen permeability thereof was determined according to the method disclosed in ISO14663-2 Annex C (1999), under conditions including 20° C. and 65% RH by means of an oxygen permeability meter OX-TRAN 2 / 21, manufactured by MOCON INC. (Detection limit: 0.01 mL / (m 2 · Tag·atm)) was measured, and the results were evaluated according to the following criteria.Determination Criteria for OTRA: Less than 0.1 mL / (m 2 ·day·atm) B: 0.1 mL / (m 2 ·day·atm) or more and less than 0.5 mL / (m 2 ·day·atm) C: 0.5 mL / (m 2 ·day·atm) or more and less than 1.0 mL / (m 2 ·day·atm) D: 1.0 mL / (m 2 ·day·atm) or more and less than 2.0 mL / (m 2 ·day·atm) E: 2.0 mL / (m 2 ·day·atm) or moreFurther, the appearance after the storage test was evaluated according to the following criteria.Appearance determination criteriaA: The appearance was comparable to that before the storage test B: A bleached part having a maximum length of 0.1 mm or more and less than 5 mm was observed. C: A bleached portion having a maximum length of 5 mm or more, 25 or more, and less than 10 mm was observed. D: A bleached portion having a maximum length of 10 or more and less than 20 mm was observed. E: A bleached portion having a maximum length of 20 mm or more was observed.Example 16The EVOH-2 was used as the material of the barrier layer (A), the Ad was used as the material of the adhesive resin layer (C), the PP was used as the material of the PO layer (D), and these materials were extruded from a die onto a casting roll by a coextrusion casting method for three layers of three kinds while blowing the air by means of an air knife at a wind speed of 30 m / s to produce an unstretched multilayer film (EVOH-2 / Ad / PP=10 μm / 10 μm / 180 μm) under the following conditions.Conditions for Production of Multilayer FilmApparatus: Cast film co extruder for three layers of three typesBarrier layer (A): EVOH-2Extruder: Single screw extruder (ME type laboratory extruder CO-EXT, Toyo Seiki Co., Ltd.)Screw: diameter=20 mmφ, L / D=20 full-flight screwExtrusion temperature: draw-in zone / compression zone / metering zone / die=175 / 200 / 220 / 220° C.Adhesive resin layer (C): AdExtruder: Single screw extruder (SZW20GT-20MG, Technovel Corporation)Screw: diameter=20 mmφ, L / D=20 full-flight screwExtrusion temperature: draw-in zone / compression zone / metering zone / die=175 / 200 / 220 / 220° C.PO layer (D): PPExtruder: Single screw extruder (GT-32-A, Research Laboratory of Plastics Technology Co., Ltd.)Screw: diameter=32 mmφ, L / D=28, full-flight screwExtrusion temperature: draw-in zone / compression zone / metering zone / die=175 / 200 / 220 / 220° C.Die: 300 mm wide coat hanger die for three layers of three kinds (manufactured by Research Laboratory of Plastics Technology Co., Ltd.)The obtained unstretched multilayer film was stretched 3.2 times in the longitudinal direction and 3.0 times in the transverse direction using a simultaneous tenter type biaxial stretching apparatus at 160° C. to obtain a biaxially stretched multilayer film having a configuration of EVOH-2 / Ad / PP=1 μm / 1 μm / 18 μm.Aluminum was vacuum-deposited on the barrier layer (A) of the obtained biaxially stretched multilayer film by the same method as in Example 1 to produce a vapor-deposited film (aluminum vapor-deposited layer / EVOH-2 / Ad / PP=40 nm / 1 μm / 1 μm / 18 μm) in which an aluminum vapor-deposited layer having an average thickness of 40 nm was formed on the barrier layer (A). With respect to the obtained vapor deposition film, the molar ratio (O / Al) of an oxygen element to an aluminum element in the aluminum vapor deposition layer (B) was measured according to the method described above in Section. (1) of Evaluation Method 1. The results are shown in Table 5.Adhesive layers were provided in the following manner: One face of the OPP and one face of the CPP50 were coated with a two-component urethane adhesive ("TAKELAC (trade mark) A-520" and "TAKENATE (trade mark) A-50" manufactured by Mitsui Chemicals, Inc.), respectively, so that the average thickness of the dried adhesive was 2 μm, and drying was performed. Thereafter, the OPP (PO layer (E1)) provided with the adhesive layer was disposed on the aluminum vapor deposition side of the vapor deposition film prepared in the above manner, and the CPP50 (PO layer (C2)) provided with the adhesive layer was disposed on the side of the PO layer (D), and the resultant structure was subjected to lamination while performing nip roll pressure bonding at 70° C. Thereafter, aging was performed at 40° C. for 4 days to obtain a multilayer structure (OPP / tie / Al / EVOH-2 / Ad / PP / tie / CPP=20 μm / 2 μm / 40 nm / 1 μm / 1 μm / 18 μm / 2 μm / 50 μm ("tie" means the adhesive layer, and "Al" means the aluminum vapor deposition layer)). With respect to the obtained multilayer structure, the OTR before the storage test was evaluated according to the method described above in the Abstract. (6) of Evaluation Method 3. The results are shown in Table 5.The obtained multilayer structure was cut to form two cover materials each having a size of 15 cm (horizontal) × 20 cm (vertical), the cover materials were superposed on each other such that the CPP layers corresponded to the inner surfaces, and three sides were heat-sealed to a width of 10 mm to produce a three-sided bag as a packaging bag. In the packaging bag, 50 g of tomato ketchup manufactured by Kagome Co., Ltd., a 15 cm long portion (the remaining one side which had not been heat-sealed) was heat-sealed using a vacuum packaging machine VAC-STAR 2500GSL manufactured by Frimark GmbH to a width of 10 mm to produce a bag having a size of 15 cm (horizontal) × 15 cm (horizontal) in which 50 g of ketchup was vacuum-packaged. With respect to the obtained bag, the OTR and the appearance after the storage test were evaluated according to the method described above in the Abstract. (7) of Evaluation Method 3. The results are shown in Table 5.Examples 17 to 22 and Comparative Examples 11 to 13Biaxially stretched multilayer films, vapor-deposited films, multilayer structures and bags were produced and evaluated by the same method as above, except that in the production of the vapor-deposited film in Example 16, the oxygen supply amount was changed as in Table 4. The results are shown in Table 5.Example 23A biaxially stretched multilayer film, an evaporation film, a multilayer structure and a bag were produced and evaluated by the same method as in Example 20 except that no PO layer (E2) (CPP50) was provided in the production of the multilayer structure. The results are shown in Table 5.Example 24A biaxially stretched multilayer film, an evaporation film, a multilayer structure and a bag were produced and evaluated by the same method as in Example 17 except that no PO layer (E2) (CPP50) was provided in the production of the multilayer structure. The results are shown in Table 5.Example 25A biaxially stretched multilayer film, an evaporation film, a multilayer structure and a bag were prepared and evaluated by the same method as in Example 23 except that the transport speed of the biaxially stretched multilayer film during evaporation was changed to 75 m / min and that evaporation was carried out such that the average thickness of the aluminum evaporation layer was 80 nm. The results are shown in Table 5.Example 26A biaxially stretched multilayer film, an evaporation film, a multilayer structure and a bag were prepared and evaluated by the same method as in Example 24, except that the transport speed of the biaxially stretched multilayer film during evaporation was changed to 75 m / min and that evaporation was carried out such that the average thickness of the aluminum evaporation layer was 80 nm. The results are shown in Table 5.Example 27A biaxially stretched multilayer film, an evaporation film, a multilayer structure and a bag were produced and evaluated by the same method as in Example 16 except that in the production of the multilayer structure, CPP30 was used as the PO layer (E2) instead of the CPP50. The results are shown in Table 5.Example 28An unstretched multilayer film was prepared such that the average thickness of each layer was set to EVOH-2 / Ad / PP=30 μm / 30 μm / 108 μm, and the obtained unstretched multilayer film was heated to 160° C. and then stretched six times in the longitudinal direction (machine direction) with a roll-type stretching machine to produce a uniaxially stretched multilayer film (EVOH-2 / Ad / PP=5 μm / 5 μm / 18 μm). The obtained uniaxial multilayer film was directly used as a vapor deposition base. Except for the above, a vapor deposition film, a multilayer structure and a bag were produced and evaluated by the same method as in Example 27. The results are shown in Table 5.Example 29An unstretched multilayer film, a vapor deposition film, a multilayer structure and a bag were produced and evaluated by the same method as in Example 27 except that the unstretched multilayer film (EVOH-2 / Ad / PP=5 μm / 5 μm / 18 μm) was produced such that the average thicknesses of the barrier layer (A), the adhesive resin layer (C) and the PO layer (D) had the average thicknesses shown in Table 3 and that the obtained unstretched multilayer film was directly used as a vapor deposition base. The results are shown in Table 5.Example 30An unstretched multilayer film, an evaporation film, a multilayer structure and a bag were produced and evaluated by the same method as in Example 29 except that EVOH-3 was used as the barrier layer (A). The results are shown in Table 5.Example 31A multilayer structure and a bag were produced and evaluated by the same method as in Example 30 except that the vapor deposition film produced in Example 10 was used as the vapor deposition film. Note that the CPP30 was placed on the side of the OPET. The results are shown in Table 5.Comparative Example 14A multilayer structure and a bag were produced and evaluated by the same method as in Example 30 except that the vapor deposition film produced in Comparative Example 4 was used as the vapor deposition film. Note that the CPP30 was placed on the side of the OPET. The results are shown in Table 5. Table 4 Table 4Unit-μmnm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nm nmmL / min-μm-μm--μm-by byExample 16EVOH-214080Ad1PP18Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretchedOPP20CPP5050OPP / tie / Al / EVOH-2 / AD / PP / tie / CPPExample 17EVOH-2140100Ad1PP18Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretchedOPP20CPP5050OPP / tie / Al / EVOH-2 / AD / PP / tie / CPPExample 18EVOH-2140130Ad1PP18Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretchedOPP20CPP5050OPP / tie / Al / EVOH-2 / AD / PP / tie / CPPExample 19EVOH-2140160Ad1PP18Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretchedOPP20CPP5050OPP / tie / Al / EVOH-2 / AD / PP / tie / CPPExample 20EVOH-214070Ad1PP18Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretchedOPP20CPP5050OPP / tie / Al / EVOH-2 / AD / PP / tie / CPPExample 21EVOH-214050Ad1PP18Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretchedOPP20CPP5050OPP / tie / Al / EVOH-2 / AD / PP / tie / CPPExample 22EVOH-214030Ad1PP18Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretchedOPP20CPP5050OPP / tie / Al / EVOH-2 / AD / PP / tie / CPPExample 23EVOH-214070Ad1PP18Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretchedOPP20--OPP / tie / Al / EVOH-2 / AD / PPExample 24EVOH-2140100Ad1PP18Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretchedOPP20--OPP / tie / Al / EVOH-2 / AD / PPExample 25EVOH-218070Ad1PP18Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretchedOPP20--OPP / tie / Al / EVOH-2 / AD / PPExample 26EVOH-2180100Ad1PP18Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretchedOPP20--OPP / tie / Al / EVOH-2 / AD / PPExample 27EVOH-214080Ad1PP18Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretchedOPP20CPP3030OPP / tie / Al / EVOH-2 / AD / PP / tie / CPPExample 28EVOH-254080Ad5PP18Stretched uniaxially stretched uniaxially stretched uniaxially stretchedOPP20CPP3030OPP / tie / Al / EVOH-2 / AD / PP / tie / CPPExample 29EVOH-254080Ad5PP18The unextended portion is not stretchedOPP20CPP3030OPP / tie / Al / EVOH-2 / AD / PP / tie / CPPExample 30EVOH-354080Ad5PP18The unextended portion is not stretchedOPP20CPP3030OPP / tie / Al / EVOH-3 / AD / PP / tie / CPPExample 31OPET14080-----OPP20CPP3030OPP / tie / Al / OPETiie / CPPComparative Example 11EVOH-2140200Ad1PP18Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretchedOPP20CPP3030OPP / tie / Al / EVOH-2 / AD / PP / tie / CPPComparative Example 12EVOH-214010Ad1PP18Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretchedOPP20CPP3030OPP / tie / Al / EVOH-2 / AD / PP / tie / CPPComparative Example 13EVOH-21400Ad1PP18Stretched biaxially stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, stretched, biaxially stretched, biaxially stretchedOPP20CPP3030OPP / tie / Al / EVOH-2 / AD / PP / tie / CPPComparative Example 14OPET1400-----OPP20CPP3030OPP / tie / Al / OPET / tie / CPPTable 5Table 5Unit------Example 161,310,021,58A. AA. AA. AExample 171,420,021,53A. AA. AA. AExample 181,780,031,72A. AB. BA. AExample 191,950,031,82B. BD. DD. DExample 201,130,021,51A. AA. AA. AExample 210,840,031,48B. BC. CC. CExample 220,570,041,41B. BC. CC. CExample 231,130,031,47A. AD. DD. DExample 241,420,031,46A. AC. CC. CExample 251,130,031,33A. AB. BB. BExample 261,360,031,51A. AA. AA. AExample 271,310,021,58A. AB. BB. BExample 281,250,031,51B. BC. CC. CExample 291,320,021,47C. CD. DD. DExample 301,290,021,34B. BC. CC. CExample 311,360,021,64C. CD. DD. DComparative Example 112,130,031,24C. CE. EE. EComparative Example 120,270,031,32B. BE. EE. EComparative Example 130,130,011,32B. BE. EE. EComparative Example 140,080,031,59C. CE. EE. EAs shown in Table 1, the vapor deposition films of Examples 1 to 10 had favorable flexural strength and storage stability. As shown in Tables 2 and 3, the vacuum insulation materials obtained from the respective multilayer structures of Examples 11 to 15 exhibited favorable heat insulation performance, bending strength, and storage stability. As shown in Tables 4 and 5, the bags obtained from the respective multilayer structures of Examples 16 to 31 had favorable gas barrier properties both before and after storage, and the appearance after storage was also advantageous. Further, it has been found that the maximum value (O / Al) MAX of the molar ratio of an oxygen element to an aluminum element in the aluminum oxide layer (B1) can be controlled by blowing a small amount of oxygen on the vapor basis (barrier layer (A)) during aluminum vapor deposition and adjusting the oxygen supply amount. Note that in each of Examples 23 to 26 which did not include a CPP layer, the appearance of the bag was deteriorated due to heat sealing to produce the bag.EXPLANATION OF THE REFERENCE NUMERALS10 Deposition film A Barrier layer (A) B Aluminum Deposition layer (B) B1 Aluminum oxide layer (B1) B2 Aluminum layer (B2) B3 Aluminum oxide layer (B3) S Surface of the aluminum Deposition layer (B) opposite to the surface in contact with the barrier layer (A)References included in the specificationThis list of documents cited by the applicant has been produced in an automated manner and is only included for the better information of the reader. The list is not part of the German patent application or utility model application. The DPMA does not take any adhesion for any faults or omissions.Cited Non-Patent LiteratureISO14663-2 Annex C (1999 [0123, 0149]

Claims

An evaporation film comprising: a barrier layer (A) made of a resin; and an aluminum evaporation layer (B) disposed directly on the barrier layer (A) and having an average thickness of 30 nm or more and 100 nm or less, wherein the aluminum evaporation layer (B) comprises an aluminum oxide layer (B1) and an aluminum layer (B2) sequentially disposed in this order from a surface in contact with the barrier layer (A), in a depth-direction elemental analysis of the aluminum oxide layer (B1), a maximum value (O / Al) MAX of a molar ratio of an oxygen element to an aluminum element is 0.5 or more and 2.0 or less, the molar ratio being measured with a scanning X-ray photoelectron spectrometer, and in depth direction analysis of the aluminum layer (B2), a minimum value (O / Al) MIN of a molar ratio of an oxygen element to an aluminum element is less than 0.5, the molar ratio being measured with a scanning X-ray photoelectron spectrometer.The vapor deposition film according to claim 1, wherein the aluminum vapor deposition layer (B) comprises an aluminum oxide layer (B3) having an area (S) opposite to the area in contact with the barrier layer (A), and in elemental analysis of the area (S), a molar ratio (O / Al) S of an oxygen element to an aluminum element is 0.5 or more and 2.0 or less, the molar ratio being measured with a scanning X-ray photoelectron spectrometer.The vapor deposition film according to claim 1 or 2, wherein the barrier layer (A) contains at least one selected from the group consisting of a vinyl alcohol polymer and a polyester resin as a main component.The vapor deposition film according to any one of claims 1 to 3, wherein the barrier layer (A) is biaxially stretched.The vapor deposition film according to any one of claims 1 to 4, wherein the average thickness of the barrier layer (A) is 0.1 μm or more and 20 μm or less.The vapor deposition film according to any one of claims 1 to 5, wherein the average thickness of the aluminum vapor deposition layer (B) is 55 nm or more and 90 nm or less.The vapor deposition film according to any one of claims 1 to 6, further comprising a polyolefin layer (D) disposed on an opposite surface of the barrier layer (A) to the aluminum vapor deposition layer (B) with an adhesive resin layer (C) interposed therebetween.The vapor deposition film according to claim 7, wherein the barrier layer (A), the adhesive resin layer (C) and the polyolefin layer (D) are at least uniaxially stretched.A multilayer structure comprising: the vapor deposition film according to claim 7 or 8; and a polyolefin layer (E) disposed on at least one surface of the vapor deposition film directly or via another intermediate layer.The multilayer structure according to claim 9, wherein polyolefin layers (E) are respectively disposed on both surfaces of the vapor deposition film directly or via another intermediate layer, and the polyolefin layers (E) contain a similar resin as a main component.The multilayer structure according to claim 9 or 10, wherein the thickness proportion of the barrier layer (A) is 5% or less with respect to the total thickness of the multilayer structure.A multilayer structure comprising: the vapor deposition film according to any one of claims 1 to 6; and a polyolefin layer (E) disposed on the vapor deposition film directly or via another intermediate layer.The multilayer structure according to claim 12, further comprising another vapor deposition film disposed on the vapor deposition film directly or via another intermediate layer, wherein the another vapor deposition film comprises a barrier layer (a) made of a resin and an aluminum vapor deposition layer (b) disposed directly on the barrier layer (a) and having an average thickness of 30 nm or more and 100 nm or less.The multilayer structure according to claim 13, wherein the aluminum vapor deposition layer (b) comprises an aluminum oxide layer (b1) and an aluminum layer (b2) sequentially arranged in this order from a surface in contact with the barrier layer (a), in an elemental analysis in a depth direction of the aluminum oxide layer (b1), a maximum value (O / Al) MAX of a molar ratio of an oxygen element to an aluminum element is 0.5 or more and 2.0 or less, the molar ratio being measured with a scanning X-ray photoelectron spectrometer, and in a depth direction analysis of the aluminum layer (b2), a minimum value (O / Al) MIN of a molar ratio of an oxygen element to an aluminum element is less than 0.5, wherein the molar ratio is measured with a scanning X-ray photoelectron spectrometer.The multilayer structure according to any one of claims 12 to 14, further comprising a polyamide layer (F) disposed on the vapor deposition film directly or via another intermediate layer.A packaging material comprising the vapor deposition film according to any one of claims 1 to 8 or the multilayer structure according to any one of claims 9 to 15.A vacuum packaging bag comprising a packaging bag formed from the packaging material of claim 16, wherein the interior of the packaging bag has a reduced pressure.A vacuum insulation fabric comprising: the vacuum packaging bag of claim 17; and a core material disposed within the vacuum packaging bag.

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